CN210007984U

CN210007984U - Multilayer PCB structure capable of being used for detecting interlayer alignment

Info

Publication number: CN210007984U
Application number: CN201822154274.2U
Authority: CN
Inventors: 曾祥福; 程剑; 谢超峰
Original assignee: Xiang Science And Technology Circuit Board Co Ltd Of Daya Gulf Section Of Huizhou City
Current assignee: Xiang Science And Technology Circuit Board Co Ltd Of Daya Gulf Section Of Huizhou City
Priority date: 2018-12-21
Filing date: 2018-12-21
Publication date: 2020-01-31
Anticipated expiration: 2028-12-21

Abstract

The utility model relates to an multilayer PCB plate structure that can be used to detection layer alignment degree, including the PCB edition of books body, the PCB edition of books body includes the inner plating that a plurality of specifications size sent, the edge of inner plating is provided with detection module, detection module is located each inner plating with position department the utility model discloses can conveniently detect the layer inclined to one side phenomenon.

Description

Multilayer PCB structure capable of being used for detecting interlayer alignment

Technical Field

The utility model relates to a PCB field, in particular to kinds of multilayer PCB plate structures that can be used to detect the degree of alignment between the layer.

Background

Pcb (printed Circuit board), which is called printed Circuit board in chinese, is an important electronic component, is a support for electronic components, and is a carrier for electrical connection of electronic components. It is called a "printed" circuit board because it is made using electronic printing.

After the electronic equipment adopts the printed board, because of the consistency of the similar printed board, the error of manual wiring is avoided, the automatic insertion or mounting, the automatic tin soldering and the automatic detection of electronic components can be realized, the quality of the electronic equipment is ensured, the labor productivity is improved, the cost is reduced, and the maintenance is convenient.

At present, the number of layers of PCBs is more and more, whether the multilayer core boards are poor in layer can not be judged basically through visual observation after lamination is completed, and the defective products such as poor in layer can be intercepted through a conduction test in finished product electrical time measurement, so that the test cost is higher, and if detection and confirmation can be carried out after lamination, cost waste from the test and interception processes of the product testing series after the product is poor in layer can not be caused.

SUMMERY OF THE UTILITY MODEL

Based on this, it is necessary to provide kinds of multi-layer PCB board structures for detecting the alignment between layers, which include a PCB board body including several inner boards with specification, and the edges of the inner boards are provided with detection modules, and the detection modules are located at the same position of each inner board.

When carrying out the preparation of multilayer PCB board, need align each inner plating and the pressfitting has been played at , the utility model discloses a multiply wood is played by the pressfitting and is received at , if do not have the inclined to one side phenomenon in layer, then because detection module is located each inner plating with position department, therefore detection module on the multilayer PCB board is strict to align, if detection module on the multilayer PCB board is not to it, then this multilayer PCB board in surface has the inclined to one side phenomenon in layer, consequently, the utility model discloses thereby can judge whether the inclined to one side phenomenon in layer appears in the product through whether align to the detection module that inspects on it, saved subsequent conduction testing process, can effectively practice thrift manufacturing cost.

The positions of the multilayer PCB can be detected through the existing X-Ray equipment so as to observe whether the detection modules on the inner layer boards are aligned or not, and therefore whether the multilayer PCB has a layer deviation phenomenon or not is judged.

Preferably, the detection modules are arranged at four corners of the inner plate.

The arrangement of the plurality of detection modules can judge whether the multilayer PCB has a layer deviation phenomenon or not by more accurately judging whether the detection modules are aligned or not.

, marking an inner layer plate of the multilayer PCB as an L1 layer, an L2 layer and an L3 layer from bottom to top, wherein the detection module is a circular ring, the center of the circular ring is positioned at the same position on each inner layer plate, the inner diameter of the circular ring on the L2 layer is larger than the outer diameter of the circular ring on the L1 layer, the inner diameter of the circular ring on the L3 layer is larger than the outer diameter of the circular ring on the L2 layer, and the like.

Each inner plate stacks the pressfitting and starts the hand at , if there is not the layer phenomenon partially between each inner plate, then just look at the surface of multilayer PCB board, L1 layer, L2 layer, L3 layer the ring on Ln layer can be tangent more can not intersect, if L1 layer, L2 layer, L3 layer the ring on Ln layer can be tangent or intersect, then can judge and have the layer phenomenon partially between each inner plate, the utility model discloses a whether can detect to having the layer partially to itself, need not other detection means, and the testing process is convenient, and the detection cost is low.

, the inner diameter of the ring on the L2 layer is 0.05mm larger than the outer diameter of the ring on the L1 layer, the inner diameter of the ring on the L3 layer is 0.05mm larger than the outer diameter of the ring on the L2 layer, and so on.

The inner layer plates are offset within 0.05mm, and the circular rings on the inner layer plates are not tangent and intersected, namely 0.05mm is the allowable deviation distance of the multilayer PCB.

, the ring is fixed on the inner plate and is made of a material that is not permeable to X-ray.

The material of ring can be for lead ring, copper ring etc. can't see through the becket of X-ray for the edge uses the X-ray right the utility model discloses shine the detection.

And , the width of the ring is 0.2 mm.

The principle and effect of the present invention will be further explained in steps with the above technical solution:

set up the detection module through the same position on each inner plate on the multilayer PCB board, can make the utility model discloses a structure itself just can detect out whether there is the layer phenomenon partially, and need not with the help of other detection means, and the testing process is convenient, detects with low costs.

Drawings

Fig. 1 is a schematic structural diagram of a multi-layer PCB board structure for detecting interlayer alignment according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of an inner plate according to an embodiment of the present invention;

fig. 3 is a detection image obtained by stacking the detection modules of the inner-layer boards without the layer deviation phenomenon by using the X-Ray detection device according to the embodiment of the present invention.

Description of reference numerals:

1-multilayer PCB, 11-L1 layers, 12-L2 layers, 13-L3 layers, 14-Ln layers and 15-detection module.

Detailed Description

To facilitate understanding by those skilled in the art, the present invention will be described in further detail with reference to the accompanying drawings and examples:

referring to fig. 1-3, multi-layer PCB structure for detecting interlayer alignment comprises a PCB body including a plurality of inner plates in different sizes, wherein a detection module 15 is disposed at an edge of each inner plate, and the detection module 15 is located at the same position of each inner plate.

When carrying out the preparation of multilayer PCB board 1, need align each inner plating and the pressfitting has been played at , the utility model discloses a multiply wood is played by the pressfitting and is received at , if do not have the inclined to one side phenomenon in layer, then because detection module 15 is located each inner plating with position department, therefore detection module 15 on the multilayer PCB board 1 is strict to align, if detection module 15 on the multilayer PCB board 1 is not to it, then this multilayer PCB board 1 in surface has the inclined to one side phenomenon in layer, consequently, the utility model discloses can judge whether the inclined to one side phenomenon in layer appears in the product through whether align to detect module 15 on it, saved subsequent conduction test process, can effectively practice thrift manufacturing cost.

The position of the multilayer PCB board 1 can be detected through the existing X-Ray equipment so as to observe whether the detection modules 15 on the inner layer boards are aligned or not, and further judge whether the multilayer PCB board 1 has a layer deviation phenomenon or not.

In embodiments, the detection modules 15 are arranged at four corners of the inner plate.

The arrangement of the plurality of detection modules 15 can more accurately judge whether the multilayer PCB 1 has a layer deviation phenomenon through the alignment of the detection modules 15.

According to embodiments, inner-layer boards of the multilayer PCB 1 are respectively marked as an L1 layer 11, an L2 layer 12 and an L3 layer 13.. Ln layer 14 from bottom to top, the detection module 15 is a circular ring, the center of the circular ring is located at the position on each inner-layer board, the inner diameter of the circular ring on the L2 layer 12 is larger than the outer diameter of the circular ring on the L1 layer 11, the inner diameter of the circular ring on the L3 layer 13 is larger than the outer diameter of the circular ring on the L2 layer 12, and the like.

Each inner plate is stacked and pressed on to start, if no layer deviation phenomenon exists between each inner plate, the inner plates face the surface of the multilayer PCB 1 to be seen, the circular rings on the L1 layer 11, the L2 layer 12 and the L3 layer 13. the circular rings on the Ln layer 14 are not tangent and can not intersect, and if the circular rings on the L1 layer 11, the L2 layer 12 and the L3 layer 13. the circular rings on the Ln layer 14 are tangent or intersect, the layer deviation phenomenon exists between each inner plate can be judged.

Of these examples, the inner diameter of the ring on the L2 layer 12 is 0.05mm larger than the outer diameter of the ring on the L1 layer 11, the inner diameter of the ring on the L3 layer 13 is 0.05mm larger than the outer diameter of the ring on the L2 layer 12, and so on.

The inner plates are offset within 0.05mm, and the circular rings on the inner plates are not tangent and intersected, namely 0.05mm is the allowable deviation distance of the multilayer PCB 1.

In embodiments, the ring is fixed on the inner plate and is made of a material that is not permeable to X-rays.

Of these examples, the width of the ring is 0.2 mm.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1, can be used to detect multilayer PCB plate structure of degree of alignment between layer, including the PCB board body, the PCB board body includes the inner plating that a plurality of specification sizes sent, its characterized in that, the edge of inner plating is provided with detection module, detection module is located the same position department of each inner plating.

2. The multi-layer PCB board structure capable of detecting the interlayer alignment of claim 1, wherein the detection module is disposed at each of four corners of the inner layer board.

3. The multi-layer PCB structure capable of detecting the interlayer alignment according to claim 2, wherein the inner-layer boards are respectively marked as L1 layer, L2 layer and L3 layer.

4. The multi-layer PCB board structure capable of detecting interlayer alignment of claim 3, wherein the inner diameter of the ring on the L2 layer is 0.05mm larger than the outer diameter of the ring on the L1 layer, the inner diameter of the ring on the L3 layer is 0.05mm larger than the outer diameter of the ring on the L2 layer, and so on.

5. The PCB structure of claim 3 or 4, wherein the ring is fixed to the inner plate and is made of a material that is not transparent to X-rays.

6. The multi-layer PCB board structure capable of detecting interlayer alignment of claim 4, wherein the width of the circular ring is 0.2 mm.