CN210005857U

CN210005857U - PCB board exposure equipment

Info

Publication number: CN210005857U
Application number: CN201921098961.5U
Authority: CN
Inventors: 王�华; 李运聪; 陈志特; 黄海浩
Original assignee: CSTMV AUTOMATION TECHNOLOGY Co Ltd
Current assignee: Guangdong Keshi Optical Technology Co.,Ltd.
Priority date: 2019-07-15
Filing date: 2019-07-15
Publication date: 2020-01-31
Anticipated expiration: 2029-07-15

Abstract

The utility model relates to an kind of PCB board exposure equipment, including the transmission module, two photoetching modules and upset module, the transmission module includes base, rotary guide and loading platform, the base embeds there is the driver, rotary guide sets up on the base, the loading platform sets up on the rotary guide, and with the driver is connected, by the driver control the loading platform is in the last removal of rotary guide, two photoetching modules and upset module are all fixed on the base, wherein, be equipped with photoetching district, cross section district and second photoetching district on the rotary guide in proper order, two the photoetching module is located photoetching district and second photoetching district respectively, the upset module is located cross section district.

Description

PCB board exposure equipment

Technical Field

The utility model relates to a PCB board exposure technical field especially relates to PCB board exposure equipment.

Background

With the continuous development of high-end electronics industry and 5G communication, the PCB industry is also developing at a high speed, future PCB circuits are developing in the direction of hyperfine, multilayer and customization, and the difficulty of the manufacturing process is higher and higher. The innovation and development of the PCB process do not leave the introduction of a new process, the introduction of advanced equipment and the improvement of the automation degree, and in the exposure process of PCB manufacturing, the traditional exposure machine based on film as image transfer has the defects of high exposure reject ratio, low digitization degree and the like, and is not suitable for the development trend of high automation and industry 4.0.

SUMMERY OF THE UTILITY MODEL

Therefore, it is necessary to provide kinds of PCB exposure apparatuses to improve the exposure accuracy of the PCB and increase the work efficiency.

In order to realize the utility model discloses a purpose, the utility model discloses a following technical scheme:

A PCB exposure apparatus, comprising:

the transmission module comprises a base, a rotary guide rail and a loading platform, wherein a driver is arranged in the base; the rotary guide rail is arranged on the base; the loading platform is arranged on the rotary guide rail and is connected with the driver, and the driver controls the loading platform to move on the rotary guide rail; the loading platform is used for placing the PCB;

the two photoetching modules are fixed on the base and comprise alignment assemblies and photoetching assemblies, and the alignment assemblies are fixedly connected with the photoetching assemblies; the alignment assembly is used for calibrating the relative position of the photoetching assembly and the PCB on the loading table; and

the overturning module is fixed on the base and used for overturning the PCB on the loading platform;

the rotary guide rail is sequentially provided with an th photoetching area, a turnover area and a second photoetching area, the two photoetching modules are respectively positioned in the th photoetching area and the second photoetching area, and the turnover module is positioned in the turnover area.

In embodiments, the rotating guide rail is further provided with a feeding area, and the feeding area, the th lithography area, the turnover area and the second lithography area are sequentially arranged.

In embodiments, the loading stations are four, and four loading stations are respectively located in the feeding zone, the th photoetching zone, the turnover zone and the second photoetching zone.

In embodiments, the alignment assembly includes a CCD alignment system and an alignment camera, which are electrically connected.

In embodiments, the loading platform is provided with a clip for fixing the PCB.

In embodiments, the flipping module comprises a rotation mechanism, a suction cup mechanism and a transmission mechanism, and the rotation mechanism is connected to the suction cup mechanism and the transmission mechanism respectively.

In of these embodiments, the system further comprises a feed module located in the feed area.

According to the PCB exposure equipment, the loading platform can continuously and circularly work on the rotary guide rail under the action of the driver, the loading platform is matched with the photoetching module for use, and the alignment component is used for calibrating the relative position of the photoetching component and the PCB on the loading platform, so that the exposure precision of the PCB is improved; the two photoetching modules and the turning module are matched for use and are arranged at intervals, so that the PCB on the loading platform can be automatically turned over after being exposed on the front side and then exposed on the back side, and the automation of double-side exposure of the PCB is realized.

Drawings

Fig. 1 is a perspective view of an embodiment PCB board exposure apparatus;

FIG. 2 is a top view of an example PCB exposure apparatus;

fig. 3 is a top view of another embodiments of the PCB exposure apparatus.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully below. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It is noted that when an element is referred to as being "secured to" another elements, it can be directly on the other elements or intervening elements may also be present, and when elements are referred to as being "connected" to the other elements, it can be directly connected to the other elements or intervening elements may be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

Fig. 1 is a perspective view of exemplary PCB exposure apparatuses, which include a driving module, a th photolithography module 210, a second photolithography module 220, and a flip module 300.

The transmission module comprises a base 110, a rotary guide rail 120 and loading platforms, the number of the loading platforms can be or more, in this embodiment, the number of the loading platforms is four, and the four loading platforms are respectively a th loading platform 131, a second loading platform 132, a third loading platform 133 and a fourth loading platform 134.

The rotating guide rail 120 is arranged on the base 110, as shown in fig. 2, the th photolithography area 121, the turn-over area 122 and the second photolithography area 123 are sequentially arranged on the rotating guide rail 120, the th photolithography module 210 and the second photolithography module 220 are respectively arranged on the th photolithography area 121 and the second photolithography area 123, and the turn-over module 300 is arranged on the turn-over area 122.

the loading platform 131, the second loading platform 132, the third loading platform 133 and the fourth loading platform 134 are sequentially arranged on the rotary guide rail 120 and connected with a driver, and the driver controls the movement of the loading platforms on the rotary guide rail 120, wherein the loading platforms are all used for placing the PCB, the loading platform 131, the second loading platform 132, the third loading platform 133 and the fourth loading platform 134 sequentially pass through the th photolithography area 121, the turn-over area 122 and the second photolithography area 123 to realize double-sided exposure of the PCB thereon, if the PCB only needs single-sided exposure, the second photolithography module 220 and the turn-over module 300 can be closed.

Both

lithography modules

210, 220 are fixed on the base 110, the th lithography module 210 comprises an alignment element 211 and a lithography element 212, the alignment element 211 being fixedly connected to the lithography element 212, and the second lithography module 220 comprises an alignment element 221 and a lithography element 222, the alignment element 221 being fixedly connected to the lithography element 222, wherein the alignment element is used to calibrate the relative position of the lithography element and the PCB board on the load table.

The flipping module 300 is fixed on the base 110 for flipping the PCB board on the loading station 120.

According to the PCB exposure equipment, each loading platform sequentially passes through the th photoetching area 121, the turn-over area 122 and the second photoetching area 123, when the loading platform passes through the th photoetching area 121, the PCB on the loading platform is subjected to front exposure, when the loading platform passes through the turn-over area 122, the PCB on the loading platform is subjected to turn-over, when the loading platform passes through the second photoetching area 123, the PCB on the loading platform is subjected to back exposure, after the PCB on the loading platform is subjected to back exposure, the PCB on the loading platform can be taken away, the PCB which is not subjected to exposure is placed, and the exposure work of the lower round is carried out.

the loading platform 131, the second loading platform 132, the third loading platform 133 and the fourth loading platform 134 can continuously and circularly work on the rotary guide rail 120 under the action of the driver, the loading platforms are matched with the photoetching modules for use, the aligning components are used for calibrating the relative positions of the photoetching modules and the PCB on the loading platforms, thereby improving the exposure precision of the PCB, the two photoetching modules are matched with the overturning modules for use and are arranged at intervals, so that the PCB on the loading platforms can be automatically overturned after being exposed on the front side and then exposed on the back side, thereby realizing the automation of the double-side exposure of the PCB.

Continuing to refer to fig. 1, the th alignment component 211 and the second alignment component 221 both include a CCD alignment system and a alignment camera, the corresponding CCD alignment system and the alignment camera are electrically connected, the alignment camera acquires position information of the PCB and sends the position information to the CCD alignment system, the CCD alignment system compares the information with preset target information, if the position is not equal to a preset value, the accurate position of the PCB is calculated, the corresponding lithography component moves according to the position information and then starts to expose the PCB, and the exposure precision of the PCB can be greatly improved in the process.

With continued reference to fig. 2, the rotating rail 120 is further provided with a feeding area 124, the th photolithography area 121, the turn-over area 122 and the second photolithography area 123 are sequentially arranged, four loading stations can be arranged, which are respectively the th loading station 131, the second loading station 132, the third loading station 133 and the fourth loading station 134, the four loading stations are respectively located in the feeding area 124, the th photolithography area 121, the turn-over area 122 and the second photolithography area 123, and are controlled by a driver to move on the rotating rail 120, so that the th loading station 131, the second loading station 132, the third loading station 133 and the fourth loading station 134 sequentially pass through the feeding area 124, the th photolithography area 121, the turn-over area 122 and the second photolithography area 123, and loading stations are arranged in each area, that four stations can simultaneously operate, thereby greatly improving the operating efficiency.

In embodiments, with reference to fig. 1, the flipping module 300 includes a rotating mechanism 310, a sucking disc mechanism 320, and a transmission mechanism 330, wherein the rotating mechanism 310 is connected to the sucking disc mechanism 320 and the transmission mechanism 330, respectively, the rotating mechanism 310 can rotate 360 degrees, the transmission mechanism 330 is a linear transmission mechanism, specifically, the end of the rotating mechanism 310 is connected to the transmission mechanism 330, the end is provided with the sucking disc mechanism 320, the sucking disc mechanism 320 is used for clamping a PCB on a loading platform, after the PCB is clamped and fixed by the sucking disc mechanism 320, the transmission mechanism 330 drives the rotating mechanism 310 to move away from the loading platform, the rotating mechanism 310 drives the sucking disc mechanism 320 to rotate 180 degrees to flip the PCB, then the transmission mechanism 330 drives the rotating mechanism 310 to move towards the loading platform again, and finally the sucking disc mechanism 320 places the flipped PCB on the loading platform to complete times of PCB flipping.

In embodiments, with continued reference to FIG. 1, the system further comprises a feeding module 400, wherein the feeding module 400 comprises a feeding module 410 and an discharging module 420, the feeding module 410 is used for placing PCB boards which are not exposed in the loading table, the discharging module 420 is used for removing PCB boards which are exposed on the loading table, and the feeding module 410 and the discharging module 420 are located in the feeding area 124 during operation.

In the PCB exposure equipment, each loading platform sequentially passes through a feeding area 124, an th photoetching area 121, a turn-over area 122 and a second photoetching area 123, when passing through the feeding area 124, a discharging assembly 420 receives the exposed PCB, PCB which is not subjected to exposure treatment is placed on the loading platform again by the feeding assembly 410, the PCB is fixed on the loading platform, when passing through the th photoetching area 121, the th photoetching module 210 carries out front exposure on the PCB on the loading platform, when passing through the turn-over area 122, the turn-over module 300 carries out turn-over on the PCB on the loading platform, when passing through the second photoetching area 123, the second photoetching module 220 carries out back exposure on the PCB on the loading platform, and after the PCB on the loading platform is exposed, the loading platform enters the feeding area 124 again to carry out lower round exposure work.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

An exposure apparatus for a PCB board of , comprising:

the transmission module comprises a base, a rotary guide rail and a loading platform, wherein a driver is arranged in the base; the rotary guide rail is arranged on the base; the loading platform is arranged on the rotary guide rail and is connected with the driver, and the driver controls the loading platform to move on the rotary guide rail; the loading platform is used for placing the PCB;

the two photoetching modules are fixed on the base and comprise alignment assemblies and photoetching assemblies, and the alignment assemblies are fixedly connected with the photoetching assemblies; the alignment assembly is used for calibrating the relative position of the photoetching assembly and the PCB on the loading table; and

the overturning module is fixed on the base and used for overturning the PCB on the loading platform;

the rotary guide rail is sequentially provided with an th photoetching area, a turnover area and a second photoetching area, the two photoetching modules are respectively positioned in the th photoetching area and the second photoetching area, and the turnover module is positioned in the turnover area.
2. The PCB exposure apparatus of claim 1, wherein the rotating guide rail is further provided with a feeding area, and the feeding area, the th lithography area, the flip area and the second lithography area are sequentially arranged.
3. The PCB exposure apparatus according to claim 2, wherein the loading stations are provided in four, four of which are respectively located at the feeding zone, th photolithography zone, the flip zone and the second photolithography zone.
4. The PCB exposure apparatus of claim 1, wherein the alignment assembly comprises a CCD alignment system and an alignment camera, and the CCD alignment system and the alignment camera are electrically connected.
5. The PCB exposure apparatus of claim 1, wherein a clamper for fixing the PCB is disposed on the loading table.
6. The PCB exposure apparatus of claim 1, wherein the flipping module comprises a rotation mechanism, a suction cup mechanism and a linear transmission module, and the rotation mechanism is connected to the suction cup mechanism and the transmission mechanism respectively.
7. The PCB exposure apparatus of claim 2, further comprising a feeding module, wherein the feeding module is located in the feeding area.