CN209981265U - CSP light source - Google Patents

Abstract

The utility model relates to a CSP light source, including flip chip and fluorescence glue film, still include the base plate, flip chip welds on the base plate to top surface and side wall through fluorescence glue film parcel flip chip. The utility model provides a CSP light source, through with flip chip welding on the base plate, avoid the direct exposure outside of flip chip electrode face to avoid the chip electrode to be contaminated or damage in making and application process, guarantee LED's normal steady operation. The LED lamp further comprises a transparent protection adhesive layer, the transparent protection adhesive layer at least covers the top surface and the side wall of the fluorescent adhesive layer, the fluorescent adhesive layer is surrounded by the transparent protection adhesive layer, the fluorescent adhesive layer can be prevented from being polluted and damaged, the quality of light emitting is guaranteed, the uniformity and consistency of the light emitting can be guaranteed for a long time in the using process of the lamp beads, and the problem of color coordinate change of a common CSP light source in the prior art is solved.

Description

CSP light source

Technical Field

The utility model belongs to the technical field of the illumination, concretely relates to CSP light source.

Background

A Chip Scale Package (CSP) light source based on a flip Chip is characterized in that an electrode 11 is arranged on the bottom surface of a Chip 1, and a packaging colloid 2 is directly arranged on the upper surface and the side wall packaging of the Chip 1, so that the electrode 11 on the bottom surface is exposed. The five-surface luminous CSP light source is wide in application, the structure of the five-surface luminous CSP light source is as shown in figures 1 and 2, the flip chip 1 is wrapped in the fluorescent colloid 2, only the bottom electrode surface is leaked to be used for electrical connection of SMT mounting, and the blue light flip chip 1 excites the yellow-green fluorescent colloid 2 to emit white light. The CSP light source can be driven by large current, meets the same brightness requirement, can greatly reduce the using number of the light sources, has great application potential in the field of TV backlight, and can be matched with an optimized lens to make a backlight lamp body which can achieve excellent optical effect.

However, the existing CSP light source has the following drawbacks:

1) the electrode surface of the flip chip is directly exposed outside, and the electrode surface is easily polluted and damaged in the manufacturing or application process, so that the failure abnormity of the LED is caused;

2) the size of the electrode 11 of the flip chip 1 is limited by the size of the flip chip 1, the requirement on the precision of equipment at a manufacturing end and an application end is high, and the investment cost of the equipment is high;

3) the fluorescent glue 2 is directly exposed in the air without any protection, and the glue 2 is easily polluted by dust or the glue 2 is damaged by external force, so that the light quality (light color uniformity and consistency) is influenced.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model provides a CSP light source can solve prior art's part defect at least.

The embodiment of the utility model provides a CSP light source, including flip chip and fluorescence glue film, still include the base plate, flip chip weld in on the base plate, and through fluorescence glue film parcel flip chip's top surface and side wall.

As an embodiment, a projection of the flip chip in a horizontal plane is within a projection range of the substrate in the horizontal plane.

In one embodiment, a projection of the peripheral edge of the phosphor layer in the horizontal plane coincides with a projection of the peripheral edge of the substrate in the horizontal plane.

In one embodiment, the substrate includes a middle insulating section, and a positive pad and a negative pad respectively arranged on the left and right sides of the middle insulating section, and the positive electrode and the negative electrode of the flip chip are respectively and correspondingly welded on the positive pad and the negative pad.

In one embodiment, the middle insulating section is a plastic section.

In one embodiment, the positive pad and the negative pad are both copper pads.

As one embodiment, the CSP light source further includes a transparent protective adhesive layer, and the transparent protective adhesive layer at least covers the top surface and the side walls of the fluorescent adhesive layer.

As one embodiment, the transparent protective adhesive layer further covers the substrate side wall.

In one embodiment, the transparent protective adhesive layer is a silica gel layer.

As an embodiment, the flip chip is a five-sided light emitting chip.

The embodiment of the utility model provides a following beneficial effect has at least:

the utility model provides a CSP light source, through with flip chip welding on the base plate, avoid the direct exposure outside of flip chip electrode face to avoid the chip electrode to be contaminated or damage in making and application process, guarantee LED's normal steady operation.

The embodiment of the utility model provides a further following beneficial effect:

the utility model provides a CSP light source, the size of design substrate size than the chip electrode will be big, and pad on the base plate can size maximize design, reduces flip chip's manufacture equipment and application apparatus's required precision relatively to reduce the input cost effectively.

The embodiment of the utility model provides a further following beneficial effect:

the utility model provides a CSP light source surrounds the fluorescence glue film through transparent protection glue film, can prevent that the fluorescence glue film from being polluted and damaged to guarantee the quality of light-emitting, make the lamp pearl can guarantee the homogeneity and the uniformity of light-emitting for a long time in the use, solve the color coordinate change problem that ordinary CSP light source exists among the prior art; the CSP light source of the same thickness carries out high temperature ageing under the same condition, compares ordinary CSP light source, and the CSP light source that this implementation provided is owing to adopt transparent protection glue film and fluorescence glue film's packaging structure, and the light source splits the time of appearance later, and temperature resistance is better, and life is longer.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a cross-sectional view of a prior art CSP light source provided in the background art;

FIG. 2 is a bottom view of a prior art CSP light source provided in the background art;

fig. 3 is a cross-sectional view of a CSP light source provided by an embodiment of the present invention;

fig. 4 is a schematic diagram of a manufacturing process of the CSP light source provided by the embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

As shown in fig. 3, an embodiment of the present invention provides a CSP light source, including flip chip 100 and fluorescent glue layer 200, further including a substrate 300, flip chip 100 is welded on substrate 300, and the fluorescent glue layer 200 wraps up the top surface and the side wall of flip chip 100.

The flip chip 100 is a conventional device in the art, and generally includes a chip anode and a chip cathode, which are separated by an insulator, and the specific structure is not described in detail herein;

correspondingly, as shown in fig. 3, the substrate 300 also preferably includes a positive electrode pad 301 and a negative electrode pad 302, and further includes an intermediate insulating section 303, the positive electrode pad 301 and the negative electrode pad 302 are respectively arranged at the left and right sides of the intermediate insulating section 303, the positive electrode of the chip is correspondingly welded on the positive electrode pad 301, and the negative electrode of the chip is correspondingly welded on the negative electrode pad 302. Wherein, the middle insulation section 303 can be made of conventional insulation materials such as plastic section; the positive electrode pad 301 and the negative electrode pad 302 are preferably made of copper.

The CSP light source that this embodiment provided, through with flip chip 100 welding on base plate 300, avoid flip chip 100 electrode face directly to expose outside to avoid the chip electrode to be contaminated or damage in manufacturing and application process, guarantee LED's normal steady operation.

The fluorescent adhesive layer 200 is a conventional structure in the art and will not be described herein. The CSP light source provided in this embodiment is preferably a five-sided light source, that is, the flip chip 100 is configured with five light-emitting surfaces on the top surface and four side surfaces, and the phosphor layer 200 correspondingly surrounds the top surface and four side surfaces of the flip chip 100.

As a preferred embodiment, as shown in fig. 3, the size of the substrate 300 is larger than the size of the chip electrode, specifically, the projection of the flip chip 100 in the horizontal plane is located within the projection range of the substrate 300 in the horizontal plane; in the five-sided light-emitting CSP light source structure, the flip chip 100 has a square structure, and the substrate 300 is preferably a square substrate 300, and the length and width of the substrate 300 are greater than those of the upper flip chip 100. Based on the above embodiment, since the size of the substrate 300 is larger than that of the chip electrode, the pad on the substrate 300 can be designed to maximize the size, and the precision requirement on the manufacturing equipment and the application equipment of the flip chip 100 is relatively reduced, thereby effectively reducing the investment cost.

Further preferably, as shown in fig. 3, a projection of the peripheral edge of the phosphor layer 200 in the horizontal plane coincides with a projection of the peripheral edge of the substrate 300 in the horizontal plane, that is, the sum of the areas of the phosphor layer 200 and the flip chip 100 is the same as the area of the top surface of the substrate 300 below; to above-mentioned five-sided light-emitting formula CSP light source structure, this fluorescence glue film 200 corresponds to the square glue film that has the recess in the bottom, and flip chip 100 inlays promptly and locates in this recess, and the length and width size of this square glue film is the same with the length and width size of base plate 300 of below to fluorescence glue film 200 combines cuboid/cube structure with base plate 300. The structure is convenient for production, and specifically, as shown in fig. 4, a plurality of flip chips 100 can be soldered on a mother substrate 301 at intervals of a preset pitch, then the whole molding of the fluorescent glue 200 is performed on the mother substrate 301, and then the dicing is performed to make each flip chip 100 independent into a body, the mother substrate 301 is correspondingly diced into a plurality of sub-substrates 300, and each side surface of the sub-substrate 300 shares a cutting surface with each side surface of the fluorescent glue layer 200 above, that is, the structure of "the projection of the periphery of the fluorescent glue layer 200 in the horizontal plane is coincident with the projection of the periphery of the substrate 300 in the horizontal plane" is obtained, the manufacturing is convenient, and the production steps are simplified.

Further optimizing the structure of the CSP light source, as shown in fig. 3, the CSP light source further includes a transparent protective adhesive layer 400, and the transparent protective adhesive layer 400 at least covers the top surface and the side walls of the fluorescent adhesive layer 200. The transparent protective adhesive layer 400 surrounds the fluorescent adhesive layer 200, so that the fluorescent adhesive layer 200 can be prevented from being polluted and damaged, the light emitting quality is ensured, the uniformity and consistency of light emitting can be ensured for a long time in the using process of the lamp beads, and the problem of color coordinate change of a common CSP light source in the prior art is solved; the CSP light source of the same thickness carries out high temperature ageing under the same condition, and compared with the ordinary CSP light source, the CSP light source provided by the embodiment adopts the packaging structure of the transparent protective glue layer 400 and the fluorescent glue layer 200, so that the light source cracks later, the temperature resistance is better, and the service life is longer.

The transparent protective adhesive layer 400 is preferably a silica gel layer, and has better light transmittance and protective performance for the fluorescent adhesive layer 200.

Further, as shown in fig. 3, the transparent protective adhesive layer 400 also covers the side walls of the substrate 300, which is convenient for production.

Specifically, as shown in fig. 4, the CSP light source manufacturing process substantially includes the following steps:

s1, bonding a plurality of flip chips 100 in an array on the mother substrate 301;

s2, after the flip chip 100 is welded, carrying out fluorescent agent molding operation on the whole parent substrate 301;

s3, after the phosphor molding operation is completed on the mother substrate 301, performing a cutting process, wherein the mother substrate 301 is cut into a plurality of sub-substrates 300, and each flip chip 100, the sub-substrate 300 below and the peripheral phosphor layer 200 form an independent CSP light source;

s4, transferring each CSP light source after cutting to a carrier film;

s5, arranging the materials on the carrier film on the carrier plate by using a piece arranging device;

s6, after the arrangement of the sheets is completed, carrying out transparent protective glue molding operation on the carrier plate;

and S7, performing secondary cutting after the transparent protective adhesive molding operation of the carrier plate is completed, wherein only the material above the carrier plate is cut, thereby completing the coating operation of the transparent protective adhesive 400 of each CSP light source and obtaining a plurality of qualified CSP light sources.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A CSP light source comprises a flip chip and a fluorescent glue layer, and is characterized in that: the flip chip is welded on the substrate, and the top surface and the side wall of the flip chip are wrapped by the fluorescent glue layer.

2. The CSP light source of claim 1 wherein: the projection of the flip chip in the horizontal plane is positioned within the projection range of the substrate in the horizontal plane.

3. The CSP light source of claim 2 wherein: the projection of the periphery of the fluorescent glue layer in the horizontal plane is superposed with the projection of the periphery of the substrate in the horizontal plane.

4. The CSP light source of claim 1 wherein: the substrate comprises a middle insulation section, and a positive electrode pad and a negative electrode pad which are arranged on the left side and the right side of the middle insulation section in a split mode, wherein the positive electrode and the negative electrode of the flip chip are correspondingly welded on the positive electrode pad and the negative electrode pad respectively.

5. The CSP light source of claim 4 wherein: the middle insulating section is a plastic section.

6. The CSP light source of claim 4 wherein: the positive electrode bonding pad and the negative electrode bonding pad are both copper bonding pads.

7. The CSP light source of any one of claims 1 to 6 wherein: the transparent protective adhesive layer at least coats the top surface and the side wall of the fluorescent adhesive layer.

8. The CSP light source of claim 7 wherein: the transparent protective adhesive layer also coats the substrate side wall.

9. The CSP light source of claim 7 wherein: the transparent protective glue layer is a silica gel layer.

10. The CSP light source of claim 1 wherein: the flip chip is a five-sided light emitting chip.

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