CN209970598U

CN209970598U - Disassembling platform convenient for IGBT module failure analysis

Info

Publication number: CN209970598U
Application number: CN201920496041.2U
Authority: CN
Inventors: 叶娜; 谢龙飞; 王豹子; 李碧珊; 董妮
Original assignee: Xi'an Zhongche Yongji Electric Co Ltd
Current assignee: Xi'an Zhongche Yongji Electric Co Ltd
Priority date: 2019-04-12
Filing date: 2019-04-12
Publication date: 2020-01-21
Anticipated expiration: 2029-04-12

Abstract

The utility model belongs to the technical field of power electronic devices, and relates to a disassembly platform convenient for failure analysis of an IGBT module, which comprises a platform frame, wherein a jack is installed at the top of the platform frame, and the IGBT module is placed at the bottom of the platform frame; a mounting bracket is fixed around the bottom plate of the IGBT module, a mounting plate is fixed above the mounting bracket, and the mounting plate is positioned below the jack; the main electrode and the auxiliary electrode of the IGBT module are provided with electrode protection blocks; through introducing the jack, utilize lever principle, the jack passes through the mounting panel with pressure transmission to the bottom plate and realizes the complete separation of shell and bottom plate, overcomes the inefficiency that exists at the present in-process of disassembling, artifical input cost is big, secondary damage risk scheduling problem, realizes quick, the succinct dismouting of IGBT module, provides powerful support for IGBT module failure analysis.

Description

Disassembling platform convenient for IGBT module failure analysis

Technical Field

The utility model belongs to the technical field of power electronic device, a disassemble platform of IGBT module is related to, especially relate to a platform of disassembling convenient to IGBT module failure analysis.

Background

An Insulated Gate Bipolar Transistor (IGBT for short) is used as a power switch device, has many advantages of large current-carrying density, reduced saturation voltage, and the like, and is widely applied in the fields of rail transit, smart grids, industrial control, electric vehicles, and the like. Since IGBT devices are subject to electrical, thermal, radiation, and mechanical stresses during use, device failure can occur when the device is subjected to stresses that exceed maximum ratings. Wherein, the electrical stress failure is usually overvoltage, overcurrent, short circuit, exceeding a safe working area and the like; thermal stress failure is mainly overheating failure; the irradiation stress failure is mainly damage to the device by high-energy particles in the universe, and finally the device fails. Therefore, failure analysis of the IGBT device is needed for the purpose of maintaining good customer relations, improving product quality, and increasing competitiveness. The content of the failure analysis is to find the position of a failure point, characterize a failure phenomenon and determine the root cause of the failure. Failure analysis requires taking a variety of analytical measures until the root cause of the failure is found, or until the analytical measures that can be taken are exhausted.

Therefore, how to efficiently develop the failure analysis work is very important, and the basic work of the failure analysis is to disassemble the failure module. At present, the failure analysis process of the IGBT device commonly used at home and abroad comprises the following steps: appearance inspection, electrical property analysis, X-ray detection, ultrasonic scanning, plastic shell removal, silica gel removal, optical microscope detection and high-end instrument and equipment deep analysis. Through the process, the failure condition of the IGBT device is analyzed, and common failure phenomena are Vce overvoltage, Vge overvoltage, IGBT chip overcurrent, freewheeling diode overcurrent, failure exceeding RBSOA, overtemperature, failure generated by vibration, ceramic substrate crack caused by improper installation and the like. The judgment of the failure types puts high requirements on the retention of bonding wires, the surface cleanliness of the chip and the integrity of the chip, so how to avoid secondary damage in the disassembly process is of great importance to failure analysis.

At present, the disassembly process can be roughly divided into the following steps: (1) straightening the main electrode and the auxiliary electrode terminal of the IGBT module by using tweezers and diagonal pliers; (2) cutting short the main electrode and the auxiliary electrode terminal; (3) using a cross knife and other tools to separate the shell from the bottom plate at the joint between the shell and the bottom plate; (4) the circuit board is separated from the bottom plate, and the top cover and the bottom plate of the shell are completely separated; (5) in order to prevent the bonding wires, the chip surface and the like from being affected when the silica gel is removed, whether the phenomena of short circuit of the emitter and the grid bonding wires, chip damage and the like exist or not is observed when the silica gel is not removed; (6) most of the silica gel is removed, and the residual silica gel is completely removed by using a silica gel cleaning agent soaking module. Therefore, the disassembly process is completely completed by manpower, the separation between the shell and the bottom plate is not completed at one time, and the separation is realized by multiple external forces; although people try to avoid damage to bonding wires, chips and the like, the damage cannot be guaranteed, and meanwhile, a disassembling platform which is high in efficiency and saves more labor cost is not formed. When the number of modules to be disassembled is large, the manual labor can not finish the disassembling work efficiently on time.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome above-mentioned prior art's shortcoming, provide a disassemble platform convenient to IGBT module failure analysis, utilize lever principle, introduce the jack to overcome the inefficiency that the current in-process exists of disassembling, artifical input cost is big, secondary damage risk scheduling problem, realize quick, the succinct dismouting of IGBT module, provide strong support for IGBT module failure analysis.

In order to achieve the above purpose, the utility model provides a following technical scheme:

a disassembly platform convenient for failure analysis of an IGBT module comprises a platform frame, wherein a jack is installed at the top of the platform frame, and the IGBT module is placed at the bottom of the platform frame; a mounting bracket is fixed on a bottom plate of the IGBT module, a mounting plate is fixed above the mounting bracket, and the mounting plate is positioned below the jack; electrode fixing blocks are arranged outside the main electrode and the auxiliary electrode of the IGBT module.

Furthermore, a plurality of mounting holes are formed in the bottom plate, and the number of the mounting holes is the same as that of the mounting supports.

Furthermore, one end of each mounting bracket is fixedly connected with the mounting plate, and the other end of each mounting bracket is fixedly connected with the mounting hole in the corresponding position of the bottom plate, so that the IGBT module, the first fixing block for protecting the main electrode, and the mounting brackets are ensured to be in close contact with the bottom of the platform frame.

Furthermore, the size of the shell of the IGBT module is larger than that of the bottom plate, and mounting supports are arranged around the bottom plate, so that the IGBT module is guaranteed not to move in the process of applying external force.

Furthermore, the jack is a mechanical jack, the jack provides pressure for separating the shell and the bottom plate, the function of providing the pressure can be completed by adopting the mechanical jack in consideration of the space size of the disassembling platform, and the cost is low; the jack can transmit pressure to the bottom plate through the mounting plate with the support, and the shell is completely separated from the bottom plate by utilizing the principle that pressure is borne by the suspension between the shell and the bottom plate.

Further, the electrode fixing blocks comprise a first fixing block for protecting the main electrode and a second fixing block for protecting the auxiliary electrode, so that the electric performance of the main electrode and the electric performance of the auxiliary electrode are prevented from being influenced in the process of disassembling the IGBT module.

Further, the height of the first fixing block and the height of the second fixing block are the same as the distance from the lower surface of the mounting plate to the upper surface of the IGBT module.

Compared with the prior art, the utility model provides a technical scheme includes following beneficial effect: by adding the design of the mounting bracket, the mounting plate and the jack, the mounting bracket is used for clamping the periphery of the bottom plate, and the IGBT module is ensured not to move in the process of applying external force; the jack can transmit pressure to the bottom plate through the mounting plate with the support, and the shell is completely separated from the bottom plate by utilizing the principle that pressure is borne by the suspension between the shell and the bottom plate. In a word, this platform of disassembling convenient to IGBT module failure analysis utilizes the lever principle of jack to realize the convenient dismantlement between IGBT module bottom plate and shell in-service use, improves and disassembles efficiency, liberates the manpower.

Drawings

Fig. 1 is a top view of an IGBT module provided by the present invention;

fig. 2 is the utility model provides a structure schematic diagram of platform disassembles convenient to IGBT module failure analysis.

Wherein: 1 is a platform frame; 2 is a jack; 3 is an IGBT module; 4 is a bottom plate; 5 is a mounting bracket; 6 is a mounting plate; 7 is a main electrode; 8 is an auxiliary electrode; 9 is an electrode fixing block; and 10 is a shell.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of structures consistent with certain aspects of the invention, as detailed in the appended claims.

In order to make those skilled in the art better understand the technical solution of the present invention, the present invention will be further described in detail with reference to the accompanying drawings and the embodiments.

Examples

Referring to fig. 1-2, the utility model provides a disassembly platform convenient for failure analysis of an IGBT module, which comprises a platform frame 1, wherein a jack 2 is installed at the top of the platform frame 1, and an IGBT module 3 is placed at the bottom of the platform frame 1; a mounting bracket 5 is fixed on a bottom plate 4 of the IGBT module 3, a mounting plate 6 is fixed above the mounting bracket 5, and the mounting plate 6 is positioned below the jack 2; electrode fixing blocks 9 are arranged outside the main electrode 7 and the auxiliary electrode 8 of the IGBT module 3.

Furthermore, a plurality of mounting holes are formed in the bottom plate 4, and the number of the mounting holes is the same as that of the mounting brackets 5.

Further, one end of each mounting bracket 5 is fixedly connected with the mounting plate 6, and the other end of each mounting bracket is fixedly connected with the mounting hole at the corresponding position of the bottom plate 4, so that the IGBT module 3, the first fixing block for protecting the main electrode 7, and the mounting bracket 5 are ensured to be in close contact with the bottom of the platform frame 1.

Further, the size of the shell 10 of the IGBT module 3 is larger than that of the bottom plate 4, and the installation supports 5 are arranged on the periphery of the bottom plate, so that the IGBT module 3 is guaranteed not to move in the process of applying external force.

Further, the jack 2 is a mechanical jack which transmits pressure to the base plate 4 through the mounting plate 6 to achieve complete separation of the housing 10 from the base plate 4. Because the jack 2 provides the pressure for separating the shell 10 and the bottom plate 4, the function of providing the pressure can be completed by adopting a mechanical jack in consideration of the space size of the disassembled platform, and the price is lower; the jack 2 can transmit the pressure to the bottom plate 4 through the mounting plate 6 with the bracket, and the shell 10 and the bottom plate 4 are completely separated by utilizing the principle that the pressure is born in the air between the shell 10 and the bottom plate 4.

Further, the electrode protection block 9 includes a first fixing block for protecting the main electrode 7 and a second fixing block for protecting the auxiliary electrode 8, so as to avoid affecting the electrical performance of the main electrode 7 and the auxiliary electrode 8 in the process of disassembling the IGBT module 3 by using the disassembling platform.

Further, the height of the first fixing block and the height of the second fixing block are the same as the distance from the lower surface of the mounting board 6 to the upper surface of the IGBT module 3.

This platform of disassembling convenient to GBT module failure analysis, in the work of disassembling of reality, IGBT module 3 places in platform frame 1's bottom, and jack 2 installs in platform frame 1's top, realizes that the concrete flow of bottom plate 4 and shell 10 separation is as follows: after the main electrode 7 and the auxiliary electrode 8 are straightened artificially, the eight mounting brackets 5 are used for clamping the periphery of the bottom plate 4 through the eight mounting holes of the bottom plate 4 by utilizing the characteristic that the size of the shell 10 is slightly larger than that of the bottom plate 4 (see fig. 1), so that the IGBT module 3 is ensured not to move in the external force application process; then, the main electrode 7 and the auxiliary electrode 8 are fixed by using the first electrode fixing block and the second electrode fixing block respectively, and the mounting plate 6 with eight mounting holes is fixedly connected with the other ends of the eight mounting brackets 5, so that the IGBT module 3, the first electrode fixing block, the second electrode fixing block and the mounting brackets 5 are ensured to be in close contact with the bottom of the platform frame 1; jack 2 is direct to exert pressure to mounting panel 6, and pressure acts on bottom plate 4 through installing support 5 at last, utilizes the unsettled principle of bearing pressure between shell 10 and bottom plate 4, can realize the complete separation of shell 10 and bottom plate 4, disassembles fast, succinctly, provides powerful support for IGBT module 3's failure analysis, effectively solved current IGBT module 3's failure analysis disassembles the inefficiency that the in-process exists, artifical input is big, secondary damage risk scheduling problem.

The above description is only exemplary of the invention, and is intended to enable those skilled in the art to understand and implement the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention.

It is to be understood that the present invention is not limited to what has been described above, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.

Claims

1. A disassembly platform convenient for IGBT module failure analysis is characterized by comprising a platform frame (1), wherein a jack (2) is installed at the top of the platform frame (1), and an IGBT module (3) is placed at the bottom of the platform frame (1); a mounting bracket (5) is fixed on a bottom plate (4) of the IGBT module (3), a mounting plate (6) is fixed above the mounting bracket (5), and the mounting plate (6) is positioned below the jack (2); electrode fixing blocks (9) are arranged outside the main electrode (7) and the auxiliary electrode (8) of the IGBT module (3).

2. The disassembly platform convenient for IGBT module failure analysis according to claim 1, characterized in that the bottom plate (4) is provided with a plurality of mounting holes, and the number of the mounting holes is the same as the number of the mounting brackets (5).

3. The disassembly platform convenient for IGBT module failure analysis according to claim 2, characterized in that one end of each mounting bracket (5) is fixedly connected with the mounting plate (6), and the other end is fixedly connected with the mounting hole at the corresponding position of the bottom plate (4).

4. A deconstructing platform facilitating IGBT module failure analysis according to any one of claims 1-3, wherein the dimensions of the housing (10) of the IGBT module (3) are larger than the dimensions of the bottom plate (4).

5. A disassembly platform facilitating failure analysis of IGBT modules according to any of claims 1-3, wherein the jacks (2) are mechanical jacks that transfer pressure to the bottom plate (4) through the mounting plate (6) to achieve complete separation of the housing (10) from the bottom plate (4).

6. A disassembly platform facilitating IGBT module failure analysis according to any of claims 1-3, characterized in that the electrode fixing block (9) comprises a first fixing block for protecting a main electrode (7) and a second fixing block for protecting an auxiliary electrode (8).

7. The disassembly platform for facilitating IGBT module failure analysis according to claim 6, characterized in that the height of the first and second fixing blocks is the same as the distance from the lower surface of the mounting plate (6) to the upper surface of the IGBT module (3).