CN209969072U - Chip cleaning device for chip brushing machine - Google Patents
Chip cleaning device for chip brushing machine Download PDFInfo
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- CN209969072U CN209969072U CN201920753166.9U CN201920753166U CN209969072U CN 209969072 U CN209969072 U CN 209969072U CN 201920753166 U CN201920753166 U CN 201920753166U CN 209969072 U CN209969072 U CN 209969072U
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- brushing
- air draft
- removal mechanism
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Abstract
The utility model relates to a processing technology field of sapphire wafer especially relates to a wafer brush mascerating machine bits clearing device. The device comprises a sheet brushing table, a water inlet device and an air draft dust removal mechanism; the brush piece platform is provided with a rotary sucker which can suck the wafer to rotate at a high speed along with the motor; an overflow groove is arranged outside the brushing platform; the air draft dust removal mechanism is arranged on the periphery of the side face of the wafer brushing table and is used for sucking the burrs on the surface of the wafer; the air draft dust removal mechanism is detachably provided with a dust removal chamber, so that the absorbed burrs on the surface of the wafer enter the dust removal chamber; the water inlet device penetrates through the air draft dust removal mechanism and extends to the position near the rotary sucker. Adopt wafer brush mascerating machine hair bits clearing device, can clear away the hair bits that brush piece in-process produced, improve wafer product quality and stability.
Description
Technical Field
The utility model relates to a processing technology field of sapphire wafer especially relates to a wafer brush mascerating machine bits clearing device.
Background
In the sapphire wafer processing process, the surface of the wafer can be adhered with dirt, the requirement on the cleanliness of the surface of the wafer in actual production is high, and a cleaning process and a brushing process are needed to remove the dirt and particles on the surface of the wafer so as to meet the high requirement on the cleanliness of the surface of the wafer.
The prior art generally utilizes the liquid medicine to wash the back and carries out the brush piece, the hair chips of brush piece machine helps cleaing away the dirty and tiny particle on wafer surface, in addition wafer surface water spray, the brush piece effect that helps reinforcing brush, but current brush head material is mostly the sponge, brush piece in-process and wafer friction, can produce some hair chips tiny particle, the adhesion is at the wafer back, cause the influence to the cleanliness factor on wafer surface, and sponge hair chips weight is lighter and the volume is less, it is difficult to wash it clean with the high pressure water to remove, and the wafer is comparatively fragile, there is the possibility of damaging the wafer with the high pressure water washing. Therefore, it is necessary to develop a lint removing device for a brush sheet machine, which removes the lint generated during the brush sheet process and improves the product quality and stability.
SUMMERY OF THE UTILITY MODEL
To the above-mentioned defect that prior art exists, the utility model provides a wafer brush mascerating machine bits clearing device.
The utility model discloses an adopt following technical scheme to realize:
a chip brushing machine flock removing device comprises a chip brushing table, a water inlet device and an air draft dust removal mechanism;
the brush piece platform is provided with a rotary sucker which can suck the wafer to rotate at a high speed along with the motor; an overflow groove is arranged outside the brushing platform;
the air draft dust removal mechanism is arranged on the periphery of the side face of the wafer brushing table and is used for sucking the burrs on the surface of the wafer; the air draft dust removal mechanism is detachably provided with a dust removal chamber, so that the absorbed burrs on the surface of the wafer enter the dust removal chamber;
the water inlet device penetrates through the air draft dust removal mechanism and extends to the position near the rotary sucker.
Furthermore, the chip brushing machine chip removing device also comprises an air supply mechanism which is arranged at the upper part of the chip brushing table and blows the chips on the surface of the chip.
Further, the air supply mechanism and the air exhaust and dust removal mechanism arranged on the periphery of the side face of the brush piece table form a closed flock removing cavity.
Furthermore, the water inlet device is provided with an upper water inlet device and a lower water inlet device, and the upper water inlet device and the lower water inlet device penetrate through the air draft dust removal mechanism and respectively extend to the positions near the upper surface and the lower surface of the rotary sucker.
Furthermore, the sheet brushing platform is provided with a slope surface which inclines from the middle to the left side and the right side, and the left side and the right side are both provided with overflow chutes.
The utility model has the advantages that:
by adopting the chip cleaning device of the wafer brushing machine of the utility model, the chips generated in the process of brushing the chip by the brush can be cleaned, and the quality and the stability of the wafer product are improved; the air draft dust removal mechanism is used for extracting the burrs on the surface of the wafer, so that the wafer is not required to be directly contacted or impacted, and the wafer is prevented from being damaged; after air draft and dust removal, the upper surface and the lower surface of the sapphire wafer are washed simultaneously, residual burrs are removed, and the cleanliness of the surface of the sapphire wafer is ensured; the air supply mechanism is arranged, so that the surface of the wafer is further ensured to be completely dry, and the burrs on the surface of the wafer can be blown up, thereby being more beneficial to air draft and dust removal.
Drawings
Fig. 1 is a schematic sectional structure diagram I of the present invention.
Fig. 2 is a schematic sectional structure diagram II of the present invention.
Fig. 3 is a schematic structural view of the brush piece table and the water inlet device of the present invention.
In the figure:
1. a sheet brushing table; 3. an air supply mechanism; 4. an air draft dust removal mechanism; 11. rotating the sucker; 12. an overflow trough; 21. an upper water inlet device; 22. and a lower water inlet device.
Detailed Description
In order to make the purpose and technical solution of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings.
As shown in fig. 1 to 3, a chip cleaning device for a wafer brushing machine comprises a brushing table 1, a water inlet device and an air draft dust removal mechanism 4;
the brushing table 1 is provided with a rotary sucker 11 which can suck the wafer to rotate at a high speed along with a motor so as to dehydrate and dry the surface of the wafer;
an overflow groove 12 is arranged on the outer side of the sheet brushing platform 1, and water on the surface of the sheet brushing platform 1 flows into the overflow groove 12 to be collected and then is treated uniformly;
the air draft dust removal mechanism 4 is arranged on the periphery of the side surface of the wafer brushing table 1 and is used for sucking the burrs on the surface of the wafer; the air draft dust removal mechanism 4 is detachably provided with a dust removal chamber, so that the absorbed chips on the surface of the wafer enter the dust removal chamber; after the burrs on the surface of the wafer are sucked, the dust removal chamber can be detached, and the burrs inside the dust removal chamber are cleaned.
The air draft dust removal mechanism 4 absorbs the flock through a dust absorption opening by utilizing the principle of a dust collector, so that the flock finally enters the dust removal chamber.
The water inlet device passes through the air draft dust removing mechanism 4 and extends to the vicinity of the rotary suction cup 11, so that the water flushing treatment can be performed on the surface of the wafer attached to the rotary suction cup 11.
The water inlet device is provided with an upper water inlet device 21 and a lower water inlet device 22, and the upper water inlet device and the lower water inlet device penetrate through the air draft dust removal mechanism 4 and respectively extend to the positions near the upper surface and the lower surface of the rotary sucker 11, so that the upper surface and the lower surface of a wafer can be cleaned simultaneously.
The upper water inlet device 21 and the lower water inlet device 22 can be an upper water inlet pipe and a lower water inlet pipe, and are connected with a water tap to control water inlet and flushing.
The sheet brushing table 1 can be provided with a slope surface which inclines from the middle to the left side and the right side, and the left side and the right side are both provided with overflow chutes 12, so that water on the surface of the sheet brushing table 1 can rapidly flow into the overflow chutes 12.
When the sapphire wafer brushing machine is used, a sapphire wafer brushed and washed by the wafer brushing machine is flatly placed and adsorbed on the rotary sucker 11, the rotary sucker 11 is started to rotate at a high speed, and water throwing treatment is carried out on the surface of the wafer; after the surface of the wafer is completely dried, starting the air draft dust removal mechanism 4, and pumping the burrs on the surface of the wafer into the dust removal chamber; closing the air draft dust removal mechanism 4, starting the water inlet device, washing the upper surface and the lower surface of the sapphire wafer, and removing residual flock; and starting the rotary sucker 11 to rotate at a high speed, and carrying out water throwing treatment on the surface of the wafer again, thereby ensuring the cleanliness of the surface of the sapphire wafer.
As another improvement of the utility model, the chip removing device of the wafer brushing machine further comprises an air supply mechanism 3 which is arranged on the upper part of the brushing platform 1 and blows the chips on the surface of the wafer.
The air supply mechanism 3 is an air blowing device in the prior art, is connected with a power supply, blows to promote the drying of the surface of the wafer and separates the burrs on the surface of the wafer from the wafer.
When the sapphire wafer brushing machine is used, a sapphire wafer brushed and washed by the wafer brushing machine is flatly placed and adsorbed on the rotary sucker 11, the rotary sucker 11 is started to rotate at a high speed, and water throwing treatment is carried out on the surface of the wafer; after the surface of the wafer is dried, the air supply mechanism 3 is started to further ensure that the surface of the wafer is completely dried, and the burrs on the surface of the wafer are blown up, so that the chips are favorably and quickly sucked into the air draft dust removal mechanism 4; starting the air draft dust removal mechanism 4, and pumping the burrs on the surface of the wafer into the dust removal chamber; closing the air draft dust removal mechanism 4, starting the water inlet device, washing the upper surface and the lower surface of the sapphire wafer, and removing residual flock; and starting the rotary sucker 11 to rotate at a high speed, and carrying out water throwing treatment on the surface of the wafer again, thereby ensuring the cleanliness of the surface of the sapphire wafer.
The utility model discloses can extensively apply to sapphire processing cleaning technology occasion.
In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "communicating" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
The above description is only for the preferred embodiment of the present invention, and the present invention is not limited thereto, and all the equivalent modifications, equivalent replacements and improvements made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (5)
1. A chip brushing machine flock removing device is characterized by comprising a chip brushing table (1), a water inlet device and an air draft dust removal mechanism (4);
the piece brushing table (1) is provided with a rotary sucker (11) which can suck the wafer to rotate at a high speed along with a motor; an overflow groove (12) is arranged at the outer side of the sheet brushing platform (1);
the air draft dust removal mechanism (4) is arranged on the periphery of the side face of the wafer brushing table (1) and is used for sucking the burrs on the surface of the wafer; the air draft dust removal mechanism (4) is detachably provided with a dust removal chamber, so that the absorbed chips on the surface of the wafer enter the dust removal chamber;
the water inlet device passes through the air draft dust removal mechanism (4) and extends to the position near the rotary sucker (11).
2. The chip cleaning device of a wafer brushing machine according to claim 1, characterized in that the chip cleaning device further comprises an air supply mechanism (3) arranged at the upper part of the brushing table (1) and used for blowing the chips on the surface of the wafer.
3. The chip cleaning device of the wafer brushing machine according to claim 2, characterized in that the air supply mechanism (3) and the air draft dust removal mechanism (4) arranged at the periphery of the side surface of the brushing table (1) form a closed chip cleaning chamber.
4. The chip cleaning device of a wafer brushing machine according to claim 1, characterized in that the water inlet device is provided with an upper water inlet device (21) and a lower water inlet device (22) which respectively extend to the vicinity of the upper surface and the lower surface of the rotary suction cup (11) through the air draft dust removal mechanism (4).
5. The chip cleaning device of a wafer brushing machine according to claim 1, characterized in that the brushing table (1) has a slope surface inclined from the middle to the left and right sides, and the left and right sides are provided with overflow chutes (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920753166.9U CN209969072U (en) | 2019-05-24 | 2019-05-24 | Chip cleaning device for chip brushing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920753166.9U CN209969072U (en) | 2019-05-24 | 2019-05-24 | Chip cleaning device for chip brushing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209969072U true CN209969072U (en) | 2020-01-21 |
Family
ID=69263653
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920753166.9U Active CN209969072U (en) | 2019-05-24 | 2019-05-24 | Chip cleaning device for chip brushing machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209969072U (en) |
-
2019
- 2019-05-24 CN CN201920753166.9U patent/CN209969072U/en active Active
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