CN209963185U

CN209963185U - Temperature control device for busbar

Info

Publication number: CN209963185U
Application number: CN201921046017.5U
Authority: CN
Inventors: 王星旭
Original assignee: Hefei Guoxuan High Tech Power Energy Co Ltd
Current assignee: Hefei Gotion High Tech Power Energy Co Ltd
Priority date: 2019-07-05
Filing date: 2019-07-05
Publication date: 2020-01-17
Anticipated expiration: 2029-07-05

Abstract

The utility model discloses a temperature control device for busbar, tray including fixed connection at the busbar bottom face, the busbar upper end is equipped with temperature control portion, temperature control portion include at least a slice set up in the semiconductor refrigeration piece of busbar upper end, the semiconductor refrigeration piece is connected with power supply portion through connecting wire, and this application heats or refrigerates to the busbar through semiconductor refrigeration piece through setting up multi-disc semiconductor refrigeration piece in busbar department, has effectually reduced the volume and the security performance of thermal management equipment to increase the silica gel conducting strip between semiconductor refrigeration piece and busbar, therefore can effectually increase the ability of the heat flow between busbar and the semiconductor refrigeration piece, improved the efficiency that the semiconductor refrigeration piece was to the refrigeration of busbar or heated.

Description

Temperature control device for busbar

Technical Field

The utility model relates to a battery module heat management technical field specifically is a temperature control device for busbar.

Background

The battery thermal management is based on the influence of temperature on the battery performance, the combination of the electrochemical characteristics and the heat production mechanism of the battery, the optimal charging and discharging temperature interval of the specific battery, and the establishment of reasonable design on the basis of the multidisciplinary fields of materials science, electrochemistry, heat transfer science, molecular dynamics and the like, and aims to solve the problem of heat dissipation or thermal runaway caused by the battery working under the condition of overhigh or overlow temperature.

The thermal management is a difficult problem which always puzzles people, the heating value of the bus is large, and therefore the temperature of the bus is required to be controlled, but most of the existing thermal management is to cool the battery, and the position of the bus with high heating is often ignored, so that the temperature management capability of the bus is insufficient.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a temperature control device for busbar to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides a temperature control device for busbar, includes the tray of fixed connection at the busbar bottom face, the busbar upper end is equipped with temperature control portion, temperature control portion include at least a slice set up in the semiconductor refrigeration piece of busbar upper end, the semiconductor refrigeration piece is connected with power supply portion through connecting wire.

As a further aspect of the present invention: and one end of the tray, which is close to the busbar, is provided with a mounting groove for clamping the busbar.

As a further aspect of the present invention: the tray is a plastic tray.

As a further aspect of the present invention: the semiconductor refrigeration piece is provided with four pieces.

As a further aspect of the present invention: the semiconductor refrigeration piece with be connected with the conducting strip between the busbar, the conducting strip is equipped with a slice at least.

As a further aspect of the present invention: the heat-conducting fins are provided with four heat-conducting fins and four refrigerating fins which are arranged in a one-to-one correspondence mode, and the area of each heat-conducting fin is not smaller than that of the busbar.

As a further aspect of the present invention: the heat conducting fins are silica gel heat conducting fins.

As a further aspect of the present invention: the connecting wires comprise cooling wires for communicating with the refrigerating circuit and heating wires for communicating with the heating circuit.

As a further aspect of the present invention: the protective cover is detachably connected to the upper portion of the tray, and the busbar, the heat conducting fins and the temperature control portion are in press connection with the upper portion of the tray through the protective cover.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the bus bar is heated or cooled by the semiconductor refrigeration pieces, and the semiconductor refrigeration pieces are small in size, safe and free of liquid cooling liquid leakage, so that the size and safety performance of the heat management equipment are effectively reduced, and the silica gel heat conducting pieces are additionally arranged between the semiconductor refrigeration pieces and the bus bar, so that the heat flowing capacity between the bus bar and the semiconductor refrigeration pieces can be effectively improved, and the refrigerating or heating efficiency of the semiconductor refrigeration pieces on the bus bar is improved;

2. the refrigeration equipment of the application is simple in structure and small in occupied space, and can be quickly assembled and fixed through the protective cover and the tray, so that the assembling speed of the battery heat management equipment is greatly improved.

Drawings

FIG. 1 is an exploded view of the structure of the present invention;

FIG. 2 is a schematic view of the structure of the temperature control part of the present invention;

FIG. 3 is a schematic diagram of the temperature control unit of the present invention;

FIG. 4 is a working schematic diagram of the refrigeration working condition of the present invention;

FIG. 5 is the original diagram of the heating operation of the utility model;

FIG. 6 is a schematic structural view of a heat conducting fin of the present invention;

fig. 7 is a schematic view of the tray structure of the present invention.

In the figure: 1-protective cover, 2-temperature control part, 21-semiconductor refrigeration piece, 22-power supply part, 23-connecting wire, 231-cooling wire, 232-heating wire, 3-heat conduction piece, 4-bus bar, 5-tray, 51-mounting groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-7, in an embodiment of the present invention, a temperature control device for a bus bar includes a tray 5, the tray 5 is a plastic tray, a protective cover 1 is detachably connected above the tray 5, a mounting groove 51 is formed at an end of the tray 5 close to the protective cover 1, a bus bar 4 is disposed above the tray 5, the bus bar 4 is clamped in the mounting groove 51, and further the bus bar 4 is limited and fixed by the mounting groove 51, a temperature control portion 2 is disposed above the bus bar 4, the temperature control portion 2 includes at least one semiconductor refrigeration sheet 21, the semiconductor refrigeration sheet 21 is connected to a power supply portion 22 by a connection wire 23, the power supply portion 22 is a power supply end capable of supplying direct current to the refrigeration sheet 21, in this embodiment, the refrigeration sheet 21 has four semiconductor refrigeration sheets, and the four semiconductor refrigeration sheets 21 are arranged in bilateral symmetry, the connection wire 23 includes a cooling wire 231 for communicating the refrigeration circuit and a heating wire 232 for communicating the heating circuit, when the semiconductor cooling plate 21 is communicated with the power supply part through the cooling wire 231, the temperature control part 2 is in a working state of cooling the bus bar 4, as shown in fig. 4, the semiconductor cooling plate 21 conducts heat from one side close to the bus bar 4 to one side close to the protective cover 1, and thus the bus bar 4 can be cooled; when the semiconductor cooling plate 21 is communicated with the power supply part through the heating wire 232, the temperature control part 2 is in a working state of heating the bus bar 4, as shown in fig. 5, the semiconductor cooling plate 21 conducts heat from one side close to the protective cover 1 to one side close to the bus bar 4, and then the bus bar 4 can be cooled;

the heat conducting fins 3 are arranged between the temperature control part 2 and the bus bar 4, at least one heat conducting fin 3 is arranged, in the embodiment, four heat conducting fins 3 are arranged and are in one-to-one correspondence with the semiconductor refrigerating fins 21, the area of each heat conducting fin 3 is not smaller than that of the bus bar 4, namely, the heat conducting fins 3 are connected with the bus bar 4 at any positions of the upper end of the bus bar 4, so that the heat conducting capacity can be ensured, in the embodiment, the heat conducting fins 3 are silica gel heat conducting fins, and the heat conducting capacity is ensured on the premise that the heat conducting fins have flexibility and insulating capacity;

in addition, the bus bar 4, the heat conducting sheet 3, and the temperature control part 2 in this embodiment are all pressed onto the upper end of the tray 5 through the protective cover 1, and are fixedly connected with the tray 5 through the protective cover 1, so that the bus bar 4, the heat conducting sheet 3, and the temperature control part 2 are fixed between the protective cover 1 and the tray 5, and the power supply part 22 in the temperature control part 2 is located outside the tray 5 so as to be connected with other power supply circuits or control circuits of the vehicle.

The utility model discloses when using, when needs refrigerate busbar 4, as shown in fig. 4, power supply portion 22 is connected with semiconductor refrigeration piece 21 through cooling wire 231, the one end intercommunication that the direct current positive pole in the power supply portion 22 and the N type semiconductor in the semiconductor refrigeration piece 21 are close to promptly, the one end and the negative pole intercommunication of P type semiconductor, the electric current flows to N type semiconductor from the positive pole, then flow back to the negative pole behind the P type semiconductor, therefore the inflow end of N type semiconductor is the cold level, the one end that is close to busbar 4 becomes the cold level promptly, and pass to the position department that is close to visor 1 with the heat that busbar 4 was located continuously, because be equipped with a plurality of N type semiconductors and the P type semiconductor of establishing ties in proper order in semiconductor refrigeration piece 21, and then can improve the heat-sinking capability of semiconductor refrigeration piece 21;

when it is necessary to heat the bus bar 4, as shown in fig. 5, the positive electrode of the dc power supply is connected to the P-type semiconductor, the negative electrode of the dc power supply is connected to the N-type semiconductor, current flows from the positive electrode of the dc power supply, then flows through the P-type semiconductor, the N-type semiconductor and then flows into the negative pole of the power supply, at this moment, the inflow end of the P-type semiconductor is a cold stage, that is, one end near the protective cover 1 becomes a cold stage, and the heat at the protective cover 1 is continuously conducted to a position near the bus bar 4, so that the bus bar 4 can be heated, and further, during the heating process, when the cell heating speed is lower than the bus bar 4, a temperature difference is generated between the cell and the bus bar 4, make the heat on the busbar 4 remove to the electric core under the drive of temperature difference, thus also can heat the electric core through the semiconductor refrigeration piece 21 of this application.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. The utility model provides a temperature control device for busbar, includes tray (5) of fixed connection in busbar (4) bottom end face, its characterized in that: busbar (4) upper end is equipped with control by temperature change portion (2), control by temperature change portion (2) including at least one slice set up in semiconductor refrigeration piece (21) of busbar (4) upper end, semiconductor refrigeration piece (21) are connected with power supply portion (22) through connecting wire (23).

2. The temperature control device for the bus bar according to claim 1, wherein an installation groove (51) for clamping the bus bar is opened at one end of the tray (5) close to the bus bar (4).

3. Temperature control device for busbars according to claim 1, characterised in that the tray (5) is a plastic tray.

4. The temperature control device for a busbar according to claim 1, wherein said semiconductor cooling plate (21) is provided with four plates.

5. The temperature control device for a busbar according to claim 4, wherein a heat conducting sheet (3) is connected between the semiconductor cooling sheet (21) and the busbar (4), and at least one sheet is provided on the heat conducting sheet (3).

6. The temperature control device for the bus bar according to claim 5, wherein the heat conducting plate (3) is provided with four pieces, and the four pieces of the heat conducting plate (3) and the four pieces of the refrigerating plate (21) are arranged in a one-to-one correspondence, and the area of the heat conducting plate (3) is not smaller than that of the bus bar (4).

7. The temperature control device for a busbar according to claim 5 or 6, wherein said heat conducting sheet (3) is a silicone heat conducting sheet.

8. The temperature control device for a bus bar as set forth in claim 1, wherein said connection wire (23) comprises a cooling wire (231) for communicating with a cooling circuit and a heating wire (232) for communicating with a heating circuit.

9. The temperature control device for the busbar according to claim 1, wherein a protective cover (1) is detachably connected to the upper end of the tray (5), and the busbar (4), the heat conducting sheet (3) and the temperature control part (2) are pressed above the tray (5) through the protective cover (1).