CN209963040U - Sucking disc device for wafer cutting - Google Patents
Sucking disc device for wafer cutting Download PDFInfo
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- CN209963040U CN209963040U CN201921149983.XU CN201921149983U CN209963040U CN 209963040 U CN209963040 U CN 209963040U CN 201921149983 U CN201921149983 U CN 201921149983U CN 209963040 U CN209963040 U CN 209963040U
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- sucking disc
- adsorption tank
- wafer
- vacuum channel
- disc body
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Abstract
The utility model discloses a sucking disc device for wafer cutting, include the circular shape sucking disc body and establish at this internal vacuum channel of sucking disc, set up a plurality of adsorption tanks in the same centre of a circle on the sucking disc body, the slope of adsorption tank both sides wall sets up and forms "V" font, a plurality of through-holes have been seted up to the adsorption tank bottom, through-hole and vacuum channel intercommunication, be equipped with the filter screen on the through-hole, vacuum channel intercommunication has the intake pipe, the intake pipe passes the bottom of sucking disc body and links to each other with the vacuum pump through first connecting tube, be equipped with first valve on the first connecting tube. The utility model discloses can adsorb the wafer effectively, the difficult jam of vacuum channel, the frequency of shutting down the maintenance is low, and production efficiency is high.
Description
Technical Field
The utility model relates to a semiconductor manufacturing technical field especially relates to a sucking disc device for wafer cutting.
Background
During the dicing process, the wafer is fixed, and the wafer is usually sucked onto the surface of the chuck by using a vacuum chuck to generate a low-pressure vacuum. All be equipped with vacuum channel in the current vacuum chuck, the surface is equipped with the adsorption tank, and the wafer can produce the piece in cutting process, and these pieces fall into vacuum channel easily and take place to block up, influence vacuum adsorption power to influence adsorption stability, lead to absorbent wafer to drop when serious, greatly increased shut down the frequency and the maintenance cost of maintenance, production efficiency reduces, and people are comparatively hard when the piece impurity of adsorption tank when clearing up in addition.
Disclosure of Invention
The utility model aims to provide a: the sucking disc device for wafer cutting can effectively adsorb wafers, a vacuum channel is not easy to block, the frequency of shutdown maintenance is low, and the production efficiency is high.
The utility model adopts the technical scheme as follows:
the utility model provides a sucking disc device for wafer cutting, includes the circular shape sucking disc body and establishes at this internal vacuum passageway of sucking disc, set up a plurality of adsorption tanks in the same centre of a circle on the sucking disc body, the slope of adsorption tank both sides wall sets up and forms "V" font, a plurality of through-holes have been seted up to the adsorption tank bottom, through-hole and vacuum passageway intercommunication, be equipped with the filter screen on the through-hole, vacuum passageway intercommunication has the intake pipe, the intake pipe passes the bottom of sucking disc body and links to each other with the vacuum pump through first connecting tube, be equipped with first valve on the first connecting tube.
The utility model discloses a theory of operation does:
put sucking disc body upper surface with the wafer, start the vacuum pump and produce the negative pressure and adsorb the wafer firmly on sucking disc body surface, piece impurity that produces during the cutting etc. fall into the adsorption tank, because be equipped with the filter screen on the through-hole of adsorption tank bottom, consequently piece impurity etc. can not get into vacuum channel by the filter screen interception, avoided leading to the fact the jam to vacuum channel, the influence is when the manual work is cleared up the adsorption tank, because the slope of adsorption tank both sides wall sets up and is "V" font, it is more convenient when making people clean the adsorption tank, can clearly see the piece of adsorption tank bottom, can not have the dead angle to remain piece impurity.
Furthermore, the included angle between the two side walls of the adsorption tank and the vertical direction is 30-50 degrees, so that people can find the scrap impurities at corners more easily during cleaning, the cleaning is convenient, and no residue is left.
Furthermore, the outer protective layer is arranged on the periphery of the sucker body, so that when ions are used for cutting, the side face and other parts of the sucker body can be effectively prevented from being damaged by ion beams.
Further, the intake pipe still communicates there is the second connecting tube, the second connecting tube links to each other with the blower, be equipped with the second valve on the second connecting tube, start the blower and blow in to vacuum passage, can blow away the piece impurity on the filter screen, prevent that the manual work from cleaning when cleaning the adsorption tank thoroughly.
Furthermore, the lower surface of the wafer can completely cover the upper surface of the sucker body, and when ions are used for cutting, the ion beams can be effectively prevented from damaging the surface of the sucker body.
To sum up, owing to adopted above-mentioned technical scheme, the beneficial effects of the utility model are that:
1. the utility model discloses a be equipped with the filter screen on the through-hole of adsorption tank bottom, piece impurity etc. are blocked by the filter screen and can not get into vacuum channel, have avoided causing the jam to vacuum channel, ensure that vacuum adsorption can adsorb the wafer steadily, the frequency of the shut down maintenance of messenger reduces, and production efficiency obtains improving.
2. The utility model discloses a set up the slope of adsorption tank both sides wall into "V" font, people can discover the piece impurity in corner more easily when cleaning the adsorption tank, and convenient clearance can not have and remain.
3. The utility model discloses a be equipped with the outer protective layer in sucking disc body periphery, when using the ion to cut, can prevent effectively that the ion beam from causing the damage to the side of sucking disc body and other positions.
4. The utility model discloses in, the intake pipe intercommunication has the second connecting tube, and the second connecting tube and the pump intercommunication of blowing start the pump of blowing and blow in to vacuum channel, can blow away the piece impurity on the filter screen, can prevent that the manual work from cleaning when cleaning the adsorption tank thoroughly.
Drawings
The invention will now be described, by way of example, with reference to the accompanying drawings, in which:
FIG. 1 is a block diagram of the present invention;
fig. 2 is a plan view of the present invention.
Labeled as: the method comprises the following steps of 1-a sucker body, 2-an adsorption groove, 21-a through hole, 3-a vacuum channel, 4-an air inlet pipe, 5-a filter screen, 6-an outer protective layer, 7-a wafer, 8-a vacuum pump, 9-a first valve, 10-an air blowing pump, 11-a second valve, 12-a first connecting pipeline and 13-a second connecting pipeline.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1
The utility model provides a sucking disc device for wafer cutting, includes circular shape sucking disc body 1 and establishes the vacuum channel 3 in sucking disc body 1, set up a plurality of concentric adsorption tanks 2 on the sucking disc body 1, 2 both sides wall slopes of adsorption tank set up and form "V" font, a plurality of through-holes 21 have been seted up to 2 bottoms in adsorption tank, through- hole 21 and 3 intercommunications of vacuum channel, be equipped with filter screen 5 on the through- hole 21, 3 intercommunications of vacuum channel have intake pipe 4, intake pipe 4 passes the bottom of sucking disc body 1 and links to each other with vacuum pump 8 through first connecting tube 12, be equipped with first valve 9 on the first connecting tube 12.
The utility model discloses a theory of operation does:
put wafer 7 on the surface of sucking disc body 1, start vacuum pump 8 and produce the negative pressure and firmly adsorb wafer 7 on sucking disc body 1 surface, piece impurity that produces during the cutting etc. fall into adsorption tank 2, because be equipped with filter screen 5 on the through-hole 21 of adsorption tank 2 bottoms, consequently piece impurity etc. is intercepted by filter screen 5 and can not get into vacuum channel 3, avoided causing the jam to vacuum channel 3, the influence when the manual work is cleared up adsorption tank 2, because 2 both sides wall slopes of adsorption tank set up and be "V" font, it is more convenient when making people clean adsorption tank 2, can clearly see the piece of adsorption tank 2 bottoms, can not have the dead angle to remain piece impurity.
Example 2
On the basis of embodiment 1, the included angle between the two side walls of the adsorption tank 2 and the vertical direction is 30-50 degrees, so that people can find the scrap impurities at the corners more easily during cleaning, the cleaning is convenient, and no residue is left.
Example 3
In addition to embodiment 1, the outer protective layer 6 is provided on the periphery of the chuck body 1, so that when ions are used for cutting, the ion beam can be effectively prevented from damaging the side surface and other parts of the chuck body 1.
Example 4
On the basis of embodiment 1, intake pipe 4 still communicates has second connecting tube 13, second connecting tube 13 links to each other with blower 10, be equipped with second valve 11 on the second connecting tube 13, start blower 10 and blow to vacuum passage 3 in, can blow away the piece impurity on the filter screen 5, clean thoroughly when preventing the manual work from cleaning adsorption tank 2.
Example 5
In addition to embodiment 1, the lower surface of the wafer 7 can cover the entire upper surface of the chuck body 1, and the ion beam can be effectively prevented from damaging the surface of the chuck body 1 when performing dicing using ions.
Claims (5)
1. The utility model provides a sucking disc device for wafer cutting, includes circular shape sucking disc body (1) and establishes vacuum channel (3) in sucking disc body (1), its characterized in that, adsorption tank (2) of a plurality of concentric circles are seted up on sucking disc body (1), adsorption tank (2) both sides wall slope sets up and forms "V" font, a plurality of through-holes (21) have been seted up to adsorption tank (2) bottom, through-hole (21) and vacuum channel (3) intercommunication, be equipped with filter screen (5) on through-hole (21), vacuum channel (3) intercommunication has intake pipe (4), intake pipe (4) pass the bottom of sucking disc body (1) and link to each other with vacuum pump (8) through first connecting tube (12), be equipped with first valve (9) on first connecting tube (12).
2. The suction cup device for wafer cutting as claimed in claim 1, wherein the angle between the two side walls of the suction groove (2) and the vertical direction is 30-50 °.
3. Chuck device for wafer dicing according to claim 1, characterized in that the chuck body (1) is provided with an outer protective layer (6) on its periphery.
4. The suction cup device for wafer cutting as recited in claim 1, wherein the air inlet pipe (4) is further connected with a second connecting pipe (13), the second connecting pipe (13) is connected with the air blowing pump (10), and a second valve (11) is disposed on the second connecting pipe (13).
5. Chuck device for wafer dicing according to claim 1, characterized in that the lower surface of the wafer (7) is able to cover the entire upper surface of the chuck body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921149983.XU CN209963040U (en) | 2019-07-22 | 2019-07-22 | Sucking disc device for wafer cutting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921149983.XU CN209963040U (en) | 2019-07-22 | 2019-07-22 | Sucking disc device for wafer cutting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209963040U true CN209963040U (en) | 2020-01-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921149983.XU Active CN209963040U (en) | 2019-07-22 | 2019-07-22 | Sucking disc device for wafer cutting |
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| Country | Link |
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| CN (1) | CN209963040U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111774727A (en) * | 2020-07-14 | 2020-10-16 | 段晓丽 | Laser lettering device for chip processing |
| CN112922952A (en) * | 2021-01-22 | 2021-06-08 | 宁波云德半导体材料有限公司 | Quartz vacuum adsorption device with pressure relief function |
-
2019
- 2019-07-22 CN CN201921149983.XU patent/CN209963040U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111774727A (en) * | 2020-07-14 | 2020-10-16 | 段晓丽 | Laser lettering device for chip processing |
| CN112922952A (en) * | 2021-01-22 | 2021-06-08 | 宁波云德半导体材料有限公司 | Quartz vacuum adsorption device with pressure relief function |
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