CN209962088U - Photoetching plate - Google Patents
Photoetching plate Download PDFInfo
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- CN209962088U CN209962088U CN201920861864.0U CN201920861864U CN209962088U CN 209962088 U CN209962088 U CN 209962088U CN 201920861864 U CN201920861864 U CN 201920861864U CN 209962088 U CN209962088 U CN 209962088U
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- photoetching
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Abstract
The utility model discloses a photoetching plate, the utility model discloses a photoetching plate comprises mother board and daughter board two parts, and the photoetching figure sets up on the daughter board, and operating personnel controls the mother board, installs photoetching plate into the photoetching machine and carries out lithography process, because the thickness of daughter board is higher than the height of heap glue, so can effectively avoid the influence of heap glue to the photoetching to effectively solve among the prior art because of the problem of the photoetching figure distortion that the heap glue leads to.
Description
Technical Field
The utility model relates to a laser detection technical field especially relates to a photoetching plate.
Background
Photolithography is one of the most important technologies in the semiconductor manufacturing industry, and among them, contact photolithography is widely used due to its high efficiency and input-output ratio. However, when the contact lithography technology is applied to manufacturing of the mercury cadmium telluride chip, corner glue stacking can be formed in the rotary gluing process, so that high points are formed, the photoetching plate cannot be in full contact with the surface of the sample wafer, and partial photoetching patterns are distorted.
For the corner stacking glue, at present, the corner stacking glue can only be scraped by skilled technicians with a scalpel, and is time-consuming and labor-consuming, and the process stability is poor. Therefore, how to realize photolithography under the condition of photoresist stacking becomes a problem to be solved urgently.
Disclosure of Invention
The utility model provides a photoetching plate to solve among the prior art because the problem of the photoetching figure distortion that the heap glue leads to.
The utility model provides a photoetching plate, this photoetching plate includes: a motherboard and a daughter board;
the mother board is used for being held by an operator;
the bottom surface of the daughter board is connected with the mother board, the top surface of the daughter board is provided with a photoetching pattern, and the thickness of the daughter board is higher than the height of corner glue stacking on the surface of the chip;
and enabling light rays to vertically penetrate through the photoetching plate through the mother plate and the daughter plate.
Preferably, the sub-board has a cubic structure.
Preferably, the daughter board is pyramid-shaped, a photoetching pattern is arranged on the top surface of the pyramid, and the bottom surface of the pyramid is connected with the mother board.
Preferably, the area of the motherboard is larger than the area of the chip.
Preferably, the area of the mother board is larger than the area of the daughter board.
Preferably, the chip is any one of the following chips: silicon chip, cadmium telluride chip and mercury cadmium telluride chip.
The utility model discloses beneficial effect as follows:
the utility model discloses a photoetching board comprises mother board and daughter board two parts, and the photoetching figure sets up on the daughter board, and operating personnel controls the mother board, installs the photoetching board into the photoetching machine and carries out the photoetching process, because the thickness of daughter board is higher than the height of heap gum, so can effectively avoid the influence of heap gum to the photoetching to effectively solve among the prior art because of the problem of the photoetching figure distortion that the heap gum leads to.
Drawings
Fig. 1 is a schematic structural diagram of a motherboard according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a daughter board according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a photolithography plate according to an embodiment of the present invention;
fig. 4 is a schematic diagram of a photolithography process according to an embodiment of the present invention.
Detailed Description
The utility model discloses photoetching board comprises mother board 1 and daughter board 2 two parts, and the photoetching figure sets up on daughter board 2, avoids piling glue 3 to make photoetching board warpage through daughter board 2's thickness to make light can see through photoetching board perpendicularly, thereby avoided piling glue 3 to the influence that the photoetching produced. The present invention will be described in further detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not limit the invention.
The embodiment of the utility model provides a photoetching plate, see fig. 1, this photoetching plate includes: a mother board 1 and a daughter board 2 connected to each other;
a mother plate 1 for an operator to hold to mount a reticle onto a lithography machine;
the bottom surface 21 of the daughter board 2 is connected with the mother board 1, the top surface 22 of the daughter board 2 is provided with a photoetching pattern, and the thickness of the daughter board 2 is higher than the height of corner glue stacking 3 on the surface of the chip 4;
light is transmitted vertically through the reticle by the mother substrate 1 and the daughter substrate 2.
That is to say, the embodiment of the utility model provides a through setting up the photoetching figure on daughter board 2, eliminate the influence of corner heap glue 3 to the photoetching through daughter board 2's thickness to operating personnel will install the photoetching board on the photoetching machine through controlling mother board 1, finally make light can see through the photoetching board perpendicularly, avoided the influence that heap glue 3 produced to the photoetching, and avoided the technology that the limit was got rid of, thereby improved 4 photoetching efficiency of chip, yield and 4 utilization ratios of irregular chip.
Additionally, the embodiment of the utility model provides a can set up the photoetching shape according to chip 4, namely, the utility model discloses the photoetching shape can be adjusted according to chip 4, so the utility model discloses the photoetching board can carry out the photoetching to chip 4 of irregular shape to fully utilize chip 4.
It should be noted that the photolithography plate according to the embodiment of the present invention can be applied to photolithography of any one of the following chips 4, such as a silicon chip, a cadmium telluride chip, and a mercury cadmium telluride chip.
In addition, in the embodiment of the present invention, the surfaces of the motherboard 1 and the daughter board 2 exposed to the outside are both plated with chromium metal.
Specifically, the embodiment of the present invention removes the plated chrome at the position where the daughter board 2 is to be disposed on the motherboard 1, forms the fenestration 11 having the same shape as the daughter board 2, and bonds the bottom surface 21 of the daughter board 2 to the motherboard 1, and the structure of the motherboard 1 is specifically as shown in fig. 2.
As shown in fig. 3, the embodiment of the present invention has the advantages that the side surface of the daughter board 2 is plated with chromium, the bottom surface 21 of the daughter board 2 is connected with the motherboard 1, and the top surface 22 of the daughter board 2 is provided with a photo-etching pattern, which can be arbitrarily set according to the shape of the chip 4.
The utility model discloses daughter board 2 of embodiment is various cube structures, for example, cuboid structure, square structure, pyramid structure, etc. The height of the cubic structure is higher than that of the stacking glue 3, so that the influence of the stacking glue 3 on photoetching is avoided.
When the daughter board 2 is configured as a pyramid structure, the top surface 22 of the pyramid is provided with a photolithographic pattern, and the bottom surface 21 of the pyramid is connected with the mother board 1.
When the specific implementation, the embodiment of the utility model provides a for the convenience of operator controls, and the area that sets up mother board 1 is greater than the area of chip 4, and mother board 1 area is greater than the area of daughter board 2.
And the embodiment of the utility model provides a size of mother board 1 can be set for according to the lithography machine, the embodiment of the utility model provides a do not do specifically to this and restrict.
As shown in FIG. 4, the embodiment of the utility model provides an eliminate the influence of corner heap glue 3 to the photoetching through daughter board 2's thickness, finally make light can see through the photoetching figure perpendicularly, avoided piling the influence that glue 3 produced the photoetching.
Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, and that the scope of the present invention is not limited to the embodiments disclosed.
Claims (6)
1. A reticle, comprising: a motherboard and a daughter board;
the mother board is used for being held by an operator;
the bottom surface of the daughter board is connected with the mother board, the top surface of the daughter board is provided with a photoetching pattern, and the thickness of the daughter board is higher than the height of corner glue stacking on the surface of the chip;
and enabling light rays to vertically penetrate through the photoetching plate through the mother plate and the daughter plate.
2. The reticle of claim 1,
the daughter board is of a cubic structure.
3. The reticle of claim 1,
the daughter board is in a pyramid shape, photoetching patterns are arranged on the top surface of the pyramid, and the bottom surface of the pyramid is connected with the mother board.
4. The reticle of any one of claims 1 to 3,
the area of the motherboard is larger than that of the chip.
5. The reticle of any one of claims 1 to 3,
the area of the motherboard is larger than that of the daughter board.
6. The reticle of any one of claims 1 to 3,
the chip is any one of the following chips: silicon chip, cadmium telluride chip and mercury cadmium telluride chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920861864.0U CN209962088U (en) | 2019-06-10 | 2019-06-10 | Photoetching plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920861864.0U CN209962088U (en) | 2019-06-10 | 2019-06-10 | Photoetching plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209962088U true CN209962088U (en) | 2020-01-17 |
Family
ID=69247558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920861864.0U Active CN209962088U (en) | 2019-06-10 | 2019-06-10 | Photoetching plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209962088U (en) |
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2019
- 2019-06-10 CN CN201920861864.0U patent/CN209962088U/en active Active
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