CN209944271U - LED radiator - Google Patents

LED radiator Download PDF

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Publication number
CN209944271U
CN209944271U CN201920369553.2U CN201920369553U CN209944271U CN 209944271 U CN209944271 U CN 209944271U CN 201920369553 U CN201920369553 U CN 201920369553U CN 209944271 U CN209944271 U CN 209944271U
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China
Prior art keywords
heat
heat pipe
heat dissipation
led
substrate
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Active
Application number
CN201920369553.2U
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Chinese (zh)
Inventor
罗新华
李兵
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Dongguan Source Of Shenyang Heat Energy Technology Co Ltd
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Dongguan Source Of Shenyang Heat Energy Technology Co Ltd
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Priority to CN201920369553.2U priority Critical patent/CN209944271U/en
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Abstract

The utility model relates to a heat dissipation field especially relates to a LED radiator. An LED radiator comprises a substrate and a radiating part; the heat dissipation part is arranged above the substrate and connected with the substrate; the heat dissipation part comprises a heat pipe assembly and a plurality of heat dissipation fins; the plurality of radiating fins are arranged above the substrate side by side at equal intervals; the heat pipe assembly is arranged inside the plurality of radiating fins which are arranged side by side at equal intervals. The LED radiator related to the utility model is provided with a plurality of heat pipe components in the radiating part, so that the radiating effect is good; meanwhile, the fixing frames are arranged at the two ends of the heat dissipation part, so that the structure is stable.

Description

LED radiator
Technical Field
The utility model relates to a heat dissipation field especially relates to a LED radiator.
Background
The existing LED has various applications in the field of public lighting, and the technology of the LED is developed more and more rapidly due to energy conservation and environmental protection. Under the action of an external power plant, 15% -25% of energy is converted into light energy by electromagnetic action generated by laying and combining electrons and holes of the LED, and the rest 75% -85% of energy is converted into heat energy by lattice oscillation generated by non-radiative combination. Since the white LED does not include an infrared portion in its emission spectrum, its heat cannot be released by radiation. The operating characteristics of semiconductor devices are very sensitive to temperature, and heat dissipation in time can have a significant effect on the luminous efficiency, luminous flux, light color, forward bias voltage, and lifetime of LEDs. Therefore, the heat dissipation design of the high-power LED light emitting device becomes very important.
Therefore, in the design of the existing LED lamp, the most important problem is the heat dissipation problem, and the poor design of the radiator can cause the poor heat dissipation performance of the whole LED lamp, thereby affecting the service life of the lamp and the like.
Therefore, it is necessary to provide a technical means to solve the above-mentioned drawbacks.
SUMMERY OF THE UTILITY MODEL
The utility model relates to a radiator with good heat dissipation effect, which is an LED radiator, comprising a substrate and a heat dissipation part; the heat dissipation part is arranged above the substrate and connected with the substrate;
the heat dissipation part comprises a heat pipe assembly and a plurality of heat dissipation fins; the plurality of radiating fins are arranged above the substrate side by side at equal intervals; the heat pipe assembly is arranged inside the plurality of radiating fins which are arranged side by side at equal intervals.
Preferably, in order to enhance the heat dissipation effect, the heat pipe assembly comprises a first heat pipe and a second heat pipe; the first heat pipe and the second heat pipe are opposite and vertical, and are arranged in the plurality of radiating fins.
Preferably, in order to facilitate installation and positioning of the heat pipe assembly, a mounting hole through which the heat pipe assembly passes is formed in the middle of the heat sink; the bottom of the radiating fin is provided with an arc-shaped sunken part for the heat pipe assembly to pass through; the upper ends and the lower ends of the first heat pipe and the second heat pipe which are erected oppositely correspondingly penetrate through the mounting holes and the arc-shaped concave parts of the radiating fins, so that the first heat pipe and the second heat pipe are fixedly arranged in the radiating fins. More specifically, in order to facilitate the heat pipe assembly, the lower ends of the first heat pipe and the second heat pipe pass through the arc-shaped depressed part, the upper part of the substrate is provided with a substrate depressed part adapted to the arc-shaped depressed part of the heat sink, a through hole is formed between the substrate depressed part and the arc-shaped depressed part, and the first heat pipe and the second heat pipe respectively pass through the through holes at corresponding positions to be mounted above the substrate;
preferably, in order to enhance the heat dissipation effect, three first heat pipes and three second heat pipes are respectively arranged; the mounting holes in the middle of the radiating fin and the arc-shaped concave parts at the bottom of the radiating fin are correspondingly three.
Preferably, in order to enhance the heat dissipation effect, a communicated airflow channel is formed between the heat dissipation fins, and a plurality of first communication holes are further formed between the mounting hole in the middle of each heat dissipation fin and the arc-shaped concave portion at the bottom of each heat dissipation fin.
Preferably, in order to enhance the heat dissipation effect and facilitate industrial processing and forming, the first communication hole is integrally a square long hole with two side edges being arc-shaped parts; two first through holes are formed; the two first through holes are arranged in the radiating fin side by side.
Preferably, in order to enhance the heat dissipation effect, a second communication hole is further provided between the mounting hole in the middle of the heat sink and the top of the heat sink. More specifically, two second communication holes are provided; the second communication hole is a circular hole as a whole.
Preferably, in order to enhance the structural stability, the LED heat sink further includes two fixing frames; the two fixing frames are respectively arranged at two ends of the heat dissipation part, and two ends of the fixing frames are fixed on the substrate.
Preferably, in order to facilitate connection with the outside, a connecting piece connected with the outside is arranged in the middle of the upper part of the heat dissipation part; one side of the connecting piece, which is far away from the heat dissipation part, is provided with a clamping groove. Furthermore, a slide rail is arranged at the corresponding position of the two inner side walls of the substrate, so that the LED radiator can be conveniently installed with the outside.
The LED radiator related to the utility model is provided with a plurality of heat pipe components in the radiating part, so that the radiating effect is good; meanwhile, the fixing frames are arranged at the two ends of the heat dissipation part, so that the structure is stable.
Drawings
Fig. 1 is an overall schematic view of an LED heat sink according to an embodiment of the present invention;
fig. 2 is a schematic view of an embodiment of the present invention, in which the heat dissipation fins and the connecting members are removed;
FIG. 3 is a schematic diagram of an LED heat sink base according to an embodiment of the present invention;
fig. 4 is a schematic diagram of a heat dissipation plate in an LED heat sink according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.
Referring to fig. 1 and 4, in order to illustrate a preferred embodiment of the present invention, the embodiment disclosed in the present invention is implemented as follows, and an LED heat sink includes a substrate 1 and a heat dissipation portion 2; the heat dissipation part 2 is arranged above the substrate 1 and connected with the substrate 1;
wherein, the heat dissipation part 2 comprises a heat pipe component 21 and a plurality of heat dissipation fins 22; a plurality of radiating fins 22 are arranged above the substrate 1 side by side at equal intervals; the heat pipe assembly 21 is disposed inside a plurality of fins 22 arranged side by side at equal intervals.
Preferably, in order to enhance the heat dissipation effect, the heat pipe assembly includes a first heat pipe 211 and a second heat pipe 212; the first heat pipe 211 and the second heat pipe 212 are erected facing each other and are provided inside the plurality of heat radiating fins 22.
Preferably, in order to facilitate the installation and positioning of the heat pipe assembly 21, the middle portion of the heat sink 22 is provided with an installation hole 221 through which the heat pipe assembly 21 passes; the bottom of the heat sink 22 is provided with an arc-shaped recess 222 through which the heat supply pipe assembly 21 passes; the upper and lower ends of the first and second heat pipes 211 and 212 facing each other are inserted into the mounting holes 221 and the arc-shaped recesses 222 of the heat dissipation fins 22, respectively, so that the first and second heat pipes 211 and 212 are fixed to the inside of the plurality of heat dissipation fins 22. More specifically, to facilitate the heat pipe assembly 21, the lower ends of the first heat pipe 211 and the second heat pipe 212 pass through the arc-shaped recess 222, the arc-shaped recess 222 of the upper portion of the substrate 1, which is adapted to the heat sink 22, is provided with the substrate recess 11, a through hole is formed between the substrate recess 11 and the arc-shaped recess 222, and the first heat pipe 211 and the second heat pipe 212 pass through the through holes at corresponding positions, respectively, to be mounted above the substrate 1;
preferably, in order to enhance the heat dissipation effect, three first heat pipes 211 and three second heat pipes 212 are respectively provided; three mounting holes 221 are correspondingly formed in the middle of the heat sink 22 and three arc-shaped recesses 222 are correspondingly formed in the bottom of the heat sink 22.
Preferably, in order to enhance the heat dissipation effect and form a communicating airflow channel between the heat dissipation fins 22, a plurality of first communication holes 223 are further provided between the mounting hole 221 in the middle of the heat dissipation fin 22 and the arc-shaped recess 222 at the bottom of the heat dissipation fin 22.
Preferably, in order to enhance the heat dissipation effect and facilitate industrial processing and forming, the first through hole 223 is integrally a square long hole with two sides being arc-shaped portions; two first communication holes 223 are provided; the two first communication holes 223 are provided side by side inside the heat sink 22.
Preferably, in order to enhance the heat dissipation effect, a second communication hole 224 is further provided between the mounting hole 221 of the middle portion of the heat sink 22 and the top portion of the heat sink 22. More specifically, two second communication holes 224 are provided; the second communication hole 224 is a circular hole as a whole.
Preferably, in order to enhance the structural stability, the LED heat sink further includes two fixing frames 3; the two fixing frames 3 are respectively arranged at two ends of the heat dissipation part 2, and two ends of the fixing frames 3 are fixed on the substrate 1.
Preferably, in order to facilitate the connection with the outside, the middle part above the heat dissipation part 2 is provided with a connecting piece 4 connected with the outside; one side of the connecting piece 4 far away from the heat dissipation part 2 is provided with a clamping groove. Furthermore, a slide rail 12 is disposed on the corresponding position of the two inner sidewalls of the substrate 1, so as to facilitate the installation of the LED heat sink to the outside.
The LED radiator related to the utility model is provided with a plurality of heat pipe components in the radiating part, so that the radiating effect is good; meanwhile, the fixing frames are arranged at the two ends of the heat dissipation part, so that the structure is stable.
The above description is only for the preferred embodiment of the present invention, and the structure is not limited to the above-mentioned shape, and any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

  1. LED radiator, its characterized in that: the LED radiator comprises a substrate and a radiating part; the heat dissipation part is arranged above the substrate and connected with the substrate;
    the heat dissipation part comprises a heat pipe assembly and a plurality of heat dissipation fins; the plurality of radiating fins are arranged above the substrate side by side at equal intervals; the heat pipe assembly is arranged inside the plurality of radiating fins which are arranged side by side at equal intervals.
  2. 2. The LED heatsink of claim 1, wherein: the heat pipe assembly comprises a first heat pipe and a second heat pipe; the first heat pipe and the second heat pipe are opposite and vertical, and are arranged in the plurality of radiating fins.
  3. 3. The LED heatsink of claim 2, wherein: the middle part of the radiating fin is provided with a mounting hole for the heat pipe assembly to pass through; the bottom of the radiating fin is provided with an arc-shaped sunken part for the heat pipe assembly to pass through; the upper ends and the lower ends of the first heat pipe and the second heat pipe which are erected oppositely correspondingly penetrate through the mounting holes and the arc-shaped concave parts of the radiating fins, so that the first heat pipe and the second heat pipe are fixedly arranged in the radiating fins.
  4. 4. The LED heatsink of claim 3, wherein: the number of the first heat pipes and the number of the second heat pipes are three respectively; the mounting holes in the middle of the radiating fin and the arc-shaped concave parts at the bottom of the radiating fin are correspondingly three.
  5. 5. The LED heatsink of claim 3, wherein: a plurality of first communication holes are further formed between the mounting hole in the middle of the radiating fin and the arc-shaped concave portion at the bottom of the radiating fin.
  6. 6. The LED heat sink of claim 5, wherein: the first connecting hole is a square long hole with two arc-shaped sides; two first through holes are formed; the two first through holes are arranged in the radiating fin side by side.
  7. 7. The LED heatsink of claim 3, wherein: and a second communicating hole is also formed between the mounting hole in the middle of the radiating fin and the top of the radiating fin.
  8. 8. The LED heatsink of claim 7, wherein: two second communication holes are formed; the second communication hole is a circular hole as a whole.
  9. 9. The LED heatsink of claim 1, wherein: the LED radiator also comprises two fixing frames; the two fixing frames are respectively arranged at two ends of the heat dissipation part, and two ends of the fixing frames are fixed on the substrate.
  10. 10. The LED heatsink of claim 1, wherein: a connecting piece connected with the outside is arranged in the middle of the upper part of the heat dissipation part; one side of the connecting piece, which is far away from the heat dissipation part, is provided with a clamping groove.
CN201920369553.2U 2019-03-22 2019-03-22 LED radiator Active CN209944271U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920369553.2U CN209944271U (en) 2019-03-22 2019-03-22 LED radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920369553.2U CN209944271U (en) 2019-03-22 2019-03-22 LED radiator

Publications (1)

Publication Number Publication Date
CN209944271U true CN209944271U (en) 2020-01-14

Family

ID=69124909

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920369553.2U Active CN209944271U (en) 2019-03-22 2019-03-22 LED radiator

Country Status (1)

Country Link
CN (1) CN209944271U (en)

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