CN209930641U

CN209930641U - Carrier for wave soldering of SL2501A mainboard

Info

Publication number: CN209930641U
Application number: CN201821746257.1U
Authority: CN
Inventors: 吴学成; 翟平
Original assignee: ANHUI SENLI AUTO ELECTRONICS Co Ltd
Current assignee: ANHUI SENLI AUTO ELECTRONICS Co Ltd
Priority date: 2018-10-26
Filing date: 2018-10-26
Publication date: 2020-01-10
Anticipated expiration: 2028-10-26

Abstract

The utility model discloses a carrier for passing wave soldering of SL2501A mainboard, belonging to the technical field of wave soldering devices and solving the problems that the existing carrier can not protect SMT components and parts and can not ensure the consistency of wave soldering welding; the technical characteristics are as follows: the solder-dragging angle structure comprises a PCB fixing buckle, an SMT component avoiding area, a solder-dragging angle and a shell, wherein the PCB fixing buckle is symmetrically arranged at the top in the shell; an SMT component avoiding area is arranged at the upper part of the inner cavity of the shell; PCB is fixed detains inner chamber intermediate position and is set up and drag the tin angle, the fixed setting of detaining of PCB can realize the fixed to the PCB board to prevent that the PCB board from upwarping, just the setting in SMT components and parts keep away the position district can play the effect that prevents to hit the piece, glue the tin to protection components and parts, just drag the tin angle and can accomplish in the welding and spread soldering tin around components and parts, prevent that soldering tin from falling back and causing tin overflow, the tin stripping can be carried out after accomplishing the welding to plug-in components and parts to the setting of dragging the tin piece, prevents continuous tin.

Description

Carrier for wave soldering of SL2501A mainboard

Technical Field

The utility model relates to a cross wave-soldering technical field, specifically be a wave-soldering carrier is crossed to SL2501A mainboard.

Background

The wave soldering technology is a very mature electronic assembly process technology, the wave soldering technology development originates from the twentieth century, and is mainly used for pupil insertion and welding of components in a hybrid assembly mode;

the carrier is an indispensable instrument in the wave-soldering process, and current carrier can not protect SMT components and parts, also can not guarantee the wave-soldering welding uniformity, therefore we propose a SL2501A mainboard and cross the wave-soldering carrier.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a wave soldering device that crosses with reasonable structure, reliability and practicality, which can protect SMT components and parts, save high temperature gummed paper, save manpower, save cost, ensure the product welding qualification rate to be more than 99%, and comprises a PCB fixing buckle, a SMT component avoiding area, a tin dragging angle and a shell, wherein the top in the shell is symmetrically provided with the PCB fixing buckle; an SMT component avoiding area is arranged at the upper part of the inner cavity of the shell; PCB is fixed detains inner chamber intermediate position and is set up and drag the tin angle to solve current carrier and can not protect SMT components and parts, also can not guarantee the problem of wave-soldering welding uniformity.

In order to achieve the above object, the utility model provides a following technical scheme:

an SL2501A mainboard wave-soldering carrier comprises a PCB fixing buckle, an SMT component avoiding area, a tin dragging corner and a shell, wherein the PCB fixing buckle is symmetrically arranged at the top in the shell; an SMT component avoiding area is arranged at the upper part of the inner cavity of the shell; and a tin dragging angle is arranged in the middle of the inner cavity of the PCB fixing buckle.

As a further aspect of the present invention: the SMT component avoiding area is rectangular in shape.

As a further aspect of the present invention: the number of the tin dragging angles is two, the avoidance position of the SMT component avoidance area is larger than 3mm, and a tin penetration area is arranged on the right side of the bottom of the shell; the bottom of the tin-permeable area is chamfered by 60 degrees.

As a further aspect of the present invention: and a tin dragging sheet is arranged on the right side of the tin permeating area.

As a further aspect of the present invention: the PCB fixing buckle and the shell are connected in a welding or riveting mode.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the labor is saved, and the labor cost is reduced;

2. the components are accurately avoided, and the collision of the components is prevented;

3. the foolproof function is realized, and the operation is convenient;

4. the welding consistency is good, and the welding qualification rate reaches more than 99 percent;

to sum up, the utility model discloses can protect SMT components and parts, guarantee wave-soldering welding uniformity, avoid the bad production of welding.

Drawings

Fig. 1 is a schematic structural view of an SL2501A motherboard passing through a wave soldering carrier.

In the figure: the solder paste comprises 1-PCB fixing buckles, 2-SMT component avoiding areas, 3-tin penetration areas, 4-tin dragging sheets, 5-tin dragging corners and 6-shells.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1, in an embodiment of the present invention, a carrier for wave soldering a SL2501A motherboard includes a PCB fixing buckle 1, an SMT component avoiding area 2, a tin dragging corner 5 and a housing 6, the PCB fixing buckle 1 is symmetrically disposed at the top inside the housing 6, and the PCB board can be fixed by the PCB fixing buckle 1, so as to prevent the PCB board from upwarping; an SMT component avoiding area 2 is arranged at the upper part of an inner cavity of the shell 6, the shape of the SMT component avoiding area 2 is rectangular, and the SMT component avoiding area 2 can prevent collision and tin adhesion of protective components; the PCB fixing buckle 1 is characterized in that a tin dragging angle 5 is arranged in the middle of an inner cavity of the PCB fixing buckle 1, the number of the tin dragging angles 5 is two, and the tin dragging angles 5 can diffuse soldering tin around components after welding is completed so as to prevent the soldering tin from falling back to cause tin overflow;

the avoidance position of the SMT component avoidance area 2 is more than 3 mm;

a tin-permeable area 3 is arranged on the right side of the bottom of the shell 6, and a plug-in component can be welded in the tin-permeable area 3;

the bottom of the tin penetration area 3 is chamfered for 60 degrees;

a tin dragging sheet 4 is arranged on the right side of the tin permeating area 3, and the tin dragging sheet 4 can be used for detinning after the plug-in components are welded, so that tin connection is prevented;

the PCB fixing buckle 1 and the shell 6 are connected in a welding or riveting mode.

The utility model discloses a theory of operation is: before the plug-in unit, the PCB is placed in a product placing area, the PCB fixing buckle is rotated for fixing the product by 190 degrees, the tool plays a role in protecting SMT components during wave soldering, the plug-in unit is soldered through the tin penetration area 3, and the tin dragging sheet 4 ensures that a tail welding disc is tin-removed to prevent tin connection; the utility model discloses can protect SMT components and parts, guarantee wave-soldering welding uniformity, avoid the bad production of welding.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the invention and for the convenience of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. A carrier for passing wave soldering of an SL2501A mainboard comprises a PCB fixing buckle (1), an SMT component avoiding area (2), a tin dragging corner (5) and a shell (6), and is characterized in that the PCB fixing buckle (1) is symmetrically arranged at the top in the shell (6); an SMT component avoiding area (2) is arranged on the upper part of the inner cavity of the shell (6); and a tin dragging angle (5) is arranged in the middle of the inner cavity of the PCB fixing buckle (1).

2. The SL2501A motherboard over-wave solder carrier of claim 1, wherein the SMT component avoiding area (2) is rectangular in shape.

3. An SL2501A motherboard over-the-wave solder carrier as claimed in claim 2, wherein there are two solder horn (5).

4. The SL2501A motherboard over-wave soldering carrier of claim 3, wherein the avoidance of the SMT component avoidance area (2) is greater than 3 mm.

5. An SL2501A motherboard over-the-wave solder carrier according to claim 4, wherein the right side of the bottom of the housing (6) is mounted with a tin-permeable area (3).

6. An SL2501A motherboard over-the-wave solder carrier as claimed in claim 5, wherein the bottom of the tin-permeable area (3) is chamfered by 60 °.

7. An SL2501A motherboard over-the-wave solder carrier as claimed in claim 6, wherein a solder-pulling sheet (4) is mounted on the right side of the tin-permeable area (3).

8. An SL2501A motherboard over-wave soldering carrier as claimed in claim 7, wherein the PCB fixing button (1) is connected to the housing (6) by soldering or riveting.