CN209923429U - Chip nickel gold plating equipment - Google Patents
Chip nickel gold plating equipment Download PDFInfo
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- CN209923429U CN209923429U CN201822176970.3U CN201822176970U CN209923429U CN 209923429 U CN209923429 U CN 209923429U CN 201822176970 U CN201822176970 U CN 201822176970U CN 209923429 U CN209923429 U CN 209923429U
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Abstract
The utility model provides a chip nickel-plating gold equipment, which comprises a frame, locate the nickel-plating bath in the frame, locate the gilding groove in the frame and locate the conveyer on frame upper portion, the nickel-plating bath includes first outer cell body and locates the first interior cell body in the first outer cell body, the lateral wall of cell body is first cavity in first, be equipped with a plurality of first feed liquor pipes in the first cavity, be equipped with first drain hole on the first feed liquor pipe, the inside lateral wall of cell body is first porous formula uniform flow board in being close to of first cavity, the one end and the nickel-plating liquid feeding device of a plurality of first feed liquor pipes are connected, first outer cell body is through the first reservoir of first drain pipe intercommunication, first reservoir is through the first cavity of second feed liquor pipe intercommunication, be equipped with first circulating pump on the second feed liquor pipe. The concentration uniformity of the nickel and gold plating solution in the chip nickel and gold plating equipment is better, the automation degree is high, and the thicknesses of a nickel layer and a gold layer on the surface of the chip after nickel and gold plating are uniform.
Description
Technical Field
The utility model belongs to the technical field of semiconductor chip nickel-gold plating, especially, relate to a chip nickel-gold plating equipment.
Background
In the manufacturing process of semiconductor chips, in order to improve the solderability of the chips, a layer of nickel is generally required to be plated on the surfaces of the chips, and in order to prevent the nickel from being oxidized in the soldering process, a layer of gold is required to be plated on the nickel layer. The common methods for plating nickel and gold comprise chemical nickel and gold plating and nickel and gold electroplating, but the methods for plating nickel and gold are widely used due to simple operation and low cost, and generally, a chip is immersed into a nickel plating solution to deposit a nickel layer with a certain thickness on the surface of a silicon wafer through a reduction reaction, then the chip is immersed into a gold plating solution to cause the nickel and the gold on the surface of the chip to perform a displacement reaction to deposit a gold layer with a certain thickness, and the uniformity of the thickness of the nickel and the gold layers obtained after the nickel and the gold plating can directly influence the welding effect and the appearance effect of the finally obtained semiconductor chip. The process of nickel and gold plating is mostly carried out in a nickel and gold plating groove, the nickel and gold plating equipment in the prior art has poor uniformity of nickel and gold plating solution concentration and temperature, nickel and gold impurities in the nickel and gold plating solution influence the uniformity of a plating layer, the process of nickel and gold plating needs manual operation, and the automation degree is low.
Disclosure of Invention
The to-be-solved problem of the utility model is to provide a chip nickel gold plating equipment, the concentration homogeneity of nickel gold plating liquid is better in the nickel gold plating equipment, and degree of automation is high, chip surface nickel layer, gold layer thickness homogeneous behind the nickel gold plating.
In order to solve the technical problem, the utility model discloses a technical scheme is: the utility model provides a chip nickel-gold plating equipment, which comprises a frame, locate the nickel-plating bath in the frame, locate gold-plating bath in the frame and locate the conveyer on frame upper portion, the nickel-plating bath includes first outer cell body and locates the first interior cell body in the first outer cell body, the lateral wall of cell body is first cavity in first, be equipped with a plurality of first feed liquor pipes in the first cavity, be equipped with first drain hole on the first feed liquor pipe, the inside lateral wall of cell body is first porous formula flow equalizer near first cavity, the one end and the nickel-plating liquid feeding device of a plurality of first feed liquor pipes are connected, first outer cell body is through first reservoir of first drain pipe intercommunication, first reservoir is through second feed liquor pipe intercommunication first cavity, be equipped with first circulating pump on the second feed liquor pipe.
In the technical scheme, preferably, the gold plating tank comprises a second outer tank body and a second inner tank body arranged in the second outer tank body, the side wall of the second inner tank body is a second cavity, a plurality of second liquid inlet pipes are arranged in the second cavity, a second liquid outlet hole is formed in each second liquid inlet pipe, the side wall of the second cavity, close to the inside of the second inner tank body, is a second porous flow homogenizing plate, and one end of each second liquid inlet pipe is connected with the gold plating liquid supply device.
In the technical scheme, preferably, the second outer tank body is communicated with a second liquid storage tank through a second liquid outlet pipe, the second liquid storage tank is communicated with a second cavity through a third liquid inlet pipe, and a second circulating pump is arranged on the third liquid inlet pipe.
In the technical scheme, preferably, the bottom of the first outer groove body is provided with a first rocker arm, two ends of the first rocker arm are provided with first shaking plates, and the middle part of the first rocker arm is connected with an output shaft of the first motor.
In the technical scheme, preferably, a first filter assembly is further arranged between the nickel plating solution supply device and the first liquid inlet pipe.
In the technical scheme, preferably, a second filter assembly is further arranged between the first liquid storage tank and the first cavity on the second liquid inlet pipe.
In the technical scheme, preferably, the conveying device comprises a second motor, a one-way synchronous belt pulley, a double-sided synchronous belt and a clamp, the clamp is meshed with the double-sided synchronous belt through the one-way synchronous belt pulley, and the second motor drives the double-sided synchronous belt to drive the clamp to move.
In the technical scheme, preferably, the bottom of the second outer groove body is provided with a second rocker arm, two ends of the second rocker arm are provided with second shaking plates, and the middle part of the second rocker arm is connected with an output shaft of a second motor.
In the technical scheme, the device preferably further comprises a plurality of nickel plating pretreatment tanks, a plurality of nickel plating post-treatment tanks and a plurality of gold plating post-treatment tanks.
In the technical scheme, preferably, the plurality of nickel plating pretreatment tanks comprise a surface oxidation layer removing tank, a first cleaning tank and a surface activation tank which are sequentially arranged.
The utility model has the advantages and positive effects that: the nickel plating bath and the gold plating bath of the chip nickel gold plating equipment adopt a multi-tube parallel combination porous uniform flow plate to feed liquid; and circulating the nickel plating solution and the gold plating solution between the inner tank body and the outer tank body by arranging a circulating system; arranging a shaking plate at the lower part of the nickel-gold plating tank to stir the nickel-gold plating solution; and the liquid inlet system and the circulating system are provided with filtering equipment, so that the concentration uniformity of the nickel plating solution and the gold plating solution in the nickel and gold plating bath is higher, the impurities in the nickel and gold plating solution are less, and the uniformity of the nickel and gold plating layer is stronger. The chip is controlled by the clamp to be immersed into each treatment tank, so that each treatment process is completed, the automation degree is high, and the labor is saved.
Drawings
Fig. 1 is a schematic structural diagram of a chip nickel-gold plating apparatus according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a nickel plating bath in a chip nickel-gold plating apparatus according to an embodiment of the present invention.
In the figure:
1. frame 2, nickel plating bath 3, gilt groove
4. Conveyer 5, surface oxide layer removing tank 6, cleaning tank
7. Surface activation tank 8, nickel plating solution supply device 9 and liquid storage tank
10. Rocker arm 11, rocking plate 21, outer tank
22. Inner groove body 23, cavity 24 and liquid inlet pipe
25. Porous flow equalizing plate 26, filter assembly 41 and motor
42. One-way synchronous pulley 43, double-sided synchronous belt 44 and clamp
Detailed Description
The embodiments of the present invention will be further described with reference to the accompanying drawings:
as shown in fig. 1, the apparatus for plating nickel and gold on a chip according to this embodiment includes a frame 1, a nickel plating bath 2, a gold plating bath 3, a plurality of nickel plating pretreatment baths, a plurality of nickel plating post-treatment baths, a plurality of gold plating post-treatment baths, and a conveyor 4 disposed on an upper portion of the frame 1, wherein the treatment baths are sequentially arranged according to the order of the nickel plating pretreatment bath, the nickel plating bath 2, the nickel plating post-treatment bath, the gold plating bath 3, and the gold plating post-treatment bath, and the nickel plating pretreatment bath includes a surface oxidation layer removing bath 5, a cleaning bath 6, and a surface activation bath 7, which are sequentially disposed. As shown in fig. 2, the nickel plating bath 2 includes an outer bath body 21 and an inner bath body 22 disposed in the outer bath body 21, a side wall of the inner bath body 22 is a cavity 23, a plurality of liquid inlet pipes 24 are disposed in the cavity 23 in parallel, a plurality of liquid outlet holes are uniformly arranged on the liquid inlet pipes 24 along the axial direction of the liquid inlet pipes 24, a side wall of the cavity 23 close to the inner bath body 22 is a porous flow equalizing plate 25, a plurality of flow equalizing holes are uniformly arranged on the porous flow equalizing plate 25, one end of the plurality of liquid inlet pipes 24 is sealed, the other end of the plurality of liquid inlet pipes is connected with a nickel plating solution supply device 8 after being connected in parallel, the outer bath body 21 is communicated with a liquid storage tank 9 through the liquid outlet pipes, the liquid storage. The outer tank body 21 and the inner tank body 22 are provided with electric heating pipes which can heat and preserve heat of the nickel plating solution in the inner tank body and the outer tank body.
In the process of nickel and gold plating, a conveying device 4 firstly clamps a chip to be processed and sequentially immerses the chip into a surface oxidation layer removing groove 5, a cleaning groove 6 and a surface activation groove 7, wherein nitric acid, pure water and activation liquid are respectively filled in the surface oxidation layer removing groove, the cleaning groove and the surface activation groove, the chip is sequentially subjected to surface oxidation layer removing, surface activation and used as pretreatment of nickel plating on the surface of the chip, then the conveying device 4 conveys the chip to the upper part of a nickel plating groove 2, the chip is immersed into nickel plating liquid for nickel plating, then the chip after nickel plating is cleaned by a nickel plating post-treatment groove, and then the chip is immersed into gold plating liquid for gold plating, so that the process of nickel and. Wherein, the nickel plating solution in the nickel plating bath 2 is provided by the nickel plating solution supply device 8, and is distributed to the liquid inlet pipes 24 which are arranged side by side, and is uniformly sprayed into the nickel plating bath 2 by the porous flow equalizing plate 25 on the cavity 23 after being distributed by the plurality of liquid outlet holes arranged on the liquid inlet pipes, so that the nickel plating solution at different positions in the whole nickel plating bath has uniform supply speed, uniform concentration and better uniformity of the nickel plating layer of the chip. The height of the inner tank body 22 is lower than that of the outer tank body 21, when the nickel plating solution supply device continuously supplies the nickel plating solution, the nickel plating solution overflowing from the inner tank body 22 into the outer tank body 21 enters the liquid storage tank 9 through the liquid outlet pipe and then is pumped into the inner tank body 22 through the circulating pump in the liquid storage tank 9, so that the nickel plating solution continuously circulates in the inner tank body and the outer tank body, and the concentration uniformity of the nickel plating solution is promoted.
Preferably, the gold plating bath 3 also comprises an outer bath body and an inner bath body arranged in the outer bath body, the side wall of the inner bath body is a cavity, a plurality of liquid inlet pipes are arranged in the cavity, liquid outlet holes are arranged on the liquid inlet pipes, the side wall of the cavity close to the inner bath body is a porous flow homogenizing plate, and one ends of the liquid inlet pipes are connected with the gold plating solution supply device. The gold plating solution in the gold plating tank 3 is provided by a gold plating solution supply device, is distributed to the liquid inlet pipes which are arranged side by side, is distributed by a plurality of liquid outlet holes arranged on the liquid inlet pipes, and is uniformly sprayed into the gold plating tank 3 by a porous flow homogenizing plate on the cavity, so that the gold plating solution at different positions in the whole gold plating tank can be uniformly supplied, the concentration of the gold plating solution is uniform, and the uniformity of the gold plating layer of the chip is better. More preferably, the outer tank body is communicated with the liquid storage tank through the liquid outlet pipe, the liquid storage tank is communicated with the cavity through the liquid inlet pipe, and the liquid inlet pipe is provided with the circulating pump. The height of the inner tank body is lower than that of the outer tank body, when the nickel plating solution is continuously supplied by the nickel plating solution supply device, the nickel plating solution overflowing from the inner tank body into the outer tank body enters the liquid storage tank through the liquid outlet pipe and then is pumped into the inner tank body through the circulating pump from the liquid storage tank, so that the nickel plating solution is continuously circulated in the inner tank body and the outer tank body, and the uniformity of the concentration of the nickel plating solution is promoted.
In the technical scheme, preferably, the bottom of the outer tank body 21 is provided with a rocker arm 10, two ends of the rocker arm 10 are provided with shaking plates 11, and the middle part of the rocker arm 10 is connected with an output shaft of a motor. The motor drives the rocking arm rotatory, makes the both ends of rocking arm constantly make a round trip and does the swing to drive and shake board 11 and make the swing, make and shake board 11 and stir the nickel plating liquid of outer cell body 21 bottom, make the concentration of nickel plating liquid more homogeneous, the nickel coating homogeneity is better, more preferred, including the bottom of cell body 22 also can set up the rocking arm, shake board and motor, stir the nickel plating liquid of interior cell body 22 bottom, make the nickel plating liquid concentration in the cell body more homogeneous.
In the technical scheme, preferably, the bottom of the outer groove body is provided with a rocker arm, the two ends of the rocker arm are provided with shaking plates, and the middle of the rocker arm is connected with an output shaft of the motor. The motor drives the rocking arm rotatory, makes the both ends of rocking arm constantly make a round trip and does the swing to the swing is made to the board of shaking in the drive, makes to shake the board and mixs the nickel plating liquid of outer cell body bottom, makes the concentration of nickel plating liquid more homogeneous, and the nickel coating homogeneity is better, and is more preferred, including the bottom of cell body also can set up the rocking arm, shake board and motor, stirs the nickel plating liquid of cell body bottom in, makes the nickel plating liquid concentration in the cell body more homogeneous.
Preferably, a filter assembly 26 is further arranged between the nickel plating solution supply device 8 and the liquid inlet pipe 24, a filter assembly is also arranged between the liquid storage tank 9 and the cavity 23 on the liquid inlet pipe, the filter assembly can filter the nickel plating solution entering the nickel plating tank to remove fine particles such as metallic nickel and the like in the nickel plating tank, the nickel plating uniformity is prevented from being affected by the existence of nickel and the fine particles, and the filter assembly is a device disclosed in the prior art and is not described herein any more.
Preferably, a filter assembly is further arranged between the gold plating solution supply device and the liquid inlet pipe, the filter assembly is also arranged between the liquid storage tank on the liquid inlet pipe and the cavity, the filter assembly can filter the gold plating solution entering the gold plating tank to remove fine particles such as gold therein, and prevent the existence of gold and fine particles from affecting the uniformity of the gold plating layer, and the filter assembly is a device disclosed in the prior art and is not described herein any more.
The conveying device 4 comprises a motor 41, a one-way synchronous pulley 42, a double-sided synchronous belt 43 and a clamp 44, the clamp 44 is meshed with the double-sided synchronous belt 43 through the one-way synchronous pulley 42, and the motor 41 drives the double-sided synchronous belt 43 to drive the clamp 44 to move. The chips delivered from the upstream process are clamped by the clamp 44, the clamp 44 is driven by the motor 41 to move above each groove body, the chips are sequentially moved to the upper parts of the groove bodies and then move downwards, the chips are immersed into the liquid medicine of each groove body to be processed, the automation degree is higher, and the labor is saved.
The nickel plating solution supply device 8 and the gold plating solution supply device 10 may include a nickel/gold plating solution storage tank, a supply pipe, and a transfer pump, respectively, and the nickel plating solution and the gold plating solution are transferred into the nickel plating tank or the gold plating tank by the transfer pump. Preferably, the supply pipe is also provided with a preheater which can preliminarily preheat the nickel plating solution and the gold plating solution and then pump the preheated solutions into the nickel plating tank and the gold plating tank through a delivery pump.
Thermometers, liquid level meters and flow meters can be arranged in the nickel plating bath 2 and the gold plating bath 3 so as to monitor the temperature, the liquid level and the flow of the nickel plating solution and the gold plating solution in the nickel plating bath and the gold plating bath at any time.
The nickel plating bath and the gold plating bath of the chip nickel-gold plating device adopt a multi-tube parallel combination porous uniform flow plate to feed liquid; and circulating the nickel plating solution and the gold plating solution between the inner tank body and the outer tank body by arranging a circulating system; arranging a shaking plate at the lower part of the nickel-gold plating tank to stir the nickel-gold plating solution; and the liquid inlet system and the circulating system are provided with filtering equipment, so that the concentration uniformity of the nickel plating solution and the gold plating solution in the nickel and gold plating bath is higher, the impurities in the nickel and gold plating solution are less, and the uniformity of the nickel and gold plating layer is stronger. The chip is controlled by the clamp to be immersed into each treatment tank, so that each treatment process is completed, the automation degree is high, and the labor is saved.
While one embodiment of the present invention has been described in detail, the description is only a preferred embodiment of the present invention, and should not be considered as limiting the scope of the present invention. All the equivalent changes and improvements made according to the application scope of the present invention should still fall within the patent coverage of the present invention.
Claims (10)
1. A chip nickel gold plating equipment is characterized in that: including the frame, locate nickel-plating bath in the frame, locate gilding groove in the frame with locate frame upper portion's conveyer, the nickel-plating bath includes first outer cell body and locates cell body in the first outer cell body, the lateral wall of cell body is first cavity in first, be equipped with a plurality of first feed liquor pipes in the first cavity, be equipped with first drain hole on the first feed liquor pipe, being close to of first cavity the inside lateral wall of cell body is first porous formula uniform flow board, and is a plurality of the one end and the nickel-plating liquid feeding device of first feed liquor pipe are connected, first outer cell body is through the first reservoir of first drain pipe intercommunication, first reservoir is through second feed liquor pipe intercommunication first cavity, be equipped with first circulating pump on the second feed liquor pipe.
2. The chip nickel-gold plating apparatus as recited in claim 1, wherein: the gold plating tank comprises a second outer tank body and a second inner tank body arranged in the second outer tank body, the side wall of the second inner tank body is a second cavity, a plurality of second liquid inlet pipes are arranged in the second cavity, a second liquid outlet hole is formed in each second liquid inlet pipe, the side wall of the second cavity, which is close to the second inner tank body, is a second porous flow homogenizing plate, and one end of each second liquid inlet pipe is connected with a gold plating liquid supply device.
3. The apparatus of claim 2, wherein: the second outer tank body is communicated with a second liquid storage tank through a second liquid outlet pipe, the second liquid storage tank is communicated with the second cavity through a third liquid inlet pipe, and a second circulating pump is arranged on the third liquid inlet pipe.
4. The chip nickel-gold plating apparatus as recited in any one of claims 1 to 3, wherein: the bottom of the first outer groove body is provided with a first rocker arm, two ends of the first rocker arm are provided with first shaking plates, and the middle of the first rocker arm is connected with an output shaft of a first motor.
5. The chip nickel-gold plating apparatus as recited in any one of claims 1 to 3, wherein: and a first filter assembly is also arranged between the nickel plating solution supply device and the first liquid inlet pipe.
6. The chip nickel-gold plating apparatus as recited in any one of claims 1 to 3, wherein: and a second filter assembly is arranged between the first liquid storage tank and the first cavity on the second liquid inlet pipe.
7. The chip nickel-gold plating apparatus as recited in any one of claims 1 to 3, wherein: the conveying device comprises a second motor, a one-way synchronous belt pulley, a double-sided synchronous belt and a clamp, the clamp is meshed with the double-sided synchronous belt through the one-way synchronous belt pulley, and the second motor drives the double-sided synchronous belt to drive the clamp to move.
8. The apparatus of claim 2 or 3, wherein: and a second rocker arm is arranged at the bottom of the second outer groove body, second shaking plates are arranged at two ends of the second rocker arm, and the middle part of the second rocker arm is connected with an output shaft of a second motor.
9. The chip nickel-gold plating apparatus as recited in any one of claims 1 to 3, wherein: also comprises a plurality of nickel plating pretreatment tanks, a plurality of nickel plating post-treatment tanks and a plurality of gold plating post-treatment tanks.
10. The chip nickel-gold plating apparatus as recited in claim 9, wherein: the nickel plating pretreatment tanks comprise a surface oxidation layer removing tank, a first cleaning tank and a surface activation tank which are sequentially arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822176970.3U CN209923429U (en) | 2018-12-24 | 2018-12-24 | Chip nickel gold plating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822176970.3U CN209923429U (en) | 2018-12-24 | 2018-12-24 | Chip nickel gold plating equipment |
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| Publication Number | Publication Date |
|---|---|
| CN209923429U true CN209923429U (en) | 2020-01-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822176970.3U Active CN209923429U (en) | 2018-12-24 | 2018-12-24 | Chip nickel gold plating equipment |
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| CN (1) | CN209923429U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114197023A (en) * | 2021-12-25 | 2022-03-18 | 霍飞 | Clamp for nickel plating protection |
| CN114214611A (en) * | 2021-12-30 | 2022-03-22 | 河北中瓷电子科技股份有限公司 | Low-temperature replacement gold plating process for packaging shell |
| CN117431535A (en) * | 2023-12-20 | 2024-01-23 | 天津响乐金属制品有限公司 | Electroplated part swinging frame and electroplated part passivation assembly line |
-
2018
- 2018-12-24 CN CN201822176970.3U patent/CN209923429U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114197023A (en) * | 2021-12-25 | 2022-03-18 | 霍飞 | Clamp for nickel plating protection |
| CN114214611A (en) * | 2021-12-30 | 2022-03-22 | 河北中瓷电子科技股份有限公司 | Low-temperature replacement gold plating process for packaging shell |
| CN117431535A (en) * | 2023-12-20 | 2024-01-23 | 天津响乐金属制品有限公司 | Electroplated part swinging frame and electroplated part passivation assembly line |
| CN117431535B (en) * | 2023-12-20 | 2024-04-02 | 天津响乐金属制品有限公司 | Electroplated part swinging frame and electroplated part passivation assembly line |
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| TR01 | Transfer of patent right |
Effective date of registration: 20220429 Address after: 214200 No. 2, Wenzhuang Road, Qiting street, Yixing City, Wuxi City, Jiangsu Province Patentee after: Jiangsu Huanxin Semiconductor Co.,Ltd. Address before: 300384 2nd floor, block a, 12 Haitai East Road, Huayuan Industrial Zone, Binhai New Area, Tianjin Patentee before: TIANJIN HUANXIN TECHNOLOGY & DEVELOPMENT Co.,Ltd. |
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