CN114214611A - Low-temperature replacement gold plating process for packaging shell - Google Patents
Low-temperature replacement gold plating process for packaging shell Download PDFInfo
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- CN114214611A CN114214611A CN202111658046.9A CN202111658046A CN114214611A CN 114214611 A CN114214611 A CN 114214611A CN 202111658046 A CN202111658046 A CN 202111658046A CN 114214611 A CN114214611 A CN 114214611A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
Abstract
The invention provides a low-temperature replacement gold plating process for a packaging shell, which belongs to the technical field of photoelectric communication and comprises the following steps of S1: placing the workpiece in ultrasonic equipment, and removing particles; s2: alkali washing is carried out on the workpiece by using alkali liquor, and organic matters on the surface of the workpiece are removed; s3: washing the workpiece with alkali liquor for the first time; s4: dissolving an oxidation or corrosion product on the surface of the workpiece by using acid liquor; s5: washing and cleaning the acid liquor on the workpiece for the second time; s6: and placing the workpiece in a gold displacement solution for reaction, wherein the temperature of the gold displacement solution is 60-80 ℃, the main salt of the gold displacement solution is potassium aurous cyanide, and the pH buffering agent is boric acid. The low-temperature displacement gold plating process for the packaging shell provided by the invention forms a thinner gold layer on the surface of the workpiece, improves the uniformity of the surface of the workpiece, and further ensures that the subsequent chemical gold plating process can be stably and well applied to the packaging tube shell.
Description
Technical Field
The invention belongs to the technical field of photoelectric communication, and particularly relates to a low-temperature replacement gold plating process for a packaging shell.
Background
With the development of the electronic industry and space technology, especially the development of the IP and printed wiring board industry in recent years, the electroless gold plating process has been more and more widely used. Compared with electrogilding, electroless gold plating has the following advantages: the coating has uniform thickness, no obvious edge effect, fine, compact and non-porous chemical coating grains, bright or semi-bright appearance and corrosion resistance; the electroless gold plating does not need complex equipment, is simple to operate and can meet some special requirements of customers. With the rapid development of the electronic industry, the importance of electroless gold plating is increasing. Due to the poor surface uniformity of the package housing, the application stability of the electroless gold plating process on the package housing is poor, and the production requirements cannot be met.
Disclosure of Invention
The invention aims to provide a low-temperature replacement gold plating process for a package shell, and aims to solve the technical problems that the application stability of a chemical gold plating process on the package shell is poor and the production requirement cannot be met in the prior art.
In order to achieve the purpose, the invention adopts the technical scheme that: a low temperature displacement gold plating process for a package housing is provided, comprising:
s1: placing the workpiece in ultrasonic equipment, and removing particles adhered to the surface of the workpiece;
s2: preparing alkali liquor, placing the workpiece in the alkali liquor for alkali washing, removing organic matters on the surface of the workpiece, and forming a uniform water film on the surface of the treated workpiece;
s3: washing with water for the first time to clean alkali liquor on the workpiece;
s4: preparing acid liquor, and placing the workpiece in the acid liquor for acid washing to dissolve oxidation or corrosion products on the surface of the workpiece;
s5: washing with water for the second time to clean the acid liquor on the workpiece;
s6: and (3) placing the workpiece in a displacement gold solution and carrying out displacement gold plating reaction, wherein the temperature of the displacement gold solution is 60-80 ℃, the main salt of the displacement gold solution is potassium aurous cyanide, the pH buffering agent is boric acid, and the reaction time is 1-5 minutes.
In a possible implementation manner, the gold replacing solution is contained in a working cavity, and a circulating system for updating the gold replacing solution is arranged on the working cavity.
In one possible implementation, a filter is provided on the circulation system.
In a possible implementation manner, a heater is arranged on the working chamber and used for maintaining the temperature of the gold replacing solution.
In a possible implementation mode, a vibrator is arranged on the working cavity and used for accelerating the flow of the replacement gold solution.
In a possible implementation manner, the alkali liquor is contained in a first box body, the acid liquor is contained in a second box body, and the ultrasonic equipment, the first box body and the second box body are all provided with heaters.
In one possible implementation mode, the working frequency of the ultrasonic equipment is 30-50kHz, the water temperature in the ultrasonic equipment is 20-50 ℃, and the cleaning time is 1-5 minutes.
In one possible implementation, the temperature of the alkali liquor is 45-60 ℃ and the alkali washing time is 1-5 minutes.
In one possible implementation, the thickness of the gold layer after the displacement gold plating reaction of the workpiece is less than 0.01 μm.
In one possible implementation, after the step S6 is performed, the workpiece after the displacement gold plating reaction is washed with water.
The low-temperature replacement gold plating process for the packaging shell has the beneficial effects that: compared with the prior art, the low-temperature displacement gold plating process for the packaging shell, disclosed by the invention, has the advantages that the displacement gold plating reaction is firstly carried out on the packaging shell before the chemical gold plating reaction is carried out; firstly, cleaning the surface of a workpiece by using ultrasonic equipment to adsorb particles on the surface of the workpiece, then cleaning the surface of the workpiece by using alkali liquor and acid liquor, wherein the alkali liquor is used for removing organic matters on the surface of the workpiece, the acid liquor is used for removing oxide skin or rusty products and the like on the surface of the workpiece, the workpiece is washed by using water after alkali washing and acid washing, so that impurities influencing displacement gold plating reaction do not exist on the surface of the workpiece, finally the workpiece is placed in displacement gold solution, the temperature of the displacement gold solution is adjusted to be 60-80 ℃ lower, boric acid is added to adjust the pH value of the displacement gold solution to be less than 6.5, the workpiece is subjected to displacement reaction under the action of potassium aurous cyanide in the displacement gold solution, the reaction lasts for 1-5 minutes, a thin gold layer is formed on the surface of the workpiece, the uniformity of the surface of the workpiece is improved, and further, the subsequent chemical gold plating process can be stable, The method is well applied to the packaging tube shell.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a schematic flow chart of a low-temperature displacement gold plating process for a package according to an embodiment of the present invention.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and is therefore not to be construed as limiting the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
Referring to fig. 1, a low temperature displacement gold plating process for a package according to the present invention will now be described. A low temperature displacement gold plating process for a package housing, comprising S1: placing the workpiece in ultrasonic equipment, and removing particles adhered to the surface of the workpiece; s2: preparing alkali liquor, placing the workpiece in the alkali liquor for alkali washing, removing organic matters on the surface of the workpiece, and forming a uniform water film on the surface of the treated workpiece; s3: washing with water for the first time to clean alkali liquor on the workpiece; s4: preparing acid liquor, and placing the workpiece in the acid liquor for acid washing to dissolve oxidation or corrosion products on the surface of the workpiece; s5: washing with water for the second time to clean the acid liquor on the workpiece; s6: and (3) placing the workpiece in a displacement gold solution and carrying out displacement gold plating reaction, wherein the temperature of the displacement gold solution is 60-80 ℃, the main salt of the displacement gold solution is potassium aurous cyanide, the pH buffering agent is boric acid, and the reaction time is 1-5 minutes.
Compared with the prior art, the low-temperature displacement gold plating process for the packaging shell provided by the invention has the advantages that the displacement gold plating reaction is firstly carried out on the packaging shell before the chemical gold plating reaction is carried out; firstly, cleaning the surface of a workpiece by using ultrasonic equipment to adsorb particles on the surface of the workpiece, then cleaning the surface of the workpiece by using alkali liquor and acid liquor, wherein the alkali liquor is used for removing organic matters on the surface of the workpiece, the acid liquor is used for removing oxide skin or rusty products and the like on the surface of the workpiece, the workpiece is washed by using water after alkali washing and acid washing, so that impurities influencing displacement gold plating reaction do not exist on the surface of the workpiece, finally the workpiece is placed in displacement gold solution, the temperature of the displacement gold solution is adjusted to be 60-80 ℃ lower, boric acid is added to adjust the pH value of the displacement gold solution to be less than 6.5, the workpiece is subjected to displacement reaction under the action of potassium aurous cyanide in the displacement gold solution, the reaction lasts for 1-5 minutes, a thin gold layer is formed on the surface of the workpiece, the uniformity of the surface of the workpiece is improved, and further, the subsequent chemical gold plating process can be stable, The method is well applied to the packaging tube shell.
The low-temperature displacement gold plating process for the packaging shell effectively reduces the operation difficulty of a displacement gold flow, improves the stability of the whole chemical gold plating process, and simultaneously can improve the chemical gold plating quality of the packaging shell.
The water level deionized water in the ultrasonic equipment reduces the influence of the water adsorbed on the surface of the packaging tube shell workpiece on replacement gold plating reaction; the alkaline components comprise special oil removing powder, sodium hydroxide, sodium silicate, surfactant and the like; the acid solution is mixed inorganic acid, such as hydrochloric acid, sulfuric acid, etc.
After the displacement gold plating reaction, the packaging tube shell workpiece is cleaned and placed into a chemical gold plating solution, the temperature of the chemical gold plating solution is (70-90) DEG C, the plating time is (30-90) min, and the thickness of a gold layer obtained on the surface of the packaging tube shell workpiece can be more than 0.5 mu m.
As a specific embodiment of the low-temperature displacement gold plating process for the package housing provided by the present invention, the displacement gold solution is placed in the working cavity, and the working cavity is provided with a circulation system for updating the displacement gold solution, so that when the displacement gold plating reaction is performed on the package housing, metal ions in the displacement gold solution are consumed all the time, and the normal performance of the displacement gold plating reaction is affected after the solubility of the metal ions is reduced; therefore, the circulating system is arranged on the working cavity and used for gradually discharging the low-concentration replacement gold solution, and adding the unused replacement gold solution to ensure the normal operation of the replacement gold plating reaction of the packaging tube shell. The circulating system comprises two water pumps and a connecting pipeline which are communicated with the working cavity, wherein one water pump is used for pumping out the replacement gold solution in the working cavity, and the other water pump is used for adding the unused replacement gold solution into the working cavity. The replacement gold solution discharged from the working cavity is placed in a vacant solution preparation box, metal ions entering the self-packaging tube shell are cleaned, the concentration of the solution is measured or the replacement gold solution is concentrated, and the replacement gold solution is processed into a new replacement gold solution, so that the production cost is saved.
As a specific embodiment of the low-temperature displacement gold plating process for the package housing provided by the invention, a filter is arranged on the circulating system, and in the displacement gold plating reaction process, metal with impurities is reacted away and the impurities enter a displacement gold solution; when the replacement gold solution is recycled, impurities are filtered out of the replacement gold solution by means of a filter, the accuracy of the concentration of the replacement gold solution is guaranteed, and the overall treatment effect of the process is improved. The filter is arranged on a connecting pipeline for pumping the replacement gold solution out of the working cavity, and impurities are removed as soon as possible. The replacement gold solution is filtered in real time in such a way, so that the cleanliness of the gold plating solution can be ensured, and the gold plating quality of the packaging tube shell is improved.
As a specific embodiment of the low-temperature displacement gold plating process for the package housing provided by the present invention, the working chamber is provided with a heater for maintaining the temperature of the displaced gold solution, so that the temperature of the displaced gold solution is always maintained at 60-80 ℃, the displaced gold solution is ensured to be performed in a lower temperature state, the temperature of the displaced gold solution is not too low, and the normal operation of the displaced gold reaction is not greatly affected, the heaters are uniformly distributed in the working chamber, so that the temperature of the displaced gold solution in the working chamber is the same, the reaction rate of the displaced gold at each position of the package housing is ensured, and further, the thickness of the gold layer at each position of the surface of the package housing is uniform. The heater is a heating pipe, a heating resistor and the like which are arranged around the outer side surface of the working cavity, and a plurality of heaters are uniformly arranged in the replacement gold solution and used for directly heating the replacement gold solution.
As a specific embodiment of the low-temperature displacement gold plating process for packaging the housing provided by the invention, the working chamber is provided with a vibrator for accelerating the flow of the displacement gold solution, and when the displacement gold plating reaction is performed, the vibrator is turned on to vibrate the displacement gold solution in the working chamber, so that the displacement gold solution is accelerated to flow, and the concentrations of all parts of the displacement gold solution are ensured to be the same; therefore, the replacement gold plating reaction rate of all parts of the packaging shell is the same, the thickness of the gold layer is consistent, and the surface uniformity of the packaging shell is ensured.
As a specific implementation manner of the low-temperature displacement gold plating process for the package shell, provided by the invention, the alkali liquor is contained in the first box, the acid liquor is contained in the second box, and the ultrasonic equipment, the first box and the second box are all provided with heaters, so that the temperature of water and the acid liquor is adjusted to be 20-50 ℃, the temperature of the alkali liquor is adjusted to be 45-60 ℃ in the process of carrying out ultrasonic cleaning, alkali washing and acid washing on the package tube shell, and the cleaning effect of the package tube shell can be increased at a higher temperature. The components in the alkali liquor and the acid liquor move more actively, and interact with impurities on the surface of the packaging tube shell at high frequency and are cleaned.
As a specific embodiment of the low-temperature displacement gold plating process for the packaging shell, the working frequency of the ultrasonic equipment is 30-50kHz, the water temperature in the ultrasonic equipment is 20-50 ℃, and the cleaning time is 1-5 minutes; impurity such as the adsorbed particulate matter of encapsulation tube work piece surface is cleared up fast through the work of ultrasonic equipment high frequency, and the cleaning effect is better. And the temperature of water in the ultrasonic equipment is better, can make the effort between the particulate matter of adhesion and the encapsulation tube shell diminish, changes in the dropping.
As a specific implementation mode of the low-temperature replacement gold plating process for the packaging shell, the temperature of the alkali liquor is 45-60 ℃, the alkali washing time is 1-5 minutes, and the higher temperature of the alkali liquor increases the activity of solutes in the alkali liquor, so that organic matters and the like on the surface of the packaging shell can be more efficiently washed and the washing is cleaner; and forming an even water film on the surface of the packaging tube shell cleaned by using the alkali liquor, namely cleaning the surface of the packaging tube shell.
As a specific implementation mode of the low-temperature displacement gold-plating process for the packaging shell, the thickness of the gold layer after the displacement gold-plating reaction of the workpiece is less than 0.01 mu m, the surface gold layer of the packaging shell is ensured to be even and flat, the subsequent chemical gold-plating is facilitated, the stability of the whole chemical gold-plating process is improved, and the chemical gold-plating quality of the packaging shell can be improved.
Referring to fig. 1, as a specific embodiment of the low-temperature displacement gold plating process for the package housing according to the present invention, after step S6, the workpiece after the displacement gold plating reaction is washed with water, and before the package housing is subjected to the electroless gold plating, the surface of the package housing is washed with water, so as to wash away the residual displacement gold solution, thereby preventing the electroless gold plating reaction affecting the package housing.
The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A low temperature displacement gold plating process for a package housing, comprising:
s1: placing the workpiece in ultrasonic equipment, and removing particles adhered to the surface of the workpiece;
s2: preparing alkali liquor, placing the workpiece in the alkali liquor for alkali washing, removing organic matters on the surface of the workpiece, and forming a uniform water film on the surface of the treated workpiece;
s3: washing with water for the first time to clean alkali liquor on the workpiece;
s4: preparing acid liquor, and placing the workpiece in the acid liquor for acid washing to dissolve oxidation or corrosion products on the surface of the workpiece;
s5: washing with water for the second time to clean the acid liquor on the workpiece;
s6: and (3) placing the workpiece in a displacement gold solution and carrying out displacement gold plating reaction, wherein the temperature of the displacement gold solution is 60-80 ℃, the main salt of the displacement gold solution is potassium aurous cyanide, the pH buffering agent is boric acid, and the reaction time is 1-5 minutes.
2. The low temperature displacement gold plating process for a package housing of claim 1 wherein the displacement gold solution is contained in a working chamber, the working chamber having a circulation system for renewing the displacement gold solution.
3. The low temperature displacement gold plating process for a package housing of claim 2, wherein a filter is provided on said circulation system.
4. The low temperature displacement gold plating process for packaging enclosures according to claim 2, wherein said working chamber is provided with a heater for maintaining the temperature of said displacement gold solution.
5. The low temperature displacement gold plating process for package housings of claim 2 wherein a vibrator is placed in the working chamber to accelerate the flow of the displacement gold solution.
6. The low temperature displacement gilding process for packaging housings of claim 1, wherein the alkali solution is contained in a first box, the acid solution is contained in a second box, and the ultrasonic device, the first box and the second box are all provided with heaters.
7. The low temperature displacement gold plating process for package housings of claim 1, wherein the ultrasonic device has an operating frequency of 30 to 50kHz, a water temperature of 20 to 50 ℃ in the ultrasonic device, and a cleaning time of 1 to 5 minutes.
8. The low temperature displacement gold plating process for a package housing of claim 1 wherein the temperature of the alkaline solution is 45-60 ℃ and the alkaline washing time is 1-5 minutes.
9. The low temperature displacement gold plating process for package housings of claim 1 wherein the thickness of the gold layer after the workpiece displacement gold plating reaction is less than 0.01 μm.
10. The low-temperature displacement gold plating process for a package according to claim 1, wherein after the step of S6, the workpiece after the displacement gold plating reaction is washed with water.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111658046.9A CN114214611A (en) | 2021-12-30 | 2021-12-30 | Low-temperature replacement gold plating process for packaging shell |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111658046.9A CN114214611A (en) | 2021-12-30 | 2021-12-30 | Low-temperature replacement gold plating process for packaging shell |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003041378A (en) * | 2001-07-27 | 2003-02-13 | Japan Pure Chemical Co Ltd | Electroless gold plating solution |
| CN101074479A (en) * | 2006-05-19 | 2007-11-21 | 何靖 | Method for treating magnesium-alloy workpiece, workpiece therefrom and composition therewith |
| JP2008306159A (en) * | 2007-05-09 | 2008-12-18 | Hitachi Chem Co Ltd | Electronic component and manufacturing method therefor |
| CN103014685A (en) * | 2013-01-14 | 2013-04-03 | 厦门大学 | Double-tank method for continuously plating thick gold with cyanide-free chemical gold plating solutions |
| CN103014684A (en) * | 2012-12-18 | 2013-04-03 | 金华冠华水晶有限公司 | Chemical silvering and pretreatment process for synthetic quartz diamond pavilion |
| CN106894003A (en) * | 2016-12-30 | 2017-06-27 | 广东致卓环保科技有限公司 | Without the thick gold method of cyanogen chemical plating and plating liquid making method on Ni-based material |
| CN108359966A (en) * | 2017-09-30 | 2018-08-03 | 深圳市正天伟科技有限公司 | A kind of half replaces semi-reduction type chemical gold plating liquid and its application process |
| CN209923429U (en) * | 2018-12-24 | 2020-01-10 | 天津环鑫科技发展有限公司 | Chip nickel gold plating equipment |
-
2021
- 2021-12-30 CN CN202111658046.9A patent/CN114214611A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003041378A (en) * | 2001-07-27 | 2003-02-13 | Japan Pure Chemical Co Ltd | Electroless gold plating solution |
| CN101074479A (en) * | 2006-05-19 | 2007-11-21 | 何靖 | Method for treating magnesium-alloy workpiece, workpiece therefrom and composition therewith |
| JP2008306159A (en) * | 2007-05-09 | 2008-12-18 | Hitachi Chem Co Ltd | Electronic component and manufacturing method therefor |
| CN103014684A (en) * | 2012-12-18 | 2013-04-03 | 金华冠华水晶有限公司 | Chemical silvering and pretreatment process for synthetic quartz diamond pavilion |
| CN103014685A (en) * | 2013-01-14 | 2013-04-03 | 厦门大学 | Double-tank method for continuously plating thick gold with cyanide-free chemical gold plating solutions |
| CN106894003A (en) * | 2016-12-30 | 2017-06-27 | 广东致卓环保科技有限公司 | Without the thick gold method of cyanogen chemical plating and plating liquid making method on Ni-based material |
| CN108359966A (en) * | 2017-09-30 | 2018-08-03 | 深圳市正天伟科技有限公司 | A kind of half replaces semi-reduction type chemical gold plating liquid and its application process |
| CN209923429U (en) * | 2018-12-24 | 2020-01-10 | 天津环鑫科技发展有限公司 | Chip nickel gold plating equipment |
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