CN209912638U - Single-layer ceramic chip type thick film high-power resistor - Google Patents
Single-layer ceramic chip type thick film high-power resistor Download PDFInfo
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- CN209912638U CN209912638U CN201920884871.2U CN201920884871U CN209912638U CN 209912638 U CN209912638 U CN 209912638U CN 201920884871 U CN201920884871 U CN 201920884871U CN 209912638 U CN209912638 U CN 209912638U
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Abstract
The utility model discloses a single-layer ceramic chip type thick film high-power resistor, which comprises a shell and a resistance chip, wherein a containing cavity is arranged in the shell, an installation position is arranged at the upper part of the containing cavity, the edge of the resistance chip is clamped on the installation position, and an elastic material is filled between the resistance chip and the installation position; the resistance chip is a structure of a single-layer ceramic chip and a cover plate, so that the integral mechanical strength of the resistance chip is improved. This resistor adopts the structure that the individual layer ceramic chip adds the apron, under the condition that does not influence equal power, the cost is reduced, and the roughness of individual layer ceramic chip is better, through the setting of installation screens, play spacing effect, make more stable the installing of resistance chip hold the intracavity, through elastic material's setting, because elastic material has elasticity, can make this resistor in the use scene of difference, the part that can both realize resistance chip through extrusion elastic material keeps inseparabler laminating rather than in the use scene, thereby the radiating effect of this resistor has been guaranteed.
Description
Technical Field
The utility model belongs to the technical field of the resistance, in particular to high-power resistor of individual layer ceramic chip type thick film.
Background
The resistor is a two-terminal electronic component which is made of a resistance material, has a certain structural form and can play a role in limiting the current to pass through in a circuit. The resistor is composed of a resistor body, a framework and a leading-out terminal.
The resistor body of the traditional resistor generally adopts a multilayer structure, and the structural mode not only needs to adopt various materials, increases the production cost, but also is difficult to ensure the flatness of the resistor body, and influences the use effect.
In the utility model patent of patent application number CN201220163455.1, a thick film plane super high power resistor of composite bottom plate is disclosed, this resistor includes first potsherd, copper sheet, second potsherd, electrode and resistance thick liquids layer, and copper sheet welded fastening is between first potsherd and second potsherd, and electrode and resistance thick liquids layer sintering are on first potsherd, and the electrode is connected with the resistance thick liquids layer.
But above-mentioned utility model discloses a thick film plane super large power resistor of composite bottom plate has adopted multilayer structure's composite bottom plate, not only needs to adopt multiple material, has increased manufacturing cost, is difficult to guarantee the roughness of resistor moreover, influences the result of use.
Disclosure of Invention
In order to solve the above problem, the utility model discloses a first-hand object provides a high-power resistor of individual layer ceramic chip type thick film adopts the individual layer ceramic chip to add the structure of apron, under the condition that does not influence equal power, greatly reduced material and manufacturing cost, the roughness of individual layer ceramic chip is better moreover, excellent in use effect.
Another object of the utility model is to provide a high-power resistor of individual layer ceramic chip type thick film, simple structure, under the same condition, the power than traditional resistor is bigger, the demand that satisfies the user that can be better.
In order to achieve the above purpose, the technical scheme of the utility model is as follows:
the utility model provides a single-layer ceramic chip type thick film high-power resistor, which comprises a shell and a resistance chip, wherein a containing cavity for containing the resistance chip is arranged in the shell, an installation position is arranged at the upper part of the containing cavity, the edge of the resistance chip is clamped on the installation position, and an elastic material is filled between the resistance chip and the installation position; the resistance chip is in a structure of a single-layer ceramic chip and a cover plate, so that the overall mechanical strength of the resistance chip is improved. In the utility model, the resistor adopts a structure that a single-layer ceramic chip is added with a cover plate, the single-layer ceramic chip is positioned at the outer side, the cover plate is positioned at the inner side, the material and production cost are greatly reduced under the condition of not influencing the same power, and the single-layer ceramic chip has better flatness and good use effect; through the setting of installation screens, can play spacing effect, make more stable the installing of resistance chip hold the intracavity, through elastic material's setting, because elastic material has elasticity, can make this resistor in the use scene of difference, can both realize through extrusion elastic material that the surface of resistance chip keeps inseparabler laminating rather than the part in the use scene to the radiating effect of this resistor has been guaranteed.
Furthermore, the shape of installation screens is the structure of returning the font, resistance chip is the rectangle structure of the size looks adaptation of peripheral size and installation screens, resistance chip installs on the installation screens, when not receiving the exogenic action, resistance chip's surface and the peripheral plane all around of holding the chamber are on same horizontal plane. The utility model discloses in, through the aforesaid setting, can better guarantee the roughness behind the resistance chip installation, the result of use is better.
Further, elastic material is the silica gel material, the individual layer ceramic chip is thick film plane porcelain base plate, and thick 1.2mm, long 44.8mm, wide 38.6mm, the apron is thick film plane porcelain base plate, and thick 1.2mm, long 35mm, wide 30 mm. In the utility model, the elastic material is specifically a silica gel material in a viscous state, which can better realize that the surface of the resistance chip is more closely attached to the components in the use scene, thereby ensuring the heat dissipation effect of the resistor; through the size setting of above-mentioned resistance chip, can be under the condition that does not influence equal power, greatly reduced material and manufacturing cost, the roughness of individual layer ceramic chip is better moreover, excellent in use effect.
Further, the printing has the resistive layer on the individual layer ceramic chip, the welding of resistive layer both ends has 2 pins, 2 perforation that correspond 2 pins are seted up to the bottom that holds the chamber, the casing is kept away from the one side that holds the chamber and is seted up the isolation chamber that improves creepage distance of 2 at least, and 2 pins of resistance chip are passed the bottom that holds the chamber through the perforation respectively and are stretched out from 2 isolation chamber wherein behind the chamber. The utility model discloses in, through the setting of keeping apart the chamber, improved the creepage distance between 2 pins, make the security performance of this resistor higher.
Further, keep apart the chamber including first isolation chamber, second isolation chamber and middle isolation chamber, the middle isolation chamber is located between first isolation chamber and the second isolation chamber, and first isolation chamber keeps apart the lateral wall that the chamber was kept apart through the middle with the second isolation chamber and separates, and 2 pins of resistance chip stretch out from first isolation chamber and second isolation chamber respectively, the middle isolation chamber is the zigzag structure, first isolation chamber is located the middle left lower part of keeping apart the chamber of zigzag structure, the second isolation chamber is located the middle upper right portion of keeping apart the chamber of zigzag structure. The utility model discloses in, through the aforesaid setting, creepage distance between 2 pins of improvement that can be better prolongs the life of this resistor.
Further, the intracavity is kept apart to first isolation chamber and second and all is provided with fixed protruding seat, metal preforming, fixation nut, and fixed protruding seat and first isolation chamber or the second is kept apart and is equipped with the interval between the lateral wall in chamber, and the metal preforming is bent and is set up, and metal preforming bending end is equipped with the electrode and passes the hole, the metal preforming is equipped with the screw clearing hole, be equipped with the pin on the fixed protruding seat and pass the hole, sheetmetal fixed slot, fixation nut hold the draw-in groove, and after the electrode pin passed the pin and pass the hole, the electrode pin passed the electrode and pass the hole, fixation nut puts into fixation nut and holds the draw-in groove, and after the sheetmetal inserted sheetmetal fixed slot, electrode pin and sheetmetal preforming fixed connection, the screw that screw clearing hole is just to fixation nut, scribble high-pressure insulating glue and. The utility model discloses in, can make things convenient for this resistor and other parts of outside to be connected through above-mentioned setting and switch on more.
Further, the thick film planar ceramic substrate is specifically a 96% alumina ceramic substrate. The utility model discloses in, the structure setting of the 96% alumina porcelain base plate of adoption individual layer, for current multilayer structure, the relative area of the resistance layer that can print on resistance chip is bigger, has improved power, under the same condition, and is bigger than the power of traditional resistor, the demand that satisfies the user that can be better.
Further, all be provided with the mounting panel outside the left and right sides of casing, the mounting panel of the casing left and right sides all begins to have the fixed orifices, all be provided with first strengthening rib between the both sides outer wall of mounting panel and casing. In the utility model, the resistor can be more conveniently installed at the position needing to be installed and is convenient to use through the arrangement of the mounting plate and the fixing hole; through the setting of first strengthening rib, can guarantee that this resistor's structural strength is higher, the structure is more stable.
Furthermore, a plurality of second reinforcing ribs are fixed on the upper side and the lower side of the inner wall of the accommodating cavity. The utility model discloses in, the second strengthening rib that holds the upper and lower both sides of the inner wall in chamber is 5, and through the setting of second strengthening rib, can guarantee that the structural strength of this resistor is higher, and the structure is more stable.
The beneficial effects of the utility model reside in that: compared with the prior art, the resistor adopts the structure that the single-layer ceramic chip is added with the cover plate, so that the material and production cost are greatly reduced under the condition of not influencing the same power, the flatness of the single-layer ceramic chip is better, and the using effect is good; through the setting of installation screens, can play spacing effect, make more stable the installing of resistance chip hold the intracavity, through elastic material's setting, because elastic material has elasticity, can make this resistor in the use scene of difference, can both realize through extrusion elastic material that the surface of resistance chip keeps inseparabler laminating rather than the part in the use scene to the radiating effect of this resistor has been guaranteed.
Drawings
Fig. 1 is a schematic view of an embodiment of the present invention, wherein a metal pellet and a fixing nut are installed on a single-layer ceramic chip type thick film high power resistor.
Fig. 2 is a schematic view of an embodiment of the single-layer ceramic chip type thick film high power resistor according to the present invention without a metal wafer and a fixing nut.
Fig. 3 is a schematic structural diagram of a housing of a single-layer ceramic thick-film high-power resistor according to the present invention.
Fig. 4 is a schematic diagram of an embodiment of the present invention, wherein a resistance chip is mounted on a single-layer ceramic chip type thick film high power resistor.
Fig. 5 is a schematic structural diagram of a resistor chip of a single-layer ceramic thick-film high-power resistor according to the present invention.
Fig. 6 is a schematic structural diagram of a metal wafer of a single-layer ceramic thick-film high-power resistor according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1-6, the utility model provides a single-layer ceramic chip type thick film high-power resistor, which comprises a casing 1 and a resistance chip 2, wherein a containing cavity 11 for containing the resistance chip 2 is arranged in the casing 1, an installation position 111 is arranged at the upper part of the containing cavity 11, the edge of the resistance chip 2 is clamped on the installation position 111, and an elastic material is filled between the resistance chip 2 and the installation position 111; the resistance chip 2 is a structure of a single-layer ceramic chip and a cover plate, so that the overall mechanical strength of the resistance chip is improved. In the utility model, the resistor adopts the structure of single-layer ceramic chip and cover plate, which greatly reduces the material and production cost without affecting the same power, and the single-layer ceramic chip has better flatness and good use effect; through the setting of installation screens 111, can play spacing effect, make more stable the installing in holding chamber 11 of resistance chip 2, through elastic material's setting, because elastic material has elasticity, can make this resistor in the use scene of difference, can both realize through extrusion elastic material that resistance chip 2's surface keeps inseparabler laminating rather than the part in the use scene to the radiating effect of this resistor has been guaranteed.
In this embodiment, the mounting clip 111 is in a shape of a Chinese character 'hui', the resistor chip 2 is in a rectangular structure with the peripheral size matched with the size of the mounting clip 111, the resistor chip 2 is mounted on the mounting clip 111, and when the resistor chip 2 is not subjected to an external force, the surface of the resistor chip 2 and the peripheral plane of the accommodating cavity 11 are on the same horizontal plane. The utility model discloses in, through the aforesaid setting, can better guarantee the roughness after 2 installations of resistance chip, the result of use is better.
In this embodiment, the elastic material is a silica gel material, the single-layer ceramic chip is a thick-film planar ceramic substrate with a thickness of 1.2mm, a length of 44.8mm and a width of 38.6mm, and the cover plate is a thick-film planar ceramic substrate with a thickness of 1.2mm, a length of 35mm and a width of 30 mm. In the utility model, the elastic material is specifically a silica gel material in a viscous state, which can better realize that the surface of the resistance chip 2 and the parts in the use scene thereof are kept to be more closely attached, thereby ensuring the heat dissipation effect of the resistor; through the size setting of above-mentioned resistance chip 2, can be under the condition that does not influence equal power, greatly reduced material and manufacturing cost, the roughness of individual layer ceramic chip is better moreover, excellent in use effect.
In this embodiment, the single-layer ceramic tile is printed with a resistor layer 21, two ends of the resistor layer 21 are welded with 2 pins 22, the bottom of the accommodating cavity 11 is provided with 2 through holes 112 corresponding to the 2 pins 22, one surface of the housing 1 far away from the accommodating cavity 11 is provided with at least 2 isolation cavities 12 for improving creepage distance, and the 2 pins 22 of the resistor chip 2 respectively pass through the through holes 112 and then extend out of the 2 isolation cavities 12 after passing through the bottom of the accommodating cavity 11. The utility model discloses in, through the setting of keeping apart chamber 12, improved the creepage distance between 2 pins 22, make the security performance of this resistor higher.
In this embodiment, the isolation cavity 12 includes a first isolation cavity 121, a second isolation cavity 122 and a middle isolation cavity 123, the middle isolation cavity 123 is located between the first isolation cavity 121 and the second isolation cavity 122, and the first isolation cavity 121 and the second isolation cavity 122 are isolated by a sidewall 1231 of the middle isolation cavity 123, 2 pins 22 of the resistor chip 2 respectively extend out of the first isolation cavity 121 and the second isolation cavity 122, the middle isolation cavity 123 is in a zigzag structure, the first isolation cavity 121 is located at a lower left portion of the middle isolation cavity 123 of the zigzag structure, and the second isolation cavity 122 is located at an upper right portion of the middle isolation cavity 123 of the zigzag structure. The utility model discloses in, through above-mentioned setting, the creepage distance between 2 pins 22 of improvement that can be better prolongs the life of this resistor.
In this embodiment, the first isolation cavity 121 and the second isolation cavity 122 are respectively provided with a fixed protrusion seat 10, a metal pressing sheet 20 and a fixing nut 30, a space is provided between the fixed protrusion seat 10 and the side wall of the first isolation cavity 121 or the second isolation cavity 122, the metal pressing sheet 20 is bent, the bent end of the metal pressing sheet 20 is provided with an electrode through hole 201, the metal pressing sheet 20 is provided with a screw through hole 202, the fixed protrusion seat 10 is provided with a pin through hole 101, a metal sheet fixing clamping groove 102 and a fixing nut accommodating clamping groove 103, after the electrode pin 22 passes through the pin through hole 101, the electrode pin 22 passes through the electrode through hole 201, the fixing nut 30 is placed in the fixing nut accommodating slot 103, after the metal pressing sheet 20 is inserted into the metal sheet fixing slot 102, the electrode pin 22 is fixedly connected with the metal pressing sheet 20, the screw hole 202 of the screw is opposite to the screw hole of the fixing nut 30, and the metal pressing sheet 20 is adhered to the shell 1 by coating the high-voltage insulating glue 40. The utility model discloses in, can make things convenient for this resistor and other parts of outside to be connected through above-mentioned setting and switch on more.
In this example, the thick film planar ceramic substrate is specifically a 96% alumina ceramic substrate. The utility model discloses in, the structure setting of the 96% alumina porcelain base plate of adoption individual layer, for current multilayer structure, the relative area of the resistance layer 21 that can print on resistance chip 2 is bigger, has improved power, under the same condition, for traditional resistor, resistance layer 21 area increase 25%, bigger than the power of traditional resistor, the demand that satisfies the user that can be better.
In this embodiment, the mounting plates 13 are disposed outside the left and right sides of the casing 1, the fixing holes 131 are formed in the mounting plates 13 on the left and right sides of the casing 1, and the first reinforcing ribs 14 are disposed between the mounting plates 13 and the outer walls on the two sides of the casing 1. In the utility model, the resistor can be more conveniently installed at the position needing to be installed and is convenient to use through the arrangement of the mounting plate 13 and the fixing hole 131; through the setting of first strengthening rib 14, can guarantee that this resistor's structural strength is higher, the structure is more stable.
In this embodiment, a plurality of second ribs 15 are fixed to both upper and lower sides of the inner wall of the accommodating chamber 11. The utility model discloses in, the second strengthening rib 15 that holds the upper and lower both sides of the inner wall of chamber 11 is 5, and through the setting of second strengthening rib 15, can guarantee that the structural strength of this resistor is higher, and the structure is more stable.
The beneficial effects of the utility model reside in that: compared with the prior art, the resistor adopts the structure that the single-layer ceramic chip is added with the cover plate, so that the material and production cost are greatly reduced under the condition of not influencing the same power, the flatness of the single-layer ceramic chip is better, and the using effect is good; through the setting of installation screens, can play spacing effect, make more stable the installing of resistance chip hold the intracavity, through elastic material's setting, because elastic material has elasticity, can make this resistor in the use scene of difference, can both realize through extrusion elastic material that the surface of resistance chip keeps inseparabler laminating rather than the part in the use scene to the radiating effect of this resistor has been guaranteed.
The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (9)
1. A single-layer ceramic chip type thick-film high-power resistor comprises a shell and a resistor chip, wherein a containing cavity for containing the resistor chip is arranged in the shell, and the resistor chip is characterized in that an installation clamping position is arranged at the upper part of the containing cavity, the edge of the resistor chip is clamped on the installation clamping position, and an elastic material is filled between the resistor chip and the installation clamping position; the resistance chip is a structure of a single-layer ceramic chip and a cover plate.
2. The single-layer ceramic thick film high-power resistor as claimed in claim 1, wherein the mounting clip is in a rectangular structure, the resistor chip is in a rectangular structure with a peripheral size matched with that of the mounting clip, the resistor chip is mounted on the mounting clip, and when the resistor chip is not subjected to an external force, a bottom plane of the resistor chip and a plane around the periphery of the accommodating cavity are on the same horizontal plane.
3. The large power resistor of claim 1, wherein the elastic material is a silica gel material, the single-layer ceramic chip is a thick-film planar ceramic substrate with a thickness of 1.2mm, a length of 44.8mm and a width of 38.6mm, and the cover plate is a thick-film planar ceramic substrate with a thickness of 1.2mm, a length of 35mm and a width of 30 mm.
4. The single-layer ceramic thick-film high-power resistor as claimed in claim 1, wherein the single-layer ceramic is printed with a resistive layer, two ends of the resistive layer are welded with 2 pins, the bottom of the accommodating cavity is provided with 2 through holes corresponding to the 2 pins, one surface of the housing away from the accommodating cavity is provided with at least 2 isolation cavities for increasing creepage distance, and the 2 pins of the resistive chip respectively penetrate through the bottom of the accommodating cavity through the through holes and then extend out of the 2 isolation cavities.
5. The single-layer ceramic chip type thick film high-power resistor of claim 4, wherein the isolation chamber comprises a first isolation chamber, a second isolation chamber and an intermediate isolation chamber, the intermediate isolation chamber is located between the first isolation chamber and the second isolation chamber, the first isolation chamber and the second isolation chamber are separated by a side wall of the intermediate isolation chamber, 2 pins of the resistor chip respectively extend out of the first isolation chamber and the second isolation chamber, the intermediate isolation chamber is in a zigzag structure, the first isolation chamber is located at the lower left portion of the intermediate isolation chamber in the zigzag structure, and the second isolation chamber is located at the upper right portion of the intermediate isolation chamber in the zigzag structure.
6. The large power resistor of claim 5, wherein the first and second isolation chambers are each provided with a fixed protrusion, a metal plate, and a nut, a space is provided between the fixed protrusion and the sidewall of the first or second isolation chamber, the metal plate is bent, the bent end of the metal plate is provided with an electrode through hole, the metal pressing sheet is provided with a screw through hole, the fixed bulge seat is provided with a pin through hole, a metal sheet fixed clamping groove and a fixed nut accommodating clamping groove, after the electrode pin passes through the pin through hole, the electrode pin passes through the electrode through hole, the fixing nut is arranged in the holding slot of the fixing nut, the electrode pin is fixedly connected with the metal pressing sheet after the metal pressing sheet is inserted into the metal sheet fixing slot, the screw through hole is opposite to the screw hole of the fixing nut, and high-voltage insulating glue is coated between the metal pressing sheet and the shell for bonding.
7. The single layer ceramic tile type thick film high power resistor of claim 3, wherein said thick film planar ceramic substrate is specifically a 96% alumina ceramic substrate.
8. The large power resistor of claim 1, wherein the mounting plates are disposed on the left and right sides of the housing, the mounting plates are provided with fixing holes, and the first ribs are disposed between the mounting plates and the outer walls of the housing.
9. The single-layer ceramic thick film high power resistor as claimed in claim 1, wherein a plurality of second ribs are fixed to the upper and lower sides of the inner wall of the accommodating cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920884871.2U CN209912638U (en) | 2019-06-13 | 2019-06-13 | Single-layer ceramic chip type thick film high-power resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920884871.2U CN209912638U (en) | 2019-06-13 | 2019-06-13 | Single-layer ceramic chip type thick film high-power resistor |
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| Publication Number | Publication Date |
|---|---|
| CN209912638U true CN209912638U (en) | 2020-01-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201920884871.2U Active CN209912638U (en) | 2019-06-13 | 2019-06-13 | Single-layer ceramic chip type thick film high-power resistor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116936211A (en) * | 2023-08-15 | 2023-10-24 | 广东正鸿电子科技有限公司 | Planar thick film power resistor and production process thereof |
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2019
- 2019-06-13 CN CN201920884871.2U patent/CN209912638U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116936211A (en) * | 2023-08-15 | 2023-10-24 | 广东正鸿电子科技有限公司 | Planar thick film power resistor and production process thereof |
| CN116936211B (en) * | 2023-08-15 | 2024-01-30 | 广东正鸿电子科技有限公司 | Planar thick film power resistor and production process thereof |
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Effective date of registration: 20211103 Address after: 523648 Room 101, building 17, Lihe Bauhinia intelligent manufacturing center, No. 105, Qingbin East Road, Qingxi Town, Dongguan City, Guangdong Province Patentee after: GUANGDONG YIJIE TECHNOLOGY Co.,Ltd. Address before: 518000 Guangdong Shenzhen Nanshan District science and Technology Park 1 Nanshan District science and Technology Park standard workshop 23 north 5, 6 level Patentee before: EBG-SHENZHEN Co.,Ltd. |