CN209910212U - Hot end radiator of energy-saving semiconductor refrigeration equipment - Google Patents
Hot end radiator of energy-saving semiconductor refrigeration equipment Download PDFInfo
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- CN209910212U CN209910212U CN201920417681.XU CN201920417681U CN209910212U CN 209910212 U CN209910212 U CN 209910212U CN 201920417681 U CN201920417681 U CN 201920417681U CN 209910212 U CN209910212 U CN 209910212U
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Abstract
The embodiment of the utility model discloses an energy-saving semiconductor refrigeration plant's hot junction radiator, including semiconductor refrigeration piece and the radiator that sets up at semiconductor refrigeration piece hot junction, the hot junction upper surface of semiconductor refrigeration piece is seted up a plurality of cross-sections and is the recess of semicircle form, the opening of recess is up, the both ends of recess are all seted up and are used for pouring into the heat conduction silica gel of heat conduction silica gel and annotate the hole, the lower extreme of radiator is provided with the curved heat conduction copper sheet that matches with the recess, the heat conduction copper sheet stretches into the recess inside and through heat conduction silica gel and recess inner wall connection; the utility model discloses set up the recess in the hot junction of semiconductor refrigeration piece, the lower extreme of radiator be provided with recess assorted heat conduction copper sheet, through stretch into the heat conduction silica gel filling hole that rethread recess side was seted up in the recess with heat conduction copper sheet and pour into heat conduction silica gel into, accomplish the connection of the two, avoid heat conduction silica gel to outwards spill over, lead to semiconductor refrigeration piece and radiator surface to glue greasiness and influence pleasing to the eye.
Description
Technical Field
The embodiment of the utility model provides an energy-saving semiconductor refrigeration plant technical field, concretely relates to energy-saving semiconductor refrigeration plant's hot junction radiator.
Background
With the continuous progress of society and the continuous development of scientific technology, people are more and more concerned about the earth on which people depend to live, and most countries in the world fully recognize the importance of the environment to the development of human beings. All countries adopt active and effective measures to improve the environment and reduce pollution. The most important and urgent problem is the energy problem, which is to be solved fundamentally, except for searching new energy, energy conservation is the key and the most direct and effective important measure at present, and in recent years, through efforts, people have achieved huge achievements in the research of energy conservation technology and product development.
Semiconductor refrigeration, also known as thermoelectric refrigeration, is a solid refrigeration mode, which is a new refrigeration technology developed on the basis of the Peltier effect. Compared with the conventional compression refrigeration, the semiconductor refrigeration still has the problems of low refrigeration efficiency and low energy efficiency due to the influence of semiconductor materials, a power supply, heat dissipation at a hot end and the like. Because the heat dissipation capacity of the semiconductor refrigerator is equal to the sum of the refrigerating capacity and the input power, the important solution of the heat dissipation problem plays an important role in improving the refrigerating efficiency.
When the hot junction of current semiconductor refrigeration piece is connected with the radiator, scribble one deck heat conduction silica gel at the binding face usually, heat conduction silica gel can fill the clearance of contact surface, extrude the contact surface with bad conductor air, avoid it to obstruct the transmission of heat between the contact surface, the extrusion of hot junction and radiator to heat conduction silica gel can make heat conduction silica gel outwards spill over to lead to semiconductor refrigeration piece and radiator surface to be glutinous greasy and influence pleasing to the eye.
SUMMERY OF THE UTILITY MODEL
For this, the embodiment of the utility model provides an energy-saving semiconductor refrigeration plant's hot junction radiator, set up the recess at the hot junction of semiconductor refrigeration piece, the lower extreme of radiator is provided with and groove phase-matched heat conduction copper sheet, when radiator and semiconductor refrigeration piece are connected, at first the heat conduction copper sheet stretches into in the recess the heat conduction silica gel filling hole that rethread recess side was seted up and pours into heat conduction silica gel into, make heat conduction silica gel outwards spill over because hot junction and radiator make the squeezing action to heat conduction silica gel in order to solve among the prior art, thereby lead to semiconductor refrigeration piece and radiator surface to glue greasy and influence pleasing to the eye problem.
In order to achieve the above object, the embodiments of the present invention provide the following technical solutions:
the utility model provides an energy-saving semiconductor refrigeration plant's hot junction radiator, includes semiconductor refrigeration piece and sets up the radiator in semiconductor refrigeration piece hot junction, the hot junction upper surface of semiconductor refrigeration piece is seted up a plurality of cross-section and is the recess of semicircle form, the opening of recess is up, the heat conduction silica gel who is used for pouring into heat conduction silica gel is all seted up at the both ends of recess and is injected the hole, the lower extreme of radiator be provided with the crooked form heat conduction copper sheet of recess assorted, the heat conduction copper sheet stretches into inside the recess and through heat conduction silica gel and recess inner wall connection.
As an optimal scheme of the utility model, the radiator is including connecting the heat dissipation aluminum sheet at heat conduction copper sheet upper surface and setting up the long fin of heat dissipation at heat dissipation aluminum sheet upper surface, the one side of heat conduction copper sheet laminating heat dissipation aluminum sheet is provided with the short fin of a plurality of heat dissipation, the short fin of heat dissipation runs through heat dissipation aluminum sheet and extends to between the long fin of two adjacent heat dissipations.
As an optimized scheme of the utility model, the cross-section of the long fin of heat dissipation and the short fin of heat dissipation is wavy, just the short fin of heat dissipation closely laminates with two adjacent long fins of heat dissipation.
As an optimal scheme of the utility model, the both sides of heat conduction copper sheet are connected with spacing cardboard, spacing cardboard card is at the both sides outer wall in semiconductor refrigeration piece hot junction and through the outer wall fixed connection of bolt and semiconductor refrigeration piece.
As an optimized scheme of the utility model, the heat conduction cream is filled to the bend of heat conduction copper sheet, the heat dissipation aluminum sheet passes through the heat conduction cream and is connected with the heat conduction copper sheet.
The utility model discloses an embodiment has following advantage:
the utility model discloses be provided with the recess that the cross-section is semicircle form at the hot junction of semiconductor refrigeration piece, just the lower extreme of radiator is provided with the curved shape heat conduction copper sheet of recess assorted, when radiator and semiconductor refrigeration piece are connected, at first stretch into the recess with the heat conduction copper sheet, and then pour into heat conduction silica gel through the heat conduction silica gel injection hole of recess both sides, compare in the tradition at the contact surface coating one deck heat conduction silica gel of radiator and semiconductor refrigeration piece, rethread extrusion makes the two connect, the utility model discloses a glue injection after fixing earlier has avoided the overflow of heat conduction silica gel; the curved contact surface increases the heat conduction area, and simultaneously, the better heat conduction performance of the copper sheet is combined, so that the heat dissipation effect is further improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.
The structure, ratio, size and the like shown in the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by people familiar with the technology, and are not used for limiting the limit conditions which can be implemented by the present invention, so that the present invention has no technical essential significance, and any structure modification, ratio relationship change or size adjustment should still fall within the scope which can be covered by the technical content disclosed by the present invention without affecting the efficacy and the achievable purpose of the present invention.
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is an exploded view of the present invention.
In the figure:
1-semiconductor refrigerating sheet; 2-a radiator;
101-a groove; 102-thermally conductive silicone injection hole;
201-heat conducting copper sheet; 202-radiating aluminum sheets; 203-long radiating fins; 204-short heat dissipation fins; 205-a limit pallet; 206-bolt.
Detailed Description
The present invention is described in terms of specific embodiments, and other advantages and benefits of the present invention will become apparent to those skilled in the art from the following disclosure. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in fig. 1 and 2, the utility model provides an energy-saving semiconductor refrigeration plant's hot junction radiator, including semiconductor refrigeration piece 1 and the radiator 2 of setting at semiconductor refrigeration piece 1 hot junction, semiconductor refrigeration piece 1's hot junction upper surface has seted up the recess 101 that a plurality of cross-section is semicircle form, the opening of recess 101 up, the heat conduction silica gel who is used for pouring into heat conduction silica gel injects hole 102 all is seted up at the both ends of recess 101, the lower extreme of radiator 2 be provided with recess 101 assorted crookedness heat conduction copper sheet 201, heat conduction copper sheet 201 stretches into inside and through heat conduction silica gel and recess 101 inner wall connection of recess 101.
When the hot junction of traditional semiconductor refrigeration piece is connected with the radiator, scribble one deck heat conduction silica gel at the binding face usually, the air of rethread extrusion discharge binding face space department makes the two zonulae occludens, but hot junction and radiator also can make unnecessary heat conduction silica gel to spill over all around to lead to semiconductor refrigeration piece and radiator surface to glue greasiness and influence pleasing to the eye.
The utility model discloses in, during radiator 2 at first stretched into crooked form heat conduction copper sheet 201 rather than assorted recess 101 with being connected of semiconductor refrigeration piece 1, heat conduction silica gel was injected into to the heat conduction silica gel injection hole 102 of rethread recess 101 both sides, filled radiator 2 and semiconductor refrigeration piece 1's space department completely up to heat conduction silica gel, accomplished the connection of the two after treating the heat conduction silica gel solidification.
In order to ensure the fixing stability of the heat-conducting copper sheet 201 in the groove 101, two sides of the heat-conducting copper sheet 201 may be connected with limiting clamping plates 205, and the limiting clamping plates 205 are clamped on the outer walls of two sides of the hot end of the semiconductor chilling plate 1 and are fixedly connected with the outer wall of the semiconductor chilling plate 1 through bolts 206. Through fixing and glue injection, overflow of the heat-conducting silica gel is avoided.
Meanwhile, the contact surface of the semiconductor refrigerating sheet 1 and the radiator 2 is in a bent shape, so that the heat conduction area is increased, the heat dissipation effect is improved by utilizing the better heat conduction performance of the copper sheet, the refrigerating efficiency and the energy efficiency ratio are also improved, and the energy-saving effect of the semiconductor refrigerating equipment is better.
The radiator 2 comprises a radiating aluminum sheet 202 connected to the upper surface of the heat conducting copper sheet 201 and a radiating long fin 203 arranged on the upper surface of the radiating aluminum sheet 202, the heat at the hot end of the semiconductor refrigerating sheet 1 is transferred to the radiating aluminum sheet 202 through the heat conducting copper sheet 201, and the heat is exchanged with the air through the radiating long fin 203.
Specifically, the bending portion of the heat conducting copper sheet 201 may be filled with a heat conducting paste, and the heat dissipating aluminum sheet 202 is connected to the heat conducting copper sheet 201 through the heat conducting paste. The existing extrusion process can also be used to press and connect the heat dissipation aluminum sheet 202 and the heat conduction copper sheet 201.
In order to further improve the heat dissipation effect of the heat sink 2, a plurality of short heat dissipation fins 204 are also arranged on one surface of the heat conduction copper sheet 201, which is attached to the heat dissipation aluminum sheet 202, the short heat dissipation fins 204 penetrate through the heat dissipation aluminum sheet 202 and extend to positions between two adjacent long heat dissipation fins 203, part of heat conducted by the heat conduction copper sheet 201 is directly taken to the outside through the short heat dissipation fins 204, and meanwhile, in order to take the cost of the heat sink 2 into consideration, the short heat dissipation fins 204 are lower than the long heat dissipation fins 203.
Here, the heat-dissipating long fins 203 and the heat-dissipating short fins 204 are made of the same material as the heat-dissipating aluminum sheet 202 and the heat-conducting copper sheet 201, respectively, and are formed integrally. The sections of the long radiating fins 203 and the short radiating fins 204 can be in a wavy shape, a zigzag shape and other curved shapes, so that the retention time of air in the radiating channel is prolonged, and the heat exchange effect is improved.
In addition, considering that the copper sheet has better heat conduction effect and the aluminum sheet has better heat dissipation performance, the short heat dissipation fins 204 can be tightly attached to the two adjacent long heat dissipation fins 203, and the heat of the short heat dissipation fins 204 can be dissipated through the long heat dissipation fins 203 attached to the short heat dissipation fins.
Although the invention has been described in detail with respect to the general description and the specific embodiments, it will be apparent to those skilled in the art that modifications and improvements can be made based on the invention. Therefore, such modifications and improvements are intended to be within the scope of the invention as claimed.
Claims (5)
1. The utility model provides an energy-saving semiconductor refrigeration plant's hot junction radiator, includes semiconductor refrigeration piece (1) and sets up radiator (2) at semiconductor refrigeration piece (1) hot junction, its characterized in that, recess (101) that a plurality of cross-section is semicircle form are seted up to the hot junction upper surface of semiconductor refrigeration piece (1), the opening of recess (101) up, heat conduction silica gel filling hole (102) that are used for pouring into heat conduction silica gel are all seted up at the both ends of recess (101), the lower extreme of radiator (2) is provided with curved heat conduction copper sheet (201) with recess (101) assorted, heat conduction copper sheet (201) stretch into inside and through heat conduction silica gel and recess (101) inner wall connection of recess (101).
2. The hot end radiator of the energy-saving semiconductor refrigeration equipment as claimed in claim 1, wherein the radiator (2) comprises an aluminum heat sink sheet (202) connected to the upper surface of a heat conducting copper sheet (201) and long heat dissipating fins (203) arranged on the upper surface of the aluminum heat sink sheet (202), one surface of the heat conducting copper sheet (201) attached to the aluminum heat sink sheet (202) is provided with a plurality of short heat dissipating fins (204), and the short heat dissipating fins (204) penetrate through the aluminum heat sink sheet (202) and extend to between two adjacent long heat dissipating fins (203).
3. The hot end radiator of the energy-saving semiconductor refrigeration equipment as claimed in claim 2, wherein the cross sections of the long radiating fins (203) and the short radiating fins (204) are wavy, and the short radiating fins (204) are tightly attached to two adjacent long radiating fins (203).
4. The hot end radiator of the energy-saving semiconductor refrigeration equipment as claimed in claim 1, wherein the two sides of the heat-conducting copper sheet (201) are connected with limiting clamping plates (205), and the limiting clamping plates (205) are clamped on the outer walls of the two sides of the hot end of the semiconductor refrigeration sheet (1) and fixedly connected with the outer wall of the semiconductor refrigeration sheet (1) through bolts (206).
5. The hot end radiator of the energy-saving semiconductor refrigeration equipment as claimed in claim 2, wherein the bent part of the heat conducting copper sheet (201) is filled with heat conducting paste, and the heat radiating aluminum sheet (202) is connected with the heat conducting copper sheet (201) through the heat conducting paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920417681.XU CN209910212U (en) | 2019-03-29 | 2019-03-29 | Hot end radiator of energy-saving semiconductor refrigeration equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920417681.XU CN209910212U (en) | 2019-03-29 | 2019-03-29 | Hot end radiator of energy-saving semiconductor refrigeration equipment |
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| Publication Number | Publication Date |
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| CN209910212U true CN209910212U (en) | 2020-01-07 |
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| CN201920417681.XU Active CN209910212U (en) | 2019-03-29 | 2019-03-29 | Hot end radiator of energy-saving semiconductor refrigeration equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112635647A (en) * | 2020-12-22 | 2021-04-09 | 杭州大和热磁电子有限公司 | Thermoelectric module capable of well radiating and manufacturing method thereof |
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2019
- 2019-03-29 CN CN201920417681.XU patent/CN209910212U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112635647A (en) * | 2020-12-22 | 2021-04-09 | 杭州大和热磁电子有限公司 | Thermoelectric module capable of well radiating and manufacturing method thereof |
| CN112635647B (en) * | 2020-12-22 | 2022-10-25 | 杭州大和热磁电子有限公司 | Thermoelectric module capable of well dissipating heat and manufacturing method thereof |
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Address after: 230000, floor 2, building A3, Zhongan chuanggu science and Technology Park, high tech Zone, Hefei, Anhui Province Patentee after: Anhui Zhongke Xinyuan Semiconductor Technology Co.,Ltd. Address before: 226000 East Road No. 3, Chengnan Street Telecom, Rugao City, Nantong City, Jiangsu Province Patentee before: JIANGSU ZHONGKE XINYUAN SEMICONDUCTOR TECHNOLOGY Co.,Ltd. |