CN209879930U - Development kit for non-welding single chip microcomputer - Google Patents

Abstract

The utility model discloses a development kit of a weldless singlechip, which belongs to the technical field of electronic product manufacture and aims to solve the problem of complex manufacturing process of the traditional singlechip, the proposal of the development kit of the weldless singlechip adopts the proposal that the development kit comprises a singlechip core board, a surface mount type functional module, a resistance module and art paper, the upper surface of the coated paper is sequentially provided with the singlechip core board and the double-conductive copper foil adhesive tape along the horizontal end, the plurality of contacts protruding outwards from the core board of the singlechip are arranged on the lower surface of the coated paper, the double-conductive copper foil adhesive tape is bonded with the pins of the patch type functional module through conductive silver adhesive, the pins of the patch type functional module are electrically connected with the contacts of the singlechip core board through two conductive leads which are distributed in parallel, and the conductive leads are bonded with the singlechip core board through conductive silver adhesive; the utility model is suitable for a singlechip hardware development field is used in the teaching.

Description

Development kit for non-welding single chip microcomputer

Technical Field

The utility model relates to an electronic product preparation technical field especially relates to a teaching is with no welding singlechip development external member.

Background

The single chip computer is an integrated circuit chip, which is a small and perfect microcomputer system formed by integrating the functions of a central processing unit CPU with data processing capacity, a random access memory RAM, a read only memory ROM, various I/O ports, an interrupt system, a timer/counter and the like (possibly comprising a display driving circuit, a pulse width modulation circuit, an analog multiplexer, an A/D converter and other circuits) on a silicon chip by adopting a super-large scale integrated circuit technology, and is widely applied to the field of industrial control.

The traditional singlechip system development and manufacturing process is mostly finished by adopting fixed experiment box connecting lines or PCB welding, most of the existing experiment boxes can only develop a single singlechip system and can only carry out limited connecting line operation on the original circuit, real electronic works cannot be produced, the personalized learning and innovation development of developers cannot be realized, the singlechip system development and manufacturing are finished by utilizing the PCB welding, the process is complex, and the time required for finishing one work is longer. Especially in the teaching field of schools, the traditional singlechip system is mostly developed and manufactured by adopting a fixed experimental box connecting line or a PCB welding method or structure, the experimental cost is high, the process is complex, and the experimental period is long.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a: the development kit of the non-welding singlechip aims to solve the problem that the manufacturing process of the traditional singlechip is complex in the teaching field.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a no welding singlechip development external member, includes core plate, SMD functional module and resistance module in the singlechip, still includes the coated paper, coated paper upper surface has set gradually along the horizontal end core plate and two copper foil sticky tapes of leading of singlechip, the core plate is arranged in the lower surface of coated paper to a plurality of contacts of bellied outside in the singlechip, two lead the copper foil sticky tape with glue with the mode fixed connection that bonds through electrically conductive silver between the pin of SMD functional module, SMD functional module's pin with connect through two electrically conductive lead wire electricity that are parallel distribution between the contact of core plate of singlechip, and electrically conductive lead wire and singlechip core plate between glue with the mode fixed connection that bonds through electrically conductive silver.

As a further description of the above technical solution:

one of the top parts of the two conductive leads is electrically connected with the resistor module.

As a further description of the above technical solution:

the conductive leads are drawn by a conductive ink pen.

To sum up, owing to adopted above-mentioned technical scheme, the beneficial effects of the utility model are that:

the utility model discloses in, directly utilize conductive ink stroke conductive lead to replace the wire, the welding is replaced to the conductive silver-colored glue, and the copper-clad plate is replaced to the coated paper, and the preparation of electronic product, preparation convenient and fast can be accomplished in the short time to the singlechip developer.

Drawings

Fig. 1 is a schematic structural view of a small system of a single chip microcomputer connection of a development kit of a weldless single chip microcomputer provided by the utility model;

fig. 2 is a functional module pin processing diagram of a development kit for a weldless single chip microcomputer provided by the present invention;

fig. 3 is the utility model provides a no singlechip core plate and art paper side view of welding singlechip development external member.

Illustration of the drawings:

1. coated paper; 2. a singlechip core board; 3. a contact; 4. a patch type functional module; 5. double-conductive copper foil tape; 6. conductive silver paste; 7. a resistance module; 8. and a conductive lead.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: a solderless singlechip development kit comprises a singlechip core board 2, a patch type functional module 4 and a resistance module 7, wherein the patch type functional module 4 comprises a buzzer module, a nixie tube module, an LED lamp module, a key module, a temperature and humidity detection module, an infrared distance measurement module, an ultrasonic distance measurement module, a liquid crystal display module, a direct current motor driving module, a motor module, an A/D conversion module and a D/A conversion module, and further comprises a coated paper 1, the upper surface of the coated paper 1 is sequentially provided with a singlechip core board 2 and a double-lead copper foil adhesive tape 5 along the horizontal end, a plurality of contacts 3 protruding outwards from the singlechip core board 2 are arranged on the lower surface of the coated paper 1, the double-lead copper foil adhesive tape 5 is bonded with pins of the patch type functional module 4 through conductive silver adhesive 6, the pins of the patch type functional module 4 are electrically connected with the contacts 3 of the singlechip core board 2 through two conductive leads 8 which are distributed in parallel, and electrically conductive lead wire 8 bonds through electrically conductive silver glue 6 between the nuclear core plate 2 with the singlechip, compares traditional welding, and the mode that bonds through electrically conductive silver glue 6 adds swiftly.

Specifically, as shown in fig. 1, one of the top of the two conductive leads 8 is electrically connected to a resistor module 7, and the resistor module 7 is used for controlling the magnitude of the current.

Specifically, as shown in fig. 1, the conductive lead 8 is drawn by a conductive ink pen, and compared with a traditional lead, the conductive lead 8 drawn by the conductive ink pen can save the manufacturing time of the single chip microcomputer.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims (3)

1. A solderless singlechip development kit comprises a singlechip core board (2), a patch type functional module (4) and a resistance module (7), the device is characterized by further comprising coated paper (1), wherein the singlechip core board (2) and the double-conductive copper foil adhesive tape (5) are sequentially arranged on the upper surface of the coated paper (1) along the horizontal end, the contacts (3) protruding outwards from the singlechip core board (2) are arranged on the lower surface of the coated paper (1), the double-conductive copper foil adhesive tape (5) is fixedly connected with the pins of the patch type functional module (4) in a bonding way through conductive silver adhesive (6), the pins of the patch type functional module (4) are electrically connected with the contacts (3) of the singlechip core board (2) through two conductive leads (8) which are distributed in parallel, and the conductive lead (8) and the singlechip core board (2) are fixedly connected in a bonding mode through conductive silver adhesive (6).

2. The solderless singlechip development kit of claim 1, wherein the resistance module (7) is electrically connected to the top one of the two conductive leads (8).

3. The development kit for a weldless single chip microcomputer according to claim 1, characterized in that said conductive leads (8) are drawn by a conductive ink pen.