CN209879400U - Server device and network device - Google Patents
Server device and network device Download PDFInfo
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- CN209879400U CN209879400U CN201920289684.XU CN201920289684U CN209879400U CN 209879400 U CN209879400 U CN 209879400U CN 201920289684 U CN201920289684 U CN 201920289684U CN 209879400 U CN209879400 U CN 209879400U
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Abstract
The present disclosure relates to the field of computer technologies, and provides a server apparatus and a network device. The server apparatus includes a chassis and a plurality of fans. The chassis is provided with a plurality of mutually independent chambers, each chamber is a through cavity, and at least one fan is arranged in each chamber. The network device comprises the server apparatus described above. The present disclosure enables the cooling airflow to be fully utilized.
Description
Technical Field
The present disclosure relates to the field of computer technologies, and in particular, to a server apparatus and a network device.
Background
The server includes a chassis and components located within the chassis. The components may heat up during operation. In order to reduce the influence of heat on the performance of the component, heat dissipation measures need to be taken.
In the prior art, heat is dissipated by introducing cooling air flow with a relatively low temperature into the server. However, different components generate different heat, and components generating higher heat need to be radiated by using cooling airflow at a lower temperature, while components generating lower heat need not be radiated by using airflow at a lower temperature. Therefore, the server is cooled by the cooling airflow with a lower temperature, which may result in insufficient utilization of the cooling airflow.
It is to be noted that the information disclosed in the above background section is only for enhancement of understanding of the background of the present disclosure, and thus may include information that does not constitute prior art known to those of ordinary skill in the art.
SUMMERY OF THE UTILITY MODEL
An object of the present disclosure is to provide a server device and a network device that can make full use of cooling airflow.
According to an aspect of the present disclosure, there is provided a server apparatus including:
the device comprises a case, a plurality of chambers and a plurality of control units, wherein the case is provided with a plurality of mutually independent chambers, and each chamber is a through cavity;
and each cavity is internally provided with at least one fan.
In an exemplary embodiment of the present disclosure, the chassis includes:
a first end wall;
a second end wall disposed opposite the first end wall;
a side wall connected between the first end wall and the second end wall;
the plurality of chambers comprise a first chamber and a second chamber, air outlets of the first chamber and the second chamber are both located on the second end wall, an air inlet of the first chamber is located on the first end wall, and an air inlet of the second chamber is located on the side wall.
In an exemplary embodiment of the present disclosure, the server apparatus further includes:
and the power supply assembly is positioned in the second chamber.
In an exemplary embodiment of the present disclosure, the server apparatus further includes:
the main plate is positioned in the first chamber;
a hard disk located in the first chamber.
In an exemplary embodiment of the present disclosure, the server apparatus further includes:
and the air deflector is arranged at the air inlet of the second cavity and used for guiding the airflow entering through the air inlet of the second cavity to the air outlet of the second cavity.
In an exemplary embodiment of the present disclosure, the air deflection plate divides the cabinet into a first chamber and a second chamber.
In an exemplary embodiment of the present disclosure, the air guiding plate is made of plastic.
In an exemplary embodiment of the present disclosure, the air deflection plate is detachably connected to the cabinet.
In an exemplary embodiment of the present disclosure, the server apparatus further includes:
the cover body is connected to the case and used for covering the air outlet of the first cavity and the air inlet and the air outlet of the second cavity;
the ventilation opening is arranged on the cover body.
According to an aspect of the present disclosure, there is provided a network device including the server apparatus of any one of the above.
According to the server device and the network equipment, different components are placed in the mutually independent chambers, and cooling air flows with different temperatures are introduced into the corresponding chambers through the fans arranged in each chamber, so that the components placed in the chambers are radiated, and the cooling air flows are fully utilized.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The above and other features and advantages of the present disclosure will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings. It is to be understood that the drawings in the following description are merely exemplary of the disclosure, and that other drawings may be derived from those drawings by one of ordinary skill in the art without the exercise of inventive faculty.
Fig. 1 is a schematic perspective view of a server device according to an embodiment of the present disclosure;
FIG. 2 is a schematic plan view of a server apparatus according to an embodiment of the present disclosure;
FIG. 3 is a diagram of the server apparatus shown in FIG. 2;
fig. 4 is a schematic diagram of a server device having a housing according to an embodiment of the present disclosure.
In the figure: 1. a chassis; 101. a first chamber; 102. a second chamber; 2. a fan; 3. a first end wall; 4. a second end wall; 5. a side wall; 6. a power supply assembly; 7. a main board; 8. a hard disk; 9. a PCIe module; 10. an air deflector; 1001. a first plate body; 1002. a second plate body; 11. an air inlet of the first chamber; 12. an air outlet of the first chamber; 13. an air outlet of the second chamber; 14. an air inlet of the second chamber; 15. a cover body; 16. and a vent.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the disclosure. One skilled in the relevant art will recognize, however, that the subject matter of the present disclosure can be practiced without one or more of the specific details, or with other methods, materials, devices, etc. In other instances, well-known technical solutions have not been shown or described in detail to avoid obscuring aspects of the present disclosure.
Furthermore, the drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus their repetitive description will be omitted. The terms "a" and "the" are used to indicate the presence of one or more elements/components/etc.; the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. other than the listed elements/components/etc.
The disclosed embodiments provide a server apparatus. As shown in fig. 1 to 3, the server apparatus may include a chassis 1 and a plurality of fans 2, wherein:
the cabinet 1 may have a plurality of chambers independent of each other. Each chamber may be a through cavity and at least one fan 2 may be provided within each chamber.
In the server device according to the embodiment of the present disclosure, different components are placed in mutually independent chambers, and cooling airflows with different temperatures are introduced into the corresponding chambers by the fans 2 provided in each chamber, so as to dissipate heat of the components placed in the respective chambers, thereby making the cooling airflows fully utilized.
The following describes in detail the components of the embodiments of the present disclosure:
as shown in fig. 1 to 3, the casing 1 may be rectangular parallelepiped, cylindrical, prismatic, or the like. The material of the case 1 may be plastic, but is not limited thereto, and may also be metal, etc. The size of the chassis 1 is not particularly limited in the embodiments of the present disclosure.
As shown in fig. 1 to 3, the cabinet 1 may include a first end wall 3 and a second end wall 4. The first end wall 3 and the second end wall 4 are oppositely arranged. Further, the first end wall 3 may be parallel to the second end wall 4, but of course, it may also be non-parallel. Between the first end wall 3 and the second end wall 4 a side wall 5 may be provided. The side wall 5 may or may not be perpendicular to the first end wall 3. The number of the side walls 5 may be two and parallel to each other, but is not limited thereto, and the two side walls 5 may not be parallel. In other embodiments of the present disclosure, the number of the sidewalls 5 may also be other values, such as, but not limited to, three or four. The chassis 1 of the embodiment of the present disclosure may further include a top wall and a bottom wall, and the top wall and the bottom wall may be parallel, or of course, may not be parallel. Wherein the first end wall 3, the second end wall 4 and the side wall 5 may be connected between the top wall and the bottom wall.
For example, as shown in fig. 1 to 3, the chassis 1 includes a first end wall 3 and a second end wall 4 which are parallel to each other, two side walls 5 which are parallel to each other, a top wall, and a bottom wall which is parallel to the top wall. These two lateral walls 5 all are perpendicular with first end wall 3, and this first end wall 3, second end wall 4 and two lateral walls 5 all connect between roof and diapire, and just first end wall 3, second end wall 4 and two lateral walls 5 all are perpendicular with the roof to make quick-witted case 1's shape be the cuboid.
As shown in fig. 1 to 3, the chamber is used for accommodating components of the server, such as a motherboard 7, a hard disk 8, a power supply module 6, and the like. The number of chambers may be plural, for example two, three, four or more. The plurality of chambers may be distributed along a predetermined direction, but may be distributed in other ways. The predetermined direction may be parallel to the top wall of the chassis 1, but is not limited thereto, and may also be perpendicular to the top wall, and of course, may also be in other directions. Each chamber may house one or more components. Each cavity is a through cavity, that is, each cavity is provided with an air inlet and an air outlet, so that one or more parts accommodated in the cavity can be radiated by introducing cooling air flow into the cavity.
For example, as shown in fig. 1 to 3, the number of the chambers may be two, including a first chamber 101 and a second chamber 102, and the first chamber 101 and the second chamber 102 are distributed along a direction parallel to the top wall. The first chamber 101 may be provided with a motherboard 7, and certainly, a hard disk 8 may also be provided, but is not limited thereto, and a PCIe module 9 may also be provided. The second chamber 102 may have a power supply assembly 6 disposed therein. For power supply unit 6, mainboard 7 and hard disk 8 generate heat highly, through the cooling air current that lets in different temperatures to first cavity 101 and second cavity 102, not only make mainboard 7, hard disk 8 and power supply unit 6 all obtain good heat dissipation, make cooling air current obtain make full use of moreover.
As shown in fig. 1 to 3, in one embodiment, the air inlet 11 of the first chamber is located on the first end wall 3, and the air outlet 12 of the first chamber is located on the second end wall 4, that is, the cooling air flows in from the first end wall 3 and flows out from the second end wall 4, so that all the components in the first chamber 101 located between the first end wall 3 and the second end wall 4 can dissipate heat through the cooling air flow. The inlet 14 of the second chamber is located at the side wall 5 and the outlet 13 of the second chamber is located at the second end wall 4, so that the cooling air flow flows in from the side wall 5 and flows out from the second end wall 4. In another embodiment, the inlet 11 of the first chamber is located on the first end wall 3, and the outlet 12 of the first chamber is located on the second end wall 4; the inlet 14 of the second chamber is located at the second end wall 4 and the outlet 13 of the second chamber is located at the side wall 5, thereby shortening the distance between the inlet 14 of the second chamber and the outlet 12 of the first chamber. In other embodiments of the present disclosure, the inlet 11 of the first chamber, the outlet 12 of the first chamber, the inlet 14 of the second chamber, and the outlet 13 of the second chamber may also be disposed at other positions of the chassis 1, and will not be described in detail herein.
In addition, as shown in fig. 1 to 3, the servers are often housed in cabinets during the use of the servers. The cabinet is provided with an air inlet and an air outlet. The air inlet of the cabinet is only communicated with the air inlet 11 of the first chamber, but not communicated with the air inlet 14 of the second chamber; the air outlet of the cabinet is communicated with the air outlet 12 of the first chamber, the air inlet 11 of the second chamber and the air inlet 11 of the second chamber. The external cooling airflow flows into the inside of the cabinet through the air inlet of the cabinet, flows into the first chamber 101 through the air inlet 11 of the first chamber, can flow out from the air outlet 12 of the first chamber, and finally flows out of the cabinet through the air outlet of the cabinet. Under the action of the fan 2 disposed in the second chamber 102, the airflow flowing out of the air outlet 12 of the first chamber can flow in from the air inlet 14 of the second chamber, so as to dissipate heat of the components disposed in the second chamber 102. By controlling the temperature of the external cooling airflow before flowing into the first chamber 101, the temperature of the cooling airflow flowing out from the air outlet 12 of the first chamber is not too high, so that the cooling airflow can be used for radiating the components in the second chamber 102, and the cooling airflow is more fully utilized. As shown in fig. 2 and 3, the upper right corner of the drawing is the area of the second chamber 102, when the main board 7 is accommodated in the first chamber 101 and the power supply module 6 is accommodated in the second chamber 102, the temperature of the airflow flowing out of the air outlet 12 of the first chamber is between 40 ℃ and 50 ℃, which is less than the maximum heat dissipation temperature 55 ℃ of the power supply module 6, so that the airflow flowing out of the air outlet 12 of the first chamber can be used for dissipating heat of the power supply module 6 in the second chamber 102. As shown in fig. 2 and 3, the upper right corner of the drawing is the area of the second chamber 102, and it can be seen that the fan 2 disposed in the second chamber 102 can maintain the wind direction, so that the airflow flowing out of the outlet 12 of the first chamber can flow in from the inlet 14 of the second chamber.
As shown in fig. 1 to 3, the fan 2 serves to draw a cooling air flow outside the chamber into the chamber to dissipate heat of components received in the chamber. One fan 2 may be provided in each chamber within the chassis 1, although a plurality of fans 2 may be provided. Taking the case 1 having the first chamber 101 and the second chamber 102 as an example, four fans 2 are disposed in the first chamber 101, and one fan 2 is disposed in the second chamber 102. The four fans 2 disposed in the first chamber 101 may be disposed at the air outlet 12 of the first chamber, and certainly, may also be disposed at the air inlet 11 of the first chamber, which is not limited in this disclosure. The fan 2 disposed in the second chamber 102 may be disposed at the air outlet 13 of the second chamber, but is not limited thereto, and may also be disposed at the air inlet 14 of the second chamber, and of course, may also be disposed at other positions in the second chamber 102. The power of the fan 2 disposed in the second chamber 102 may be greater than that of the fan 2 disposed in the first chamber 101, so that the airflow flowing out of the air outlet 12 of the first chamber of the server housed in the rack may flow in from the air inlet 14 of the second chamber. Furthermore, the fan 2 in each chamber may be connected to the power supply assembly 6 provided in the second chamber 102 as described above. The fan 2 in each chamber is detachably connected to the corresponding chamber, so that the fan 2 can be conveniently detached to clean and maintain the fan 2. The detachable connection mode can be clamped, and certainly, the detachable connection mode can also be threaded connection and the like.
As shown in fig. 1 to 3, the server apparatus of the present disclosure may further include a wind deflector 10. The air deflector 10 may be disposed at the air inlet 14 of the second chamber, and is used for guiding the cooling air flow flowing in through the air inlet 14 of the second chamber to the air outlet 13 of the second chamber. The air deflector 10 may be made of plastic material, which not only reduces the weight of the server case 1, but also improves the safety inside the case 1 due to its good insulating property. In other embodiments of the present disclosure, the air guiding plate 10 may be made of other materials, which are not described in detail herein. In addition, the air guiding plate 10 is detachably connected to the chassis 1, for example, by clipping, screwing, or the like. In other embodiments of the present disclosure, the air guiding plate 10 is fixedly connected to the chassis 1, such as by riveting. Of course, the air guiding plate 10 may also be integrally formed with the chassis 1, and the integrally forming manner thereof will not be described in detail herein.
As shown in fig. 1 to 3, the air deflector 10 not only can guide the cooling air flow, but also can divide the housing 1 into the first chamber 101 and the second chamber 102. Taking the rectangular case 1 as an example, the air guiding plate 10 is perpendicular to both the top wall and the bottom wall, one side of the air guiding plate 10 may be connected to the second end wall 4, and the other side of the air guiding plate 10 may be connected to the side wall 5, so as to divide the case 1 into the first chamber 101 and the second chamber 102. Further, the air guiding plate 10 may include a first plate 1001 and a second plate 1002. The first board body 1001 and the second board body 1002 are connected along a direction parallel to the bottom wall, and both the first board body 1001 and the second board body 1002 are perpendicular to the bottom wall. The side of the first plate 1001 away from the second plate 1002 is connected to the side wall 5, and the side of the second plate 1002 away from the first plate 1001 is connected to the second end wall 4, so that the side wall 5, the air guiding plate 10, the second end wall 4, the top wall and the bottom wall enclose a second chamber 102, and a first chamber 101 is formed in an area outside the second chamber 102 in the chassis 1. The second plate 1002 may or may not be perpendicular to the second end wall 4. The angle β between the first plate 1001 and the side wall 5 may be acute, so that the first plate 1001 may better guide the cooling air flow. Furthermore, the first plate 1001 may be recessed away from the first chamber 101 to form an arc-shaped plate, so as to better guide the cooling air flow.
As shown in fig. 3 and 4, the server apparatus of the embodiment of the present disclosure may further include a housing 15. Taking the case 1 having the first chamber 101 and the second chamber 102 as an example, the cover 15 is connected to the case 1 and is used for covering the air outlet 12 of the first chamber, the air inlet 14 of the second chamber, and the air outlet 13 of the second chamber. The cover body 15 may further have a ventilation opening 16, so that the air outlet 12 of the first chamber, the air inlet 14 of the second chamber, and the air outlet 13 of the second chamber are all communicated with the outside through the ventilation opening 16. Further, the first chamber 101 accommodates components having high heat generation, and the second chamber 102 accommodates components having low heat generation. In the use process of the case 1, the cooling airflow is only communicated with the air inlet 11 of the first chamber, so that the cooling airflow is only used for radiating the components in the first chamber 101, and the radiating effect is improved; after the cooling airflow flows out from the air outlet 12 of the first chamber, under the action of the fan 2 in the second chamber 102, the cooling airflow after the heat dissipation of the components in the first chamber 101 can enter the second chamber 102, and the components in the second chamber 102 are subjected to heat dissipation, so that the cooling airflow is fully utilized, and the waste of resources is avoided.
The embodiment of the disclosure also provides a network device. The network device may comprise the server apparatus according to any of the above embodiments. Wherein the network device may be a computer or the like. The server device of the network device in the embodiment of the present disclosure is the same as the server device in the above embodiment, and therefore, the same advantageous effects are obtained, and details are not described herein again.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
Claims (10)
1. A server apparatus, comprising:
the device comprises a case, a plurality of chambers and a plurality of control units, wherein the case is provided with a plurality of mutually independent chambers, and each chamber is a through cavity;
and each cavity is internally provided with at least one fan.
2. The server apparatus according to claim 1, wherein the chassis includes:
a first end wall;
a second end wall disposed opposite the first end wall;
a side wall connected between the first end wall and the second end wall;
the plurality of chambers comprise a first chamber and a second chamber, air outlets of the first chamber and the second chamber are both located on the second end wall, an air inlet of the first chamber is located on the first end wall, and an air inlet of the second chamber is located on the side wall.
3. The server apparatus according to claim 2, characterized in that the server apparatus further comprises:
and the power supply assembly is positioned in the second chamber.
4. The server apparatus according to claim 3, characterized in that the server apparatus further comprises:
the main plate is positioned in the first chamber;
a hard disk located in the first chamber.
5. The server apparatus according to claim 2, characterized in that the server apparatus further comprises:
and the air deflector is arranged at the air inlet of the second cavity and used for guiding the airflow entering through the air inlet of the second cavity to the air outlet of the second cavity.
6. The server apparatus of claim 5, wherein the air deflection plate divides the chassis into the first chamber and the second chamber.
7. The server apparatus according to claim 5, wherein the air deflector is made of plastic.
8. The server apparatus of claim 5, wherein the air deflection plates are removably coupled to the chassis.
9. The server apparatus according to claim 2, characterized in that the server apparatus further comprises:
the cover body is connected to the case and used for covering the air outlet of the first cavity and the air inlet and the air outlet of the second cavity;
the ventilation opening is arranged on the cover body.
10. A network device, characterized in that it comprises a server device according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920289684.XU CN209879400U (en) | 2019-03-07 | 2019-03-07 | Server device and network device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920289684.XU CN209879400U (en) | 2019-03-07 | 2019-03-07 | Server device and network device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209879400U true CN209879400U (en) | 2019-12-31 |
Family
ID=68954200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920289684.XU Active CN209879400U (en) | 2019-03-07 | 2019-03-07 | Server device and network device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209879400U (en) |
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2019
- 2019-03-07 CN CN201920289684.XU patent/CN209879400U/en active Active
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