Background
In modern society, automobiles have become one of the first-choice transportation tools for the public. The gearbox is one of soul parts of the automobile as an indispensable part of the automobile. Speed sensors within the transmission are used to identify the speed of rotation, typically hall effect sensors, and provide speed information to the TCU to coordinate with the automatic transmission to complete the shift operation.
As in the Chinese patent: "novel gearbox speedtransmitter (CN 201721640190.9)", including shell and plug, be connected as an organic wholely through injection moulding between plug and the shell, be equipped with the mounting hole at the lateral part of plug, the embedding is equipped with the becket on the mounting hole inner wall, and the pot head of shell is equipped with O type sealing washer, has magnet, integrated chip and a plurality of terminal through moulding plastics and sealing admittedly in the shell, and the stitch of terminal and integrated chip's pin welds each other, and the head of terminal passes in the shell stretches into the plug. The structure needs to inject the integrated chip into the shell, and the chip needs to bear pressure in the injection molding process, so that the performance of the chip is influenced, and the performance of the speed sensor is influenced. In addition, the existing manufacturing process is to firstly perform injection molding on the shell, and then add plastic particles to the shell after the shell is molded to form the composite structure of the connector and the shell. According to the process, the requirement on mold design is high, two materials are required to be combined and injection molded at the same time, and the two materials have certain difference, so that the formed sensor is not stable enough and has potential risks of air leakage or oil leakage and the like.
Disclosure of Invention
The utility model provides a speed sensor with simple process, good stability, low cost and high reliability; the technical problems that a speed sensor in a gearbox in the prior art is complex in process procedure, poor in stability and not prone to failure are solved.
The above technical problem of the present invention is solved by the following technical solutions: the utility model provides a speed sensor structure, includes the casing, the casing including holding the chamber, the top that holds the chamber is equipped with the backup pad, the opposite side of backup pad is equipped with the embedding ring, installs the connector subassembly holding the intracavity, the connector subassembly include integrated into one piece's outer joint and connector body, install the stitch on the connector body, magnet and chip component are installed to the one end at the connector body. The sensor is composed of a shell and a connector, has a simple structure, and is directly placed into the shell for encapsulation after the connector assembly is assembled. The simple structure of casing only needs to set up and holds chamber and embedding ring, holds the chamber and be cylindric, and the backup pad is perpendicular with the axis that holds the chamber, and the backup pad is the flat board, has seted up the draw-in groove at the embedding ring annex of backup pad, and the convenience is fixed a position the embedding ring when the shaping in the mould. The stitch is directly injected into the connector, the magnet and the chip element are directly welded on the connector body, then the connector and the shell are solidified through encapsulation, secondary injection molding of the chip element is not needed, and therefore the reliability of the chip element is improved. The outer joint is located the backup pad top and is used for being connected with the outside, and the connector body is located and holds the intracavity, and stitch, chip component and magnet easy to assemble to utilize the embedment to guarantee the connection stability of each device.
Preferably, the accommodating cavity is cylindrical, a positioning plane is arranged on the cavity wall of the accommodating cavity, and a positioning surface matched with the positioning plane is arranged on the connector body. Set up locating plane at the opening part that holds the chamber, also set up the complex locating surface with holding chamber cooperation department at the connector simultaneously to prevent both rotation each other, improve complex stability.
Preferably, the outer surface of the connecting section matched with the accommodating cavity on the connector body is provided with a positioning bulge. Through the positioning bulge, the center of a circle is positioned by adopting point matching, the structure is simple, and the positioning precision is high.
Preferably, the connector body include integrated into one piece's linkage segment and installation section, the cross section of linkage segment is the same with the cross section that holds the chamber, the cross section of installation section is less than the cross section that holds the chamber, it is sealed to be in the encapsulating behind the holding intracavity at the connector body. Set up location arch and locating surface on the installation section, guarantee that the connector body is in the position that holds the intracavity, the linkage segment is used for installing each component, the linkage segment and hold the space between the chamber, utilize the encapsulating to fill up. Above holding the chamber, hold and have a step face between chamber and the supporting part for the encapsulating is sealed, and the sealed face of encapsulating is parallel and level with the supporting part.
Preferably, the bottom end of the connector body is provided with a chip element mounting groove, and the rear side of the bottom end of the connector body is provided with a magnet accommodating groove.
Preferably, the accommodating cavity and the supporting plate are provided with step surfaces, the outer joint and the connector body are arranged in a step shape, and the outer joint is located on the step surfaces. The convenient encapsulating of ladder face, outer joint and connector body are not on integrative straight line, easy to assemble and location.
A process for manufacturing a speed sensor structure: firstly, placing pins into a mold of a connector, and performing injection molding to form the shape of the connector, wherein the connector comprises an outer connector and a connector body, and the pins are fixed in the connector body in an injection molding manner; meanwhile, the embedded ring is placed in a mold of the shell, the shape of the shell is formed by injection molding, the shell comprises an accommodating cavity and a supporting plate, and the embedded ring is positioned on the supporting plate on the shell; secondly, welding the chip element in the mounting groove below the connector body, and fixing the magnet in the accommodating groove below the connector body; thirdly, placing the connector assembly provided with the magnet and the chip element in the second step into the accommodating cavity of the connector body in the first step, and then carrying out encapsulation curing; and fourthly, sleeving a sealing ring on the shell. Only two sets of molds are needed, the connector and the shell are separately injected, pins are directly placed in the molds and are directly integrally injected and molded with the connector, and then the chip elements and the magnets are welded on the connector body. The direct embedment of connector subassembly is no longer needed the secondary to mould plastics in the intracavity that holds of casing, has effectively prevented twice that the secondary tectorial membrane that can exist in the injection molding process from causing twice plastics to combine not well, leads to the potential risk such as gas leakage oil leakage. Meanwhile, the adverse effect on chip components and parts due to high temperature and high pressure of injection molding can be avoided. The stability of the sensor is improved, and the failure risk is reduced.
Preferably, the injection pressure in the first step is 120 ~ 140kg/cm2And the injection molding temperature is 250 ℃ and ~ 330 ℃ in the second step of welding process, the chip elements are welded by laser welding, and the encapsulation curing in the third step is performed by resin curing agent.
Therefore, the utility model discloses a speed sensor possesses following advantage: the sensor is simple in structure, simple in technological process, small in damage to chip elements and high in product stability, the two components of the connector and the shell are respectively subjected to injection molding and then encapsulated, secondary injection molding is not needed, the stability of connection of the two components is guaranteed, and the service performance of the whole sensor is improved.
Example (b):
as shown in fig. 1 and 2, a speed sensor, including casing 4, the cylindric chamber 8 that holds has been seted up in casing 4, the shaping has a backup pad 2 still on casing 4, the through-hole has been seted up to one side of backup pad 2, install embedding ring 3 through moulding plastics outside the through-hole, embedding ring 3's central line is parallel with the central line that holds chamber 8, set up the three support draw-in groove 6 of equipartition on the pore wall of through-hole for when shaping embedding ring 3, support and fix a position embedding ring 3. And a sealing ring 5 is sleeved on the outer wall of the accommodating cavity 8. A stepped surface 7 is formed above the accommodating cavity 8, and the stepped surface 7 is used for providing a filling seal when the connecting head assembly is filled and sealed subsequently. And a positioning plane 9 is arranged at the opening of the accommodating cavity 8.
As shown in fig. 3, 4 and 5, the connector assembly 1 is placed in the accommodating cavity 8, the connector assembly 1 includes an outer connector 10 and a connector body which are integrally formed, the outer connector 10 is located above the supporting plate 2, and the connector body is located in the accommodating cavity. The connector body comprises an integrally formed connecting section 11 and an installing section 12, a positioning surface 18 is arranged on the connecting section 11, the positioning surface 18 is a plane, and the positioning surface 18 is matched with a positioning plane 9 at the opening of the accommodating cavity to prevent the connector body from rotating in the accommodating cavity 8. Positioning bulges 15 are uniformly distributed on the connecting section 11, and the circle center of the connector main body is positioned through the uniformly distributed positioning bulges 15. Install stitch 14 on the installation section, stitch 14 is the direct injection moulding on the installation section 11 of connector main part, has seted up chip component mounting groove 17 at the lower extreme of connector main part, and chip component 13 welds in the connector main part, and simultaneously, the rear side at the connector body is opened and is equipped with the magnet holding tank, installs magnet 16 therein.
After placing the connector subassembly and holding the chamber, utilize the embedment with the connector subassembly solidification in holding the intracavity, embedment plane and backup pad plane parallel and level.
The process for manufacturing the speed sensor comprises the first step of placing pins into a mold of the connector to form the shape of the connector by injection molding, wherein the connector comprises an outer connector and a connector body, the pins are fixed in the connector body by injection molding, meanwhile, placing the embedding ring into a mold of the shell to form the shape of the shell by injection molding, the shell comprises an accommodating cavity and a supporting plate, the embedding ring is arranged on the supporting plate on the shell, and the injection molding pressure is 120 ~ 140kg/cm2The injection molding temperature is 250 ℃ and ~ 330 ℃, the injection molding materials of the shell and the connector are PA66+30% GF, the chip element is welded in an installation groove below the connector body by laser, the magnet is fixed in a holding groove below the connector body, the connector assembly provided with the magnet and the chip element is placed in the holding cavity of the connector body in the first step, then the resin curing agent is used for encapsulation and curing, and the shell is sleeved with a sealing ring.