CN103336139B - Modular sensor and manufacturing process thereof - Google Patents
Modular sensor and manufacturing process thereof Download PDFInfo
- Publication number
- CN103336139B CN103336139B CN201310229557.8A CN201310229557A CN103336139B CN 103336139 B CN103336139 B CN 103336139B CN 201310229557 A CN201310229557 A CN 201310229557A CN 103336139 B CN103336139 B CN 103336139B
- Authority
- CN
- China
- Prior art keywords
- module
- pin needle
- circuit board
- hall chip
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Measuring Magnetic Variables (AREA)
- Transmission And Conversion Of Sensor Element Output (AREA)
Abstract
The invention discloses a kind of modular sensor and manufacturing process thereof, comprise cavity module, framework module, circuit board, Hall chip and cover plate; Cavity module top is open, and bottom has a detent and integral molded plastic has PIN needle assembly; Framework module rear end has strip through-hole, and upper surface has two limiting stands, and lower surface has positioning boss, and outside, front end has the draw-in groove of the accommodation Hall chip formed by two buckles and a saddle.Buckle adopts inner side interference point hook portion and the rivet hot spur of end face, ensures that Hall chip is fixed restriction in space; Utilize the elasticity of metal PIN needle and the fit structure of cavity module and framework module, ensure the accurate location of framework module in cavity module and be firmly connected, avoid glue to flow after the impact of uncontrollable overlay electronic component temperature and damage electronic component; And ensure that Hall chip front end face and cavity module front facet are close to but are unlikely to that extruding force is excessive causes cavity module front end deformation and failure, effectively ensure that sensing breath.
Description
Technical field
The present invention is relevant with sensor technology, is specifically related to a kind of modularization active sensor and manufacturing process thereof, and described sensor can be used for motor car engine, wheel box and ABS anti-lock braking system.
Background technology
At present, speed probe in speed probe in motor car engine and phase detector, wheel box and the wheel speed sensors etc. in ABS anti-lock braking system comprise passive type and active two kinds of forms, wherein passsive sensor is called passive sensor, and active sensor is called active sensor.Compared with passsive sensor, active sensor has the advantages such as volume is little, quality is light, integrated level is high, response is fast, antijamming capability is strong, therefore obtains and applies more and more widely.
Existing active sensor mainly contains two kinds of molding modes, is respectively integral molded plastic formula and rack shell assembled.
Integral molded plastic formula the integrated circuit component being packaged with Hall chip is linked together with the wire harness patching PIN needle or comprise plug and is fixed on an injection moulding block (also wrap in some injection moulding block and be injected with magnet), form an injection moulded components, the sensor that then secondary injection molding is complete.This molding mode because quadric injection mould pressure is large and temperature is high, therefore integrated circuit component, patches PIN needle or wire harness is difficult to be securely fixed on an injection moulding block.Meanwhile, injection moulded components when quadric injection mould up and down all around six-freedom degree be difficult to accurate limit, cause the installation site of Hall chip to be difficult to control, easily produce deviation, after causing entrucking, detector gap is inconsistent thus affect sensor function output.In addition, an impermeability between injection moulding and quadric injection mould is difficult to ensure, and, electrical equipment is after the High Temperature High Pressure effect of quadric injection mould, may cause and lose efficacy or potential inefficacy, bring hidden danger to product reliability, the precise reason why of product failure is also not easily accurately located simultaneously.
Rack shell assembled the integrated circuit component erection welding being packaged with Hall chip is injected with to bag to patch on the support of PIN needle that (some is packaged with between the integrated circuit component of Hall chip and PIN needle and is also connected with the electronic component such as electric capacity, resistance, or be packaged with the circuit board of the element such as integrated capacitance, resistance), then on support, load onto sealing O type circle form bracket component, finally bracket component is assembled to corresponding shell and forms complete sensor.Typical structure can see Fig. 1, and this active sensor comprises support 1', shell 2', Hall chip 3', circuit board assemblies 4' and sealing O type circle 5', and its medium-height trestle 1' bag is injected with and patches PIN needle.During this Standard, first band is patched the pre-injection mo(u)lding of support 1' of PIN needle, again Hall chip 3' is installed to the head of support 1', circuit board assemblies 4' welds with Hall chip 3' one end, the other end welds with the one end patching PIN needle, then sealing O type circle 5' is sleeved on support 1', finally the bracket component of assembling is installed in shell 2'.
Be in the patent of invention of CN101008660A at publication number, disclosed active sensor is except adopting rack shell fabricated construction, as shown in Figure 1, also support is connected at (in Fig. 1 A place) by epoxy resin cure with shell, blocks vent port finally by steel ball 6' and sealed by UV glue (in Fig. 1 B place).
In the fabricated sensor construction of rack shell, easily there is existing between support sensing head (i.e. Hall chip 3') and shell 2' gap and cause sensor to can't detect signal or sensing head extruding shell 2' and cause case head bulge even to break.If adopt publication number to be the patent of CN2896225Y, the gap between support sensing head and shell is accurately controlled by U-type groove structure, then circuit board assemblies must adopt flexible circuit board assembly, so the hard circuit board assembly of cheaper can not be adopted, production cost is caused to improve, two carry out flexible circuit board assembly not only needs manual assembly, and flexible circuit board assembly with patch welding of PIN needle and must adopt manual welding and machine cannot be used to weld, cause the reliability decrease of product.In addition, the sealing O type circle 5' high temperature between support 1' and shell 2' is resistance to long afterwards can be aging and lose sealing and cause leakage.Adopt the epoxy resin cure structure in the patent of invention of publication number CN101008660A, the electronic component on epoxy resin covering flexible circuit board may be caused in the curing process, Wen Chonghou makes electronic component damage, and the sealing means of steel ball 6' force fit vent port may make temperature rush after-poppet 1' and steel ball 6' sealing place to be cracked and cause sensing head to reveal, or to make on support steel ball and patch to break between PIN needle to cause to patch PIN needle and reveal.
In addition, in above two kinds of molding modes, the structure of sensor all cannot realize modularization, and dirigibility and the product versatility of product design are poor, can not realize the needs being mass-produced different model sensor by single product line platform.
Summary of the invention
Technical matters to be solved by this invention is to provide a kind of modular sensor, structure simple and flexible, reliability is high, impermeability is good, applicability is strong, not only accurately can locate Hall chip, Hall chip can be avoided to produce crimp or Latent destruction extruding to sensor head, and the connection between each module of sensor and location can be ensured.The present invention also provides the manufacture method of described modular sensor.
For solving the problems of the technologies described above, modular sensor provided by the invention, comprises cavity module, framework module, circuit board, Hall chip;
Described cavity module is the housing of an open-top, and the bottom of described housing has a detent, and housing bottom integral molded plastic has PIN needle assembly;
The inner integral molded plastic in front end of described framework module has magnet and soft iron, rear end has strip through-hole, the upper surface of described framework module has two limiting stands to circuit board cross spacing, lower surface has the positioning boss coordinated with detent, the both sides of outside, described framework module front end have two corresponding buckles, the below of buckle has a saddle, described buckle and saddle surround the draw-in groove being formed and hold Hall chip, described buckle all has a sharp hook portion, two sharp hook portions are inwardly given prominence to, the front end of buckle is formed with spur, after described spur rivet hot, in the vertical direction blocks Hall chip,
Described circuit board is close on framework module upper surface, be welded to connect with chip PIN needle below the chip PIN needle that the PIN needle contact on its surface is positioned at Hall chip, PIN needle one end of described PIN needle assembly is stretched out from the side of cavity module, the other end protrudes upward, and successively by the PIN needle hole on the strip through-hole of framework module and circuit board, described framework module, circuit board and Hall chip are encapsulated in cavity inside modules.
Further, the spur of described buckle is greater than the length of Hall chip matrix at vertical direction in the length of vertical direction.
Preferably, described positioning boss has pointed boss, this pointed boss is positioned at the centre position of positioning boss, and the tip of this pointed boss and the bottom of detent have gap.Preferably, positioning boss have at least two connected pointed boss.
Preferably, the left and right sides that described detent contacts with positioning boss adopt polishing.The positioning boss of described framework module and the detent of cavity module are linked together by bonding glue.
Wherein, the PIN needle of described PIN needle assembly to be made and in obtuse angle by having flexible metal.
In said structure, described circuit board is flexible circuit board, and the PIN needle hole on it is circular PIN needle hole; Or described circuit board is hard circuit board, the PIN needle hole on it is bar shaped PIN needle hole.
Better, the end that described PIN needle assembly has at least a PIN needle to expose circuit board has barb.
In said structure, sensor can also comprise a cover plate, described cover plate by framework module, circuit board and Hall chip enclosed package in cavity inside modules.Or framework module, circuit board and Hall chip are covered by an injecting glue layer and are encapsulated in cavity inside modules, in the cavity of described injecting glue layer between framework module and cavity module.
The present invention also provides a kind of manufacturing process of modular sensor, comprises the following steps:
A) injection mo(u)lding comprises the cavity module of PIN needle assembly;
B) the shaping framework module comprising magnet and soft iron of integral molded plastic;
C) Hall chip is vertically installed in the buckle of framework module and the draw-in groove of saddle formation from top to bottom, make matrix side and the draw-in groove side transition fit of Hall chip, the matrix skew back face of Hall chip and the sharp hook portion interference fit of buckle, the saddle below buckle is close in the lower surface of Hall chip, along the matrix skew back face place perpendicular to framework module end face direction rivet hot Hall chip, after making the spur rivet hot of buckle, in the vertical direction blocks Hall chip;
D) bonding glue is injected the detent of cavity module, make glue level lower than and be installed to the top plane of positioning boss after cavity module close to framework module;
E) framework module is installed in the cavity of cavity module, the PIN needle of PIN needle assembly is inserted in the strip through-hole of framework module and is exposed to framework module upper surface, and the positioning boss of framework module embeds in the detent of cavity module;
F) mounting circuit boards, the PIN needle contact on circuit board is inserted below the chip PIN needle of Hall chip, and the PIN needle of PIN needle assembly is stretched out from the PIN needle hole circuit board;
G) weld corresponding with the PIN needle hole of circuit board for the PIN needle of PIN needle assembly, and by the chip PIN needle of Hall chip and the PIN needle contact of circuit board is corresponding welds together;
H) settable cementitious glue, links together cavity module and framework module;
I) package cavity module, makes framework module, circuit board and Hall chip be encapsulated in cavity module.
Wherein, utilize a mechanical arm to carry out rivet hot in step c), mechanical arm head comprises pre-pressure head and rivet hot head, and described pre-pressure head is flexibly connected with rivet hot head by a spring, and described rivet hot head comprises two thermal heads, and pre-pressure head is between two thermal heads.During mechanical arm feeding, pre-pressure head pushes down Hall chip, and thermal head carries out hot pressing to the spur of buckle, makes rivet hot plane step back matrix front end face in Hall chip.Because the spur of buckle is greater than the length of Hall chip matrix at vertical direction in the length of vertical direction, after rivet hot, spur upper end goes out to limit the degree of freedom of Hall chip in the vertical direction to draw-in groove inwardly projecting.
Wherein, when step e) assembling framework module, first the PIN needle of PIN needle assembly inserted in the strip through-hole of framework module, then move framework module backward and make in its cavity being pressed into cavity module, positioning boss embeds in the detent of cavity module simultaneously.Described positioning boss centre position has pointed boss, and the tip of this pointed boss and the bottom of detent have gap.
Wherein, in step I) in, a cover plate can be press-fited at the inwall point glue of cavity module, by cover plate by framework module, circuit board and Hall chip enclosed package in cavity inside modules, also can encapsulating make it solidify in the cavity between framework module and cavity module, the injecting glue layer after described framework module, circuit board and Hall chip are cured covers and is encapsulated in cavity inside modules.
Usefulness of the present invention is:
1) in the present invention, the buckle of framework module front end adopts the rivet hot spur of interference point hook portion and end face novelty inside chip draw-in groove simultaneously, make Hall chip all be firmly fixed restriction in X, Y, Z tri-directions, effectively ensure that Hall chip accurately fixedlying positioning at framework module;
2) the present invention utilizes the fit structure of the detent in the elasticity of metal PIN needle self in PIN needle assembly, cavity module and the positioning boss in framework module, ensure that the accurate location of framework module in cavity module, a small amount of clearance fit bottom the simultaneously multiple pointed boss design of positioning boss and pointed boss tip and detent had both avoided glue and has caused electronic component to damage because assembling after the uncontrollable overlay electronic component temperature of squeezing flow impacts, and ensure that framework module is firmly connected with after cavity module glue curing simultaneously;
3) there is flexible PIN needle to framework module applying power forward in the present invention, ensure that the front facet of Hall chip front end face and cavity module fits tightly but is unlikely to that extruding force is excessive causes cavity module front end deformation and failure, effectively ensure that sensing breath;
4) the present invention can adopt flexible circuit board, can adopt low-cost hard circuit board again, can encapsulate according to actual needs and design;
5) sensor of the present invention adopts modular assembly scheme, the adverse effect that when avoiding integral molded plastic, High Temperature High Pressure causes electronic devices and components;
6) modular conceptual design is flexible, is conducive to the same platform development of different model sensor, be conducive to batch production, and transducer sensitivity is high, has and installs stability reliably.
Accompanying drawing explanation
Fig. 1 is the structural representation of the fabricated active sensor of existing rack shell;
Fig. 2 is the schematic perspective view of the sensor head that the present invention is complete;
Fig. 3 is the structural representation of cover plate of the present invention;
Fig. 4 is the schematic perspective view after sensor head shown in Fig. 2 removes cover plate;
Fig. 5 is the schematic perspective view of lumen module of the present invention;
Fig. 6 be in the present invention framework module just put schematic perspective view;
Fig. 7 is the inversion schematic perspective view of framework module in the present invention;
Fig. 8 is the vertical view of framework module in the present invention;
Fig. 9 is the schematic perspective view in the present invention after framework module installation Hall chip;
Figure 10 is the vertical view in the present invention after framework module installation Hall chip;
Figure 11 is the schematic diagram of PIN needle assembly in the present invention;
Figure 12 is the structural representation of flexible circuit board in the present invention;
Figure 13 is the structural representation of Hall chip in the present invention;
Figure 14 is the structural representation of the mechanical arm head of rivet hot Hall chip in the present invention;
Figure 15 is the longitudinal sectional view that the framework module having installed Hall chip is installed in cavity module;
Figure 16 is the transverse sectional view that the framework module having installed Hall chip is installed in cavity module;
Figure 17 is the longitudinal sectional view that the framework module having installed Hall chip and flexible circuit board is installed in cavity module;
Figure 18 is another structural representation of PIN needle in PIN needle assembly;
Figure 19 is that the framework module having installed Hall chip and flexible circuit board is installed to the longitudinal sectional view had in the cavity module of PIN needle shown in Figure 18.
Wherein description of reference numerals is as follows:
1 cavity module 11PIN needle assemblies
111,112,113PIN pin 114 barb
12 detent 13 front facets
14 face, chamber, the ends
2 framework module 21 buckles
211, the 212 sharp hook portions in draw-in groove side 213,214
215,216 spur 22 strip through-holes
23,24 limiting stand 25 positioning boss
The pointed boss of 250 positioning boss top plane 251,252,253
26 saddle 27 rivet hot planes
28 framework module upper surface 29 framework module lower surfaces
3 flexible circuit board 31PIN pin contacts
32 circular PIN needle holes
4 Hall chip 41,42 matrix sides
43,44 matrix skew back face 45 matrix front end faces
46 chip PIN needle
The pre-pressure head of 5 mechanical arm heads 51
52 rivet hots, 521,522 thermal head
53 springs
6 magnet 7 soft irons
8 cover plates
Embodiment
Below in conjunction with accompanying drawing and embodiment, the present invention is further detailed explanation.
Modular sensor provided by the invention, is mainly used in active sensor, and as shown in Figure 2, Figure 3 and Figure 4, comprise cavity module 1, framework module 2, circuit board, Hall chip 4 and cover plate 8, wherein circuit board is for flexible circuit board 3.
As shown in Figure 5, cavity module 1 is the housing of an open-top, and the centre position, bottom of housing has a detent 12, and the left and right sides of this detent 12 carry out polishing; Housing bottom integral molded plastic has PIN needle assembly 11(as shown in figure 11), described PIN needle assembly 11 has three PIN needle 111,112,113 in obtuse angle, its one end is stretched out from the side of cavity module 1, the other end stretches out obliquely, as shown in Fig. 5, Figure 15, described PIN needle 111,112,113 is made by having flexible metal, has certain elasticity.
As shown in Figure 6, Figure 7, the inner integral molded plastic in front end of framework module 2 has magnet 6 and soft iron 7(as shown in figure 15), it is rectangle that rear end has in three strip through-hole 22(the present embodiment), the upper surface of described framework module 2 has two limiting stands 23,24 to flexible circuit board 3 cross spacing, and lower surface has the positioning boss 25 coordinated with detent 12.The top plane 250 of positioning boss 25 has at least one pointed boss, preferably adopt multiple pointed boss, adopt the pointed boss 251,252,253 that three connected in this application, as shown in Figure 7, these three pointed boss 251,252,253 are positioned at the centre position of positioning boss 25, and the left and right sides of positioning boss 25 are also through polishing.
As shown in Fig. 6, Fig. 7, Fig. 8, the both sides of outside, framework module 2 front end have two corresponding buckles 21, and the below of buckle 21 has a saddle 26, and buckle 21 and saddle 26 surround the draw-in groove being formed and hold Hall chip 4.Described buckle 21 all has a sharp hook portion 213,214, two sharp hook portions 213,214 are inwardly given prominence to, the front end of buckle 21 is formed with spur 215,216, described spur 215,216 is greater than the length of Hall chip 4 matrix at vertical direction (Z axis) in the length of vertical direction (Z axis), and after ensureing rivet hot like this, in the vertical direction blocks Hall chip 4.
The positioning boss 25 of described framework module 2 and the detent 12 of cavity module 1 are linked together by bonding glue, as shown in figure 17, flexible circuit board 3 is close on framework module upper surface 28, be welded to connect with chip PIN needle 46 below the chip PIN needle 46 that the PIN needle contact 31 on its surface is positioned at Hall chip 4, PIN needle 111,112,113 is successively by the circular PIN needle hole 32(on the strip through-hole 22 of framework module 2 and flexible circuit board as shown in figure 12), cover plate 8 is by inner in cavity module 1 for framework module 2, circuit board and Hall chip 4 enclosed package.
In said structure, flexible circuit board 3 can replace with hard circuit board, and accordingly for the ease of installing, the PIN needle hole on hard circuit board will be designed to bar shaped or rectangle.
As shown in figure 18, PIN needle assembly has at least the end that a PIN needle is exposing circuit board to increase barb 114, when only having the end of a PIN needle to have barb 114, preferred structure is that barb 114 is positioned in a middle PIN needle 112 of PIN needle assembly, when there being the end of two PIN needle to have barb 114, preferred structure is two PIN needle 111 that barb 114 is positioned at PIN needle assembly both sides, on 113, like this, after framework module 2 is installed to cavity module 1, move framework module 2 backward, due to the elasticity of metal PIN needle, barb 114 can block framework module 2 automatically, simultaneously can also the strip through-hole of adequate compensation framework module 2 in the scale error of Z-direction, as shown in figure 19.
The manufacturing process of modular sensor of the present invention, comprises the following steps:
A) injection mo(u)lding comprises the cavity module 1 of PIN needle assembly 11, preferably, angled-lift splits core_pulling demoulding mode can be adopted to complete;
B) the shaping framework module 2 comprising magnet 6 and soft iron 7 of integral molded plastic;
C) utilize automatic mechanical hand by Hall chip 4 vertically (Z axis) be installed in the draw-in groove that the buckle 21 of framework module 2 and saddle 26 formed from top to bottom, as Fig. 6, Fig. 8, Figure 10, shown in Figure 13, the matrix side 41 of Hall chip 4, 42 with draw-in groove side 211, 212 transition fit, the matrix skew back face 43 of Hall chip 4, 44 with the sharp hook portion 213 of buckle 21, 214 interference fit, the saddle 26 below buckle 21 is close in the lower surface of Hall chip 4, automatic mechanical hand keeps certain snap-in force 1-3 second, with another automatic mechanical hand along the matrix skew back face 43 perpendicular to framework module 2 end face direction (X-axis) rivet hot Hall chip 4, 44 places, make the spur after rivet hot 215, 216 upper ends are at the upper fixing Hall chip 4 of vertical direction (Z axis),
D) glue (as epoxy resin) that will bond injects the detent 12 of cavity module 1, make glue level lower than and be installed to the top plane 250 of positioning boss 25 after cavity module 1 close to framework module 2;
E) first by three of PIN needle assembly 11 PIN needle 111, 112, 113 insert in three strip through-holes 22 of framework module 2, the elasticity of recycling PIN needle moves framework module 2 backward to be made in its cavity being pressed into cavity module 1, three PIN needle 111, 112, 113 expose framework module upper surface 28, positioning boss 25 embeds in the detent 12 of cavity module 1 simultaneously, as shown in figure 15, three pointed boss 251 of positioning boss 25, 252, the bottom of 253 tips and detent 12 has a small amount of gap, due to three pointed boss 251, 252, 253 in the middle of the positioning boss 25 of framework module 2, as shown in figure 16, as long as control the injection rate IR of bonding glue according to step d), just can ensure that glue can not be extruded guiding and the location of effect of flood framework module 2 and cavity module 1 and avoid glue to cause electronic component to damage because assembling after the uncontrollable overlay electronic component temperature of squeezing flow impacts in cavity module 1 and framework module 2 assembling process,
Because PIN needle 111,112,113 has elasticity, thus can to framework module 2 apply forward with downward power, make the matrix front end face 45 of Hall chip 4 be close to the front facet 13 of cavity module 1, the lower surface 29 of framework module 2 is close to the face, chamber, the end 14 of cavity module 1;
F) mounting circuit boards, when circuit board is flexible circuit board 3, the one end first flexible circuit board 3 with PIN needle contact 31 is stretched into below the chip PIN needle 46 of Hall chip 4, make PIN needle contact 31 corresponding with chip PIN needle 46 position, the more circular PIN needle hole 32 of flexible circuit board 3 other end is enclosed within PIN needle 111,112,113; When circuit board is hard circuit board, first PIN needle 111,112,113 is packed in the PIN needle hole of hard circuit board, then one end hard circuit board with PIN needle contact is stretched into below the chip PIN needle 46 of Hall chip 4;
G) (while welding, first precompressed flexible circuit board 3 makes it be close to framework module upper surface 28 by correspondingly with the PIN needle hole of circuit board for the PIN needle 111,112,113 of PIN needle assembly 11 to weld to utilize automatic mechanical hand, make framework module lower surface 29 be close to the face, chamber, the end 14 of cavity module 1 simultaneously), and by the chip PIN needle 46 of Hall chip 4 and the PIN needle contact of circuit board is corresponding welds together;
H) high temperature furnace solidification, makes bonding glue (epoxy resin) harden, cavity module 1 and framework module 2 is linked together, and framework module 2 and cavity module 1 is linked together firmly after multiple pointed boss design makes glue hot setting;
I) along the chamber wall surrounding point silica gel of cavity module 1, by press-fit cover plate 8 make framework module 2, circuit board and Hall chip 4 enclosed package in cavity module 1, form transducing head as shown in Figure 2.
In step c, as shown in figure 14, mechanical arm head 5 comprises pre-pressure head 51 and rivet hot 52, described pre-pressure head 51 is flexibly connected by a spring 53 and rivet hot 52, described rivet hot 52 comprises two thermal heads 521, 522, pre-pressure head 51 is positioned at two thermal heads 521, between 522, during mechanical arm feeding, pre-pressure head 51 first pushes down Hall chip 4, thermal head 521, the spur 215 of 522 pairs of buckles 21, 216 carry out hot pressing, control feeding time and position, make rivet hot plane 27 step back in Hall chip 4 matrix front end face 45(as shown in Figure 10), due to spur 215, 216 are greater than the length of Hall chip 4 matrix at vertical direction (Z axis) in the length of vertical direction (Z axis), make the spur 215 of buckle 21 after rivet hot like this, 216 upper ends are outstanding in draw-in groove, limit the degree of freedom of Hall chip 4 in the vertical direction, such Hall chip 4 is at X, Y, the degree of freedom in Z tri-directions is zero.
In step I, the method for epoxy resin encapsulating and hot setting can also be adopted, the cavity between framework module 2 and cavity module 1 is tamped completely, cover all electrical equipments.
The exposed end (one end that side is stretched out bottom cavity module 1) of three PIN needle 111,112,113 of described cavity module 1 can according to the intact stent of sensor difference in functionality length, ring flange corner, connector corner entirety bag note formation one band plug and ring flange.
Sensor head as shown in Figure 2 can as the general-purpose module of quadric injection mould.
In the present invention, the buckle of framework module front end adopts the rivet hot spur of interference point hook portion and end face novelty inside chip draw-in groove simultaneously, make Hall chip all be firmly fixed restriction in X, Y, Z tri-directions, effectively ensure that Hall chip accurately fixedlying positioning at framework module; The present invention utilizes the fit structure of the detent in the elasticity of metal PIN needle self in PIN needle assembly, cavity module and the positioning boss in framework module, ensure that the accurate location of framework module in cavity module, a small amount of clearance fit bottom the simultaneously multiple pointed boss design of positioning boss and pointed boss tip and detent had both avoided glue and has caused electronic component to damage because assembling after the uncontrollable overlay electronic component temperature of squeezing flow impacts, and ensure that framework module is firmly connected with after cavity module glue curing simultaneously; There is in the present invention flexible PIN needle power is forward applied to framework module, ensure that the front facet of Hall chip front end face and cavity module fits tightly but is unlikely to that extruding force is excessive causes cavity module front end deformation and failure, effectively ensure that sensing breath; The present invention can adopt flexible circuit board, can adopt low-cost hard circuit board again, can encapsulate according to actual needs and design; Sensor of the present invention adopts modular assembly scheme, the adverse effect that when avoiding integral molded plastic, High Temperature High Pressure causes electronic devices and components; The modular conceptual design of the present invention is flexible, is conducive to the same platform development of different model sensor, be conducive to batch production, and transducer sensitivity is high, has and installs stability reliably.
Above by specific embodiment to invention has been detailed description, this embodiment is only preferred embodiment of the present invention, and it not limits the invention.Without departing from the principles of the present invention, the equivalent replacement that those skilled in the art makes the syndeton etc. between the concrete structure of each module of sensor, each module and improvement, all should be considered as in the technology category protected in the present invention.
Claims (18)
1. a modular sensor, is characterized in that, comprises cavity module (1), framework module (2), circuit board, Hall chip (4);
Described cavity module (1) is the housing of an open-top, and the bottom of described housing has a detent (12), and housing bottom integral molded plastic has PIN needle assembly (11);
The inner integral molded plastic in front end of described framework module (2) has magnet (6) and soft iron (7), rear end has strip through-hole (22), the upper surface of described framework module (2) has two limiting stands (23 to circuit board cross spacing, 24), lower surface has the positioning boss (25) coordinated with detent (12), the both sides of described framework module (2) outside, front end have two corresponding buckles (21), the below of buckle (21) has a saddle (26), described buckle (21) and saddle (26) surround the draw-in groove being formed and hold Hall chip (4), described buckle (21) all has a sharp hook portion (213, 214), two sharp hook portions (213, 214) inwardly give prominence to, the front end of buckle (21) is formed with spur (215, 216), described spur (215, 216) after rivet hot, in the vertical direction blocks Hall chip (4),
Described circuit board is close on framework module upper surface (28), the PIN needle contact (31) on its surface is positioned at chip PIN needle (46) below of Hall chip (4) and is welded to connect with chip PIN needle (46), the PIN needle (111 of described PIN needle assembly (11), 112, 113) one end is stretched out from the side of cavity module (1), the other end protrudes upward, and successively by the PIN needle hole on the strip through-hole (22) of framework module (2) and circuit board, described framework module (2), it is inner that circuit board and Hall chip (4) are encapsulated in cavity module (1).
2. modular sensor according to claim 1, is characterized in that, the spur (215,216) of described buckle (21) is greater than the length of Hall chip (4) matrix at vertical direction in the length of vertical direction.
3. modular sensor according to claim 1, it is characterized in that, (25) have pointed boss to described positioning boss, this pointed boss is positioned at the centre position of positioning boss (25), and the bottom of the tip of this pointed boss and detent (12) has gap.
4. modular sensor according to claim 3, is characterized in that, described positioning boss (25) comprises at least two connected pointed boss.
5. modular sensor according to claim 1, it is characterized in that, the positioning boss (25) of described framework module (2) and the detent (12) of cavity module (1) are linked together by bonding glue.
6. modular sensor according to claim 1, is characterized in that, the left and right sides that described detent (12) contacts with positioning boss (25) adopt polishing.
7. modular sensor according to claim 1, is characterized in that, the PIN needle (111,112,113) of described PIN needle assembly (11) to be made and in obtuse angle by having flexible metal.
8. modular sensor according to claim 1, is characterized in that, described circuit board is flexible circuit board (3), and the PIN needle hole on it is circular PIN needle hole (32).
9. modular sensor according to claim 1, is characterized in that, described circuit board is hard circuit board, and the PIN needle hole on it is bar shaped PIN needle hole.
10. modular sensor according to claim 1, is characterized in that, the end that described PIN needle assembly (11) has at least a PIN needle to expose circuit board has barb (114).
11. modular sensors according to claim 1, it is characterized in that, also comprise a cover plate (8), described cover plate (8) is inner in cavity module (1) by framework module (2), circuit board and Hall chip (4) enclosed package.
12. modular sensors according to claim 1, it is characterized in that, described framework module (2), circuit board and Hall chip (4) are covered by an injecting glue layer and are encapsulated in cavity module (1) inside, and described injecting glue layer is positioned at the cavity between framework module (2) and cavity module (1).
The manufacturing process of 13. 1 kinds of modular sensors, is characterized in that, comprises the following steps:
A) injection mo(u)lding comprises the cavity module (1) of PIN needle assembly (11);
B) the shaping framework module (2) comprising magnet (6) and soft iron (7) of integral molded plastic;
C) Hall chip (4) is vertically installed in the draw-in groove that the buckle (21) of framework module (2) and saddle (26) formed from top to bottom, make the matrix side (41 of Hall chip (4), 42) with draw-in groove side (211, 212) transition fit, the matrix skew back face (43 of Hall chip (4), 44) with the sharp hook portion (213 of buckle (21), 214) interference fit, the saddle (26) of buckle (21) below is close in the lower surface of Hall chip (4), along the matrix skew back face (43 perpendicular to framework module (2) end face direction rivet hot Hall chip (4), 44) place, make the spur (215 of buckle (21), 216) after rivet hot, in the vertical direction blocks Hall chip (4),
D) glue that will bond injects the detent (12) of cavity module (1), make glue level lower than and be installed to the top plane (250) of cavity module (1) positioning boss (25) afterwards close to framework module (2);
E) framework module (2) is installed in the cavity of cavity module (1), make the PIN needle of PIN needle assembly (11) (111,112,113) insert framework module (2) strip through-hole (22) in and be exposed to framework module upper surface (28), and the positioning boss (25) of framework module (2) embed cavity module (1) detent (12) in;
F) mounting circuit boards, make the PIN needle contact on circuit board insert chip PIN needle (46) below of Hall chip (4), and the PIN needle of PIN needle assembly (11) (111,112,113) is stretched out from the PIN needle hole circuit board;
G) weld corresponding with the PIN needle hole of circuit board for the PIN needle (111,112,113) of PIN needle assembly (11), and weld together corresponding with the PIN needle contact of circuit board for the chip PIN needle (46) of Hall chip (4);
H) settable cementitious glue, links together cavity module (1) and framework module (2);
I) package cavity module (1), makes framework module (2), circuit board and Hall chip (4) be encapsulated in cavity module (1).
The manufacturing process of 14. modular sensors according to claim 13, it is characterized in that, the spur (215,216) of described buckle (21) is greater than the length of Hall chip (4) matrix at vertical direction in the length of vertical direction, and after rivet hot, spur (215,216) upper end goes out to limit the degree of freedom of Hall chip (4) in the vertical direction to draw-in groove inwardly projecting.
The manufacturing process of 15. modular sensors according to claim 13, it is characterized in that, in step e) in, first the PIN needle (111,112,113) of PIN needle assembly (11) is inserted in the strip through-hole (22) of framework module (2), moving framework module (2) more backward makes in its cavity being pressed into cavity module (1), and positioning boss (25) embeds in the detent (12) of cavity module (1) simultaneously.
The manufacturing process of 16. modular sensors according to claim 13, is characterized in that, described positioning boss (25) centre position has pointed boss, and the bottom of the tip of this pointed boss and detent (12) has gap.
The manufacturing process of 17. modular sensors according to claim 13, it is characterized in that, in step I) in, cavity module (1) inwall point glue and press-fit a cover plate (8), described cover plate (8) is inner in cavity module (1) by framework module (2), circuit board and Hall chip (4) enclosed package.
The manufacturing process of 18. modular sensors according to claim 13, it is characterized in that, in step I) in, encapsulating in cavity between framework module (2) and cavity module (1) also makes it solidify, and the injecting glue layer after described framework module (2), circuit board and Hall chip (4) are cured covers and is encapsulated in cavity module (1) inside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310229557.8A CN103336139B (en) | 2013-06-09 | 2013-06-09 | Modular sensor and manufacturing process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310229557.8A CN103336139B (en) | 2013-06-09 | 2013-06-09 | Modular sensor and manufacturing process thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103336139A CN103336139A (en) | 2013-10-02 |
| CN103336139B true CN103336139B (en) | 2015-11-18 |
Family
ID=49244342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310229557.8A Active CN103336139B (en) | 2013-06-09 | 2013-06-09 | Modular sensor and manufacturing process thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103336139B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103624983B (en) * | 2013-11-19 | 2016-03-23 | 上海航天汽车机电股份有限公司汽车机电分公司 | A kind of sensor hot-riveting device |
| CN105241484B (en) * | 2014-07-10 | 2017-09-12 | 联合汽车电子有限公司 | The location structure of circuit board and chip in automobile sensor |
| CN104316094B (en) * | 2014-10-14 | 2017-07-07 | 联合汽车电子有限公司 | Glue seals formula sensor and its manufacturing process |
| CN104319266B (en) * | 2014-10-14 | 2017-12-12 | 联合汽车电子有限公司 | The sealant sealing assembling structure and glue encapsulation method of auto electronic element |
| CN109443593B (en) * | 2018-10-17 | 2021-03-30 | 杭州休普电子技术有限公司 | Preparation process of wireless temperature sensor using electromagnetic self-power-taking |
| CN114152771A (en) * | 2021-12-03 | 2022-03-08 | 陆博汽车电子（曲阜）有限公司 | Sensor framework and sensor comprising same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4922197A (en) * | 1988-08-01 | 1990-05-01 | Eaton Corporation | High resolution proximity detector employing magnetoresistive sensor disposed within a pressure resistant enclosure |
| CN2896225Y (en) * | 2006-03-09 | 2007-05-02 | 联合汽车电子有限公司 | Phase sensor carriage |
| CN201152878Y (en) * | 2007-12-28 | 2008-11-19 | 联合汽车电子有限公司 | Assembling rotation speed sensor |
| CN203364843U (en) * | 2013-06-09 | 2013-12-25 | 联合汽车电子有限公司 | Modularization sensor |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10239339A (en) * | 1997-02-27 | 1998-09-11 | Kansei Corp | Resin-sealed type rotation sensor and apparatus and method for manufacturing the same |
-
2013
- 2013-06-09 CN CN201310229557.8A patent/CN103336139B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4922197A (en) * | 1988-08-01 | 1990-05-01 | Eaton Corporation | High resolution proximity detector employing magnetoresistive sensor disposed within a pressure resistant enclosure |
| CN2896225Y (en) * | 2006-03-09 | 2007-05-02 | 联合汽车电子有限公司 | Phase sensor carriage |
| CN201152878Y (en) * | 2007-12-28 | 2008-11-19 | 联合汽车电子有限公司 | Assembling rotation speed sensor |
| CN203364843U (en) * | 2013-06-09 | 2013-12-25 | 联合汽车电子有限公司 | Modularization sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103336139A (en) | 2013-10-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103336139B (en) | Modular sensor and manufacturing process thereof | |
| CN203364843U (en) | Modularization sensor | |
| CN104364615B (en) | Thermal flowmeter | |
| US10953578B2 (en) | Sensor production by holding the intermediate injection-molded part | |
| CN104319266B (en) | The sealant sealing assembling structure and glue encapsulation method of auto electronic element | |
| CN103134524B (en) | Rotation detecting and manufacture method thereof | |
| CN104316094B (en) | Glue seals formula sensor and its manufacturing process | |
| CN102582264B (en) | Liquid ejection head and method of producing liquid ejection head | |
| US9474168B2 (en) | Electronic module and method for manufacturing electronic module | |
| CN206930299U (en) | A kind of automobile sensor with the plastic structure of internal double layers | |
| US20100320694A1 (en) | Apparatus, method, and system for sealing an object or a plurality of objects in an assembly and sealing said assembly around an aperture | |
| CN204216020U (en) | The sealant sealing assembling structure of auto electronic element | |
| JP2009004449A (en) | Resin-leakage sensing method and apparatus | |
| JP5192564B2 (en) | Electronic circuit storage case and method of manufacturing the same | |
| JP2001201416A (en) | Method for manufacturing pressure detecting device | |
| CN204214465U (en) | Rubber seal formula sensor | |
| CN203981196U (en) | The location structure of circuit board and chip in automobile sensor | |
| CN105526956A (en) | Sensor assembly and method for producing a sensor assembly | |
| JP5645508B2 (en) | Method for producing electronic component and electronic component | |
| JP4942541B2 (en) | Electrical and electronic module and manufacturing method thereof | |
| CN209878795U (en) | Speed sensor structure | |
| CN101764068A (en) | Method for packaging semiconductor apparatus assembly | |
| CN211982224U (en) | Electronic expansion valve circuit board is fixed and seal structure | |
| CN204464583U (en) | The integrated threeway that marsh geophone is being got lines crossed | |
| US20240154351A1 (en) | Input/output device with injection-molded cables |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |