CN103336139A - Modular sensor and manufacturing technique thereof - Google Patents
Modular sensor and manufacturing technique thereof Download PDFInfo
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- CN103336139A CN103336139A CN2013102295578A CN201310229557A CN103336139A CN 103336139 A CN103336139 A CN 103336139A CN 2013102295578 A CN2013102295578 A CN 2013102295578A CN 201310229557 A CN201310229557 A CN 201310229557A CN 103336139 A CN103336139 A CN 103336139A
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Abstract
The invention discloses a modular sensor and a manufacturing technique thereof. The modular sensor comprises a cavity module, a framework module, a circuit board, a Hall chip and a cover plate, the top of the cavity module is opened, a positioning groove is formed in the bottom of the cavity module, and the cavity is integrally injected and molded with PIN needle module; strip through holes are formed in the rear end of the framework module, two position spacing tables are arranged on the upper end surface of the framework module, a positioning lug boss is arranged on the lower end surface of the framework module, and a clamp groove comprising two buckles and one support table and used for accommodating the hall chip is formed in the outer part of the front end of the framework module. The buckle adopts an inner side interference pointed hook part and an end surface hot riveting spur, so as to enable the hall chip to be fixed and confined in the space; the elasticity of the metal PIN needle and the matching structure of the cavity module and the framework module guarantee the framework module to be accurately positioned and fixedly connected in the cavity body module, and prevent the electric element from being damaged after glue flowing uncontrolled cover the electronic element temperature shock; the front end surface of the hall chip and the front cavity surface of the cavity module are closely pressed, but the compression force is not so large as to cause deformation and damage of the cavity module front end, so as to effectively guarantee sensor information.
Description
Technical field
The present invention is relevant with sensor technology, is specifically related to a kind of modularization active sensor and manufacturing process thereof, and described sensor can be used for motor car engine, wheel box and ABS anti-lock braking system.
Background technology
At present, wheel speed sensors in speed probe in speed probe in the motor car engine and phase detector, the wheel box and the ABS anti-lock braking system etc. comprises passive type and active two kinds of forms, wherein passsive sensor is called passive sensor, and active sensor is called active sensor.Compare with passsive sensor, active sensor has advantages such as volume is little, quality is light, integrated level is high, response is fast, antijamming capability is strong, has therefore obtained application more and more widely.
Existing active sensor mainly contains two kinds of molding modes, is respectively integral molded plastic formula and rack shell assembled.
To be the integrated circuit component that will be packaged with Hall chip with the wire harness that patches the PIN pin or comprise plug link together the integral molded plastic formula and be fixed on injection moulding piece (in some injection moulding piece also bag be injected with magnet), form one time the injection moulding assembly, then quadric injection mould moulding complete sensors.This molding mode is because quadric injection mould pressure is big and temperature is high, so integrated circuit component, patch PIN pin or wire harness and be difficult to be securely fixed on injection moulding piece.Simultaneously, injection moulding assembly when quadric injection mould up and down all around six-freedom degree be difficult to accurately spacingly, cause the installation site of Hall chip to be difficult to control, be easy to generate deviation, thereby the inconsistent sensor function that influence of detector gap is exported after causing entrucking.In addition, the impermeability between an injection moulding and the quadric injection mould is difficult to assurance, and, electrical equipment is through after the High Temperature High Pressure effect of quadric injection mould, may cause and lose efficacy or potential inefficacy, bring hidden danger to product reliability, the accurate reason of product failure also is difficult for accurately location simultaneously.
The rack shell assembled is that the integrated circuit component erection welding that will be packaged with Hall chip is injected with to bag on the support that patches the PIN pin that (some is packaged with between the integrated circuit component of Hall chip and the PIN pin and also is connected with electronic components such as electric capacity, resistance, perhaps be packaged with the circuit board of elements such as integrated capacitance, resistance), load onto sealing O type circle at support then and form bracket component, at last bracket component is assembled to corresponding shell and forms complete sensors.Typical structure can be referring to Fig. 1, and this active sensor comprises support 1', shell 2', Hall chip 3', circuit board assemblies 4' and sealing O type circle 5', and its medium-height trestle 1' bag is injected with and patches the PIN pin.During this structure assembling, earlier band is patched the pre-injection mo(u)lding of support 1' of PIN pin, again Hall chip 3' is installed to the head of support 1', circuit board assemblies 4' one end and Hall chip 3' welding, the other end and the end welding that patches the PIN pin, to seal O type circle 5' then and be sleeved on the support 1', the bracket component with assembling is installed among the shell 2' at last.
Be in the patent of invention of CN101008660A at publication number, disclosed active sensor is except adopting the rack shell fabricated construction, as shown in Figure 1, also support is connected (A place among Fig. 1) with shell by epoxy resin cure, blocks vent port by steel ball 6' at last and also seal by UV glue (B place among Fig. 1).
In the fabricated sensor construction of rack shell, occur existing between support sensing head (being Hall chip 3') and the shell 2' gap to cause sensor to detect less than signal or sensing head extruding shell 2' easily and cause the case head bulge even break.If adopting publication number is the patent of CN2896225Y, accurately control gap between support sensing head and the shell by U-shaped groove structure, then circuit board assemblies must adopt the flexible circuit board component, so can not adopt the more cheap hard circuit board assembly of price, cause production cost to improve, two come the flexible circuit board component not only to need artificial assembling, and the flexible circuit board component must adopt manual welding with the welding that patches the PIN pin and can't use machine to weld, and causes reliability of products to descend.In addition, the sealing O type circle 5' high temperature between support 1' and the shell 2' can be aging after durable and lose sealing and cause leakage.Epoxy resin cure structure in the patent of invention of employing publication number CN101008660A, in solidification process, may cause the electronic component on the epoxy resin covering flexible circuit plate, Wen Chonghou damages electronic component, and the sealing means that steel ball 6' interference is pressed into vent port may make temperature crack with steel ball 6' sealing place towards after-poppet 1' to cause sensing head to reveal, and perhaps makes on the support steel ball and patch to break between the PIN pin to cause and patch the leakage of PIN pin.
In addition, more than in two kinds of molding modes, the structure of sensor all can't realize modularization, the dirigibility of product design and product versatility are relatively poor, can not realize mass-producing by single product line platform the needs of different model sensor.
Summary of the invention
Technical matters to be solved by this invention provides a kind of modular sensor, simple in structure flexible, the reliability height, impermeability is good, applicability is strong, not only can accurately locate Hall chip, can avoid Hall chip that sensor head is produced crimp or potential destructive extruding, and can guarantee connection and location between each module of sensor.The present invention also provides the manufacture method of described modular sensor.
For solving the problems of the technologies described above, modular sensor provided by the invention comprises cavity module, skeleton module, circuit board, Hall chip;
Described cavity module is the housing of an open-top, and the bottom of described housing has a location groove, and the housing bottom integral molded plastic has the PIN needle assemblies;
The front end inner body of described skeleton module is injected with magnet and soft iron, the rear end has strip through-hole, the upper surface of described skeleton module has two limiting stands to the circuit board cross spacing, the lower surface has the positioning boss that cooperates with detent, the both sides of described skeleton module front end outside have two corresponding buckles, the below of buckle has a saddle, described buckle and saddle surround and form the draw-in groove that holds Hall chip, described buckle all has a sharp hook portion, two sharp hook portions are inwardly outstanding, the front end of buckle is formed with spur, and in the vertical direction blocks Hall chip after the described spur rivet hot;
Described circuit board is close on the skeleton module upper surface, its surperficial PIN pin contact is positioned at the chip PIN pin below of Hall chip and is welded to connect with chip PIN pin, PIN pin one end of described PIN needle assemblies stretches out from a side of cavity module, the other end protrudes upward, and successively by the strip through-hole of skeleton module and the PIN pin hole on the circuit board, described skeleton module, circuit board and Hall chip are encapsulated in the cavity inside modules.
Further, the spur of described buckle in the length of vertical direction greater than the length of Hall chip matrix at vertical direction.
Preferably, have pointed boss on the described positioning boss, this pointed boss is positioned at the centre position of positioning boss, and the tip of this pointed boss and the bottom of detent have the gap.Preferable, have at least two continuous pointed boss on the positioning boss.
Preferably, the contacted left and right sides of described detent and positioning boss face adopts polishing.The detent of the positioning boss of described skeleton module and cavity module links together by bonding glue.
Wherein, the PIN pin of described PIN needle assemblies is made by the rubber-like metal and in obtuse angle.
In said structure, described circuit board is the flexible circuit plate, and the PIN pin hole on it is circular PIN pin hole; Perhaps, described circuit board is hard circuit board, and the PIN pin hole on it is bar shaped PIN pin hole.
Better, the end that described PIN needle assemblies has at least a PIN pin to expose circuit board has barb.
In said structure, sensor can also comprise a cover plate, described cover plate with skeleton module, circuit board and Hall chip enclosed package in the cavity inside modules.Perhaps, skeleton module, circuit board and Hall chip are covered by an injecting glue layer and are encapsulated in the cavity inside modules, in the cavity of described injecting glue layer between skeleton module and cavity module.
The present invention also provides a kind of manufacturing process of modular sensor, may further comprise the steps:
A) injection mo(u)lding comprises the cavity module of PIN needle assemblies;
B) the integral molded plastic moulding comprises the skeleton module of magnet and soft iron;
C) Hall chip vertically is installed to from top to bottom in the draw-in groove that the buckle of skeleton module and saddle form, make matrix side and the draw-in groove side transition fit of Hall chip, the sharp hook portion interference fit of the matrix skew back face of Hall chip and buckle, the saddle of buckle below is close in the lower surface of Hall chip, along perpendicular to the matrix skew back face place of skeleton module end face direction rivet hot Hall chip, make the spur rivet hot of buckle after in the vertical direction block Hall chip;
D) glue that will bond injects the detent of cavity module, the glue plane is lower than and is installed to the plane, top of positioning boss after the cavity module close to the skeleton module;
E) the skeleton module is installed in the cavity of cavity module, the PIN cushion that makes the PIN needle assemblies is to the marrow in the strip through-hole of frame module and be exposed to skeleton module upper surface, and the positioning boss of skeleton module embeds in the detent of cavity module;
F) mounting circuit boards, the chip PIN pin below that makes the PIN pin contact on the circuit board insert Hall chip, and the PIN pin of PIN needle assemblies stretches out from the PIN pin hole on the circuit board;
G) weld together with the PIN pin contact of circuit board is corresponding with the corresponding welding of PIN pin hole of PIN pin with the circuit board of PIN needle assemblies, and with the chip PIN pin of Hall chip;
H) settable cementitious glue links together cavity module and skeleton module;
I) package cavity phantom piece is encapsulated in the cavity module skeleton module, circuit board and Hall chip.
Wherein, utilize a mechanical arm to carry out rivet hot in step c), the mechanical arm head comprises pre-pressure head and rivet hot head, and described pre-pressure head flexibly connects by a spring and rivet hot head, and described rivet hot head comprises two thermal heads, and pre-pressure head is between two thermal heads.During the mechanical arm feeding, pre-pressure head is pushed down Hall chip, and thermal head carries out hot pressing to the spur of buckle, makes the rivet hot plane step back matrix front end face in Hall chip.Since the spur of buckle in the length of vertical direction greater than the length of Hall chip matrix at vertical direction, the degree of freedom of spur upper end outstanding restriction Hall chip in the vertical direction in the draw-in groove after the rivet hot.
Wherein, when step e) assembling skeleton module, earlier with the PIN cushion of PIN needle assemblies to the marrow in the strip through-hole of frame module, mobile skeleton module makes in its cavity that is pressed into the cavity module backward again, and positioning boss embeds in the detent of cavity module simultaneously.Described positioning boss centre position has pointed boss, and the tip of this pointed boss and the bottom of detent have the gap.
Wherein, in step I) in, can and press-fit a cover plate at the inwall point glue of cavity module, by cover plate with skeleton module, circuit board and Hall chip enclosed package in the cavity inside modules, encapsulating and it is solidified in also can the cavity between skeleton module and cavity module, the injecting glue layer after described skeleton module, circuit board and Hall chip are cured covers and is encapsulated in the cavity inside modules.
Usefulness of the present invention is:
1) among the present invention, the buckle of skeleton module front end adopts the rivet hot spur of the inboard interference point hook portion of chip draw-in groove and end face novelty simultaneously, make Hall chip in X, Y, three directions of Z all by fixed constraints firmly, guaranteed Hall chip accurately fixedlying positioning in the skeleton module effectively;
2) the present invention utilizes the fit structure of the elasticity of metal PIN pin self in the PIN needle assemblies, the detent in the cavity module and the positioning boss in the skeleton module, guaranteed the accurate location of skeleton module in the cavity module, simultaneously the multiple pointed boss design of positioning boss and pointed boss tip cooperate with the little clearance of detent bottom and have both avoided glue to flow because of the assembling extruding causing the electronic component damage after the uncontrollable overlay electronic component temperature impact, have guaranteed simultaneously firmly to be connected after skeleton module and the cavity module glue curing;
3) rubber-like PIN applies forward power at the skeleton module among the present invention, the front facet that has guaranteed Hall chip front end face and cavity module fits tightly but is unlikely to the excessive cavity module front end deformation and failure that causes of extruding force, has effectively guaranteed the sensing breath;
4) the present invention can adopt the flexible circuit plate, can adopt low-cost hard circuit board again, can encapsulate according to actual needs and design;
5) sensor of the present invention adopts modularization assembling scheme, the adverse effect that High Temperature High Pressure causes electronic devices and components when having avoided integral molded plastic;
6) modular conceptual design is flexible, is conducive to the same platform development of different model sensor, be conducive to produce in batches, and the transducer sensitivity height, have reliable installation stability.
Description of drawings
Fig. 1 is the structural representation of the fabricated active sensor of existing rack shell;
Fig. 2 is the schematic perspective view of complete sensors head of the present invention;
Fig. 3 is the structural representation of cover plate of the present invention;
Fig. 4 is the schematic perspective view after sensor head shown in Figure 2 is removed cover plate;
Fig. 5 is the schematic perspective view of lumen phantom piece of the present invention;
Fig. 6 be among the present invention the skeleton module just put schematic perspective view;
Fig. 7 is the inversion schematic perspective view of skeleton module among the present invention;
Fig. 8 is the vertical view of skeleton module among the present invention;
Fig. 9 is the schematic perspective view behind the skeleton module installation Hall chip among the present invention;
Figure 10 is the vertical view behind the skeleton module installation Hall chip among the present invention;
Figure 11 is the synoptic diagram of PIN needle assemblies among the present invention;
Figure 12 is the structural representation of flexible circuit plate among the present invention;
Figure 13 is the structural representation of Hall chip among the present invention;
Figure 14 is the structural representation of the mechanical arm head of rivet hot Hall chip among the present invention;
Figure 15 is that skeleton module that Hall chip has been installed is installed to the longitudinal sectional view in the cavity module;
Figure 16 is that skeleton module that Hall chip has been installed is installed to the transverse sectional view in the cavity module;
Figure 17 is that skeleton module that Hall chip and flexible circuit plate be installed is installed to the longitudinal sectional view in the cavity module;
Figure 18 is another structural representation of PIN pin in the PIN needle assemblies;
Figure 19 is that skeleton module that Hall chip and flexible circuit plate be installed is installed to the longitudinal sectional view in the cavity module with PIN pin shown in Figure 180.
Wherein description of reference numerals is as follows:
1 cavity module 11PIN needle assemblies
111,112,113PIN pin 114 barbs
12 detents, 13 front facets
14 end chamber face
2 skeleton modules, 21 buckles
211,212 draw-in groove sides 213,214 sharp hook portions
215,216 spurs, 22 strip through-holes
23,24 limiting stands, 25 positioning boss
Plane 251,252,250 positioning boss top, 253 pointed boss
26 saddles, 27 rivet hot planes
28 skeleton module upper surfaces, 29 skeleton module lower surfaces
3 flexible circuit plate 31PIN pin contacts
32 circular PIN pin holes
4 Hall chips 41,42 matrix sides
43,44 matrix skew back faces, 45 matrix front end faces
46 chip PIN pins
5 mechanical arm heads, 51 pre-pressure heads
52 rivet hots, 521,522 thermal head
53 springs
6 magnet, 7 soft irons
8 cover plates
Embodiment
The present invention is further detailed explanation below in conjunction with accompanying drawing and embodiment.
Modular sensor provided by the invention is mainly used in active sensor, as Fig. 2, Fig. 3 and shown in Figure 4, comprises cavity module 1, skeleton module 2, circuit board, Hall chip 4 and cover plate 8, and wherein circuit board is example with flexible circuit plate 3.
As shown in Figure 5, cavity module 1 is the housing of an open-top, and the centre position, bottom of housing has a location groove 12, and the left and right sides face of this detent 12 carries out polishing; The housing bottom integral molded plastic has PIN needle assemblies 11(as shown in figure 11), described PIN needle assemblies 11 has three PIN pins 111,112,113 in obtuse angle, the one end stretches out from a side of cavity module 1, the other end stretches out obliquely, as Fig. 5, shown in Figure 15, described PIN pin 111,112,113 is made by the rubber-like metal, has certain elasticity.
As Fig. 6, shown in Figure 7, the front end inner body of skeleton module 2 is injected with magnet 6 and soft iron 7(as shown in figure 15), it is rectangle that the rear end has in three strip through-hole 22(present embodiments), the upper surface of described skeleton module 2 has two limiting stands 23,24 to flexible circuit plate 3 cross spacings, and the lower surface has the positioning boss 25 that cooperates with detent 12.Has at least one pointed boss on the plane, top 250 of positioning boss 25, the multiple pointed boss of preferable employing, adopt three continuous pointed boss 251,252,253 in this application, as shown in Figure 7, these three pointed boss 251,252,253 are positioned at the centre position of positioning boss 25, and the left and right sides face of positioning boss 25 also passes through polishing.
As Fig. 6, Fig. 7, shown in Figure 8, the both sides of skeleton module 2 front end outsides have two corresponding buckles 21, and the below of buckle 21 has a saddle 26, and buckle 21 and saddle 26 surround and form the draw-in groove that holds Hall chip 4.Described buckle 21 all has a sharp hook portion 213,214, two sharp hook portions 213,214 are inwardly outstanding, the front end of buckle 21 is formed with spur 215,216, described spur 215,216 in the length of vertical direction (Z axle) greater than the length of Hall chip 4 matrixes at vertical direction (Z axle), guarantee rivet hot like this after in the vertical direction block Hall chip 4.
The positioning boss 25 of described skeleton module 2 and the detent 12 of cavity module 1 link together by bonding glue, as shown in figure 17, flexible circuit plate 3 is close on the skeleton module upper surface 28, its surperficial PIN pin contact 31 is positioned at chip PIN pin 46 belows of Hall chip 4 and is welded to connect with chip PIN pin 46, the strip through-hole 22 by skeleton module 2 and the circular PIN pin hole 32(on the flexible circuit plate be as shown in figure 12 successively for PIN pin 111,112,113), cover plate 8 with skeleton module 2, circuit board and Hall chip 4 enclosed package in cavity module 1 inside.
In said structure, flexible circuit plate 3 can replace with hard circuit board, and for the ease of installing, the PIN pin hole on the hard circuit board will be designed to bar shaped or rectangle accordingly.
As shown in figure 18, the PIN needle assemblies has at least a PIN pin to increase barb 114 in the end of exposing circuit board, when the end of having only a PIN pin has barb 114, preferred construction is that barb 114 is positioned on the middle PIN pin 112 of PIN needle assemblies, when the end of two PIN pins has barb 114, preferred construction is two PIN pins 111 that barb 114 is positioned at PIN needle assemblies both sides, on 113, like this, after skeleton module 2 is installed to cavity module 1, mobile skeleton module 2 backward, because the elasticity of metal PIN pin, barb 114 can block skeleton module 2 automatically, strip through-hole that simultaneously can also adequate compensation skeleton module 2 is in the scale error of Z-direction, as shown in figure 19.
The manufacturing process of modular sensor of the present invention may further comprise the steps:
A) injection mo(u)lding comprises the cavity module 1 of PIN needle assemblies 11, and is preferable, can adopt the angled-lift splits stripping means of loosing core to finish;
B) the integral molded plastic moulding comprises the skeleton module 2 of magnet 6 and soft iron 7;
C) utilize automatic mechanical hand with Hall chip 4 vertically (Z axle) be installed to from top to bottom in the draw-in groove that the buckle 21 of skeleton module 2 and saddle 26 form, as Fig. 6, Fig. 8, Figure 10, shown in Figure 13, the matrix side 41 of Hall chip 4,42 with draw-in groove side 211,212 transition fit, the matrix skew back face 43 of Hall chip 4,44 with the sharp hook portion 213 of buckle 21,214 interference fit, the saddle 26 of buckle 21 belows is close in the lower surface of Hall chip 4, automatic mechanical hand keeps certain snap-in force 1-3 second, with the matrix skew back face 43 of another automatic mechanical hand edge perpendicular to skeleton module 2 end face direction (X-axis) rivet hot Hall chips 4,44 places make the spur 215 after the rivet hot, 216 upper ends are at the fixing Hall chip 4 of vertical direction (Z axle);
D) glue (as epoxy resin) that will bond injects the detent 12 of cavity module 1, the glue plane is lower than and is installed to the plane, top 250 of cavity module 1 back positioning boss 25 close to skeleton module 2;
E) elder generation is with three PIN pins 111 of PIN needle assemblies 11,112,113 insert in three strip through-holes 22 of skeleton module 2, the elasticity of recycling PIN pin mobile skeleton module 2 backward makes in its cavity that is pressed into cavity module 1, three PIN pins 111,112,113 expose skeleton module upper surface 28, positioning boss 25 embeds in the detent 12 of cavity module 1 simultaneously, as shown in figure 15, three pointed boss 251 of positioning boss 25,252, the bottom of 253 tips and detent 12 has little clearance, because three pointed boss 251,252,253 in the middle of the positioning boss 25 of skeleton module 2, as shown in figure 16, as long as according to the injection rate IR of step d) control bonding glue, just can guarantee that glue can not be extruded guiding and the location of effect of flood skeleton module 2 and cavity module 1 and avoid glue to flow because of the assembling extruding and cause the electronic component damage after uncontrollable overlay electronic component temperature impacts in cavity module 1 and skeleton module 2 assembling processes;
Because PIN pin 111,112,113 has elasticity, so can apply forward and downward power skeleton module 2, make the matrix front end face 45 of Hall chip 4 be close to the front facet 13 of cavity module 1, the lower surface 29 of skeleton module 2 is close to chamber, the end face 14 of cavity module 1;
F) mounting circuit boards, when circuit board is flexible circuit plate 3, an end that earlier flexible circuit plate 3 is had PIN pin contact 31 stretches into chip PIN pin 46 belows of Hall chip 4, make PIN pin contact 31 corresponding with chip PIN pin 46 positions, the circular PIN pin hole 32 with flexible circuit plate 3 other ends is enclosed within on the PIN pin 111,112,113 again; When circuit board is hard circuit board, earlier PIN pin 111,112,113 is packed in the PIN pin hole of hard circuit board, an end that again hard circuit board is had PIN pin contact stretches into chip PIN pin 46 belows of Hall chip 4;
G) (elder generation's precompressed flexible circuit plate 3 makes it be close to skeleton module upper surface 28 in the time of welding with the corresponding welding of PIN pin hole of circuit board with the PIN pin 111,112 of PIN needle assemblies 11,113 to utilize automatic mechanical hand, make skeleton module lower surface 29 be close to chamber, the end face 14 of cavity module 1 simultaneously), and the chip PIN pin 46 of Hall chip 4 welded together with the PIN pin contact of circuit board is corresponding;
H) high temperature furnace solidifies, and makes bonding glue (epoxy resin) sclerosis, and cavity module 1 and skeleton module 2 are linked together, and after multiple pointed boss design makes the glue hot setting skeleton module 2 and cavity module 1 is linked together firmly;
I) around the chamber wall of cavity module 1, put silica gel, make skeleton module 2, circuit board and Hall chip 4 enclosed package in cavity module 1 by press-fiting cover plate 8, form transducing head as shown in Figure 2.
In step c, as shown in figure 14, mechanical arm head 5 comprises pre-pressure head 51 and rivet hot 52, described pre-pressure head 51 is by a spring 53 and rivet hot 52 flexible connection, described rivet hot 52 comprises two thermal heads 521,522, pre-pressure head 51 is positioned at two thermal heads 521, between 522, during the mechanical arm feeding, pre-pressure head 51 is pushed down Hall chip 4 earlier, thermal head 521, the spur 215 of 522 pairs of buckles 21,216 carry out hot pressing, control feeding time and position, rivet hot plane 27 is stepped back in the matrix front end face 45(of Hall chip 4 as shown in figure 10), because spur 215,216 in the length of vertical direction (Z axle) greater than the length of Hall chip 4 matrixes at vertical direction (Z axle), make the spur 215 of buckle 21 after the rivet hot like this, give prominence in draw-in groove 216 upper ends, limited the degree of freedom of Hall chip 4 in the vertical directions, Hall chip 4 is at X like this, Y, the degree of freedom of three directions of Z is zero.
In step I, can also adopt the method for epoxy resin encapsulating and hot setting, the cavity between skeleton module 2 and the cavity module 1 is tamped fully, cover all electrical equipments.
Three PIN pins 111 of described cavity module 1,112,113 exposed end (end that stretches out from cavity module 1 bottom one side) can be annotated the intact stent that forms a band plug and ring flange according to sensor difference in functionality length, ring flange corner, the whole bag of connector corner.
Sensor head as shown in Figure 2 can be used as the general-purpose module of quadric injection mould.
The buckle of skeleton module front end adopts the rivet hot spur of the inboard interference point hook portion of chip draw-in groove and end face novelty simultaneously among the present invention, make Hall chip in X, Y, three directions of Z all by fixed constraints firmly, guaranteed Hall chip accurately fixedlying positioning in the skeleton module effectively; The present invention utilizes the fit structure of the elasticity of metal PIN pin self in the PIN needle assemblies, the detent in the cavity module and the positioning boss in the skeleton module, guaranteed the accurate location of skeleton module in the cavity module, simultaneously the multiple pointed boss design of positioning boss and pointed boss tip cooperate with the little clearance of detent bottom and have both avoided glue to flow because of the assembling extruding causing the electronic component damage after the uncontrollable overlay electronic component temperature impact, have guaranteed simultaneously firmly to be connected after skeleton module and the cavity module glue curing; Rubber-like PIN applies forward power at the skeleton module among the present invention, and the front facet that has guaranteed Hall chip front end face and cavity module fits tightly but is unlikely to the excessive cavity module front end deformation and failure that causes of extruding force, has effectively guaranteed the sensing breath; The present invention can adopt the flexible circuit plate, can adopt low-cost hard circuit board again, can encapsulate according to actual needs and design; Sensor of the present invention adopts modularization assembling scheme, the adverse effect that High Temperature High Pressure causes electronic devices and components when having avoided integral molded plastic; The modular conceptual design of the present invention is flexible, is conducive to the same platform development of different model sensor, be conducive to produce in batches, and the transducer sensitivity height, have reliable installation stability.
More than by specific embodiment the present invention is had been described in detail, this embodiment only is preferred embodiment of the present invention, it is not to limit the invention.Under the situation that does not break away from the principle of the invention, equivalent replacement and improvement that those skilled in the art makes the concrete structure of each module of sensor, the syndeton between each module etc. all should be considered as in the technology category that the present invention protects.
Claims (17)
1. a modular sensor is characterized in that, comprises cavity module (1), skeleton module (2), circuit board, Hall chip (4);
Described cavity module (1) is the housing of an open-top, and the bottom of described housing has a location groove (12), and the housing bottom integral molded plastic has PIN needle assemblies (11);
The front end inner body of described skeleton module (2) is injected with magnet (6) and soft iron (7), the rear end has strip through-hole (22), the upper surface of described skeleton module (2) has two limiting stands (23 to the circuit board cross spacing, 24), the lower surface has the positioning boss (25) that cooperates with detent (12), the both sides of described skeleton module (2) front end outside have two corresponding buckles (21), the below of buckle (21) has a saddle (26), described buckle (21) and saddle (26) surround to form and hold the draw-in groove of Hall chip (4), described buckle (21) all has a sharp hook portion (213,214), two sharp hook portions (213,214) inwardly outstanding, the front end of buckle (21) is formed with spur (215,216), described spur (215,216) in the vertical direction blocks Hall chip (4) after the rivet hot;
Described circuit board is close on the skeleton module upper surface (28), its surperficial PIN pin contact (31) is positioned at chip PIN pin (46) below of Hall chip (4) and is welded to connect with chip PIN pin (46), the PIN pin of described PIN needle assemblies (11) (111,112, a 113) end stretches out from a side of cavity module (1), the other end protrudes upward, and successively by the strip through-hole (22) of skeleton module (2) and the PIN pin hole on the circuit board, described skeleton module (2), circuit board and Hall chip (4) are encapsulated in cavity module (1) inside.
2. modular sensor according to claim 1 is characterized in that, the spur of described buckle (21) (215,216) in the length of vertical direction greater than the length of Hall chip (4) matrix at vertical direction.
3. modular sensor according to claim 1, it is characterized in that, described positioning boss has pointed boss on (25), and this pointed boss is positioned at the centre position of positioning boss (25), and the bottom of the tip of this pointed boss and detent (12) has the gap.
4. modular sensor according to claim 3 is characterized in that, described positioning boss (25) comprises at least two continuous pointed boss.
5. modular sensor according to claim 1 is characterized in that, the positioning boss (25) of described skeleton module (2) and the detent (12) of cavity module (1) link together by bonding glue.
6. modular sensor according to claim 1 is characterized in that, described detent (12) adopts polishing with the contacted left and right sides of positioning boss (25) face.
7. modular sensor according to claim 1 is characterized in that, the PIN pin of described PIN needle assemblies (11) (111,112,113) is made by the rubber-like metal and in obtuse angle.
8. modular sensor according to claim 1 is characterized in that, described circuit board is flexible circuit plate (3), and the PIN pin hole on it is circular PIN pin hole (32); Described circuit board is hard circuit board, and the PIN pin hole on it is bar shaped PIN pin hole.
9. modular sensor according to claim 1 is characterized in that, the end that described PIN needle assemblies (11) has at least a PIN pin to expose circuit board has barb (114).
10. modular sensor according to claim 1 is characterized in that, also comprises a cover plate (8), described cover plate (8) with skeleton module (2), circuit board and Hall chip (4) enclosed package in cavity module (1) inside.
11. modular sensor according to claim 1, it is characterized in that, described skeleton module (2), circuit board and Hall chip (4) are covered by an injecting glue layer and are encapsulated in cavity module (1) inside, and described injecting glue layer is positioned at the cavity between skeleton module (2) and the cavity module (1).
12. the manufacturing process of a modular sensor is characterized in that, may further comprise the steps:
A) injection mo(u)lding comprises the cavity module (1) of PIN needle assemblies (11);
B) the integral molded plastic moulding comprises the skeleton module (2) of magnet (6) and soft iron (7);
C) Hall chip (4) vertically is installed to from top to bottom in the draw-in groove that the buckle (21) of skeleton module (2) and saddle (26) form, make the matrix side (41 of Hall chip (4), 42) with draw-in groove side (211,212) transition fit, the matrix skew back face (43 of Hall chip (4), 44) with the sharp hook portion (213 of buckle (21), 214) interference fit, the saddle (26) of buckle (21) below is close in the lower surface of Hall chip (4), along the matrix skew back face (43 perpendicular to skeleton module (2) end face direction rivet hot Hall chip (4), 44) locate, make the spur (215 of buckle (21), 216) in the vertical direction blocks Hall chip (4) after the rivet hot;
D) glue that will bond injects the detent (12) of cavity module (1), the glue plane is lower than and is installed to the plane, top (250) of cavity module (1) back positioning boss (25) close to skeleton module (2);
E) skeleton module (2) is installed in the cavity of cavity module (1), make the PIN pin (111,112,113) of PIN needle assemblies (11) insert in the strip through-hole (22) of skeleton module (2) and be exposed to skeleton module upper surface (28), and the positioning boss (25) of skeleton module (2) embeds in the detent (12) of cavity module (1);
F) mounting circuit boards, chip PIN pin (46) below that makes the PIN pin contact on the circuit board insert Hall chip (4), and the PIN pin of PIN needle assemblies (11) (111,112,113) stretches out from the PIN pin hole on the circuit board;
G) weld together with the PIN pin contact of circuit board is corresponding with the corresponding welding of PIN pin hole of PIN pin (111,112,113) with the circuit board of PIN needle assemblies (11), and with the chip PIN pin (46) of Hall chip (4);
H) settable cementitious glue links together cavity module (1) and skeleton module (2);
I) package cavity phantom piece (1) is encapsulated in the cavity module (1) skeleton module (2), circuit board and Hall chip (4).
13. the manufacturing process of modular sensor according to claim 12, it is characterized in that, the spur of described buckle (21) (215,216) in the length of vertical direction greater than the length of Hall chip (4) matrix at vertical direction, the degree of freedom of spur after the rivet hot (215,216) upper end outstanding restriction Hall chip (4) in the vertical direction in the draw-in groove.
14. the manufacturing process of modular sensor according to claim 12, it is characterized in that, in step e), PIN pin (111,112,113) with PIN needle assemblies (11) inserts in the strip through-hole (22) of skeleton module (2) earlier, mobile skeleton module (2) makes in its cavity that is pressed into cavity module (1) backward again, and positioning boss (25) embeds in the detent (12) of cavity module (1) simultaneously.
15. the manufacturing process of modular sensor according to claim 12 is characterized in that, described positioning boss (25) centre position has pointed boss, and the bottom of the tip of this pointed boss and detent (12) has the gap.
16. the manufacturing process of modular sensor according to claim 12, it is characterized in that, in step I) in, at the inwall point glue of cavity module (1) and press-fit a cover plate (8), described cover plate (8) with skeleton module (2), circuit board and Hall chip (4) enclosed package in cavity module (1) inside.
17. the manufacturing process of modular sensor according to claim 12, it is characterized in that, in step I) in, encapsulating and make its curing in the cavity between skeleton module (2) and cavity module (1), the injecting glue layer after described skeleton module (2), circuit board and Hall chip (4) are cured cover and are encapsulated in cavity module (1) inside.
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