CN209858608U - Wafer bearing table and full-automatic probe station - Google Patents
Wafer bearing table and full-automatic probe station Download PDFInfo
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- CN209858608U CN209858608U CN201920202616.5U CN201920202616U CN209858608U CN 209858608 U CN209858608 U CN 209858608U CN 201920202616 U CN201920202616 U CN 201920202616U CN 209858608 U CN209858608 U CN 209858608U
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- wafer
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- sided
- ring groove
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Abstract
The utility model discloses a wafer bearing platform. The wafer bearing platform comprises a bottom, a first supporting plate, a second supporting plate and a wafer placing part; the release part is provided with a first through hole, and a positioning ring groove is arranged along the first through hole; the positioning ring groove is connected to the bottom through a first supporting plate, the positioning ring groove is connected to the bottom through a second supporting plate, and the sheet placing part and the bottom form a testing space; the positioning fixture for fixing the double-sided wafer is fixed along the positioning ring groove, so that the double-sided wafer is fixed on the wafer bearing table, and the test probe conducts the double-sided wafer through the test space, thereby meeting the test requirement of simultaneous electrical contact on two sides of the double-sided wafer.
Description
Technical Field
The utility model relates to a wafer bearing platform and full-automatic probe platform.
Background
The double-sided wafer is a wafer with two sides respectively provided with an electrode, the problem of a wafer bearing table is solved for realizing the test of the double-sided wafer, the wafer bearing table for the conventional single-side needle test adopts the double-side needle test respectively, the double-sided wafer is placed on the conventional semiconductor test equipment, and the two sides are tested respectively, so that the test efficiency is low, and the electrical parameter condition of the double-sided crystal grain is difficult to obtain directly due to the fact that the electrical parameter is unstable because of the respective test.
SUMMERY OF THE UTILITY MODEL
In order to solve the test problem of the double-sided wafer, the utility model provides a wafer bearing platform, a full-automatic probe station, an automatic feeding method and an automatic discharging method.
The technical scheme of the utility model is that: the wafer bearing platform comprises a bottom, a first supporting plate, a second supporting plate and a wafer placing part;
the release part is provided with a first through hole, and a positioning ring groove is arranged along the first through hole; the positioning ring groove is connected to the bottom through a first supporting plate, the positioning ring groove is connected to the bottom through a second supporting plate, and the sheet placing part and the bottom form a testing space;
the positioning fixture for fixing the double-sided wafer is fixed along the positioning ring groove, so that the double-sided wafer is fixed on the wafer bearing table, and the test probe conducts the double-sided wafer through the test space, thereby meeting the test requirement of simultaneous electrical contact on two sides of the double-sided wafer.
Furthermore, the positioning ring groove is provided with a positioning bulge, the positioning fixture is provided with a positioning hole, and the positioning bulge is accommodated in the positioning hole.
Further, the bottom part also comprises a base,
a slide connection portion connected to a base plate to enable the wafer stage to move relative to the base plate;
the first support plate and the second support plate are respectively connected to the rotating connecting part, so that the sheet placing part can rotate relative to the sliding connecting part;
the rotation adjusting portion is connected to the sliding connecting portion and the rotation connecting portion at the same time, and the rotation adjusting portion adjusts the rotation connecting portion to rotate relative to the sliding connecting portion.
Further, the rotation regulating part includes,
a first driving part fixed to the sliding connection part;
the stop block is connected with the sliding connecting part in a sliding manner; the stopping block is connected to an output shaft of the first driving part, so that the first driving part drives the stopping block to move relative to the sliding connecting part;
the positioning spring is connected to the sliding connecting portion and the rotating connecting portion at the same time, so that the rotating connecting portion is abutted against the abutting block, and the rotating position of the rotating connecting portion is changed by adjusting the position of the abutting block.
Furthermore, the stop block is connected with a screw rod and is connected with the sliding connection part through a linear slide rail; the movement of the stop block along the linear slide rail is realized through the rotation of the adjusting screw rod;
the output shaft of the first driving part is connected with the screw rod through a synchronous belt, and the first driving part is controlled and connected to the screw rod of the stopping block to rotate.
Further, first rotatory cylinder that compresses tightly is installed to first backup pad, the rotatory cylinder that compresses tightly of second is installed to the second backup pad, first rotatory cylinder that compresses tightly and the rotatory cylinder that compresses tightly of second are used for being fixed in the locating fixture and put the piece portion.
A full-automatic probe station comprises the wafer bearing station and also comprises a probe head,
a substrate;
the device comprises a first support frame and a second support frame;
the mounting plate is connected to the base plate through a first support frame, and the mounting plate is connected to the base plate through a second support frame; the mounting plate is right corresponding to the substrate and is positioned above the substrate; the mounting plate is provided with a discharging hole;
a first discharging part and a second discharging part;
the first material conveying part is connected to the mounting plate in a sliding mode and can take materials from the first material placing part, and the first material conveying part can place the materials into the second material placing part;
the second material conveying part is movably connected with the base plate; the second material conveying part can penetrate through the first through hole along the testing space.
An automatic feeding method for a material to be fed,
the first material conveying part takes out the double-sided wafer from the first material placing part to reach the position corresponding to the second material placing part; the first through hole is opposite to the corresponding discharging hole; the second material transporting portion penetrates through the discharging hole through the testing space, the double-sided wafer on the first material transporting portion is jacked up, the double-sided wafer is separated from the first material transporting portion, then the discharging hole is far away from the first material transporting portion, the discharging hole and the first through hole are sequentially returned by the second material transporting portion, and the double-sided wafer is stopped against the positioning clamp.
Furthermore, the second material conveying part descends, the double-sided wafer is prevented from descending into the discharging hole by abutting against the second material conveying part under the action of gravity, the second material conveying part ascends and is far away from the discharging hole, and the second material conveying part rotates; and then the second material conveying part descends until the double-sided wafer is placed on the positioning fixture.
A method for automatically feeding materials, which comprises the following steps,
the first through hole is right corresponding to the discharging hole, and the second material conveying part is lifted to jack up the tested double-sided wafer until the double-sided wafer is far away from the discharging hole; the first material conveying part moves to enable the first material conveying part to be located between the mounting plate and the double-sided wafer, the second material conveying part descends to enable the double-sided wafer to fall into the first material conveying part, and the double-sided wafer is placed into the second material placing part by the first material conveying part.
The beneficial effects of the utility model reside in that: the wafer bearing table can meet the test requirements of double-sided wafers, has high test efficiency, can directly obtain the electrical parameters of double-sided crystal grains, and has direct and reliable test parameters.
Drawings
FIG. 1 is a schematic diagram of a fully automated probe station;
FIG. 2 is a schematic view of a stage;
FIG. 3 is a schematic view of the wafer stage for placing a double-sided wafer;
FIG. 4 is a schematic view of a positioning fixture;
fig. 5 is a bottom schematic view.
Detailed Description
In order to facilitate the understanding of the technical solutions of the present invention for those skilled in the art, the technical solutions of the present invention will be described in further detail with reference to specific embodiments.
As shown in fig. 2, 3 and 4, the sheet support platform 50 includes a bottom 51, a first support plate 521, a second support plate 522 and a sheet placing part 53;
the release part 53 is provided with a first through hole 531, and a positioning ring groove 532 is arranged along the first through hole 531; the positioning ring groove 532 is connected to the bottom part 51 through the first support plate 521, the positioning ring groove 532 is connected to the bottom part 51 through the second support plate 522, and the release part 53 and the bottom part 51 form a testing space 54; the test space 54 is formed for satisfying a needle test for the side of the double-sided wafer close to the bottom 51; the conventional part for bearing the wafer to be tested does not reserve a space for inserting a needle, so the conventional part cannot be used for testing the double-sided wafer; by adopting the wafer bearing table 50 of the utility model, the requirements of the test, the automatic feeding and the automatic discharging of the double-sided wafer can be met, and the test efficiency of the double-sided wafer is convenient to be improved;
fixing a positioning clamp A for fixing a double-sided wafer along the positioning ring groove 532, so that the double-sided wafer is fixed on the wafer bearing table 50, and conducting the double-sided wafer through the test probe through the test space 54, thereby meeting the test requirement of simultaneously electrically contacting two sides of the double-sided wafer; the positioning fixture A comprises a first clamping piece and a second clamping piece, the first clamping piece is provided with a limiting groove of a double-sided wafer, so that the edge (non-grain area) of the double-sided wafer is prevented from abutting against the limiting groove, the second clamping piece is prevented from abutting against the double-sided wafer, and the first clamping piece and the second clamping piece act together to fix the double-sided wafer.
As shown in fig. 2, 3 and 4, the positioning ring groove 532 is provided with a positioning protrusion 5321, the positioning fixture a is provided with a positioning hole a1, and the positioning protrusion 5321 is accommodated in the positioning hole a 1; therefore, the positioning clamp A is arranged at a preset position of the positioning ring groove 532 (the positioning bulge 5321 is arranged at the position matched with the positioning hole A1), the difficulty of connecting the positioning clamp A to the positioning ring groove 532 is reduced, and the production efficiency is improved.
As shown in fig. 2, 3 and 4, the bottom portion 51 further includes,
a slide connection portion 511 connected to the base plate 20 and allowing the stage 50 to move relative to the base plate 20; the wafer bearing table 50 can move relative to the substrate 20, so that the spatial position of the wafer bearing table 50 is changed, and the requirements of feeding, testing and the like on different positions of the wafer bearing table 50 are met;
a rotation connection part 512 rotatably connected to the sliding connection part 511, wherein the first support plate 521 and the second support plate 522 are respectively connected to the rotation connection part 512, so that the sheet placing part 53 can rotate relative to the sliding connection part 511;
a rotation adjusting part 513 connected to both the sliding connection part 511 and the rotation connection part 512, wherein the rotation adjusting part 513 adjusts the rotation of the rotation connection part 512 relative to the sliding connection part 511; the angle adjustment of the double-sided wafer is realized, and the test requirement is met.
As shown in fig. 2, 3, 4 and 5, the rotation regulating part 513 includes,
a first driving unit 5131 fixed to the sliding connection portion 511; the first driving part 5131 is a motor;
a stopping block 5132 slidably connected to the sliding connection portion 511; the stop block 5132 is connected to an output shaft of the first driving portion 5131, so that the first driving portion 5131 drives the stop block 5132 to move relative to the sliding connection portion 511;
the positioning spring 5133 is connected to the sliding connection part 511 and the rotating connection part 512 at the same time, so that the rotating connection part 512 is stopped against the stopping block 5132, and the rotating position of the rotating connection part 512 is changed by adjusting the position of the stopping block 5132; the angle of the double-sided wafer is adjusted by the rotation adjustment of the rotation connecting portion 512 by the first driving portion 5131.
As shown in fig. 2, 3, 4 and 5, the stopping block 5132 is connected to a screw rod and is connected to the sliding connection portion 511 through a linear slide rail; the movement of the stopping block 5132 along the linear sliding rail is realized by the rotation of the adjusting screw rod;
the output shaft of the first driving portion 5131 is connected with the screw rod through a synchronous belt, so that the first driving portion 5131 is controlled to be connected with the screw rod of the stopping block 5132 to rotate, and the linear motion of the stopping block 5132 is controlled through the screw rod and the linear slide rail.
As shown in fig. 2, 3, 4 and 5, the first support plate 521 is mounted with a first rotary pressing cylinder 5211, the second support plate 522 is mounted with a second rotary pressing cylinder 5221, and the first rotary pressing cylinder 5211 and the second rotary pressing cylinder 5221 are used for fixing the positioning jig a to the release portion 53; the rotary pressing cylinder (comprising the first rotary pressing cylinder 5211 and the second rotary pressing cylinder 5221) has the advantages that the axial feeding is realized, meanwhile, the rotation can be realized along the axial direction perpendicular to the axial direction, the use function is realized, the positioning clamp A is pressed and fixed on the sheet placing part 53, the stable fixation of the double-sided wafer on the sheet placing part 53 is ensured, the structure is simple, and the use is convenient.
As shown in fig. 1, 2, 3, 4 and 5, a fully automatic probe station 100 includes the wafer stage 50, the fully automatic probe station 100 further includes,
a substrate 20;
a first support frame 31 and a second support frame 32; for supporting the mounting plate 40;
the mounting plate 40 is connected to the substrate 20 through a first support 31, and the mounting plate 40 is connected to the substrate 20 through a second support 32; the mounting plate 40 is opposite to the substrate 20, the mounting plate 40 is positioned above the substrate 20, and the mounting plate 40 is horizontally arranged to ensure the levelness of the double-sided wafer, so that the test is convenient; the mounting plate 40 is provided with a discharging hole 41, the discharging hole 41 is used for enabling a double-sided wafer to enter the wafer bearing table 50 or taking out the double-sided wafer from the wafer bearing table 50, the discharging hole 41 has guiding and deviation adjusting functions, so that the double-sided wafer is placed into the wafer bearing table 50 along the vertical direction, the circle center of the double-sided wafer is overlapped with the preset circle center position of the wafer bearing table 50, the rotation adjustment of the double-sided wafer is conveniently realized along the preset circle center of the wafer bearing table 50, and the adjustment difficulty is reduced;
a first discharging part 61 and a second discharging part 62; the first material placing part 61 is a material feeding rack, and the second material placing part 62 is a rack for receiving the tested double-sided wafer, so that the full-automatic operation of testing the double-sided wafer is realized, and the structure is convenient and reliable;
the first material conveying part 70 is connected to the mounting plate 40 in a sliding manner, the first material conveying part 70 can take materials from the first material placing part 61, and the first material conveying part 70 can place the materials into the second material placing part 62; the first material conveying part 70 comprises
The second material conveying part 80 is movably connected with the base plate 20; the second material transporting part 80 can pass through the first through hole 531 along the testing space 54, the damage caused by the double-sided wafer falling freely from the material discharging hole 41 is prevented by the second material transporting part 80, and meanwhile, the double-sided wafer falling freely may not fall into the placing position due to a certain distance between the material discharging hole 41 and the wafer bearing table 50, so that the testing is influenced; the second material conveying part 80 ensures that the descending speed of the double-sided wafer cannot cause damage, and meanwhile, the double-sided wafer can be smoothly placed in a preset placing position.
As shown in fig. 1, 2, 3, 4 and 5, an automatic feeding method,
the first material conveying part 70 takes out the double-sided wafer from the first material placing part 61 to reach the second material placing part 62; the first through hole 531 is opposite to the corresponding discharging hole 41; the second material conveying part 80 penetrates through the discharging hole 41 through the testing space 54, the double-sided wafer on the first material conveying part 70 is jacked up, the double-sided wafer is separated from the first material conveying part 70, then the first material conveying part 61 is far away from the discharging hole 41, the second material conveying part 80 returns to the discharging hole 41 and the first through hole 531 in sequence, and the double-sided wafer is stopped against the positioning clamp A; guarantee two-sided wafer can just put into preset position, also can not damage because of two-sided wafer freely drops, convenient to use is reliable.
As shown in fig. 1, fig. 2, fig. 3, fig. 4 and fig. 5, the second material conveying part 80 descends, the double-sided wafer is prevented from descending into the material discharging hole 41 by the second material conveying part 80 under the action of gravity, the second material conveying part 80 ascends and is far away from the material discharging hole 41, and the second material conveying part 80 rotates; then the second material conveying part 80 descends until the double-sided wafer is placed on the positioning clamp A; the double-sided wafer is aligned with the rotation center through the discharging hole 41, and the angle adjustment of the double-sided wafer is realized.
As shown in fig. 1, 2, 3, 4 and 5, in an automatic blanking method, a first through hole 531 is opposite to a corresponding blanking hole 41, and a second material conveying part 80 is lifted up to jack up a tested double-sided wafer until the double-sided wafer is far away from the blanking hole 41; the first material conveying part 70 moves to enable the first material conveying part 70 to be positioned between the mounting plate 40 and the double-sided wafer, the second material conveying part 80 descends to enable the double-sided wafer to fall on the first material conveying part 70, and the first material conveying part 70 puts the double-sided wafer into the second material placing part 62; the double-sided wafer after the test is finished is automatically taken, so that the test efficiency is improved conveniently; the automatic blanking method can be combined with the automatic feeding method, so that the full-automatic test of the double-sided wafer is realized.
The above is the preferred embodiment of the present invention, and is not used to limit the protection scope of the present invention. It should be recognized that non-inventive variations and modifications to the disclosed embodiments, as understood by those skilled in the art, are intended to be included within the scope of the present invention as claimed and claimed.
Claims (6)
1. A stage (50), characterized by: the sheet bearing platform (50) comprises a bottom (51), a first supporting plate (521), a second supporting plate (522) and a sheet placing part (53);
the release part (53) is provided with a first through hole (531), and a positioning ring groove (532) is arranged along the first through hole (531); the positioning ring groove (532) is connected to the bottom (51) through a first support plate (521), the positioning ring groove (532) is connected to the bottom (51) through a second support plate (522), and the release part (53) and the bottom (51) form a test space (54);
the positioning fixture (A) for fixing the double-sided wafer is fixed along the positioning ring groove (532), so that the double-sided wafer is fixed on the wafer bearing table (50), and the test probe conducts the double-sided wafer through the test space (54), thereby meeting the test requirement of simultaneous electrical contact on two sides of the double-sided wafer.
2. The stage (50) of claim 1, wherein: the locating ring groove (532) is provided with locating protrusion (5321), positioning fixture (A) is provided with locating hole (A1), locating protrusion (5321) hold in locating hole (A1).
3. The stage (50) of claim 1, wherein: said bottom part (51) further comprising,
a slide connection part (511) which is connected to a base plate (20) and enables the wafer bearing table (50) to move relative to the base plate (20);
a rotation connecting portion (512) rotatably connected to the slide connecting portion (511), the first support plate (521) and the second support plate (522) being respectively connected to the rotation connecting portion (512) so that the release portion (53) can rotate relative to the slide connecting portion (511);
and a rotation adjusting part (513) connected to both the sliding connection part (511) and the rotation connection part (512), wherein the rotation adjusting part (513) adjusts the rotation of the rotation connection part (512) relative to the sliding connection part (511).
4. The stage (50) of claim 3, wherein: the rotation adjusting part (513) comprises,
a first drive unit (5131) fixed to the slide connection unit (511);
a stop block (5132) which is connected with the sliding connection part (511) in a sliding way; the stop block (5132) is connected to an output shaft of the first driving part (5131), so that the first driving part (5131) drives the stop block (5132) to move relative to the sliding connecting part (511);
and the positioning spring (5133) is simultaneously connected with the sliding connecting part (511) and the rotating connecting part (512) to enable the rotating connecting part (512) to stop against the stop block (5132), so that the rotating position of the rotating connecting part (512) is changed by adjusting the position of the stop block (5132).
5. The stage (50) of claim 4, wherein: the stop block (5132) is connected with a screw rod and is connected with the sliding connecting part (511) through a linear slide rail; the movement of the stopping block (5132) along the linear sliding rail is realized through the rotation of the adjusting screw rod;
an output shaft of the first driving part (5131) is connected with a screw rod through a synchronous belt, so that the first driving part (5131) controls the screw rod connected to the stopping block (5132) to rotate.
6. The stage (50) of claim 1, wherein: first rotatory cylinder (5211) that compresses tightly is installed to first backup pad (521), second rotatory cylinder (5221) that compresses tightly is installed to second backup pad (522), first rotatory cylinder (5211) that compresses tightly and second rotatory cylinder (5221) that compress tightly are used for being fixed in the locating fixture (A) and put piece portion (53).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920202616.5U CN209858608U (en) | 2019-02-16 | 2019-02-16 | Wafer bearing table and full-automatic probe station |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920202616.5U CN209858608U (en) | 2019-02-16 | 2019-02-16 | Wafer bearing table and full-automatic probe station |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209858608U true CN209858608U (en) | 2019-12-27 |
Family
ID=68931947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920202616.5U Active CN209858608U (en) | 2019-02-16 | 2019-02-16 | Wafer bearing table and full-automatic probe station |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209858608U (en) |
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2019
- 2019-02-16 CN CN201920202616.5U patent/CN209858608U/en active Active
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Address after: 518172 Longgang District, Shenzhen City, Guangdong Province Patentee after: Silicon electric semiconductor equipment (Shenzhen) Co., Ltd Address before: 518172 Longgang District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN SIDEA SEMICONDUCTOR EQUIPMENT Co.,Ltd. |