CN209858486U - Tile-shaped composite wafer longitudinal wave angle probe with small blind area and high signal-to-noise ratio for welding seam of austenitic thin-walled tube - Google Patents
Tile-shaped composite wafer longitudinal wave angle probe with small blind area and high signal-to-noise ratio for welding seam of austenitic thin-walled tube Download PDFInfo
- Publication number
- CN209858486U CN209858486U CN201920166159.9U CN201920166159U CN209858486U CN 209858486 U CN209858486 U CN 209858486U CN 201920166159 U CN201920166159 U CN 201920166159U CN 209858486 U CN209858486 U CN 209858486U
- Authority
- CN
- China
- Prior art keywords
- tile
- wafer
- shaped piezoelectric
- longitudinal wave
- shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model discloses a tile-shaped composite wafer longitudinal wave angle probe with small blind area and high signal-to-noise ratio of an austenite thin-wall pipe welding seam, wherein the upper surface of a tile-shaped piezoelectric wafer is plated with an upper electrode layer, the lower surface of the tile-shaped piezoelectric wafer is plated with a lower electrode layer, the tile-shaped piezoelectric wafer and a matching layer material are adhered together, the tile-shaped piezoelectric wafer with the matching layer material is put into a mould and heated at the temperature of an oven to be bent into the same radian as that of a wedge block, and is solidified and formed, the tile-shaped piezoelectric wafer with the matching layer material is adhered to the cambered surface of the wedge block, an upper electrode lead is welded on the upper electrode surface of the tile-shaped piezoelectric wafer, a lower electrode lead is welded on the lower electrode surface of the tile-shaped piezoelectric wafer, the upper electrode lead and the lower electrode lead are connected with an electrical module, the utility model discloses a tile-shaped piezoelectric composite wafer realizes the ultrasonic, and the detection signal-to-noise ratio is improved.
Description
The technical field is as follows:
the utility model relates to a compound wafer longitudinal wave oblique probe of tile form of little blind area high SNR of austenite thin wall pipe welding seam belongs to ultrasonic nondestructive test technical field.
Background art:
the austenitic steel pipe has important application value in industries such as industrial petrochemical industry, thermal power generation, nuclear power and the like due to good mechanical and service properties, but because the grains in the austenite are thick, tree-shaped grains are more easily formed after welding, and the detection of the austenitic weld joint is difficult. The dendritic crystal grains formed by the austenitic weld joint can attenuate ultrasonic transverse waves and bend sound beams, so that the detection sensitivity and the signal-to-noise ratio of the ultrasonic transverse waves are insufficient, and the positioning can also be greatly deviated. Transverse waves have proved to be incapable of detecting austenitic welds, so longitudinal wave oblique probes are selected for detecting austenitic welds in the market, and the penetrating power of longitudinal waves is utilized.
The oblique probe is a probe with ultrasonic oblique incidence, and can detect defects in the welding seam from two sides of the welding seam through oblique incidence to the welding seam. The oblique incidence is generated by the wedge, and due to the difference of acoustic impedance between the wedge and the austenitic steel, the sound wave is refracted when passing through the wedge, and forms a refracted transverse wave and a refracted longitudinal wave. The longitudinal wave angle probe is more difficult to design than the transverse wave angle probe, and is mainly designed for the initial wave and the front edge. The sound wave emitted by the probe can be reflected and refracted at the interface (acoustic interface) between the wedge block and the detection workpiece, the refraction angle is related to the incidence angle and the sound velocity at two sides of the interface, and the law follows the well-known Snell law:
where the index i represents the incident medium, the index t represents the refractive medium, and c represents the speed of sound in the medium.
Because the acoustic velocity of the refracted longitudinal wave is larger than that of the refracted transverse wave, the refracted longitudinal wave with the same angle is generated according to the Fresnel law, and the required incident wave angle is smaller. This results in an increase in the initial wave and an increase in the dead zone of the longitudinal wave angle probe. When the incident wave angle is smaller, the angle between the wafer and the wedge is also smaller, and at this time, the ultrasonic wave transmitted by the wafer is reflected by the wedge and enters the wafer more easily and is received by an instrument, so that the initial wave is increased, the near-surface defect cannot be distinguished, and the blind area of probe detection is increased. If the wafer is tile-shaped, the acoustic beam has a convergence effect, waves reflected by the wedge block to enter the wafer are reduced, so that dead zones are reduced, and on the other hand, the focusing of the wafer also enables the ultrasonic energy to converge, so that the signal-to-noise ratio is increased when the austenitic weld joint is detected, and the detection quality is improved.
SUMMERY OF THE UTILITY MODEL
To the above problem, the to-be-solved technical problem of the utility model is to provide a tile form composite wafer longitudinal wave oblique probe of little blind area high signal to noise ratio of austenite thin wall pipe welding seam, through piezoelectricity composite wafer tile form, realize the effect of ultrasonic convergence to reduce the blind area in austenite thin wall pipe testing process, improve the detection signal to noise ratio.
The utility model discloses a tile-shaped composite wafer longitudinal wave angle probe of little blind area high SNR of austenite thin wall pipe welding seam, tile-shaped composite wafer longitudinal wave angle probe's structure from last to containing six parts of electricity module, lead wire, backing material, tile-shaped piezoelectric wafer, matching layer material, voussoir down, the upper surface of tile-shaped piezoelectric wafer plated last electrode layer, the lower surface of tile-shaped piezoelectric wafer has plated the bottom electrode layer, tile-shaped piezoelectric wafer and matching layer material bond together, tile-shaped piezoelectric wafer with matching layer material put into the mould and heat at oven temperature and make its radian the same with the voussoir in it to solidification shaping, tile-shaped piezoelectric wafer with matching layer material bond to the cambered surface of voussoir on, get rid of the air between tile-shaped piezoelectric wafer and the voussoir, last electrode surface welding of tile-shaped piezoelectric wafer go up electrode lead wire, and a lower electrode lead is welded on the surface of the lower electrode of the tile-shaped piezoelectric wafer, and the upper electrode lead and the lower electrode lead are connected with the electrical module.
Further, the tile-shaped piezoelectric wafer and the matching layer material are fixedly bonded into a whole through glue, the tile-shaped piezoelectric wafer and the matching layer material are die-cast into the tile-shaped piezoelectric wafer with a certain radian of the matching layer material in an oven through a die, signal lines are led out from the positive electrode and the negative electrode of the tile-shaped piezoelectric wafer and are connected into an electrical module, the back surface of the tile-shaped piezoelectric wafer is introduced with a prepared backing material, the back surface of the tile-shaped piezoelectric wafer is cured and formed in the oven after the backing material is introduced into the back surface of the tile-shaped piezoelectric wafer, then a wedge block with a corresponding convex radian is prepared, a probe is cured on the wedge block through epoxy, and finally the wedge block is sealed in a stainless steel.
Further, the matching layer material can be prepared by adopting polymers and fillers according to different filling ratios.
Furthermore, the tile-shaped piezoelectric wafer is made of piezoelectric ceramic and epoxy composite material.
Furthermore, the backing material is a composite material with high acoustic impedance and high acoustic attenuation and containing air holes, for example, tungsten powder with high filling ratio is filled in epoxy resin to prepare the backing, and modification treatment is carried out to improve the acoustic attenuation coefficient and properly increase the flexibility of the base material, namely, polysulfide rubber is added to realize the purpose.
Further, the wedge block is processed by machine glass material, and can also be resin material such as polystyrene and polyimide.
Furthermore, the upper electrode lead and the lower electrode lead are high-shielding single-core coaxial cables.
Furthermore, a cambered surface is processed on the wedge block, a saw-tooth-shaped sound trap is processed on the wedge block, and sound absorption materials are filled in the sound trap and are used for absorbing noise waves.
Further, the tile-shaped piezoelectric wafer for welding the upper electrode lead and the lower electrode lead is arranged in a lining sleeve copper tube, the backing material is poured into the lining sleeve copper tube and is cured and formed into a backing at 45 ℃ in an oven, the tile-shaped composite wafer longitudinal wave oblique probe is packaged in a shell, the upper electrode lead and the lower electrode lead are connected into a coaxial cable, and a wire protection sleeve is arranged on the coaxial cable.
The utility model has the advantages that: the utility model discloses a piezoelectricity combined material wafer tile form realizes the supersound effect of converging to reduce the blind area in austenite thin wall pipe testing process, improve the detection signal to noise ratio.
Drawings
For ease of illustration, the invention is described in detail by the following detailed description and accompanying drawings.
FIG. 1 is a front sectional view of the present invention;
fig. 2 is a perspective view of the wedge of the present invention.
In the figure: 1-1 wedge block; 1-2 acoustic trap; 1-3 matching layer materials; 1-4 tile-shaped piezoelectric wafer lower electrode layers; 1-5 tile piezoelectric wafers; 1-6 upper electrode layers; 1-7 backing material; 1-8 lower electrode leads; 1-9 coaxial cables; 1-10 wire sheath; 1-11 upper electrode leads; 1-12 electrical modules; 1-3 inner bushing copper pipe; 1-14 shells.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described below with reference to specific embodiments shown in the accompanying drawings. It should be understood that the description is intended to be illustrative only and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.
As shown in figures 1 and 2, the structure of the tile-shaped composite wafer longitudinal wave angle probe with small blind area and high signal-to-noise ratio of an austenite thin-wall tube welding seam is that the tile-shaped composite wafer longitudinal wave angle probe comprises, from top to bottom, an electrical module 1-12, a backing material 1-7, a tile-shaped piezoelectric wafer 1-5, a matching layer material 1-3 and a wedge block 1-1, wherein the upper surface of the tile-shaped piezoelectric wafer 1-5 is plated with an upper electrode layer 1-6, the lower surface of the tile-shaped piezoelectric wafer 1-5 is plated with a lower electrode layer 1-4, the tile-shaped piezoelectric wafer 1-5 and the matching layer material 1-3 are bonded together, the tile-shaped piezoelectric wafer 1-5 with the matching layer material 1-3 is placed in a mold and heated at the oven temperature to bend the tile-shaped composite wafer into the same radian as the wedge block 1, and curing and molding, wherein the tile-shaped piezoelectric wafer 1-5 with the matching layer material 1-3 is adhered to the arc surface of the wedge block 1-1, air between the tile-shaped piezoelectric wafer 1-5 and the wedge block 1-1 is eliminated, an upper electrode lead 1-11 is welded on an upper electrode layer 1-6 of the tile-shaped piezoelectric wafer 1-5, a lower electrode lead 1-8 is welded on a lower electrode layer 1-4 of the tile-shaped piezoelectric wafer 1-5, and the upper electrode lead 1-11 and the lower electrode lead 1-8 are connected with an electrical module 1-12.
Specifically, the tile-shaped piezoelectric wafers 1-4 and the matching layer materials 1-3 are fixedly bonded into a whole through glue, the tile-shaped piezoelectric wafers 1-4 and the matching layer materials 1-3 are die-cast into a certain radian with the matching layer materials 1-3 in an oven through a die, the prepared backing materials 1-7 are introduced into the back surfaces of the tile-shaped piezoelectric wafers 1-4, the backing materials 1-7 are introduced into the back surfaces of the tile-shaped piezoelectric wafers 1-4 and then cured and formed in the oven, then corresponding wedge blocks 1-1 with convex radians are prepared, probes are cured on the wedge blocks through epoxy, finally the probes are sealed in a stainless steel shell through potting adhesive, the matching layer materials 1-3 can be prepared by adopting polymers and fillers according to different filling ratios, the tile-shaped piezoelectric wafers 1-4 are piezoelectric ceramics and epoxy composite materials, the backing material 1-7 is a composite material with high acoustic impedance and high acoustic attenuation containing air holes, for example, tungsten powder with high filling ratio is filled in epoxy resin to prepare a backing, in order to improve the acoustic attenuation coefficient and properly increase the flexibility of a base material, namely, modification treatment is carried out, a polysulfide rubber is added to realize the modification treatment, the wedge block 1-1 is processed by a machine glass material, the upper electrode lead 1-11 and the lower electrode lead 1-8 are single-core coaxial cables with high shielding performance, a cambered surface is processed on the wedge block 1-1, a saw-tooth-shaped acoustic trap 1-2 is processed on the wedge block, sound absorption materials are filled in the acoustic trap and used for absorbing noise, the tile-shaped piezoelectric wafers 1-4 for welding the upper electrode lead 1-8 and the lower electrode lead 1-11 are filled in an inner lining copper pipe 1-13, the backing material is poured into the copper pipe 1-13 of the inner bushing, the backing material is cured and formed into a backing 1-7 in an oven at 45 ℃, the tile-shaped composite wafer longitudinal wave angle probe is encapsulated in a shell 1-14, the upper electrode lead and the lower electrode lead are connected into a coaxial cable 1-9, and a wire protection sleeve 1-10 is arranged on the coaxial cable 1-9.
The basic principles and main features of the present invention, the advantages of the present invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (9)
1. A tile-shaped composite wafer longitudinal wave angle probe with small blind area and high signal-to-noise ratio of an austenitic thin-wall tube weld joint is characterized in that the tile-shaped composite wafer longitudinal wave angle probe structurally comprises an electrical module, a lead, a backing material, a tile-shaped piezoelectric wafer, a matching layer material and a wedge block from top to bottom, an upper electrode layer is plated on the upper surface of the tile-shaped piezoelectric wafer, a lower electrode layer is plated on the lower surface of the tile-shaped piezoelectric wafer, the tile-shaped piezoelectric wafer and the matching layer material are bonded together, the tile-shaped piezoelectric wafer with the matching layer material is placed in a die and heated in an oven at the temperature to be bent into the same radian as the wedge block and is solidified and molded, the tile-shaped piezoelectric wafer with the matching layer material is bonded to the cambered surface of the wedge block, an upper electrode lead is welded on the surface of the tile-shaped piezoelectric wafer, a lower electrode lead is welded on the surface of the lower, the upper electrode lead and the lower electrode lead are connected with the electrical module.
2. The tile-shaped composite wafer longitudinal wave angle probe with small blind area and high signal-to-noise ratio for the weld seam of the austenitic thin-walled tube according to claim 1, characterized in that: the tile-shaped piezoelectric wafer and the matching layer material are fixedly bonded into a whole through glue, and a backing material is introduced into the back surface of the tile-shaped piezoelectric wafer.
3. The tile-shaped composite wafer longitudinal wave angle probe with small blind area and high signal-to-noise ratio for the weld seam of the austenitic thin-walled tube according to claim 1, characterized in that: the matching layer material can be prepared by adopting polymers and fillers according to different filling ratios.
4. The tile-shaped composite wafer longitudinal wave angle probe with small blind area and high signal-to-noise ratio for the weld seam of the austenitic thin-walled tube according to claim 1, characterized in that: the tile-shaped piezoelectric wafer is made of piezoelectric ceramic and epoxy composite material.
5. The tile-shaped composite wafer longitudinal wave angle probe with small blind area and high signal-to-noise ratio for the weld seam of the austenitic thin-walled tube according to claim 1, characterized in that: the backing material is a composite material with high acoustic impedance and high acoustic attenuation and containing air holes.
6. The tile-shaped composite wafer longitudinal wave angle probe with small blind area and high signal-to-noise ratio for the weld seam of the austenitic thin-walled tube according to claim 1, characterized in that: the wedge block is processed by machine glass materials.
7. The tile-shaped composite wafer longitudinal wave angle probe with small blind area and high signal-to-noise ratio for the weld seam of the austenitic thin-walled tube according to claim 1, characterized in that: the upper electrode lead and the lower electrode lead are high-shielding single-core coaxial cables.
8. The tile-shaped composite wafer longitudinal wave angle probe with small blind area and high signal-to-noise ratio for the weld seam of the austenitic thin-walled tube according to claim 1, characterized in that: the wedge block is provided with a cambered surface, and the wedge block is provided with a saw-tooth sound trap.
9. The tile-shaped composite wafer longitudinal wave angle probe with small blind area and high signal-to-noise ratio for the weld seam of the austenitic thin-walled tube according to claim 1, characterized in that: the tile-shaped piezoelectric wafer for welding the upper electrode lead and the lower electrode lead is arranged in the lining sleeve copper tube, the backing material is poured into the lining sleeve copper tube, the tile-shaped composite wafer longitudinal wave angle probe is encapsulated in the shell, the upper electrode lead and the lower electrode lead are connected to a coaxial cable, and a wire protecting sleeve is arranged on the coaxial cable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920166159.9U CN209858486U (en) | 2019-01-30 | 2019-01-30 | Tile-shaped composite wafer longitudinal wave angle probe with small blind area and high signal-to-noise ratio for welding seam of austenitic thin-walled tube |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920166159.9U CN209858486U (en) | 2019-01-30 | 2019-01-30 | Tile-shaped composite wafer longitudinal wave angle probe with small blind area and high signal-to-noise ratio for welding seam of austenitic thin-walled tube |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209858486U true CN209858486U (en) | 2019-12-27 |
Family
ID=68931287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920166159.9U Active CN209858486U (en) | 2019-01-30 | 2019-01-30 | Tile-shaped composite wafer longitudinal wave angle probe with small blind area and high signal-to-noise ratio for welding seam of austenitic thin-walled tube |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209858486U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112098516A (en) * | 2020-09-29 | 2020-12-18 | 国家电网有限公司 | Sensor for ultrasonic detection and signal processing method thereof |
-
2019
- 2019-01-30 CN CN201920166159.9U patent/CN209858486U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112098516A (en) * | 2020-09-29 | 2020-12-18 | 国家电网有限公司 | Sensor for ultrasonic detection and signal processing method thereof |
| CN112098516B (en) * | 2020-09-29 | 2022-10-04 | 国家电网有限公司 | Sensor for ultrasonic detection and signal processing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11156587B2 (en) | Flexible sensor with piezoelectric array applied for weld defect detection based on feature guided waves and its testing method | |
| CN209878680U (en) | Self-focusing water immersion probe of composite material wafer for ultrasonic automatic detection of convex-arc-surface workpiece | |
| US4366713A (en) | Ultrasonic bond testing of semiconductor devices | |
| CN202141698U (en) | Curved face line focusing probe device for circumferential ultrasonic detection of thick-wall cylindrical parts | |
| CN209858486U (en) | Tile-shaped composite wafer longitudinal wave angle probe with small blind area and high signal-to-noise ratio for welding seam of austenitic thin-walled tube | |
| KR20110110302A (en) | Ultrasonic probe | |
| US4430593A (en) | Acoustic transducer | |
| CN102507738A (en) | Ultrasonic microscopic detection method for electronic package internal delamination defect | |
| CN210690492U (en) | 1.8MHz double-matrix phase control probe for austenite coarse-grain weld joint detection | |
| GB2450238A (en) | Acoustic waveguides | |
| CN202533413U (en) | Bimorph straight probe for detecting incomplete penetration width in weld of T-shaped joint | |
| CN109932425B (en) | Method and device for comparing bonding strength of laminated chips | |
| JP3457845B2 (en) | High temperature ultrasonic probe and method of mounting the same | |
| CN209927784U (en) | Fillet weld ultrasonic testing is with taking water pocket reinforcing coupling type 2D matrix probe | |
| CN212433069U (en) | Ultrasonic phased array probe and electric fusion welding joint detection system | |
| CN209927782U (en) | 64-signal-source 5MHz flexible bendable ultrasonic phased array probe for detecting complex curved surface workpiece | |
| CN104280460A (en) | Ultrasonic water logging detection method of composite material | |
| CN106198756B (en) | A kind of through gas baseline focus Air Coupling sensor of coaxial double cambered surfaces | |
| CN216771608U (en) | Focusing piezoelectric ceramic acoustic emission source and contact type A-type ultrasonic focusing probe | |
| CN102818621B (en) | Non-contact collecting probe | |
| CN112285202A (en) | Variable-curvature PBX surface crack oriented nondestructive testing method and sensor | |
| CN214374519U (en) | Fine sound beam ultrasonic probe | |
| JP2010223608A (en) | Method for inspecting corrosion-proof coating | |
| CN105944947B (en) | A kind of non-through type gas baseline focus Air Coupling sensor of coaxial double cambered surfaces | |
| CN206057254U (en) | A kind of ultrasonic reflectoscope detection probe |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |