CN102507738A - Ultrasonic microscopic detection method for electronic package internal delamination defect - Google Patents
Ultrasonic microscopic detection method for electronic package internal delamination defect Download PDFInfo
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- CN102507738A CN102507738A CN2011103090453A CN201110309045A CN102507738A CN 102507738 A CN102507738 A CN 102507738A CN 2011103090453 A CN2011103090453 A CN 2011103090453A CN 201110309045 A CN201110309045 A CN 201110309045A CN 102507738 A CN102507738 A CN 102507738A
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Abstract
The invention aims to provide an ultrasonic microscopic detection method, for detecting a delamination defect inside an electronic package, and solving the problem that the defect can not be detected out due to ambient temperature/humidity change, thermal cycle and electromagnetic and stress field action during the operation of the electronic package. The method comprises providing an ultrasonic microscopic detection device designed for electronic package structure detection; horizontally placing the electronic package in the water tank of a scanning inspection motion control system and fully immersing in water; allowing ultrasonic wave beams to be incident in such a way that the beams are vertical to the electronic package surface, and allowing the ultrasonic transducer to receive the reflected return wave from the electronic package internal part to obtain an image of a layer (structure) between different media inside the package; and observing the images of layers (structure) at different depths inside the electronic package, and determining whether there exists a delamination defect.
Description
One, technical field
The invention belongs to technical field of nondestructive testing, be specifically related to electronic package material and ultrasound examination, is a kind of method that is used to observe Electronic Packaging interior laminate layer structure (defective) micro-image.
Two, background technology
Ultrasonic micro measurement method is a kind of Dynamic Non-Destruction Measurement that can observe the interior of articles fine structure; It utilizes high-frequency ultrasonic and testee to interact; Can obtain the acoustic picture of sub-micron grade, all be widely used in the field in many ways in electronic information, Aero-Space, industrial machinery and biomedicine etc.
Electron package structure is the supporter of electron devices such as large scale integrated chip (LSI chip), electric function element, connecting line; It is the polynary complex structure of a kind of stratiform; It not only plays a part to lay, fix, seal, protect chip and increased thermal conductivity ability, still links up the bridge of chip internal and external circuit.
The electronic packing body great majority are layer structures, for example between capsulation material and the cementing agent, have formed a plurality of bonding interfaces between chip and the chip carrier, between chip and the cementing agent etc.In the electron device package process, because the uncontrollable of material and technological factor can produce microdefect, for example layering, micro-crack, cavity etc., wherein lamination defect is a modal defective in these defectives.In the process, the interface that forms between different materials can produce thermal stress because thermal expansivity is different, in case interfacial stress reaches critical value under arms; The interface debonding cracking will take place; Cause the multiple inefficacy of encapsulation, integrality descends, and finally causes the electron device performance failure.Therefore, the detection to the Electronic Packaging lamination defect has important practical significance.
Chinese patent 101762762A has provided a kind of method that electrical property comparison table and actual electrically value detect encapsulating structure circuit node off position that contrasts, and this method can only be directed against aspect of circuit structure, and whether detect its electricity operation characteristic complete; Chinese patent 101493319A provides a kind of method of utilizing X ray to detect packaged chip; Can detect whether metal connecting line exists distortion between encapsulation chips and the encapsulating lead; But the method only is confined to detection chip metal-layer structure (defective); Can not detected electrons encapsulate the structure (defective) between each layer different materials, and not provide accuracy of detection, can only be as the foundation that qualitatively judges.
Ultrasonic micro measurement method uses frequency range to be 20MHz---the ultrasound wave of 300MHz, the imaging observation and the decision problem that can under micro-degree, solve Electronic Packaging interior laminate layer structure.Because frequency of ultrasonic is high more; Resolution is high more; But penetration capacity is just poor more, and it is also just serious more to inject the scattering effect that causes behind the object, cause thus producing image blurring even can't obtain AP; Need material and thickness when therefore detecting, the transducer of choose reasonable corresponding frequencies according to Electronic Packaging.Through calculating the variation that each frequency transducer ultrasonic waves transmitted takes place in the tested Electronic Packaging rear focal point of incident position; Can effectively adjust the relative position of transducer and tested Electronic Packaging, electron gain encapsulation inner the optimization image of interested certain depth aspect.
Three, summary of the invention
The object of the invention provides a kind of ultrasonic micro measurement method; Be used for the inner lamination defect of detected electrons encapsulation, the problem that the defective that the solution Electronic Packaging in use causes owing to environment temperature and humidity variation, thermal cycle, electromagnetism and stress field effect can't detect.
Desire to achieve the above object, Electronic Packaging lamination defect detection method of the present invention may further comprise the steps: step 1: ultrasonic micro measurement motion control and data processing equipment to the electron package structure detection design are provided.Step 2: level electronic package is put into the tank of scanning kinetic control system, and be immersed in the water fully.Step 3: the incident of the vertical electronics package surface of ultrasonic beam, ultrasonic transducer receive and come from the inner reflection echo of Electronic Packaging, obtain level (structure) image between the inner different medium of encapsulation.Step 4: observe level (structure) image of the inner different depth of Electronic Packaging, judge whether to exist lamination defect.
Four, description of drawings
The Theoretical Calculation synoptic diagram that Fig. 1 ultrasound wave incident electron encapsulation back focal length changes
Fig. 2 utilizes ultrasonic microscopic method detected electrons encapsulation interior laminate layer structural representation
Five, embodiment
Thickness according to Electronic Packaging is selected corresponding ultrasonic transducer with the resolution that detects requirement; Ultrasonic waves transmitted can the tested Electronic Packaging of vertical incidence in order to make; High-frequency ultrasonic transducer's vertical ground is installed on the described ultrasonic micro measurement device of step 1, and all ultrasonic transducers that can be used for changing are water immersion focusing formula transducer.Level electronic package is placed in the described tank of step 2, and the water in the tank is oxygen-free water.As shown in Figure 2, the detection method each several part comprises: tank and water 1, tested Electronic Packaging 2, high-frequency ultrasonic transducer 3, ultrasonic micro measurement motion control and data processing equipment 4
Being used to calculate acoustic beam, to incide Electronic Packaging inside following because of refraction produces the formula that focal length changes:
As shown in Figure 1, wherein d is a transducer diameter, and F is the transducer focal length, and SP ' is focal length in the object of refraction back, and SP is an aclastic theoretical focal length behind the sound wave entering object.
Obtain SP according to formula and can adjust the vertical range of transducer, obtain the optimization image of the inner aspect interested of Electronic Packaging to Electronic Packaging.
For example, the frequency that calculates according to above-mentioned formula is that the variable in distance of 20MHz and 100MHz ultrasonic transducer acoustic beam incident electron encapsulation back focus is as shown in the table:
Attach: routine transducer brand PANAMETRICS, velocity of sound c in the water
1=1480m/s, electronic package material (epoxy resin) velocity of sound c
2=2540m/s
Adjust the vertical range of transducer and Electronic Packaging, the beginning scanning is also extracted echo data information, thereby obtains the Electronic Packaging image of internal structure, judges whether to exist lamination defect.
Claims (9)
1. the ultrasonic micro measurement method of Electronic Packaging interior laminate layer defective, said Electronic Packaging is used plastic package, and range of application is commercial or industrial.Utilize ultrasonic beam irradiation Electronic Packaging surface (or back side), form image, detect the lamination defect between the inner different medium of encapsulation, it is characterized in that following each step according to ultrasound echo signal:
Step 1: ultrasonic micro measurement motion control and data processing equipment to the electron package structure detection design are provided, and device comprises that high-frequency ultrasonic transducer, high-speed data acquisition card, scanning kinetic control system, signal characteristic extract and image processing system.
Step 2: level electronic package is put into the tank of the said scanning kinetic control system of step 1, and be immersed in the water fully.
Step 3: the incident of the vertical electronics package surface of ultrasonic beam, ultrasonic transducer receive and come from the inner reflection echo of Electronic Packaging, obtain level (structure) image between the inner different medium of encapsulation.
Step 4: observe level (structure) image of the inner different depth of Electronic Packaging, judge whether to exist lamination defect.
2. the ultrasonic micro measurement method of Electronic Packaging interior laminate layer defective according to claim 1, it is characterized in that: the water that is used for the submergence electronic encapsulation device in the said step 2 is oxygen-free water.
3. the ultrasonic micro measurement method of Electronic Packaging interior laminate layer defective according to claim 1, it is characterized in that: the frequency of utilization scope is at 20MHz in the said step 3---and the high-frequency ultrasonic of 300MHz is as detection means.
4. the ultrasonic micro measurement method of Electronic Packaging interior laminate layer defective according to claim 1; It is characterized in that: the incident of the vertical electronics package surface of ultrasound wave relies on the pulse reflection echo method to receive level (structure) image between the inner different medium of Electronic Packaging.
5. the ultrasonic micro measurement method of Electronic Packaging interior laminate layer defective according to claim 1, it is characterized in that: need not contact tested Electronic Packaging during detection, need not destroy tested Electronic Packaging, not have radiation, noise is little.
6. the ultrasonic micro measurement method of Electronic Packaging interior laminate layer defective according to claim 1 is characterized in that: obtain the micro-image of inner each level of Electronic Packaging, micro-precision is 8um.
7. high-frequency ultrasonic frequency range according to claim 3 is characterized in that: according to the structure attribute of different Electronic Packaging, select to change the ultrasonic transducer of corresponding frequencies during use, transducer is the water immersion focusing formula.Every replacing primary transducer needs according to the vertical range between transducer focal length adjustment transducer and the Electronic Packaging, and the Electronic Packaging inner structure is within the burnt post scope of focused transducer.
8. level (structure) image between the inner different medium of Electronic Packaging according to claim 4 is characterized in that: rely on the collection of reflection echo, the disposable acoustic picture that obtains inner each layer of Electronic Packaging.
9. level (structure) image between the inner different medium of Electronic Packaging according to claim 4; It is characterized in that: to the thickness of electronic package material; Get into the phenomenon that refraction takes place for focus beam behind the encapsulation medium according to penetration capacity and the sound wave of different frequency ultrasound wave in medium by couplant (water); Accurate Theory distance when providing detection between ultrasonic transducer and the electron package structure is accomplished the interested certain depth layer images optimization in Electronic Packaging inside.
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102830049A (en) * | 2012-09-03 | 2012-12-19 | 北京理工大学 | Ultrasound array micronano detection method of particle sizes multiphase fluid particles |
| CN104634876A (en) * | 2015-01-30 | 2015-05-20 | 北京科技大学 | Method for detecting inclusions in metal material by virtue of ultrasonic scanning microscope |
| CN105738475A (en) * | 2014-12-10 | 2016-07-06 | 上海梅山钢铁股份有限公司 | Detection method of internal defects of thin-gauge cold rolled steel plates for automobiles |
| CN108375632A (en) * | 2018-01-23 | 2018-08-07 | 航天科工防御技术研究试验中心 | A kind of plastic device lamination defect detection method |
| CN109073603A (en) * | 2016-04-18 | 2018-12-21 | 株式会社日立电力解决方案 | The image generating method of ultrasonograph device and ultrasonograph device |
| CN109752722A (en) * | 2017-11-02 | 2019-05-14 | 弗兰克公司 | Multi-modal acoustics imaging tool |
| CN111665295A (en) * | 2020-05-28 | 2020-09-15 | 深圳第三代半导体研究院 | Solid material and semiconductor device internal defect detection method |
| CN112557869A (en) * | 2020-11-19 | 2021-03-26 | 头领科技（昆山）有限公司 | Detection method and detection equipment for audio chip |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101493436A (en) * | 2007-12-26 | 2009-07-29 | 松下电器产业株式会社 | Ultrasonic measuring method, electronic component manufacturing method, and semiconductor package |
| CN102104028A (en) * | 2010-11-05 | 2011-06-22 | 南通富士通微电子股份有限公司 | Semiconductor plastic-sealed body and layered scanning method |
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2011
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101493436A (en) * | 2007-12-26 | 2009-07-29 | 松下电器产业株式会社 | Ultrasonic measuring method, electronic component manufacturing method, and semiconductor package |
| CN102104028A (en) * | 2010-11-05 | 2011-06-22 | 南通富士通微电子股份有限公司 | Semiconductor plastic-sealed body and layered scanning method |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102830049A (en) * | 2012-09-03 | 2012-12-19 | 北京理工大学 | Ultrasound array micronano detection method of particle sizes multiphase fluid particles |
| CN105738475A (en) * | 2014-12-10 | 2016-07-06 | 上海梅山钢铁股份有限公司 | Detection method of internal defects of thin-gauge cold rolled steel plates for automobiles |
| CN104634876A (en) * | 2015-01-30 | 2015-05-20 | 北京科技大学 | Method for detecting inclusions in metal material by virtue of ultrasonic scanning microscope |
| CN109073603A (en) * | 2016-04-18 | 2018-12-21 | 株式会社日立电力解决方案 | The image generating method of ultrasonograph device and ultrasonograph device |
| CN109073603B (en) * | 2016-04-18 | 2021-04-09 | 株式会社日立电力解决方案 | Ultrasonic imaging apparatus and image generation method for ultrasonic imaging apparatus |
| CN109752722A (en) * | 2017-11-02 | 2019-05-14 | 弗兰克公司 | Multi-modal acoustics imaging tool |
| CN109752722B (en) * | 2017-11-02 | 2024-04-02 | 弗兰克公司 | Multi-modal acoustic imaging tool |
| CN108375632A (en) * | 2018-01-23 | 2018-08-07 | 航天科工防御技术研究试验中心 | A kind of plastic device lamination defect detection method |
| CN108375632B (en) * | 2018-01-23 | 2020-10-09 | 航天科工防御技术研究试验中心 | Layered defect detection method for plastic package device |
| CN111665295A (en) * | 2020-05-28 | 2020-09-15 | 深圳第三代半导体研究院 | Solid material and semiconductor device internal defect detection method |
| CN112557869A (en) * | 2020-11-19 | 2021-03-26 | 头领科技（昆山）有限公司 | Detection method and detection equipment for audio chip |
| CN112557869B (en) * | 2020-11-19 | 2022-06-28 | 头领科技（昆山）有限公司 | Detection method and detection equipment for audio chip |
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Application publication date: 20120620 |