CN209804627U - Wafer sticking lump fixing device - Google Patents
Wafer sticking lump fixing device Download PDFInfo
- Publication number
- CN209804627U CN209804627U CN201920752111.6U CN201920752111U CN209804627U CN 209804627 U CN209804627 U CN 209804627U CN 201920752111 U CN201920752111 U CN 201920752111U CN 209804627 U CN209804627 U CN 209804627U
- Authority
- CN
- China
- Prior art keywords
- lump
- sticking
- wafer
- plate
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000853 adhesive Substances 0.000 claims 3
- 230000001070 adhesive effect Effects 0.000 claims 3
- 239000003292 glue Substances 0.000 abstract description 23
- 238000004026 adhesive bonding Methods 0.000 abstract description 7
- 235000012431 wafers Nutrition 0.000 description 34
- 239000010453 quartz Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a wafer sticking lump fixing device, which comprises a sticking lump plate (2), a screw (3), a sticking lump bracket (4), a sticking lump bottom plate (1) and a wafer pressing plate (6); a plurality of threaded positioning holes are formed in the sticking lump plate (2) and are used for connecting screws (3); each sticking lump support (4) is placed on the sticking lump plate (2) and is fixed in position through a fixed angle formed by connecting a plurality of screws (3); the wafer sticks to put in gluing board (2) upper surface that sticks together through gluing support (4) that sticks together to keep wafer (5) position through wafer clamp plate (6), glue bottom plate (1) upside that sticks together and connect and glue board (2) that sticks together, and carry out inclination adjustment through the support that the downside was equipped with. The utility model discloses a glue bottom plate (1) that sticks together and glue the contained angle that board (2) formed that sticks together and be convenient for manual operation, glue simultaneously and set for the multiposition L type in the board (2) that sticks together and glue support (4) that sticks together, realized gluing in batches and stick together, improved and glued the output and the quality that sticks together.
Description
Technical Field
The utility model relates to a quartz wafer processing field especially relates to a wafer glues fixing device that sticks together.
Background
At present, the quartz wafer sticking lump in China mainly depends on the combination of an operator and the working experience of the operator, the quartz wafer sticking lump is stuck by simple operation, the quantity of the wafer sticking lump is very limited every time, the quartz wafer sticking lump can not be effectively stuck in a large quantity, and the quartz wafer sticking lump is very time-consuming, so that the wafer sticking lump fixing device is needed to improve the efficiency and the quality of the wafer sticking lump.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to the above-mentioned problem, provide a wafer glues fixing device that sticks together.
A wafer sticking lump fixing device comprises a sticking lump plate, a screw, a sticking lump support and a wafer pressing plate; the sticking lump plate is provided with a plurality of threaded positioning holes for connecting screws; each sticking lump support is placed on the sticking lump plate, and is fixed in position through a fixed angle formed by connecting a plurality of screws; the wafer is pasted on the upper surface of the sticking weight plate through the sticking weight bracket, and the position of the wafer is kept through the wafer pressing plate.
Further, the number of screws for forming the fixed angle is not less than 3.
Furthermore, glue the support that sticks together and be L shape, the wafer is placed and is stuck together support corner inboard.
Furthermore, the inner side of the sticking lump support is provided with an inclined groove, so that wafers can be conveniently arranged.
Furthermore, the inner side of the wafer pressing plate is provided with an inclined groove, so that the wafer pressing plate can keep positioning on the wafer conveniently.
Further, still including gluing the bottom plate that sticks together, glue the bottom plate upside that sticks together and connect and glue the board that sticks together to carry out inclination adjustment, the manual operation of being convenient for through the support that the downside was equipped with.
Further, glue the bottom plate that sticks together and pass through the screw and glue the board that sticks together and be connected.
The utility model has the advantages that: through gluing the bottom plate that sticks together and gluing the contained angle that sticks together board and desktop formed and be convenient for manual operation, glue simultaneously and set for the multiposition L type in the board that sticks together and glue the support that sticks together, realized sticking together in batches, improved and glued the output and the quality that stick together.
Drawings
FIG. 1 is a schematic structural view of a wafer-bonded lump fixing device;
FIG. 2 is a schematic structure diagram of a sticking lump support and a groove on the inner side of a wafer pressing plate;
In the figure: the chip bonding method comprises the following steps of 1-bonding a lump bottom plate, 2-bonding a lump plate, 3-screws, 4-bonding a lump support, 5-chips and 6-chip pressing plates.
Detailed Description
In order to clearly understand the technical features, objects, and effects of the present invention, embodiments of the present invention will be described with reference to the accompanying drawings.
In this embodiment, a wafer sticking lump fixing device includes a sticking lump plate 2, 12 sets of screws 3, 12 sticking lump brackets 4, and 12 wafer pressing plates 6; 12 groups of threaded positioning holes are formed in the sticking lump plate 2 and used for connecting screws 3; each sticking lump support 4 is placed on the sticking lump plate 2 and is fixed in position through a fixed angle formed by connecting 3 screws 3; the wafer is stuck to the upper surface of the sticking weight plate 2 through the sticking weight bracket 4, and the position of the wafer 5 is kept through the wafer pressing plate 6.
The sticking lump support 4 is L-shaped, and the wafer 5 is placed on the inner side of the corner of the sticking lump support 4.
Still including gluing bottom plate 1 that sticks together, glue 1 upside connections of bottom plate that sticks together and glue board 2 that sticks together to carry out inclination adjustment, the manual operation of being convenient for through the support that the downside was equipped with.
Glue bottom plate 1 that sticks together and glue board 2 connection that sticks together through the screw.
as shown in fig. 2, the inner side of the sticking lump support 4 is provided with an inclined groove for facilitating arrangement of the wafers 5, and the inner side of the wafer pressing plate 6 is also provided with an inclined groove for facilitating the wafer pressing plate 6 to keep positioning of the wafers 5.
The angle of one end of the wafer pressing plate 6 is the same as the corner angle of the L-shaped sticky lump support 4, and is used for keeping the position of the arranged wafer 5 stable.
The utility model discloses a glue bottom plate 1 that sticks together and glue the contained angle that sticks together board 2 and desktop formed and be convenient for manual operation, glue simultaneously and set for the multiposition L type among the board 2 that sticks together and glue the support 4 that sticks together, realized sticking together in batches, improved and glued output and the quality that sticks together.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (7)
1. A wafer sticking lump fixing device is characterized by comprising a sticking lump plate (2), a screw (3), a sticking lump support (4) and a wafer pressing plate (6); the sticking lump plate (2) is provided with a plurality of threaded positioning holes for connecting screws (3); each sticking lump support (4) is placed on the sticking lump plate (2) and is fixed in position through a fixed angle formed by connecting a plurality of screws (3); the wafer is attached to the upper surface of the sticking lump plate (2) through the sticking lump support (4), and the position of the wafer (5) is kept through the wafer pressing plate (6).
2. The wafer sticking lump fixing device as claimed in claim 1, wherein the number of screws (3) for forming the fixing angle is not less than 3.
3. The wafer sticky lump fixing device according to claim 1, wherein the sticky lump support (4) is L-shaped, and the wafer (5) is placed inside the corner of the sticky lump support (4).
4. The wafer sticking lump fixing device as claimed in claim 1, wherein the sticking lump support (4) is provided with an inclined groove inside to facilitate arrangement of the wafer (5).
5. The wafer sticking lump fixing device as claimed in claim 1, wherein the wafer pressing plate (6) is provided with an inclined groove inside to facilitate the wafer pressing plate (6) to keep the wafer (5) in position.
6. The wafer sticking lump fixing device according to claim 1, further comprising a sticking lump bottom plate (1), wherein the upper side of the sticking lump bottom plate (1) is connected with a sticking lump plate (2), and the inclination angle adjustment is performed through a support arranged on the lower side, so that manual operation is facilitated.
7. The wafer adhesive lump fixing device according to claim 6, wherein the adhesive lump base plate (1) is connected with the adhesive lump plate (2) by screws.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920752111.6U CN209804627U (en) | 2019-05-23 | 2019-05-23 | Wafer sticking lump fixing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920752111.6U CN209804627U (en) | 2019-05-23 | 2019-05-23 | Wafer sticking lump fixing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209804627U true CN209804627U (en) | 2019-12-17 |
Family
ID=68832997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920752111.6U Expired - Fee Related CN209804627U (en) | 2019-05-23 | 2019-05-23 | Wafer sticking lump fixing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209804627U (en) |
-
2019
- 2019-05-23 CN CN201920752111.6U patent/CN209804627U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder |
Address after: No. 136, Tianying Road, high tech Zone, Chengdu, Sichuan 610000 Patentee after: CHENGDU TIMEMAKER CRYSTAL TECHNOLOGY Co.,Ltd. Address before: 610000 No. 103, Tianying Road, West Park, hi tech Zone, Chengdu, Sichuan Patentee before: CHENGDU TIMEMAKER CRYSTAL TECHNOLOGY Co.,Ltd. |
|
| CP02 | Change in the address of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191217 |