CN209794073U - mould device for thermal insulation board - Google Patents
mould device for thermal insulation board Download PDFInfo
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- CN209794073U CN209794073U CN201822072340.1U CN201822072340U CN209794073U CN 209794073 U CN209794073 U CN 209794073U CN 201822072340 U CN201822072340 U CN 201822072340U CN 209794073 U CN209794073 U CN 209794073U
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- mould
- shaping unit
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- bottom plate
- cavity
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Abstract
The utility model discloses an insulation board die set, it includes mould, lower mould, bottom plate, at least one press and at least one lower press, it is located to go up the mould the lower mould with the top of bottom plate, the outer fringe of the bottom surface of going up the mould is equipped with the insert, the insert is followed and is close to the direction of lower mould extends the arch, the outer fringe of the top surface of lower mould is equipped with the recess, the insert is inserted and is located in the recess and can reciprocate in the recess, the bottom plate set up in the lower mould and can reciprocate in the lower mould, go up the mould the lower mould with be formed with the mould cavity between the bottom plate, go up the press and support in the top surface of last mould, the push down machine support and support in the bottom surface of bottom plate. Acting force is applied to the upper die and the bottom plate through the upper press and the lower press respectively, the raw material composition is extruded in the die cavity, the density of the product is increased, the quality of the product is greatly improved, and the applicability of the product is expanded.
Description
Technical Field
The utility model relates to an insulation material production and processing field, in particular to heated board die set.
Background
Traditional heated board production facility can relate to processes such as raw materials premix, notes material, heating design, drawing of patterns, maintenance, cutting in the production process. However, in the production process, sufficient pressure cannot be applied to the raw materials, so that the density of the prepared product is low, the texture is loose and fragile, the bonding strength is not high, the hidden trouble of falling off exists in the use process, and the product quality and the product use range are greatly influenced.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming the above-mentioned not enough of current existence, the utility model provides a heated board mould device.
The utility model discloses a realize through following technical scheme:
the utility model provides an insulation board die set, its includes mould, lower mould, bottom plate, at least one go up press and at least one lower press, it is located to go up the mould the lower mould with the top of bottom plate, the outer fringe of the bottom surface of going up the mould is equipped with the insert, the insert is along being close to the direction of lower mould extends the arch, the outer fringe of the top surface of lower mould is equipped with the recess, the insert is inserted and is located in the recess and can reciprocate in the recess, the bottom plate set up in the lower mould and can reciprocate in the lower mould, go up the mould the lower mould with be formed with the mould cavity between the bottom plate, go up the press and lean on in the top surface of last mould, the lower press support lean on in the bottom surface of bottom plate.
Further, the insulation board die device further comprises an upper shaping unit, the upper shaping unit is connected to the upper press, the bottom surface of the upper shaping unit is abutted to the top surface of the upper die, the upper shaping unit is provided with a plurality of first interfaces, a first cavity is formed in the upper shaping unit, and the first interfaces are communicated with the first cavity.
Furthermore, the first pair of interfaces is located on the side surface of the upper shaping unit, the bottom surface of the upper shaping unit is provided with a plurality of first through holes distributed in an array manner, and the plurality of first through holes are communicated with the first cavity.
Further, the insulation board die device further comprises a lower shaping unit, the lower shaping unit is located below the lower die and the bottom plate, the lower shaping unit is provided with at least one through hole, the through holes correspond to the pressing machines one to one, the pressing machines penetrate through the through holes and abut against the bottom plate, the lower shaping unit is provided with a plurality of second pairs of interfaces, a second cavity is formed in the lower shaping unit, and the second pairs of interfaces are communicated with the second cavity.
Further, the lower die is placed on the lower shaping unit and is in abutting contact with the lower shaping unit.
Further, the bottom surface of the bottom plate is in abutting contact with the top surface of the lower shaping unit.
Furthermore, the second pair of interfaces is located on the side surface of the lower shaping unit, the top surface of the lower shaping unit is provided with a plurality of second through holes distributed in an array manner, and the plurality of second through holes are communicated with the second cavity.
Further, the insulation board die device further comprises a plurality of supports, and the supports abut against the bottom of the lower shaping unit.
Further, the shape of lower mould is frame construction, the bottom outer fringe of lower mould is provided with a plurality of support piece, and is a plurality of support piece all follows the central direction of lower mould extends the arch, the bottom plate is placed a plurality ofly on the support piece.
Furthermore, the groove continuously and uninterruptedly surrounds the peripheral outer edge of the lower die, the insert continuously and uninterruptedly surrounds the peripheral outer edge of the upper die, and the insert and the upper die are integrally formed.
The beneficial effects of the utility model reside in that: acting force is applied to the upper die and the bottom plate through the upper press and the lower press respectively, so that the insert moves up and down in the groove and the bottom plate moves up and down in the lower die, the raw material composition is extruded in the die cavity, the density of the product is increased, the quality of the product is greatly improved, and the applicability of the product is expanded.
Drawings
Fig. 1 is a schematic structural view of a mold device for an insulation board according to an embodiment of the present invention.
Fig. 2 is the internal structure schematic diagram of the upper die, the lower die and the bottom plate of the insulation board die device of the embodiment of the utility model.
Fig. 3 is the utility model discloses heated board die set's last mould's schematic structure diagram.
Fig. 4 is the utility model discloses the schematic structure of heated board die set's lower mould.
Fig. 5 is a schematic structural view of a lower shaping unit of the insulation board mold device according to the embodiment of the present invention.
Description of reference numerals:
Upper die 1
Insert 11
Mold cavity 12
Lower die 2
Groove 21
Support member 22
Base plate 3
Upper press 4
Lower press 5
Upper shaping unit 6
A first pair of interfaces 61
Lower shaping unit 7
Second pair of interfaces 71
Through hole 72
Support 8
Detailed Description
The following description of the embodiments refers to the accompanying drawings, which are included to illustrate specific embodiments in which the invention may be practiced.
As shown in fig. 1, 2, 3, 4, and 5, the present embodiment discloses a heat insulation board mold device, which includes an upper mold 1, a lower mold 2, a bottom plate 3, at least one upper press 4, and at least one lower press 5, where the upper mold 1 is located above the lower mold 2 and the bottom plate 3, an insert 11 is disposed on an outer edge of a bottom surface of the upper mold 1, the insert 11 extends in a direction close to the lower mold 2, a groove 21 is disposed on an outer edge of a top surface of the lower mold 2, the insert 11 is inserted into the groove 21 and can move up and down in the groove 21, a mold cavity 12 is formed between the upper mold 1, the lower mold 2, and the bottom plate 3, and the upper press 4 abuts against the top surface of the upper mold 1. Go up press 4 and will apply decurrent effort to last mould 1 for go up mould 1 and can remove downwards, reduced the thickness in the mould cavity 12, thereby realize exerting pressure and can extrude the raw materials composition in the mould unit 2 to the raw materials composition in the mould unit 2, increase the density of product, guaranteed the requirement of heated board mould device to pressure in process of production, strengthened the intensity index of heated board, improved product quality greatly.
The bottom plate 3 is arranged in the lower die 2 and can move up and down in the lower die 2, and the lower press 5 is abutted against the bottom surface of the bottom plate 3. The downward pressing machine 5 applies upward acting force to the bottom plate 3, so that the bottom plate 3 can move upwards, the thickness in the die cavity 12 is reduced, the pressure is applied to the raw material composition in the die unit 2, the raw material composition in the die unit 2 can be extruded, the density of a product is increased, the requirement of the heat-insulating plate die device on the pressure in the production process is met, the strength index of the heat-insulating plate is enhanced, and the product quality is greatly improved. Simultaneously, through the plug-in 11 reciprocating in recess 21 and bottom plate 3 reciprocating in lower mould 2, can realize adjusting the thickness of mould cavity 12 to realize that heated board die set can satisfy the production and processing of different thickness heated boards, realize that the range of application is extensive, need not to produce the mould of making different thickness alone again, greatly reduced the cost.
The insulation board die device further comprises an upper shaping unit 6, the upper shaping unit 6 is connected to the upper press 4, the bottom surface of the upper shaping unit 6 is abutted to the top surface of the upper die 1 to be contacted, the upper shaping unit 6 is provided with a plurality of first pair of interfaces 61, a first cavity is formed in the upper shaping unit 6, and the plurality of first pair of interfaces 61 are communicated with the first cavity. A plurality of first interfaces 61 can be connected with outside heat medium device or refrigerant device, heated board die set is when needs heat setting, and outside heat medium device provides the heat medium and injects the heat medium into first cavity through first pair of interface 61 for go up the temperature rise of design unit 6, the bottom surface of going up design unit 6 and the top surface of last mould 1 and lean on the contact, make the temperature rise of going up design unit 6 and transmit heat energy to last mould 1, thereby the realization is heated the design to the raw materials composition in the mould cavity 12. When the insulation board mold device is cooled and shaped, the external refrigerant device provides a refrigerant and injects the refrigerant into the first cavity through the first pair of interfaces 61, so that the temperature of the upper shaping unit 6 is reduced, the bottom surface of the upper shaping unit 6 is abutted against the top surface of the upper mold 1 to contact, the temperature of the upper shaping unit 6 is reduced, the heat of the upper mold 1 is absorbed, and the raw material composition in the mold cavity 12 is cooled and shaped.
Go up design unit 6 and can connect respectively in heat medium device and refrigerant device through a plurality of first to interface 61, the in-process that insulation board mould device was used closes the refrigerant device earlier, opens the heat medium device, heats the design, later switches into and closes the heat medium device, opens the refrigerant device, realizes cooling design. The dual functions of heating and cooling are realized, the switching between heating and cooling can be realized, and the production efficiency of the insulation board die device is improved. Wherein, heat medium and refrigerant all can include: water, oil, etc.
The first pair of connectors 61 are located on the side of the upper shaping unit 6, so as to facilitate the connection between the first pair of connectors 61 and the heating medium device or the cooling medium device.
The bottom surface of the upper shaping unit 6 is provided with a plurality of first through holes distributed in an array manner, and the plurality of first through holes are communicated with the first cavity. Insulation board mould device is when needs heating design, and the heat medium of heat medium device enters into first cavity through to first pair of interface 61 in, first cavity is linked together with a plurality of first through-holes for the heat medium will be through a plurality of first through-holes by the first cavity of discharge, and the bottom surface contact of going up design unit 6 supports and leans on in last mould 1, makes the heat medium will be direct with last mould 1 contact and transfer heat, makes heat time descend by a wide margin, thereby has improved production efficiency. When the insulation board mold device needs to be cooled and shaped, the refrigerant of the refrigerant device enters the first cavity through the first pair of interfaces 61, the first cavity is communicated with the first through holes, the refrigerant is discharged from the first cavity through the first through holes, the refrigerant directly contacts the upper mold 1 and absorbs heat of the raw material composition in the mold cavity 12, the cooling time is greatly reduced, and the production efficiency is improved. The heating medium may include steam, and the cooling medium may include induced air.
The heat preservation plate die device further comprises a lower shaping unit 7, the lower shaping unit 7 is located below the lower die 2 and the bottom plate 3, the lower shaping unit 7 is provided with at least one through hole 72, the through holes 72 correspond to the lower pressing machines 5 one by one, and the lower pressing machines 5 penetrate through the through holes 72 and abut against the bottom plate 3. The plurality of lower presses 5 abut against the bottom plate 3 through the through holes 72 and apply force to the bottom plate 3, and the structure is simple.
The lower shaping unit 7 has a plurality of second pairs of interfaces 71, a second cavity is formed in the lower shaping unit 7, and the plurality of second pairs of interfaces 71 are all communicated with the second cavity. The second pair of connectors 71 may be connected to an external heat medium device or a cooling medium device, and the heating and cooling of the raw material composition in the mold cavity 12 are realized by the heat medium or the cooling medium provided by the heat medium device or the cooling medium device.
The lower shaping unit 7 can be respectively connected to the heat medium device and the refrigerant device through the second pairs of interfaces 71, so that the dual functions of heating and cooling are realized, the switching between heating and cooling can be realized, and the production efficiency of the heat-insulation plate die device is improved.
The lower mold 2 is placed on the lower shaping unit 7 and is in abutting contact with the lower shaping unit 7. When the insulation board mold device needs to be heated and shaped, the external heat medium device provides heat medium and injects the heat medium into the second cavity through the second pair of interfaces 71, so that the temperature of the lower shaping unit 7 is increased, the top surface of the lower shaping unit 7 is abutted to the lower mold 2 to contact, the temperature of the lower shaping unit 7 is increased, and heat energy is transferred to the lower mold 2, so that the raw material composition in the mold cavity 12 is heated and shaped. When the insulation board mold device needs to be cooled and shaped, the external refrigerant device provides a refrigerant and injects the refrigerant into the second cavity through the second butt joint 71, so that the temperature of the lower shaping unit 7 is reduced, the top surface of the lower shaping unit 7 is abutted to the top surface of the lower mold 2, the temperature of the lower shaping unit 7 is reduced, the heat of the lower mold 2 is absorbed, and the raw material composition in the mold cavity 12 is cooled and shaped.
The top surface of the lower shaping unit 7 may not be directly supported against the bottom surface of the lower mold 2, and the bottom surface of the bottom plate 3 may be in abutting contact with the top surface of the lower shaping unit 7. The contact area between the lower shaping unit 7 and the mold cavity 12 is increased by directly contacting the top surface of the lower shaping unit 7 with the bottom surface of the bottom plate 3, so that the production efficiency of the insulation plate mold device is improved.
The second pair of connectors 71 is located on the side of the lower shaping unit 7, so as to facilitate connection between the second pair of connectors 71 and the heat medium device or the refrigerant device.
The top surface of the lower shaping unit 7 is provided with a plurality of second through holes distributed in an array manner, and the plurality of second through holes are communicated with the second cavity. When the insulation board mold device needs to be heated and shaped, a heating medium of the heating medium device enters the second cavity through the second pair of interfaces 71, the second cavity is communicated with the second through holes, the heating medium is discharged out of the second cavity through the second through holes, the top surface of the lower shaping unit 7 faces the bottom surface of the bottom plate 3, the heating medium is directly contacted with the bottom plate 3 and transfers heat to a raw material composition in the mold cavity 12, the heating time is greatly reduced, and the production efficiency of the insulation board mold device is improved. When the heat-insulating plate die device needs to be cooled and shaped, a refrigerant of the refrigerant device enters the second cavity through the second pair of ports 71, the second cavity is communicated with the plurality of second through holes, the refrigerant is discharged out of the second cavity through the plurality of second through holes, the refrigerant is directly contacted with the bottom plate 3 and absorbs heat of the raw material composition in the die cavity 12, the cooling time is greatly reduced, and the production efficiency of the heat-insulating plate die device is improved.
The heat preservation plate mold device further comprises a plurality of supports 8, and the plurality of supports 8 are abutted against the bottom of the lower shaping unit 7. The support 8 plays a role in supporting and fixing, so that the insulation board die device is convenient to install and connect, and the stability of the insulation board die device is improved.
The upper die 1, the lower die 2 and the bottom plate 3 are made of metal, so that the structural strength is high, and the stability of the heat-insulation plate die device is improved. Meanwhile, the heat transfer is fast, the heating and cooling effects on the raw material composition in the die cavity 12 are accelerated, and the production efficiency of the insulation board die device is improved.
The lower mould 2 is in a frame structure, a plurality of supporting pieces 22 are arranged on the outer edge of the bottom of the lower mould 2, the supporting pieces 22 extend and protrude along the central direction of the lower mould 2, and the bottom plate 3 is placed on the supporting pieces 22. The supporting piece 22 is used for supporting the bottom plate 3, and the bottom plate 3 can move up and down in the lower die 2, so that the thickness of the die cavity 4 can be adjusted through the movement of the bottom plate 3, the bottom plate 3 and the lower die 2 can be conveniently assembled and disassembled, and the demolding is convenient. Meanwhile, the structure is simple, and the processing and the manufacturing are convenient. The supporting member 22 is sheet-shaped, and the thickness of the supporting member 22 is small, so that when the lower shaping unit 7 abuts against and contacts the lower die 2, the distance between the lower shaping unit 7 and the bottom plate 3 is very small, which is convenient for heat transfer.
The insert 11 is integrally formed with the upper mold 1. The structural strength is enhanced, the service life of the insulation board die device is prolonged, and the processing and the manufacturing are convenient.
The groove 21 continuously and uninterruptedly surrounds the peripheral edge of the lower die 2, and the insert 11 continuously and uninterruptedly surrounds the peripheral edge of the upper die 1. Insert to recess 21 in through insert 11, go up mould 1 and lower mould 2 all around and strengthened the leakproofness of mould cavity 12 through insert 11 and recess 21, effectively avoided the raw materials composition in the mould cavity 12 to take place the seepage phenomenon, improved heated board die set's stability.
The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the invention, which is defined by the appended claims.
Claims (10)
1. The utility model provides an heated board die set, its characterized in that, it includes last mould, lower mould, bottom plate, at least one press and at least one lower press, it is located to go up the mould the lower mould with the top of bottom plate, the outer fringe of the bottom surface of going up the mould is equipped with the insert, the insert is along being close to the direction extension arch of lower mould, the outer fringe of the top surface of lower mould is equipped with the recess, the insert inserts insert locate in the recess and can reciprocate in the recess, the bottom plate set up in the lower mould and can reciprocate in the lower mould, go up the mould the lower mould with be formed with the mould cavity between the bottom plate, go up the press support lean on in the top surface of last mould, the push down machine support lean on in the bottom surface of bottom plate.
2. The insulation board die device according to claim 1, further comprising an upper shaping unit, wherein the upper shaping unit is connected to the upper press, a bottom surface of the upper shaping unit is in abutting contact with a top surface of the upper die, the upper shaping unit has a plurality of first pair of interfaces, the upper shaping unit has a first cavity therein, and the plurality of first pair of interfaces are all communicated with the first cavity.
3. The insulation board die apparatus according to claim 2, wherein the first pair of interfaces are located on the side surface of the upper shaping unit, the bottom surface of the upper shaping unit has a plurality of first through holes distributed in an array, and the plurality of first through holes are all communicated with the first cavity.
4. The insulation board die apparatus according to claim 1, further comprising a lower shaping unit, wherein the lower shaping unit is located below the lower die and the bottom plate, the lower shaping unit has at least one through hole, the through hole corresponds to the lower press one by one, the lower press passes through the through hole and abuts against the bottom plate, the lower shaping unit has a plurality of second pairs of interfaces, the lower shaping unit has a second cavity therein, and the plurality of second pairs of interfaces are all communicated with the second cavity.
5. An insulation board die apparatus as claimed in claim 4, wherein said lower die is placed on and in abutting contact with said lower shaping unit.
6. The insulation board die apparatus of claim 4, wherein the bottom surface of the bottom plate is in abutting contact with the top surface of the lower shaping unit.
7. The insulation board die apparatus according to claim 4, wherein the second pair of interfaces are located on a side surface of the lower shaping unit, a top surface of the lower shaping unit has a plurality of second through holes distributed in an array, and the plurality of second through holes are all communicated with the second cavity.
8. The insulation board die apparatus according to claim 4, further comprising a plurality of brackets, wherein the plurality of brackets abut against the bottom of the lower shaping unit.
9. The insulation board die assembly according to claim 1, wherein the lower die is shaped like a frame, a plurality of supporting members are provided on the outer edge of the bottom of the lower die, the plurality of supporting members each extend in a direction of the center of the lower die and protrude, and the bottom plate is placed on the plurality of supporting members.
10. The insulation board die apparatus of claim 1, wherein the groove continuously and uninterruptedly surrounds the peripheral edge of the lower die, the insert continuously and uninterruptedly surrounds the peripheral edge of the upper die, and the insert and the upper die are integrally formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822072340.1U CN209794073U (en) | 2018-12-11 | 2018-12-11 | mould device for thermal insulation board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822072340.1U CN209794073U (en) | 2018-12-11 | 2018-12-11 | mould device for thermal insulation board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209794073U true CN209794073U (en) | 2019-12-17 |
Family
ID=68817118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822072340.1U Active CN209794073U (en) | 2018-12-11 | 2018-12-11 | mould device for thermal insulation board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209794073U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109910147A (en) * | 2018-12-11 | 2019-06-21 | 上海圣奎塑业有限公司 | Mould of heat insulation plate device |
-
2018
- 2018-12-11 CN CN201822072340.1U patent/CN209794073U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109910147A (en) * | 2018-12-11 | 2019-06-21 | 上海圣奎塑业有限公司 | Mould of heat insulation plate device |
| CN109910147B (en) * | 2018-12-11 | 2024-05-14 | 上海圣奎塑业有限公司 | Thermal insulation board mould device |
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