CN109910147B - Thermal insulation board mould device - Google Patents
Thermal insulation board mould device Download PDFInfo
- Publication number
- CN109910147B CN109910147B CN201811509874.4A CN201811509874A CN109910147B CN 109910147 B CN109910147 B CN 109910147B CN 201811509874 A CN201811509874 A CN 201811509874A CN 109910147 B CN109910147 B CN 109910147B
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- shaping unit
- die
- mold
- bottom plate
- cavity
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- 238000009413 insulation Methods 0.000 title claims description 24
- 238000007493 shaping process Methods 0.000 claims description 83
- 238000003825 pressing Methods 0.000 claims description 7
- 238000004321 preservation Methods 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 239000002994 raw material Substances 0.000 abstract description 16
- 239000000203 mixture Substances 0.000 abstract description 15
- 238000010438 heat treatment Methods 0.000 description 33
- 238000004519 manufacturing process Methods 0.000 description 19
- 239000003507 refrigerant Substances 0.000 description 15
- 238000001816 cooling Methods 0.000 description 13
- 239000002826 coolant Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 210000001503 joint Anatomy 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention discloses a heat-insulating plate die device which comprises an upper die, a lower die, a bottom plate, at least one upper press and at least one lower press, wherein the upper die is positioned above the lower die and the bottom plate, an insert is arranged at the outer edge of the bottom surface of the upper die, the insert extends to be convex along the direction close to the lower die, a groove is arranged at the outer edge of the top surface of the lower die, the insert is inserted into the groove and can move up and down in the groove, the bottom plate is arranged in the lower die and can move up and down in the lower die, a die cavity is formed among the upper die, the lower die and the bottom plate, the upper press is propped against the top surface of the upper die, and the lower press is propped against the bottom surface of the bottom plate. The acting force is applied to the upper die and the bottom plate through the upper press and the lower press respectively, the raw material composition can be extruded in the die cavity, the compactness of the product is improved, the quality of the product is greatly improved, and the applicability of the product is expanded.
Description
Technical Field
The invention relates to the field of production and processing of heat-insulating materials, in particular to a heat-insulating plate die device.
Background
The traditional insulation board production equipment can involve the procedures of raw material premixing, material injection, heating shaping, demoulding, maintenance, cutting and the like in the production process. However, in the production process, the application of enough pressure to the raw materials cannot be realized, so that the manufactured product is low in density, loose and fragile in texture, low in bonding strength and hidden danger of falling off in the use process, and the product quality and the product application range are greatly influenced.
Disclosure of Invention
The invention aims to overcome the defects existing in the prior art, and provides a heat-insulating plate die device.
The invention is realized by the following technical scheme:
The utility model provides a heated board mould device, its includes mould, lower mould, bottom plate, at least one upper press and at least one lower press, the upper mould is located the lower mould with the top of bottom plate, the outer fringe of the bottom surface of upper mould is equipped with the inserts, the inserts is along being close to the direction extension arch of lower mould, the outer fringe of the top surface of lower mould is equipped with the recess, the inserts insert locate in the recess and can reciprocate in the recess, the bottom plate set up in the lower mould and can reciprocate in the lower mould, the upper mould the lower mould with be formed with the mould cavity between the bottom plate, the upper press support in the top surface of upper mould, the lower press support in the bottom surface of bottom plate.
Further, the heat insulation board die device further comprises an upper shaping unit, the upper shaping unit is connected to the upper press, the bottom surface of the upper shaping unit is in abutting contact with the top surface of the upper die, the upper shaping unit is provided with a plurality of first pairs of interfaces, a first cavity is formed in the upper shaping unit, and the first pairs of interfaces are communicated with the first cavity.
Further, the first butt joint is located on the side face of the upper shaping unit, the bottom face of the upper shaping unit is provided with a plurality of first through holes distributed in an array mode, and the plurality of first through holes are communicated with the first cavity.
Further, the heat insulation board die device further comprises a lower shaping unit, the lower shaping unit is located below the lower die and the bottom plate, the lower shaping unit is provided with at least one perforation, the perforation corresponds to the lower pressing machine one by one, the lower pressing machine penetrates through the perforation and abuts against the bottom plate, the lower shaping unit is provided with a plurality of second pairs of interfaces, the second shaping unit is internally provided with a second cavity, and the second pairs of interfaces are all communicated with the second cavity.
Further, the lower die is placed on and in abutting contact with the lower shaping unit.
Further, the bottom surface of the bottom plate is abutted against and contacted with the top surface of the lower shaping unit.
Further, the second butt joint is located on the side face of the lower shaping unit, the top face of the lower shaping unit is provided with a plurality of second through holes distributed in an array mode, and the second through holes are communicated with the second cavity.
Further, the heat insulation plate die device further comprises a plurality of brackets, and the brackets are propped against the bottom of the lower shaping unit.
Further, the shape of lower mould is frame construction, the bottom outer fringe of lower mould is provided with a plurality of support piece, and is a plurality of support piece is all followed the central direction extension arch of lower mould, the bottom plate is placed a plurality of support piece is last.
Further, the groove continuously surrounds the periphery of the lower die, the insert continuously surrounds the periphery of the upper die, and the insert and the upper die are integrally formed.
The invention has the beneficial effects that: the acting force is applied to the upper die and the bottom plate through the upper press and the lower press respectively, so that the insert moves up and down in the groove and the bottom plate moves up and down in the lower die, the raw material composition can be extruded in the die cavity, the compactness of a product is improved, the quality of the product is greatly improved, and the applicability of the product is expanded.
Drawings
Fig. 1 is a schematic structural diagram of an insulation board mold device according to an embodiment of the invention.
Fig. 2 is a schematic diagram of the internal structures of the upper mold, the lower mold and the bottom plate of the insulation board mold device according to the embodiment of the invention.
Fig. 3 is a schematic structural view of an upper mold of the insulation board mold device according to the embodiment of the invention.
Fig. 4 is a schematic structural view of a lower mold of the insulation board mold device according to the embodiment of the invention.
Fig. 5 is a schematic structural view of a lower shaping unit of the heat insulation board die device according to the embodiment of the invention.
Reference numerals illustrate:
Upper die 1
Insert 11
Mold cavity 12
Lower die 2
Groove 21
Support 22
Bottom plate 3
Upper press 4
Down press 5
Upper shaping unit 6
First pair of interfaces 61
Lower shaping unit 7
A second pair of interfaces 71
Perforations 72
Bracket 8
Detailed Description
The following description of embodiments refers to the accompanying drawings, which illustrate specific embodiments in which the invention may be practiced.
As shown in fig. 1, 2, 3, 4 and 5, the embodiment discloses a heat insulation board mold device, which comprises an upper mold 1, a lower mold 2, a bottom plate 3, at least one upper press 4 and at least one lower press 5, wherein the upper mold 1 is positioned above the lower mold 2 and the bottom plate 3, an insert 11 is arranged at the outer edge of the bottom surface of the upper mold 1, the insert 11 extends and protrudes along the direction close to the lower mold 2, a groove 21 is arranged at the outer edge of the top surface of the lower mold 2, the insert 11 is inserted in the groove 21 and can move up and down in the groove 21, a mold cavity 12 is formed among the upper mold 1, the lower mold 2 and the bottom plate 3, and the upper press 4 is abutted against the top surface of the upper mold 1. The upper press 4 applies downward acting force to the upper die 1, so that the upper die 1 can move downwards, the thickness in the die cavity 12 is reduced, the raw material composition in the die unit 2 is pressurized and can be extruded, the compactness of a product is improved, the requirement of the heat-insulating plate die device on the pressure in the production process is ensured, the strength index of the heat-insulating plate is enhanced, and the product quality is greatly improved.
The bottom plate 3 is provided in the lower die 2 and can move up and down in the lower die 2, and the press 5 abuts against the bottom surface of the bottom plate 3. The pressing machine 5 applies upward acting force to the bottom plate 3, so that the bottom plate 3 can move upwards, the thickness in the die cavity 12 is reduced, the purposes of applying pressure to the raw material composition in the die unit 2 and extruding the raw material composition in the die unit 2 are further achieved, the compactness of a product is improved, the requirement of the heat-insulating plate die device on the pressure in the production process is ensured, the strength index of the heat-insulating plate is enhanced, and the product quality is greatly improved. Meanwhile, through the up-and-down movement of the insert 11 in the groove 21 and the up-and-down movement of the bottom plate 3 in the lower die 2, the thickness adjustment of the die cavity 12 can be realized, so that the production and processing of the insulation board with different thickness can be realized, the application range is wide, the independent production and manufacturing of dies with different thicknesses are not needed, and the cost is greatly reduced.
The heat insulation plate die device further comprises an upper shaping unit 6, the upper shaping unit 6 is connected to the upper press 4, the bottom surface of the upper shaping unit 6 is in abutting contact with the top surface of the upper die 1, the upper shaping unit 6 is provided with a plurality of first pairs of interfaces 61, a first cavity is formed in the upper shaping unit 6, and the plurality of first pairs of interfaces 61 are all communicated with the first cavity. The plurality of first pair of interfaces 61 may be connected with an external heating medium device or a cooling medium device, and when the heat-insulating plate mold device needs to be heated and shaped, the external heating medium device provides heating medium and injects the heating medium into the first cavity through the first pair of interfaces 61, so that the temperature of the upper shaping unit 6 is increased, the bottom surface of the upper shaping unit 6 is in abutting contact with the top surface of the upper mold 1, so that the temperature of the upper shaping unit 6 is increased and heat energy is transferred to the upper mold 1, and the raw material composition in the mold cavity 12 is heated and shaped. When the heat-insulating plate die device needs cooling and shaping, an external refrigerant device provides a refrigerant and injects the refrigerant into the first cavity through the first pair of interfaces 61, so that the temperature of the upper shaping unit 6 is reduced, the bottom surface of the upper shaping unit 6 is in abutting contact with the top surface of the upper die 1, the temperature of the upper shaping unit 6 is reduced, the heat of the upper die 1 is absorbed, and the raw material composition in the die cavity 12 is cooled and shaped.
The upper shaping unit 6 can be respectively connected to the heating medium device and the cooling medium device through a plurality of first pairs of interfaces 61, and the heat insulation plate die device is used for closing the cooling medium device and opening the heating medium device to perform heating shaping and then switching into closing the heating medium device and opening the cooling medium device to realize cooling shaping. The dual functions of heating and cooling are realized, the switching of heating and cooling can be realized, and the production efficiency of the heat insulation plate die device is improved. Wherein, heating medium and refrigerant can all include: water, oil, etc.
The first pair of interfaces 61 is located at a side of the upper shaping unit 6, so that the first pair of interfaces 61 can be conveniently connected with a heating medium device or a cooling medium device.
The bottom surface of the upper shaping unit 6 is provided with a plurality of first through holes distributed in an array, and the plurality of first through holes are communicated with the first cavity. When the heat preservation plate mold device needs to be heated and shaped, the heating medium of the heating medium device enters the first cavity through the pair of interfaces 61, the first cavity is communicated with the plurality of first through holes, the heating medium is discharged out of the first cavity through the plurality of first through holes, the bottom surface of the upper shaping unit 6 is contacted and abutted against the upper mold 1, the heating medium is directly contacted with the upper mold 1 and transfers heat, the heating time is greatly reduced, and the production efficiency is improved. When the heat-insulating plate die device needs cooling and shaping, a refrigerant of the refrigerant device enters the first cavity through the first pair of interfaces 61, and the first cavity is communicated with the plurality of first through holes, so that the refrigerant is discharged out of the first cavity through the plurality of first through holes, and the refrigerant is directly contacted with the upper die 1 and absorbs heat of the raw material composition in the die cavity 12, so that the cooling time is greatly reduced, and the production efficiency is improved. Wherein, the heating medium can comprise steam and the like, and the cooling medium can comprise induced draft and the like.
The heat-insulating plate die device further comprises a lower shaping unit 7, wherein the lower shaping unit 7 is positioned below the lower die 2 and the bottom plate 3, the lower shaping unit 7 is provided with at least one perforation 72, the perforation 72 corresponds to the lower press 5 one by one, and the lower press 5 penetrates through the perforation 72 and abuts against the bottom plate 3. The plurality of pressing machines 5 are abutted against the bottom plate 3 through the through holes 72 and apply force to the bottom plate 3, so that the structure is simple.
The lower shaping unit 7 is provided with a plurality of second pairs of interfaces 71, a second cavity is formed in the second shaping unit, and the plurality of second pairs of interfaces 71 are communicated with the second cavity. The second plurality of ports 71 may be connected to an external heating medium device or cooling medium device for heating and cooling the feedstock composition within the mold cavity 12 by the heating medium or cooling medium provided by the heating medium device or cooling medium device.
The lower shaping unit 7 can be respectively connected to the heating medium device and the cooling medium device through a plurality of second pairs of interfaces 71, so that the dual functions of heating and cooling are realized, the switching of heating and cooling can be realized, and the production efficiency of the heat insulation plate die device is improved.
The lower die 2 is placed on the lower shaping unit 7 and is in abutting contact with the lower shaping unit 7. When the heat-insulating plate die device needs to be heated and shaped, an external heat medium device provides a heat medium and injects the heat medium into the second cavity through the second pair of interfaces 71, so that the temperature of the lower shaping unit 7 is increased, the top surface of the lower shaping unit 7 is in abutting contact with the lower die 2, the temperature of the lower shaping unit 7 is increased, heat energy is transferred to the lower die 2, and the raw material composition in the die cavity 12 is heated and shaped. When the heat-insulating plate die device needs cooling and shaping, an external refrigerant device provides a refrigerant and injects the refrigerant into the second cavity through the second pair of interfaces 71, so that the temperature of the lower shaping unit 7 is reduced, the top surface of the lower shaping unit 7 is in abutting contact with the top surface of the lower die 2, the temperature of the lower shaping unit 7 is reduced, and the heat of the lower die 2 is absorbed, so that the raw material composition in the die cavity 12 is cooled and shaped.
The top surface of the lower shaping unit 7 may not be directly supported against the bottom surface of the lower die 2, and the bottom surface of the bottom plate 3 may be in contact with the top surface of the lower shaping unit 7. The top surface of the lower shaping unit 7 is directly contacted with the bottom surface of the bottom plate 3, so that the contact area between the lower shaping unit 7 and the die cavity 12 is increased, and the production efficiency of the heat insulation plate die device is improved.
The second pair of interfaces 71 is located at the side of the lower shaping unit 7, so that the second pair of interfaces 71 is conveniently connected with a heating medium device or a cooling medium device.
The top surface of the lower shaping unit 7 is provided with a plurality of second through holes distributed in an array, and the second through holes are communicated with the second cavity. When the heat preservation plate die device needs to be heated and shaped, the heating medium of the heating medium device enters the second cavity through the second pair of interfaces 71, the second cavity is communicated with the second through holes, the heating medium is discharged out of the second cavity through the second through holes, the top surface of the lower shaping unit 7 faces the bottom surface of the bottom plate 3, the heating medium is directly contacted with the bottom plate 3 and transfers heat to the raw material composition in the die cavity 12, the heating time is greatly reduced, and therefore the production efficiency of the heat preservation plate die device is improved. When the heat-insulating plate die device needs cooling and shaping, the refrigerant of the refrigerant device enters the second cavity through the second pair of interfaces 71, and the second cavity is communicated with the plurality of second through holes, so that the refrigerant is discharged out of the second cavity through the plurality of second through holes, and the refrigerant is directly contacted with the bottom plate 3 and absorbs the heat of the raw material composition in the die cavity 12, so that the cooling time is greatly reduced, and the production efficiency of the heat-insulating plate die device is improved.
The heat-insulating plate die device further comprises a plurality of brackets 8, and the brackets 8 are propped against the bottom of the lower shaping unit 7. The support 8 plays a role in supporting and fixing, is convenient for the installation and connection of the heat-insulating plate die device, and improves the stability of the heat-insulating plate die device.
The upper die 1, the lower die 2 and the bottom plate 3 are all made of metal, so that the structural strength is high, and the stability of the heat-insulating plate die device is improved. At the same time, the heat transfer is rapid, thereby accelerating the heating and cooling effect of the raw material composition in the mold cavity 12 and improving the production efficiency of the heat-insulating plate mold device.
The lower die 2 is in a frame structure, a plurality of supporting pieces 22 are arranged on the outer edge of the bottom of the lower die 2, the supporting pieces 22 extend and bulge along the center direction of the lower die 2, and the bottom plate 3 is placed on the supporting pieces 22. The support piece 22 is used for supporting the bottom plate 3, the bottom plate 3 can move up and down in the lower die 2, so that the thickness of the die cavity 4 can be adjusted through the movement of the bottom plate 3, the bottom plate 3 and the lower die 2 are convenient to assemble and disassemble, and the demolding is convenient. Meanwhile, the structure is simple, and the processing and the manufacturing are convenient. The shape of the supporting piece 22 is in a sheet shape, and the thickness of the supporting piece 22 is thinner, so that when the lower shaping unit 7 is abutted against the lower die 2, the interval between the lower shaping unit 7 and the bottom plate 3 is very small, and heat transfer is facilitated.
The insert 11 is integrally formed with the upper die 1. The structural strength is enhanced, the service life of the heat insulation plate die device is prolonged, and the heat insulation plate die device is convenient to process and manufacture.
The groove 21 continuously surrounds the peripheral edge of the lower die 2, and the insert 11 continuously surrounds the peripheral edge of the upper die 1. The insert 11 is inserted into the groove 21, the sealing performance of the die cavity 12 is enhanced through the insert 11 and the groove 21 on the periphery of the upper die 1 and the periphery of the lower die 2, the leakage phenomenon of the raw material composition in the die cavity 12 is effectively avoided, and the stability of the heat insulation plate die device is improved.
The foregoing disclosure is illustrative of the present invention and is not to be construed as limiting the scope of the invention, which is defined by the appended claims.
Claims (8)
1. The heat preservation plate mold device is characterized by comprising an upper mold, a lower mold, a bottom plate, at least one upper press and at least one lower press, wherein the upper mold is positioned above the lower mold and the bottom plate, an insert is arranged at the outer edge of the bottom surface of the upper mold, the insert extends to be convex along the direction close to the lower mold, a groove is arranged at the outer edge of the top surface of the lower mold, the insert is inserted into the groove and can move up and down in the groove, the bottom plate is arranged in the lower mold and can move up and down in the lower mold, a mold cavity is formed among the upper mold, the lower mold and the bottom plate, the upper press is propped against the top surface of the upper mold, and the lower press is propped against the bottom surface of the bottom plate;
The heat insulation plate die device further comprises an upper shaping unit, the upper shaping unit is connected to the upper press, the bottom surface of the upper shaping unit is in abutting contact with the top surface of the upper die, the upper shaping unit is provided with a plurality of first pairs of interfaces, a first cavity is formed in the upper shaping unit, and the plurality of first pairs of interfaces are communicated with the first cavity;
The heat preservation board die device further comprises a lower shaping unit, the lower shaping unit is located below the lower die and the bottom plate, the lower shaping unit is provided with at least one perforation, the perforation corresponds to the pressing machine one by one, the pressing machine penetrates through the perforation and abuts against the bottom plate, the lower shaping unit is provided with a plurality of second pairs of interfaces, the second shaping unit is internally provided with a second cavity, and the second pairs of interfaces are all communicated with the second cavity.
2. The heated platen die assembly of claim 1 wherein said first interface is located on a side of said upper shaping unit, said bottom surface of said upper shaping unit having a plurality of first through holes in an array configuration, said plurality of first through holes being in communication with said first cavity.
3. The heated platen die assembly of claim 1 wherein the lower die is placed on and in abutting contact with the lower shaping unit.
4. The heated platen die assembly of claim 1 wherein the bottom surface of the base plate is in abutting contact with the top surface of the lower shaping unit.
5. The heated platen die assembly of claim 1 wherein said second interface is located on a side of said lower shaping unit, a top surface of said lower shaping unit having a plurality of second through holes in an array arrangement, a plurality of said second through holes being in communication with said second cavity.
6. The insulation board mold device of claim 1, further comprising a plurality of brackets, wherein a plurality of brackets abut against the bottom of the lower shaping unit.
7. The insulation board mold device as set forth in claim 1, wherein said lower mold is shaped as a frame structure, a plurality of supporting members are provided at a bottom outer edge of said lower mold, a plurality of said supporting members each extend in a central direction of said lower mold to be convex, and said bottom plate is placed on a plurality of said supporting members.
8. The heated platen die assembly of claim 1 wherein said recess is continuously and uninterrupted around the peripheral edge of said lower die, said insert is continuously and uninterrupted around the peripheral edge of said upper die, and said insert is integrally formed with said upper die.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811509874.4A CN109910147B (en) | 2018-12-11 | 2018-12-11 | Thermal insulation board mould device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811509874.4A CN109910147B (en) | 2018-12-11 | 2018-12-11 | Thermal insulation board mould device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109910147A CN109910147A (en) | 2019-06-21 |
| CN109910147B true CN109910147B (en) | 2024-05-14 |
Family
ID=66959857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811509874.4A Active CN109910147B (en) | 2018-12-11 | 2018-12-11 | Thermal insulation board mould device |
Country Status (1)
| Country | Link |
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| CN (1) | CN109910147B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001328143A (en) * | 2000-05-22 | 2001-11-27 | Fuiisa Kk | Insert molding method and mold |
| JP2003137405A (en) * | 2001-11-01 | 2003-05-14 | Toyo Tire & Rubber Co Ltd | Heat insulating panel manufacturing equipment and heat insulating panel manufacturing method |
| CN201049499Y (en) * | 2007-06-20 | 2008-04-23 | 山东省建筑科学研究院 | Roofing heat-insulating board forming machine |
| CN202114173U (en) * | 2011-03-25 | 2012-01-18 | 杭州余杭钱潮摩擦材料有限公司 | Hot pressing moulding and automatic de-moulding device for brake sheet |
| CN204622288U (en) * | 2015-01-30 | 2015-09-09 | 天津大华创业电力成套设备有限公司 | A kind of warming plate stripper apparatus |
| CN206690415U (en) * | 2017-03-03 | 2017-12-01 | 广西点图包装有限公司 | Cooling shaping mould for plastic products |
| CN209794073U (en) * | 2018-12-11 | 2019-12-17 | 上海圣奎塑业有限公司 | mould device for thermal insulation board |
-
2018
- 2018-12-11 CN CN201811509874.4A patent/CN109910147B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001328143A (en) * | 2000-05-22 | 2001-11-27 | Fuiisa Kk | Insert molding method and mold |
| JP2003137405A (en) * | 2001-11-01 | 2003-05-14 | Toyo Tire & Rubber Co Ltd | Heat insulating panel manufacturing equipment and heat insulating panel manufacturing method |
| CN201049499Y (en) * | 2007-06-20 | 2008-04-23 | 山东省建筑科学研究院 | Roofing heat-insulating board forming machine |
| CN202114173U (en) * | 2011-03-25 | 2012-01-18 | 杭州余杭钱潮摩擦材料有限公司 | Hot pressing moulding and automatic de-moulding device for brake sheet |
| CN204622288U (en) * | 2015-01-30 | 2015-09-09 | 天津大华创业电力成套设备有限公司 | A kind of warming plate stripper apparatus |
| CN206690415U (en) * | 2017-03-03 | 2017-12-01 | 广西点图包装有限公司 | Cooling shaping mould for plastic products |
| CN209794073U (en) * | 2018-12-11 | 2019-12-17 | 上海圣奎塑业有限公司 | mould device for thermal insulation board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109910147A (en) | 2019-06-21 |
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