CN209792167U - Plasma wafer cleaning cavity with uniform airflow - Google Patents

Abstract

The utility model discloses a plasma wafer cleaning cavity with uniform air flow, a plurality of pairs of aluminum pipe groups penetrate between two side walls of a box body, each pair of aluminum pipe groups are arranged adjacently up and down, each aluminum pipe group comprises a plurality of aluminum pipes which are arranged in a straight line, one end of each aluminum pipe is fixed on the inner wall of one side of the box body, the other end of each aluminum pipe penetrates through the other side wall of the box body, and the tail ends of the aluminum pipes are connected through a plate electrode; the front side of the box body is rotatably connected with a box door through a hinge, the free end of the box door is provided with a door lock, the box door is provided with an air inlet pipe, two ends of the horizontal air pipe are respectively connected with a vertical air pipe, and a plurality of holes are uniformly formed in the vertical air pipe; the back of the box body is provided with a vacuumizing tube, the front end of the vacuumizing tube is provided with a baffle plate, and the baffle plate is uniformly provided with a plurality of holes; the inner wall of the box body is provided with a guide rail, and a wafer bracket is movably connected in the guide rail. The wafer cleaning device is reasonable in design structure, easy to maintain, uniform in cleaning, good in cleaning effect and capable of reducing wafer damage.

Description

Plasma wafer cleaning cavity with uniform airflow

Technical Field

The utility model relates to an even plasma wafer of air current washs cavity belongs to plasma cleaning machine technical field.

Background

at present, a plasma cleaning machine is also called a plasma cleaning machine or a plasma surface treatment instrument, which is a brand-new high-technology, and plasma is utilized to achieve the effect which cannot be achieved by a conventional cleaning method. The mechanism of plasma cleaning is mainly based on the 'activation' of active particles in plasma to remove the stains on the surface of an object.

The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; with the increasing integration of integrated circuits, the cleanliness of the surfaces of wafers as raw materials of integrated circuits is also increasing, so that plasma cleaning machines are often used to clean wafers.

The electrode that current plasma cleaning machine adopted is horizontal multilayer electrode plate structure, and this kind of structure is relatively poor to inorganic gas convection property in the cavity, all has certain defect to product treatment effect and homogeneity in the electrode tool. And during air draft and inflation processes, gas quantity is intensively input and output from the air outlet pipe and the air inlet pipe, the pressure ratio is larger, and due to the flat structure, the gas directly sweeps over the wafer on the carrier, and disturbance is fixed on the wafer to cause the vibration of the wafer, so that the wafer is damaged.

SUMMERY OF THE UTILITY MODEL

The purpose is as follows: in order to overcome the defects existing in the prior art, the utility model provides an even plasma wafer cleaning cavity of air current.

The technical scheme is as follows: in order to solve the technical problem, the utility model discloses a technical scheme does:

A plasma wafer cleaning chamber with uniform gas flow comprises: the aluminum pipe groups are arranged adjacently up and down and comprise a plurality of aluminum pipes which are arranged in a straight line, one end of each aluminum pipe is fixed on the inner wall of one side of the box body, the other end of each aluminum pipe penetrates through the other side wall of the box body, and the tail ends of the aluminum pipes are connected through a plate electrode; the front side of the box body is rotatably connected with a box door through a hinge, a door lock is arranged at the free end of the box door, an air inlet pipe is arranged on the box door, the tail end of the air inlet pipe extends out of the back side of the box door, a horizontal air pipe is connected to the side wall of the tail end of the air inlet pipe, two ends of the horizontal air pipe are respectively connected with a vertical air pipe, and a plurality of holes are uniformly formed; the back of the box body is provided with a vacuumizing tube, the front end of the vacuumizing tube is provided with a baffle plate, and the baffle plate is uniformly provided with a plurality of holes; the inner wall of the box body is provided with a guide rail, and a wafer bracket is movably connected in the guide rail.

As the preferred scheme, box one side inner wall is provided with the recess, is provided with the sleeve in the recess, is provided with the through-hole on the other side wall, is provided with the joint in the through-hole, and aluminum pipe one end detachably is connected with the sleeve, and the aluminum pipe other end penetrates from through-hole one end, wears out from the joint other end, and the sealing washer has still been cup jointed in the joint exit, and the sealing washer is fixed mutually through sealed lid with the joint, the sleeve all adopts insulating material with the joint.

Preferably, the bottom of the box body is provided with a positioning block.

Preferably, the box door is provided with an observation window.

Preferably, the gap between the holes is 1-1.5 cm.

Preferably, the aluminum tube sets are arranged in two pairs, and each aluminum tube set comprises 6-10 aluminum tubes.

Has the advantages that: the utility model provides a pair of plasma wafer that air current is even washs cavity, this project organization is reasonable, easy to maintain, wash evenly, reduce the wafer and damage, the cleaning performance is good.

Drawings

Fig. 1 is a schematic structural view of the present invention;

Fig. 2 is a back schematic view of the present invention;

FIG. 3 is a schematic structural view of the front end of the evacuation tube;

FIG. 4 is a schematic view showing the connection of one end of an aluminum pipe;

FIG. 5 is a schematic view showing the connection of the other end of the aluminum pipe.

Detailed Description

the present invention will be further described with reference to the accompanying drawings.

As shown in fig. 1-3, a plasma wafer cleaning chamber with uniform gas flow comprises: the aluminum pipe group 2 comprises a plurality of aluminum pipes 3, the plurality of aluminum pipes 3 are arranged in a straight line, one end of each aluminum pipe 3 is fixed on the inner wall of one side of the box body 1, the other end of each aluminum pipe 3 penetrates through the other side wall of the box body 1, and the tail ends of the aluminum pipes 3 are connected through a plate electrode 4; the front side of the box body 1 is rotatably connected with a box door 5 through a hinge, a door lock is arranged at the free end of the box door 5, an air inlet pipe 6 is arranged on the box door 5, the tail end of the air inlet pipe 6 extends out of the back side of the box door 1, a horizontal air pipe 7 is connected to the side wall of the tail end of the air inlet pipe 6, two ends of the horizontal air pipe 7 are respectively connected with a vertical air pipe 8, and a plurality of holes 9 are uniformly formed; the back of the box body 1 is provided with a vacuumizing tube 10, the front end of the vacuumizing tube 10 is provided with a baffle plate 11, and a plurality of holes 12 are uniformly formed in the baffle plate 11; the inner wall of the box body 1 is provided with a guide rail 13, and a wafer bracket 14 is movably connected in the guide rail 13.

as shown in fig. 4-5, a groove 15 is formed in the inner wall of one side of the box body 1, a sleeve 16 is arranged in the groove 15, a through hole 17 is formed in the other side wall, a clamping joint 18 is arranged in the through hole 17, one end of the aluminum pipe 3 is detachably connected with the sleeve 16, the other end of the aluminum pipe 3 penetrates through one end of the through hole 17 and penetrates out of the other end of the clamping joint 18, a sealing ring 19 is further sleeved at the outlet of the clamping joint 18, the sealing ring 19 and the clamping joint 18 are fixed through a sealing cover 20, and the sleeve 16 and.

Preferably, a positioning block 21 is arranged at the bottom of the box body 1.

Preferably, the door 1 is provided with an observation window 22.

Preferably, the gap between the holes is 1-1.5 cm.

Preferably, the aluminum pipe groups 2 are arranged in two pairs, and the aluminum pipe groups 2 are composed of 6 to 10 aluminum pipes 3.

When the vacuum box is used, wafers are respectively placed into the wafer bracket, the box door and the box body are sealed, the vacuum pump vacuumizes the box body through the vacuum tube arranged on the back face of the box body, and the baffle is arranged at the front end of the vacuum tube and is provided with small tight holes, so that too large disturbance can not be generated to air flow in the box body. In addition, argon and hydrogen are injected from the box door air inlet pipe, the air inlet pipe is respectively distributed into the vertical air pipes after passing through the horizontal air pipes, the positions of the holes formed in the vertical air pipes correspond to the positions between each pair of aluminum pipe groups, and the number of the holes is large, so that a large amount of reaction gas is subjected to partial pressure and concentrated delivery to the aluminum pipe groups, and the disturbance of air flow to light-weight wafers is further reduced. At the moment, the two electrode plates of each pair of aluminum tube groups are respectively connected with radio frequency and grounded, the mixed gas between each pair of aluminum tube groups is fully ionized, and because the aluminum tubes are provided with gaps, ionized plasma can freely flow in the whole box body to clean wafers on the bracket, so that the cleaning effect and the uniformity of products are improved.

Meanwhile, the aluminum pipe detachable structure is adopted in the design, one end of the aluminum pipe is fixed in the sleeve in the inner wall of one side of the box body through threads, the other end of the aluminum pipe is fixed with the side wall of the box body through the clamping joint, and the sleeve and the clamping joint are made of insulating materials and used for ensuring mutual insulation between the aluminum pipe and the box body. In addition, the gap between the aluminum pipe and the through hole is sealed through a clamping joint, and the gap between the clamping joint and the aluminum pipe is sealed through a sealing ring, so that the air tightness of the box body is ensured. And the clamping head, the sealing ring and the sealing cover are connected in a detachable mode such as clamping and the like, so that later-stage maintenance and replacement are facilitated.

The above description is only a preferred embodiment of the present invention, and it should be noted that: for those skilled in the art, without departing from the principle of the present invention, several improvements and modifications can be made, and these improvements and modifications should also be considered as the protection scope of the present invention.

Claims (6)

1. A plasma wafer cleaning chamber with uniform gas flow comprises: the box, its characterized in that: a plurality of pairs of aluminum pipe groups penetrate through two side walls of the box body, each pair of aluminum pipe groups are arranged adjacently up and down, each aluminum pipe group comprises a plurality of aluminum pipes which are arranged in a straight line, one ends of the aluminum pipes are fixed on the inner wall of one side of the box body, the other ends of the aluminum pipes penetrate through the other side wall of the box body, and the tail ends of the aluminum pipes are connected through electrode plates; the front side of the box body is rotatably connected with a box door through a hinge, a door lock is arranged at the free end of the box door, an air inlet pipe is arranged on the box door, the tail end of the air inlet pipe extends out of the back side of the box door, a horizontal air pipe is connected to the side wall of the tail end of the air inlet pipe, two ends of the horizontal air pipe are respectively connected with a vertical air pipe, and a plurality of holes are uniformly formed; the back of the box body is provided with a vacuumizing tube, the front end of the vacuumizing tube is provided with a baffle plate, and the baffle plate is uniformly provided with a plurality of holes; the inner wall of the box body is provided with a guide rail, and a wafer bracket is movably connected in the guide rail.

2. The plasma wafer cleaning chamber of claim 1, wherein: the inner wall of one side of the box body is provided with a groove, a sleeve is arranged in the groove, a through hole is formed in the other side wall, a clamping joint is arranged in the through hole, one end of an aluminum pipe is detachably connected with the sleeve, the other end of the aluminum pipe penetrates into the through hole from one end of the through hole and penetrates out from the other end of the clamping joint, a sealing ring is further sleeved at the outlet of the clamping joint and is fixed with the clamping joint through a sealing cover, and the sleeve and the clamping.

3. The plasma wafer cleaning chamber of claim 1, wherein: and a positioning block is arranged at the bottom of the box body.

4. the plasma wafer cleaning chamber of claim 1, wherein: and an observation window is arranged on the box door.

5. the plasma wafer cleaning chamber of claim 1, wherein: the gap between the holes is 1-1.5 cm.

6. The plasma wafer cleaning chamber of claim 1, wherein: the aluminum tube sets are arranged in two pairs and consist of 6-10 aluminum tubes.