CN209784267U - Ultrasonic flaw detection equipment and system based on SPI data transparent transmission - Google Patents
Ultrasonic flaw detection equipment and system based on SPI data transparent transmission Download PDFInfo
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- CN209784267U CN209784267U CN201920532665.5U CN201920532665U CN209784267U CN 209784267 U CN209784267 U CN 209784267U CN 201920532665 U CN201920532665 U CN 201920532665U CN 209784267 U CN209784267 U CN 209784267U
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Abstract
The utility model provides an ultrasonic flaw detection equipment based on SPI data passes through, it is including the wireless communication module who connects gradually, SPI data passes through pass module and digital logic control module, wireless communication module passes through the first serial communication bus with SPI data and is connected, SPI data passes through pass module and digital logic control module and passes through second serial communication bus and be connected, first serial communication bus is used for passing module transmission data information to SPI data, SPI data passes through the module and converts data information into the second transmission standard by first transmission standard, second serial communication bus is used for passing module and digital logic control module through SPI data and establishes the principal and subordinate relation. The utility model also provides an ultrasonic flaw detection system based on SPI data passes thoroughly, adopts the little, the small digital logic control module of capacity that does not have built-in treater, has both ensured the original data transmission rate of product, can make portable micro-design again.
Description
Technical Field
The utility model relates to an industry field of detecting a flaw especially relates to an ultrasonic flaw detection equipment and system based on SPI data passes through.
Background
Along with the rapid development of the industrial modernization process, the importance of industrial ultrasonic flaw detection is more and more emphasized, and the ultrasonic flaw detection is widely applied to the detection field of the modernization industry. In most industrial measurement control applications, data transparent transmission is a very important link in digital signal processing, a data acquisition end of an ultrasonic flaw detection device generally controls an ultrasonic probe to generate an ultrasonic signal through a digital logic control module, but the digital logic control module adopts an expensive chip with a large-capacity and large-volume processor, so that the circuit structure of the data acquisition end is complicated, the miniaturization design of ultrasonic detection equipment is not facilitated, and the carrying of the ultrasonic flaw detection device is also inconvenient.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model aims at providing an ultrasonic flaw detection check out test set and system based on SPI data pass through has adopted serial communication's communication mode, utilizes serial communication's extensive suitability, the simple and high characteristics of data transmission rate of agreement, makes the ultrasonic flaw detection check out test set based on SPI data pass through improve data acquisition efficiency and accuracy in ultrasonic flaw detection, also makes the high performance-price ratio and the portability height of ultrasonic flaw detection check out test set based on SPI data pass through simultaneously.
For solving above-mentioned technical problem, on the one hand, the utility model provides an ultrasonic flaw detection check out test set based on SPI data passes through, pass through module and digital logic control module including wireless communication module, SPI data that connect gradually, wireless communication module with SPI data passes through the module and passes through first serial communication bus connection, SPI data pass through the module with digital logic control module passes through second serial communication bus connection, first serial communication bus be used for to SPI data pass through the module and send data information, SPI data pass through the module will data information converts the second transmission standard into by first transmission standard, second serial communication bus be used for with SPI data pass through the module with digital logic control module establishes the principal and subordinate's relation.
As a further improvement of the above technical solution, the SPI data transparent transmission module includes a peripheral circuit, a first serial bus port, and a second serial bus port.
As a further improvement of the above technical solution, the SPI data transparent transmission module employs an FT232H chip, the first serial bus port employs a USB port, and the second serial bus port employs an SPI port.
As a further improvement of the above technical solution, the peripheral circuit includes a reset circuit, a crystal oscillator circuit, and a power supply circuit, the reset circuit is configured to restore the peripheral circuit to an initial state, the crystal oscillator circuit is configured to provide a synchronous clock signal to the SPI data transparent transmission module, and the power supply circuit is configured to provide a driving power supply to the SPI data transparent transmission module.
As a further improvement of the above technical solution, the SPI data transparent transmission module further includes a data conversion unit and a control unit, the data conversion unit is configured to convert data information of the first transmission standard and data information of the second transmission standard to each other, and the control unit is configured to control transmission of the data information.
As a further improvement of the above technical solution, the wireless communication module adopts a WIFI module with an MT7628 chip, and the WIFI module further includes a first serial bus port and a WIFI antenna for receiving or sending a wireless WIFI signal.
As a further improvement of the above technical solution, the digital logic control module includes a second serial bus port and an input/output port for data signals, and the digital logic control module is configured to perform logic control on the data signals.
As a further improvement of the above technical solution, the digital logic control module is further connected to an ultrasonic probe through the input/output port, and the ultrasonic probe is configured to generate an ultrasonic signal and receive the reflected ultrasonic signal.
As a further improvement of the above technical solution, the digital logic control module adopts a 10AX016C3U19 chip with a model number of U20.
on the other hand, the utility model also provides an ultrasonic flaw detection system based on SPI data passes through, including above-mentioned ultrasonic flaw detection check out test set and the long-range end based on SPI data passes through, the long-range end with ultrasonic flaw detection check out test set based on SPI data passes through communication connection is established to wireless communication module.
The utility model provides a pair of ultrasonic flaw detection equipment and system based on SPI data passes through, through wireless communication module with increase between the digital logic control module SPI data passes through the module, wireless communication module with SPI data passes through the module and passes through first serial communication bus connects, SPI data pass through the module with digital logic control module passes through second serial communication bus connects, has improved data information and is in based on the speed of SPI internal transmission, makes digital logic control module can miniaturized design, reduces digital processing logic module's size makes the circuit design of detection device that detects a flaw simpler, makes ultrasonic flaw detection equipment portable based on SPI data passes through has improved work efficiency.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a block diagram of the ultrasonic flaw detection apparatus based on SPI data transparent transmission of the present invention;
Fig. 2 is a block diagram of the ultrasonic flaw detection system based on SPI data transparent transmission of the present invention;
Fig. 3 is a circuit structure diagram of the wireless communication module of the present invention;
fig. 4 is a block diagram of the SPI data transparent transmission module of the present invention;
Fig. 5 is a circuit structure diagram of the SPI data transparent transmission module of the present invention;
Fig. 6 is the utility model discloses a structural schematic diagram of the master-slave relation of SPI data pass through module and digital logic control module.
Description of main component symbols:
100-ultrasonic flaw detection equipment based on SPI data transparent transmission; 110-a wireless communication module; 120-SPI data transparent transmission module; 130-digital logic control module; 140-a first serial communication bus; 150-a second serial communication bus; 160-first serial bus port; 170-a second serial bus port; 180-a reset circuit; 190-crystal oscillator circuit; 200-a power supply circuit; 210-a WIFI antenna; 220-input-output port; 230-an ultrasound probe; 300-an ultrasonic flaw detection system based on SPI data transparent transmission; 400-remote end.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1, the utility model provides an ultrasonic flaw detection equipment 100 based on SPI data passes through, pass through module 120 and digital logic control module 130 including wireless communication module 110, SPI data that connect gradually, wireless communication module 110 with SPI data passes through module 120 and connects through first serial communication bus 140, SPI data pass through module 120 with digital logic control module 130 passes through second serial communication bus 150 and connects, first serial communication bus 140 be used for to SPI data pass through module 120 and send data message, SPI data pass through module 120 will data message converts the second transmission standard into by first transmission standard, second serial communication bus 150 is used for with SPI data pass through module 120 with digital logic control module 130 establishes the master-slave relation.
Referring to fig. 3, in the present embodiment, the wireless communication module 110 is a WIFI module, the SPI data transparent transmission module 120 has circuits and chips with data processing function, signal conversion function, and the like, the SPI data transparent transmission module 120 is equivalent to a microprocessor, has the characteristics of small volume, light weight, easy modularization and the like, the SPI data transparent transmission module 120 adopts an FT232H chip with a model number of U24, the first serial bus port 160 is a USB port, the second serial bus port 170 is an SPI port, the wireless communication module 110 adopts a WIFI module of MT7628 chip model U29, the WIFI module further includes a first serial bus port 160 and a WIFI antenna 210 for receiving or transmitting WIFI signals, the second transmission standard adopts a USB (Universal Serial bus) bus protocol, and the second transmission standard adopts an SPI (Serial Peripheral interface) bus protocol. The USB standard comprises transmission modes of control transmission, block transmission, terminal transmission and synchronous transmission, wherein the control transmission comprises control information required by transmission, is used for initial setting of equipment, has the characteristics of safe and reliable communication, and only needs a narrower bandwidth. The block transmission transmits data according to data packets, can occupy the whole bandwidth of the bus, and the safety of data transmission is ensured by the bus. The interrupt transmission is repeated according to a certain period, and the period length can be freely defined by a driver. The synchronous transmission has a method that enables the use of a fixed predefined bandwidth, which transmission mode is most suitable in case a continuous data stream needs to be ensured, but in case of occasional data loss. The wireless communication module 110 is connected to the SPI data transparent transmission module 120 through the first serial communication bus 140, and at least one of the four different transmission modes is adopted according to actual needs, so that reliability and stability of transmission of the data information in the wireless communication module 110 and the SPI data transparent transmission module 120 are ensured.
The wireless communication module 110 may establish a wireless connection with a processing terminal, such as a PAD, a notebook computer, etc., the digital logic control module 130 mainly employs a Field Programmable Gate Array (FPGA) that employs a logic cell array, the FPGA includes three parts, namely a configurable logic module, an input/output module, and an internal connection line, the field programmable gate array implements combinational logic by using small lookup tables, each lookup table is connected to an input terminal of a flip-flop, the flip-flop drives other logic circuits or drives I/O, thereby forming basic logic units that implement combinational logic functions and sequential logic functions, the logic units are connected to each other or to the I/O units by using metal wires, the digital logic control module 130 further implements by loading programming data into an internal static storage unit, the values stored in the memory unit determine the logical function of the logic unit and the way in which the modules are connected to each other or to the I/O. The digital logic control module 130 has the characteristics of no built-in processor and small capacity, and the digital logic control module 130 only performs simple digital logic control, such as bridging, digital filtering and the like, so that the size of the digital logic control module 130 can be reduced, and the size of the ultrasonic flaw detection equipment 100 based on the SPI data transmission is also reduced.
In addition, the first serial communication bus 140 is a USB bus, the second serial communication bus 150 is an SPI bus, main pins of the SPI bus include an SCK pin, a DI pin, a DO pin, and chip select pins CS0, CS1, and CS2, the SCK is used for outputting a synchronous clock in one direction, the DI is used for inputting data in one direction, the chip select pin CSn (n is 0, 1, 2) is used for selecting a device, and basic operation elements of the four-wire serial port include: chip selection, chip selection ending, bit output and bit input. The chip select is defined as that a chip select pin CSn outputs an active level (which can be defined as a high level or a low level), the chip select end is defined as that the chip select pin CSn outputs a non-active level, the bit output is defined as that when SCK is at a low level, DO outputs bit data, SCK outputs a high level pulse, the bit input is defined as that SCK outputs a high level pulse, the DI inputs bit data after a falling edge, the byte output is defined as 8 bits output, the byte input is defined as 8 bits input, the data input and output of a 4-wire serial port take a byte as a unit, each byte contains 8 bits, and the low bit and the high bit are supported to be in front. It will be appreciated that the SPI bus is high speed. Full duplex, synchronous communication bus, only occupy four lines on the pin of SPI bus chip again, practiced thrift the pin of chip also saves space for follow-up overall arrangement on the circuit board, has simplified circuit design to a certain extent, has reduced the design cost of SPI data passthrough-based ultrasonic inspection check out test set 100.
Referring to fig. 6, it should be noted that the SPI data transparent transmission module 120 is connected to the digital logic control module 130 through the second serial communication bus 150, the SPI data transparent transmission module 120 and the digital logic control module 130 establish a master-slave relationship, that is, the SPI data transparent transmission module 120 is a master, the digital logic control module 130 is a slave, the second serial communication bus 150 is an SPI bus, the SPI bus includes four signal lines of a clock (SOICLK, SCLK), a Chip Select (CS) master output, a slave input (MOSI) master input, and a slave output (MISO), a device generating a clock signal is the SPI data transparent transmission module 120, data transmitted between the master and the slave is synchronous with the clock generated by the master, the SPI bus supports a higher clock frequency, and the chip select signal from the master is used for selecting a slave, namely, a low level effective signal, and when the slave is pulled high, the slave is disconnected with the SPI and the bus. When multiple slaves are used, the master needs to provide a separate chip select signal for each slave, which is always an active low signal. The transmission rate of the SPI bus is 50Mbps, and the transmission rate of the USB bus is 480 Mb/S. The SPI data transparent transmission module 120 further converts the data information output by the first serial communication bus 140 into the data information output by the second serial communication bus 150, where the data information may include a test instruction at a processing end, such as a notebook computer, or may also include a reflected ultrasonic signal, a reflected voltage signal, and the like, and the SPI data transparent transmission module 120 establishes a master-slave relationship with the digital logic control module 130, thereby improving the efficiency of data transmission.
further, the SPI data transparent module 120 includes a peripheral circuit, a first serial bus port 160 and a second serial bus port 170.
Specifically, the first serial bus port 160 is used for connecting the wireless communication module 110, the second serial bus port 170 is used for connecting the digital logic control module 130, the first serial bus port 160 adopts a USB port, the peripheral circuit can be used for converting between analog signals and digital signals, and the circuit can be initialized, so as to ensure the accuracy of input and output of control signals. The second serial bus port 170 is an SPI port, the USB port can be powered on during data transmission, so that the reliability of data transmission is improved, the SPI port is used for establishing a master-slave relationship, the data transmission rate is increased, and the data acquisition efficiency and the data transmission efficiency of the ultrasonic flaw detection device 100 based on the SPI data transparent transmission are improved.
Further, the peripheral circuit includes a reset circuit 180, a crystal oscillator circuit 190 and a power supply circuit 200, the reset circuit 180 is configured to restore the peripheral circuit to an initial state, the crystal oscillator circuit 190 is configured to provide a synchronous clock signal to the SPI data transparent transmission module 120, and the power supply circuit 200 is configured to provide a driving power supply to the SPI data transparent transmission module 120.
Referring to fig. 4 and 5, the reset circuit 180 is configured to restore the peripheral circuit to an initial state, the reset mode of the reset circuit 180 includes a manual button reset, a power-on reset, and an integral power-on reset, and the reset circuit 180 may be composed of a capacitor and an inductor. It should be noted that the above reset mode can be flexibly selected according to actual situations. The crystal oscillator circuit 190 may be a quartz crystal oscillator composed of a capacitor and a quartz wafer, and the crystal oscillator circuit 190 generates an oscillation current in the circuit to send out a clock signal, and is a crystal capable of converting electric energy and mechanical energy into each other to work in a resonance state to provide stable and accurate single-frequency oscillation. Crystal oscillator circuit 190 has improved ultrasonic flaw detection check out test set 100's based on SPI data passes through accuracy of data acquisition, power supply circuit 200 does SPI data passes through module 120 and improves the power supply who inserts to the circuit board, power supply circuit 200 can comprise big electric capacity, SPI data passes through module 120 and reaches rated voltage through handling, if convert the voltage 5V of input into 3.3V, makes SPI data passes through module 120 and is in normal operating condition, thereby reduces ultrasonic flaw detection check out test set 100's based on SPI data passes through the consumption.
Further, the SPI data transparent transmission module 120 further includes a data conversion unit and a control unit, the data conversion unit is configured to convert data information of the first transmission standard and data information of the second transmission standard into each other, and the control unit is configured to control transmission of the data information.
Taking flaw detection of a weld of a workpiece as an example, the data conversion unit may convert the ultrasonic signal fed back by the digital logic control module 130 into a digital signal, which is convenient to store in the storage unit of the SPI data transparent transmission module 120, and the peripheral circuit is convenient to amplify, gain, attenuate and the like the digital signal, thereby obtaining an ultrasonic signal meeting requirements, so that the ultrasonic signal is clearly displayed at the processing end, and a tester can visually know the current detection result data. The control unit may implement interconversion between the first transmission standard and the second transmission standard, the control unit mainly includes an encoding unit and a decoding unit, it can be understood that each network has a respective information communication mode inside, when two networks or hardware need to communicate with each other, if the communication modes of the other networks are not identified, the two networks or hardware cannot communicate with each other, and the control unit is used for protocol conversion to establish real-time communication in the ultrasonic flaw detection apparatus 100 based on SPI data transparent transmission.
In this embodiment, when a signal is transmitted from the wireless communication module 110 to the digital logic control module 130, the SPI data pass-through module 120 converts the data information of the first transmission standard into the data information of the second transmission standard, that is, converts the information of the USB port standard into the information of the SPI port; when a signal is transmitted from the digital logic control module 130 to the wireless communication module 110, the SPI data pass-through module 120 converts the data information of the second transmission standard into the data information of the first transmission standard, that is, converts the data information of the SPI port standard into the information of the USB port standard.
further, the digital logic control module 130 includes a second serial bus port 170 and an input/output port 220 for data signals, and the digital logic control module 130 is configured to perform logic control on the data signals.
The digital logic control module 130 adopts a 10AX016C3U19 chip with a model number of U20, the digital logic control module 130 includes an SPI port and an input/output port 220 for data signals, and the logic control of the digital logic control module 130 may be signal generation, connection with other devices, filtering function, and the like.
Further, the digital logic control module 130 is also connected to an ultrasonic probe 230 through the input/output port 220, and the ultrasonic probe 230 is configured to generate an ultrasonic signal and receive the reflected ultrasonic signal.
In this embodiment, the digital logic control module 130 is connected to the ultrasonic probe 230 through the input/output port 220, so that the ultrasonic testing apparatus 100 based on SPI data transmission and the ultrasonic probe 230 are combined to form a data acquisition end of the ultrasonic testing apparatus, the digital logic control module 130 can control the ultrasonic probe 230 to generate an ultrasonic signal, the ultrasonic probe 230 is a transducer that utilizes a piezoelectric effect of a material to realize conversion between electric energy and sound energy, and a main component of the ultrasonic probe 230 is a single crystal or polycrystalline sheet with a piezoelectric effect, which can realize conversion between electric energy and sound energy.
In this embodiment, the i/o port 220 of the digital logic control module 130 controls generation, after processing (logic control, bridging, digital filtering, etc.) of the digital logic control module 130, the processed ultrasonic signal is sent from the second serial bus port 170 to the SPI data transparent transmission module 120 through the second serial communication bus 150, the SPI data transparent transmission module 120 receives the processed ultrasonic signal through the second serial bus port 170 and converts the processed ultrasonic signal from an SPI transmission standard into data information of a USB transmission standard, and then sends the data information to the wireless communication module 110 through the first serial bus port 160 of the SPI data transparent transmission module 120, and the wireless communication module 110 modulates the data information on a radio frequency carrier signal and sends the data information through the radio frequency carrier signal, the data is transmitted to other receiving equipment (such as a computer, a notebook computer, a PAD, etc.) for analysis and processing, so that the position and the size of the welding seam of the workpiece can be determined.
The utility model also provides an ultrasonic flaw detection system 300 based on SPI data passes through, including above-mentioned ultrasonic flaw detection check out test set 100 and the long-range end 400 based on SPI data passes through, long-range end 400 with ultrasonic flaw detection check out test set 100 based on SPI data passes through communication connection is established to wireless communication module 110.
Referring to fig. 2, in particular, the SPI data transparent transmission-based ultrasonic flaw detection system 300 includes the SPI data transparent transmission-based ultrasonic flaw detection device 100, the ultrasonic probe 230, and the remote end 400, and it can be understood that the ultrasonic probe 230 and the SPI data transparent transmission-based ultrasonic flaw detection device 100 may form an ultrasonic detection end of the SPI data transparent transmission-based ultrasonic flaw detection system 300, the remote end may be a processing end of the SPI data transparent transmission-based ultrasonic flaw detection system 300, the remote end 400 may include a WIFI module, a touch screen, a processor, and a memory, the remote end 400 may send a test command to the ultrasonic detection end through the WIFI module, the wireless communication module 110 receives the test command, and since the digital logic control module 130 in the SPI data transparent transmission-based ultrasonic flaw detection device 100 has no internal processing unit, the SPI data pass-through module 120 has a chip and a peripheral circuit with a data processing function, and can be designed to a certain extent to the ultrasonic flaw detection device 100 based on SPI data pass-through, and also can be designed as an ultrasonic detection end with a portable data scanning and data acquisition function, so that the detection range is effectively enlarged, and the working efficiency of the ultrasonic flaw detection device 100 based on SPI data pass-through is also improved.
In specific application, taking a weld of a workpiece as an example, a tester places the ultrasonic flaw detection device 100 based on SPI data transparent transmission at the weld of the workpiece, adjusts the communication connection between the remote terminal 400 and the ultrasonic flaw detection device 100 based on SPI data transparent transmission, presses a button of a test instruction on a touch screen of the remote terminal 400, the wireless communication module 110 receives the test instruction, obtains data information after processing, and transmits the data information to the SPI data transparent transmission module 120 through the first serial communication bus 140 by the first serial bus port 160, the SPI data transparent transmission module 120 converts the data information of the first transmission standard into the data information of the second transmission standard and transmits the data information to the digital logic control module 130 through the second serial communication bus 150, the digital logic control module 130 controls the ultrasonic probe 230 to generate a corresponding ultrasonic signal according to the data information, the workpiece reflects the ultrasonic signal to the ultrasonic probe 230, and the ultrasonic probe 230 feeds the ultrasonic signal back to the digital logic control module 130, and the processing of the ultrasonic signal is the same as the ultrasonic processing process in the ultrasonic flaw detection apparatus 100 based on the SPI data transparent transmission, and details are not repeated here.
The utility model provides a pair of ultrasonic flaw detection equipment and system based on SPI data pass through, through increase the SPI data pass through module 120 between wireless communication module 110 and digital logic control module 130, wireless communication module 110 passes through module 120 with SPI data pass through module 120 and is connected through first serial communication bus 140, SPI data pass through module 120 and digital logic control module 130 pass through second serial communication bus 150 and is connected, improve the speed that data information is in ultrasonic flaw detection equipment 100 based on SPI data pass through internal transmission, make digital logic control module 130 can the miniaturized setting, reduce the size of digital logic control module 130, make the circuit design of ultrasonic flaw detection equipment 100 based on SPI data pass through simpler, reduce the cost of ultrasonic flaw detection equipment 100 based on SPI data pass through simple design, the working efficiency of the ultrasonic flaw detection system 300 based on the SPI data transparent transmission is also improved.
the above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention should be covered by the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. The utility model provides an ultrasonic flaw detection equipment based on SPI data passes through which characterized in that: the wireless communication module is connected with the SPI data transparent transmission module through a first serial communication bus, the SPI data transparent transmission module is connected with the digital logic control module through a second serial communication bus, the first serial communication bus is used for sending data information to the SPI data transparent transmission module, the SPI data transparent transmission module converts the data information from a first transmission standard into a second transmission standard, and the second serial communication bus is used for establishing a master-slave relationship between the SPI data transparent transmission module and the digital logic control module.
2. The ultrasonic flaw detection equipment based on the SPI data transparent transmission according to claim 1, characterized in that: the SPI data transparent transmission module comprises a peripheral circuit, a first serial bus port and a second serial bus port.
3. The ultrasonic flaw detection equipment based on the SPI data transparent transmission according to claim 2, characterized in that: the SPI data transparent transmission module adopts an FT232H chip, the first serial bus port adopts a USB port, and the second serial bus port adopts an SPI port.
4. the ultrasonic flaw detection equipment based on the SPI data transparent transmission according to claim 2, characterized in that: the peripheral circuit comprises a reset circuit, a crystal oscillator circuit and a power supply circuit, wherein the reset circuit is used for restoring the peripheral circuit to an initial state, the crystal oscillator circuit is used for providing synchronous clock signals for the SPI data transparent transmission module, and the power supply circuit is used for providing driving power for the SPI data transparent transmission module.
5. The ultrasonic flaw detection equipment based on the SPI data transparent transmission according to claim 3, characterized in that: the SPI data transparent transmission module further comprises a data conversion unit and a control unit, wherein the data conversion unit is used for mutual conversion between the data information of the first transmission standard and the data information of the second transmission standard, and the control unit is used for controlling the transmission of the data information.
6. The ultrasonic flaw detection equipment based on the SPI data transparent transmission according to claim 1, characterized in that: the wireless communication module adopts a WIFI module of an MT7628 chip, and the WIFI module further comprises a first serial bus port and a WIFI antenna for receiving or sending wireless WIFI signals.
7. The ultrasonic flaw detection equipment based on the SPI data transparent transmission according to claim 1, characterized in that: the digital logic control module comprises a second serial bus port and an input/output port of a data signal, and is used for carrying out logic control on the data signal.
8. The ultrasonic flaw detection equipment based on the SPI data transparent transmission according to claim 7, characterized in that: the digital logic control module is also connected with an ultrasonic probe through the input/output port, and the ultrasonic probe is used for generating ultrasonic signals and receiving the reflected ultrasonic signals.
9. The ultrasonic flaw detection equipment based on the SPI data transparent transmission according to claim 1, characterized in that: the digital logic control module adopts a 10AX016C3U19 chip with the model number of U20.
10. The utility model provides an ultrasonic flaw detection system based on SPI data passes through, its characterized in that includes: the SPI data transmission-based ultrasonic flaw detection device of any one of claims 1-9 and a remote end, wherein the remote end is in communication connection with the SPI data transmission-based ultrasonic flaw detection device through the wireless communication module.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114338393A (en) * | 2021-12-28 | 2022-04-12 | 深圳市汇川技术股份有限公司 | Transmission method, transparent transmission equipment, device, communication system and medium for upgrade data |
| CN114691580A (en) * | 2020-12-28 | 2022-07-01 | 格科微电子（上海）有限公司 | Integrated circuit, digital circuit module, chip, camera and electronic information device |
-
2019
- 2019-04-18 CN CN201920532665.5U patent/CN209784267U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114691580A (en) * | 2020-12-28 | 2022-07-01 | 格科微电子（上海）有限公司 | Integrated circuit, digital circuit module, chip, camera and electronic information device |
| CN114338393A (en) * | 2021-12-28 | 2022-04-12 | 深圳市汇川技术股份有限公司 | Transmission method, transparent transmission equipment, device, communication system and medium for upgrade data |
| CN114338393B (en) * | 2021-12-28 | 2024-04-26 | 深圳市汇川技术股份有限公司 | Upgrade data transmission method, transparent transmission device, apparatus, communication system and medium |
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