CN209774864U

CN209774864U - IC packaging installation device

Info

Publication number: CN209774864U
Application number: CN201920381189.1U
Authority: CN
Inventors: 谢增雄; 郑雷
Original assignee: Jiangsu Jurun Silicon Valley New Materials Technology Co Ltd
Current assignee: Jiangsu Jurun Silicon Valley New Materials Technology Co Ltd
Priority date: 2019-03-25
Filing date: 2019-03-25
Publication date: 2019-12-13
Anticipated expiration: 2029-03-25

Abstract

The utility model discloses a IC encapsulation installation device, including die holder, stock guide, side sword terrace die and upper die base, there is the die backing plate top through screw fixed mounting, there is the stock guide in die top both sides through screw fixed mounting respectively, IC strip material has been placed between the stock guide, there is the terrace die backing plate at upper die base below center through screw fixed mounting, there is punch plate below through screw fixed mounting, the terrace die is installed through pegging graft in the terrace die backing plate center, the side sword terrace die is installed through pegging graft in the terrace die backing plate both sides. The utility model discloses an install the stock guide above the die for IC strip material is leading at the eager muscle forming process automation and just can not take place the incline, prevents to form the burr or chip crackle appear after the mould excision, leads to the chip to scrap, has guaranteed simultaneously through increasing the side sword terrace die and has advanced the unanimity of apart from, accomplishes the distance effect.

Description

IC packaging installation device

Technical Field

The utility model relates to an electronic packaging technical field specifically is a IC encapsulation installation device.

Background

Packaging is a technique for packaging integrated circuits with an insulating plastic or ceramic material. Packaging is essential to the chip and also critical. Because the chip must be isolated from the outside to prevent the electrical performance degradation caused by the corrosion of the chip circuit by impurities in the air. On the other hand, the packaged chip is more convenient to mount and transport. The quality of the packaging technology is also of great importance since it directly affects the performance of the chip itself and the design and manufacture of the PCB (printed circuit board) to which it is connected.

However, there are some disadvantages in the conventional IC packaging process, such as:

1. In the traditional IC packaging rib cutting forming process, a die is used for cutting off a dam between outer pins of a lead frame and a part of process connected with the frame edge, when a row of IC strips are installed on the die, the IC strips are prone to deflection, and chip cracks can be generated due to the fact that burrs are formed seriously after the die is cut off, and therefore chips are scrapped.

2. A positioning device for controlling the advancing distance of the IC strip materials in rows in the rib cutting forming process is provided with a guide pin and a material blocking pin, but when the strip materials are very thin, the material blocking pin can crush the edge of the strip materials to cause chip scrapping.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a IC encapsulation installation device to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: an IC packaging installation device comprises a lower die holder, a material guide plate, a side edge male die and an upper die holder, wherein guide posts are fixedly installed at four corners above the lower die holder through welding, a female die backing plate is fixedly installed at the center above the lower die holder through a screw, a female die is fixedly arranged above the female die base plate through screws, guide plates are fixedly arranged on two sides above the female die through screws respectively, IC strip materials are placed between the material guide plates, a convex die base plate is fixedly arranged at the center below the upper die base through screws, a male die fixing plate is fixedly arranged below the male die base plate through screws, rubber is fixedly arranged below the male die fixing plate through screws, the rubber lower part is fixedly provided with a stripper plate through screws, the center of the punch plate is provided with a punch through insertion, and two sides of the punch plate are provided with side-edge punches through insertion.

Furthermore, a guide sleeve is fixedly installed at the position, corresponding to the guide pillar, of the upper die base through welding, and the upper die base and the lower die base move relatively through the guide pillar and the guide sleeve.

Further, the length of a side edge of the side edge male die is the same as the feeding distance of the IC strip material, the side edge male dies are respectively arranged on two sides of the male die fixing plate, and the distance between the two side edge male dies is the same as the feeding distance of the IC strip material.

Further, the male die and the side-edge male die penetrate through the rubber and the discharging plate, and the bottoms of the male die and the side-edge male die are flush with the bottom of the discharging plate.

Further, the distance between the material guide plates is the same as the width of the IC strip material, and the height of the material guide plates is 1-2mm higher than that of the IC strip material.

furthermore, a blanking port is arranged at the lower die holder, the die base plate and the die under the side edge convex die corresponding to the side edge convex die.

Compared with the prior art, the beneficial effects of the utility model are that:

1. The utility model discloses an install the stock guide above the die for IC strip material is leading at the eager muscle forming process in automation and just can not take place the incline, prevents to form the burr or chip crackle from appearing after the mould excision, leads to the chip to scrap.

2. The utility model discloses an increase the side sword terrace die and guaranteed to advance the unanimity apart from, accomplish the distance effect, avoided using the guide round pin to crush the strip material simultaneously, lead to the condemned problem of chip.

Drawings

FIG. 1 is a front view of the overall structure of the present invention;

FIG. 2 is a left side view of the overall structure of the present invention;

FIG. 3 is a top view of the overall structure of the present invention;

Fig. 4 is a front view of the IC strip of the present invention.

in FIGS. 1-4: 1-a lower die holder; 2-guide pillar; 3-a die backing plate; 4-a material guide plate; 5, unloading a plate; 6-rubber; 7-side edge punch; 8-a male die fixing plate; 9-a male die; 10-a male die backing plate; 11-an upper die holder; 12-a female die; 13-IC strip.

Detailed Description

the technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

referring to fig. 1-4, the present invention provides a technical solution: an IC packaging installation device comprises a lower die holder 1, guide plates 4, side edge convex dies 7 and an upper die holder 11, wherein guide posts 2 are fixedly installed at four corners above the lower die holder 1 through welding, a concave die base plate 3 is fixedly installed at the center above the lower die holder 1 through screws, a concave die 12 is fixedly installed above the concave die base plate 3 through screws, the guide plates 4 are respectively fixedly installed at two sides above the concave die 12 through screws, the guide plates play a role in guiding an IC strip material 13 during feeding, the IC strip material is not deviated during feeding, an IC strip material 13 is placed between the guide plates 4, a convex die base plate 10 is fixedly installed at the center below the upper die holder 11 through screws, a convex die fixing plate 8 is fixedly installed below the convex die base plate 10 through screws, rubber 6 is fixedly installed below the convex die fixing plate 8 through screws, the upper die is used for continuously descending the upper die after a discharging plate 5 is contacted with the guide plates 4, the rib cutting process is convenient, the center of the punch retainer plate 8 is provided with a punch 9 in an inserting manner, the two sides of the punch retainer plate 8 are provided with side-edge punches 7 in an inserting manner, the side-edge punches 7 can block the IC strip 13 when the IC strip 13 is fed forwards after a process is finished, the spacing effect is finished, and the side-edge punches 7 can be lifted up along with the upper die after the rib cutting forming is finished, so that the IC strip is continuously fed.

the upper die base 11 is fixedly provided with a guide sleeve corresponding to the guide column 2 through welding, the upper die base 11 and the lower die base 1 move relative to each other through the guide column 2 and the guide sleeve, the side edge length of the side edge male die 7 is the same as the feeding distance of the IC strip 13, the side edge male dies 7 are respectively arranged on two sides of the male die fixing plate 8, the distance between the two side edge male dies 7 is the same as the feeding distance of the IC strip 13, the male die 9 and the side edge male dies 7 penetrate through the rubber 6 and the discharging plate 5, the bottoms of the male die 9 and the side edge male dies 7 are flush with the bottom of the discharging plate 5, the distance between the guiding plates 4 is the same as the width of the IC strip 13, the height of the guiding plates 4 is 1-2mm higher than that of the IC strip 13, the discharging plate 5 is prevented from touching the IC strip 13, and a discharging port is arranged at the position of the.

The working principle is as follows: when the punching die is used, the die is installed in the pressing machine, the IC strip 13 is conveyed into the guide plate 4 through the automatic conveying device, the pressing machine is started, the upper die moves downwards along with the pressing machine until the discharging plate 5 is contacted with the guide plate 4, the die continues to move downwards, the rubber 6 on the discharging plate 5 is compressed, the upper die continues to move downwards, the male die 9 and the side-edge male die 7 on the upper die start to contact the IC strip 13 and continue to downwards complete rib cutting and forming, then the die moves upwards, the discharging plate 5 blocks the IC strip 13 on the male die to complete discharging, the IC strip 13 can continue to be fed, punching waste materials leak downwards from the blanking ports of the lower die seat 1, the female die base plate 3 and the female die 12, no material is accumulated, and the hole of the female die 12 is small in expansion force and not easy. This completes a stroke process.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a IC encapsulation installation device, includes die holder (1), stock guide (4), side sword terrace die (7) and upper die base (11), die holder (1) top four corners is through welded fastening install guide pillar (2), and die holder (1) top center has die backing plate (3) through screw fixed mounting, die backing plate (3) top has die (12) through screw fixed mounting, die (12) top both sides are respectively through screw fixed mounting have stock guide (4), its characterized in that: placed IC strip material (13) between stock guide (4), there is terrace die backing plate (10) at upper die base (11) below center through screw fixed mounting, there is punch plate (8) punch plate (10) below through screw fixed mounting, there is rubber (6) punch plate (8) below through screw fixed mounting, there is stripper (5) rubber (6) below through screw fixed mounting, punch plate (8) center is installed terrace die (9) through pegging graft, side sword terrace die (7) are installed through pegging graft in punch plate (8) both sides.

2. An IC package mounting apparatus according to claim 1, wherein: the upper die holder (11) is fixedly provided with a guide sleeve corresponding to the guide pillar (2) through welding, and the upper die holder (11) and the lower die holder (1) move relatively through the guide pillar (2) and the guide sleeve.

3. An IC package mounting apparatus according to claim 1, wherein: the length of the side edge of each side edge male die (7) is the same as the feeding distance of the IC strip material (13), the side edge male dies (7) are respectively arranged on two sides of the male die fixing plate (8), and the distance between the two side edge male dies (7) is the same as the feeding distance of the IC strip material (13).

4. An IC package mounting apparatus according to claim 1, wherein: the male die (9) and the side-edge male die (7) penetrate through the rubber (6) and the discharging plate (5), and the bottoms of the male die (9) and the side-edge male die (7) are flush with the bottom of the discharging plate (5).

5. An IC package mounting apparatus according to claim 1, wherein: the distance between the material guide plates (4) is the same as the width of the IC strip material (13), and the height of the material guide plates (4) is 1-2mm higher than that of the IC strip material (13).

6. An IC package mounting apparatus according to claim 1, wherein: and blanking ports are arranged at the positions of the lower die holder (1), the female die base plate (3) and the female die (12) under the side edge male die (7).