CN209767380U - structure for preventing chip surge current through external capacitor - Google Patents
structure for preventing chip surge current through external capacitor Download PDFInfo
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- CN209767380U CN209767380U CN201920949298.9U CN201920949298U CN209767380U CN 209767380 U CN209767380 U CN 209767380U CN 201920949298 U CN201920949298 U CN 201920949298U CN 209767380 U CN209767380 U CN 209767380U
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Abstract
The utility model discloses a prevent chip surge current's structure through external electric capacity, include: a chip assembly comprising a chip circuit board, a capacitor receptacle, a capacitor, a chip, and a first thermally conductive plate; one end of VIN of the chip in the chip circuit board is connected with the positive electrode of C1, one end of AGN is connected with R2, one end of GND is grounded, one end of VFB is respectively connected with the negative electrodes of R4 and C5, and one end of Vout is respectively connected with L1 and RSEN. The utility model discloses heat conduction cover on the heat conduction copper sheet is connected with the heat conduction cover on the chip circuit board, the heat conduction seat of support housing bottom is connected with the first heat-conducting plate on the chip, accomplish radiator unit's installation, at chip subassembly during operation, the heat that produces on chip and the electric capacity is absorbed by the heat conduction seat of first heat-conducting plate top and the heat conduction cover in the electric capacity outside, the heat absorbs the completion back, transmit to radiating part department by the heat conduction copper sheet again, the heat is taken out by the axial fan of radiating part top at last, thereby avoid the heat to pile up and cause the damage to the chip.
Description
The technical field is as follows:
The utility model relates to a power supply unit technical field specifically is a prevent chip surge current's structure through external electric capacity.
background art:
The development of electronic technology has led to the increasing output power of power supplies. The filter capacitor at the rear end of the rectifier bridge for converting alternating current into direct current power supply is also getting bigger and bigger, and most of the switching power supplies generally adopt a thermistor or a common mode inductor to reduce the higher surge current generated at the moment of power-up of the switching power supply. The surge current is mainly generated by charging a filter capacitor, and at the moment of electrifying and conducting a switch tube of the switching power supply, the capacitor has a low impedance characteristic to alternating current. If not taking protective measures, then the peak current of input surge current will be greater than steady state input current far away, harm the reliability and the security of power, reduce switching power supply's life, among the prior art, mostly adopt external electric capacity in the production that prevents surge current, however because external electric capacity, lead to whole at the during operation, easily produce a large amount of heats, if the heat can not in time give off, very easily cause the damage to equipment, for this reason, provide one kind and prevent chip surge current's structure through external electric capacity.
The utility model has the following contents:
an object of the utility model is to provide a prevent chip surge current's structure through external electric capacity to solve the problem that proposes in the above-mentioned background art.
The utility model discloses by following technical scheme implement: a structure for preventing chip surge current through an external capacitor comprises:
A heat dissipating component;
A fan assembly;
A chip assembly comprising a chip circuit board, a capacitor receptacle, a capacitor, a chip, and a first thermally conductive plate;
one end of VIN of the chip in the chip circuit board is connected with the positive electrode of C1, one end of AGN is connected with R2, one end of GND is grounded, one end of VFB is respectively connected with the negative electrodes of R4 and C5, one end of Vout is respectively connected with L1 and RSEN, one end of ISEN is respectively connected with the positive electrode of C4, the positive electrode of D3 and L1, one end of SW is connected with the positive electrode of C3, and BOOT is connected with the negative electrode of C3.
As further preferable in the present technical solution: the heat dissipation assembly comprises a support shell, a support rod, a heat dissipation portion, a second heat conduction plate, a heat conduction seat, a heat conduction copper sheet and a heat conduction sleeve, wherein the bottom of the support shell is fixedly connected with the support rod, the heat dissipation portion is arranged inside the support shell, the second heat conduction plate is fixedly connected with the top of the heat dissipation portion, the heat conduction seat is fixedly connected with the bottom of the heat dissipation portion, the outer side wall of the heat dissipation portion is fixedly connected with the heat conduction copper sheet, one end of the heat conduction copper sheet is fixedly connected with the heat conduction sleeve, and the heat conduction sleeve is sleeved on the outer side wall of the capacitor.
As further preferable in the present technical solution: the fan assembly comprises an axial flow fan, a fixing shell and a thread groove, the axial flow fan is located at the top of the radiating portion, the fixing shell is fixedly connected to the upper end and the lower end of the axial flow fan, and the thread groove is formed in the outer surface of the fixing shell.
as further preferable in the present technical solution: the capacitor seat is fixedly connected to the upper surface of the chip circuit board, the capacitor is fixedly connected to the top of the capacitor seat, the chip is arranged at a neutral position of the upper surface of the chip circuit board, and the first heat conducting plate is fixedly connected to the top of the chip.
as further preferable in the present technical solution: the heat dissipation portion is composed of at least twelve groups of heat dissipation fins.
As further preferable in the present technical solution: the heat conducting seat is positioned at the top of the first heat conducting plate, and heat conducting silicone grease is coated at the joint of the heat conducting seat and the first heat conducting plate.
as further preferable in the present technical solution: the supporting rods are provided with four groups and are symmetrically distributed above the chip circuit board.
As further preferable in the present technical solution: the heat-conducting copper sheet penetrates through the outer side wall of the supporting shell and extends to the outer side wall of the heat dissipation part.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses a set up radiator unit and fan subassembly, wherein, be connected the heat conduction cover on heat conduction copper sheet and the heat conduction cover on the chip circuit board, the heat conduction seat of support housing bottom is connected with the first heat-conducting plate on the chip, accomplish radiator unit's installation, at chip subassembly during operation, the heat that produces on chip and the electric capacity is absorbed by the heat conduction seat of first heat-conducting plate top and the heat conduction cover in the electric capacity outside, after the heat absorption is accomplished, transmit to radiating part department by the heat conduction copper sheet again, the heat is taken out by the axial fan of radiating part top at last, thereby avoid the heat to pile up and cause the damage to the chip.
Description of the drawings:
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a circuit diagram of the present invention;
Fig. 2 is a front view of the present invention;
fig. 3 is a cross-sectional view of the heat dissipating assembly of the present invention;
Fig. 4 is a schematic structural view of the middle fan assembly of the present invention.
In the figure: 10. a chip assembly; 11. a chip circuit board; 12. an electrical receptacle; 13. a capacitor; 14. a chip; 15. a first heat-conducting plate; 20. a heat dissipating component; 21. a support housing; 22. a support bar; 23. a heat dissipating section; 231. a heat sink; 24. a second heat-conducting plate; 25. a heat conducting base; 26. a thermally conductive copper sheet; 27. a heat conducting sleeve; 30. a fan assembly; 31. an axial flow fan; 32. a stationary case; 33. a thread groove.
The specific implementation mode is as follows:
the technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Examples
Referring to fig. 1-4, the present invention provides a technical solution: a structure for preventing chip surge current through an external capacitor comprises:
a chip assembly 10 including a chip circuit board 11, a capacitor holder 12, a capacitor 13, a chip 14, and a first heat-conducting plate 15;
One end of VIN of the chip 14 in the chip circuit board 11 is connected with the positive electrode of C1, one end of AGN is connected with R2, one end of GND is grounded, one end of VFB is respectively connected with the negative electrodes of R4 and C5, one end of Vout is respectively connected with L1 and RSEN, one end of ISEN is respectively connected with the positive electrode of C4, the positive electrode of D3 and L1, one end of SW is connected with the positive electrode of C3, and BOOT is connected with the negative electrode of C3;
a heat dissipating component 20;
A fan assembly 30.
In this embodiment, the model of the axial flow fan 31 is 12S6015H, and the model of the chip 14 is CX 8503.
In this embodiment, specifically: the heat dissipation assembly 20 comprises a support shell 21, a support rod 22, a heat dissipation part 23, a second heat conduction plate 24, a heat conduction seat 25, a heat conduction copper sheet 26 and a heat conduction sleeve 27, wherein the support rod 22 is fixedly connected to the bottom of the support shell 21, the heat dissipation part 23 is arranged inside the support shell 21, the second heat conduction plate 24 is fixedly connected to the top of the heat dissipation part 23, the heat conduction seat 25 is fixedly connected to the bottom of the heat dissipation part 23, the heat conduction copper sheet 26 is fixedly connected to the outer side wall of the heat dissipation part 23, the heat conduction sleeve 27 is fixedly connected to one end of the heat conduction copper sheet 26, and the heat conduction sleeve 27 is sleeved on the outer side wall of the capacitor 13.
in this embodiment, specifically: the fan assembly 30 comprises an axial flow fan 31, a fixing shell 32 and a thread groove 33, wherein the axial flow fan 31 is positioned at the top of the heat dissipation part 23, the fixing shell 32 is fixedly connected to the upper end and the lower end of the axial flow fan 31, and the thread groove 33 is formed in the outer surface of the fixing shell 32.
In this embodiment, specifically: the capacitor 12 is fixedly connected to the upper surface of the chip circuit board 11, the capacitor 13 is fixedly connected to the top of the capacitor 12, the chip 14 is arranged at a neutral position on the upper surface of the chip circuit board 11, and the first heat conduction plate 15 is fixedly connected to the top of the chip 14; the capacitor receptacle 12 mounts a capacitor 13.
In this embodiment, specifically: the heat dissipation portion 23 is composed of at least twelve groups of heat dissipation fins 231; the plurality of sets of fins 231 increase the heat dissipation area, thereby achieving the purpose of increasing the heat dissipation efficiency.
In this embodiment, specifically: the heat conducting seat 25 is positioned at the top of the first heat conducting plate 15, and heat conducting silicone grease is coated at the joint of the heat conducting seat 25 and the first heat conducting plate 15; by applying the heat-conducting silicone grease, the heat-conducting efficiency between the joints of the heat-conducting seat 25 and the first heat-conducting plate 15 is improved.
in this embodiment, specifically: the support rods 22 are provided with four groups and are symmetrically distributed above the chip circuit board 11; the four sets of support rods 22 simultaneously support the support housing 21, and the mounting stability of the support housing 21 is improved.
In this embodiment, specifically: the heat conducting copper sheet 26 penetrates through the outer side wall of the support shell 21 and extends to the outer side wall of the heat dissipation part 23; the heat conducting copper sheet 26 conducts heat on the heat conducting sleeve 27.
Working principle or structural principle, when using, firstly, install support housing 21 to bracing piece 22 on, make heat conduction sleeve 27 on the heat conduction copper sheet 26 be connected with heat conduction sleeve 27 on the chip circuit board 11, the heat conduction seat 25 of support housing 21 bottom is connected with first heat-conducting plate 15 on the chip 14, accomplish the installation of radiator unit, when chip subassembly 10 worked, the heat that produces on chip 14 and the electric capacity 13 was absorbed by heat conduction seat 25 and the heat conduction sleeve 27 of the electric capacity 13 outside above first heat-conducting plate 15, after the heat absorption was accomplished, transmit to radiator unit 23 department by heat conduction copper sheet 26 again, the heat is taken out by axial fan 31 above radiator unit 23 at last, therefore, accomplish the heat dissipation of chip subassembly 10.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. A structure for preventing chip surge current through external capacitor, comprising:
A heat dissipating component (20);
A fan assembly (30);
a chip assembly (10) comprising a chip circuit board (11), a capacitor holder (12), a capacitor (13), a chip (14) and a first heat-conducting plate (15);
One end of VIN of the chip (14) in the chip circuit board (11) is connected with the positive electrode of C1, one end of AGN is connected with R2, one end of GND is grounded, one end of VFB is respectively connected with the negative electrodes of R4 and C5, one end of Vout is respectively connected with L1 and RSEN, one end of ISEN is respectively connected with the positive electrode of C4, the positive electrode of D3 and L1, one end of SW is connected with the positive electrode of C3, and BOOT is connected with the negative electrode of C3.
2. The structure for preventing chip surge current by external capacitor according to claim 1, wherein: the heat dissipation assembly (20) comprises a support shell (21), a support rod (22), a heat dissipation part (23), a second heat conduction plate (24), a heat conduction seat (25), a heat conduction copper sheet (26) and a heat conduction sleeve (27), wherein the bottom of the support shell (21) is fixedly connected with the support rod (22), the heat dissipation part (23) is arranged inside the support shell (21), the top of the heat dissipation part (23) is fixedly connected with the second heat conduction plate (24), the bottom of the heat dissipation part (23) is fixedly connected with the heat conduction seat (25), the outer side wall of the heat dissipation part (23) is fixedly connected with the heat conduction copper sheet (26), one end of the heat conduction copper sheet (26) is fixedly connected with the heat conduction sleeve (27), and the heat conduction sleeve (27) is sleeved on the outer side wall of the capacitor (13).
3. the structure for preventing chip surge current by external capacitor according to claim 2, characterized in that: the fan assembly (30) comprises an axial flow fan (31), a fixing shell (32) and a thread groove (33), the axial flow fan (31) is located at the top of the heat dissipation portion (23), the fixing shell (32) is fixedly connected to the upper end and the lower end of the axial flow fan (31), and the thread groove (33) is formed in the outer surface of the fixing shell (32).
4. the structure for preventing chip surge current by external capacitor according to claim 1, wherein: the capacitor seat (12) is fixedly connected to the upper surface of the chip circuit board (11), the capacitor (13) is fixedly connected to the top of the capacitor seat (12), the chip (14) is arranged at a neutral position of the upper surface of the chip circuit board (11), and the first heat-conducting plate (15) is fixedly connected to the top of the chip (14).
5. The structure for preventing chip surge current by external capacitor according to claim 2, characterized in that: the heat dissipation portion (23) is composed of at least twelve groups of heat dissipation fins (231).
6. The structure for preventing chip surge current by external capacitor according to claim 2, characterized in that: the heat conducting seat (25) is positioned at the top of the first heat conducting plate (15), and heat conducting silicone grease is coated at the joint of the heat conducting seat (25) and the first heat conducting plate (15).
7. The structure for preventing chip surge current by external capacitor according to claim 2, characterized in that: the supporting rods (22) are provided with four groups and are symmetrically distributed above the chip circuit board (11).
8. The structure for preventing chip surge current by external capacitor according to claim 2, characterized in that: the heat-conducting copper sheet (26) penetrates through the outer side wall of the supporting shell (21) and extends to the outer side wall of the heat dissipation part (23).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2019209336957 | 2019-06-20 | ||
| CN201920933695 | 2019-06-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209767380U true CN209767380U (en) | 2019-12-10 |
Family
ID=68745849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920949298.9U Active CN209767380U (en) | 2019-06-20 | 2019-06-24 | structure for preventing chip surge current through external capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209767380U (en) |
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2019
- 2019-06-24 CN CN201920949298.9U patent/CN209767380U/en active Active
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