CN209756481U - Circuit manufacturing equipment - Google Patents
Circuit manufacturing equipment Download PDFInfo
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- CN209756481U CN209756481U CN201822241762.7U CN201822241762U CN209756481U CN 209756481 U CN209756481 U CN 209756481U CN 201822241762 U CN201822241762 U CN 201822241762U CN 209756481 U CN209756481 U CN 209756481U
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Abstract
The utility model provides a circuit preparation equipment relates to printing electron and makes technical field. A circuit fabrication apparatus comprising: the fixing mechanism is used for clamping and fixing the transparent base material; the first coating mechanism, the second coating mechanism and the light source are arranged above the transparent substrate; wherein the first coating mechanism is used for coating and forming a surface modification layer; the second coating mechanism is used for coating and forming a liquid metal layer; the light source is used for providing a light beam acting on the surface modification layer; the rotating mechanism is connected with the fixing mechanism and used for overturning the transparent base material; and the control mechanism is used for driving the first coating mechanism, the second coating mechanism or the light source to perform corresponding operation on the transparent substrate. The utility model forms the target pattern by using the light beam, avoids the characteristic of larger surface tension of the liquid metal, and can meet the requirement of more precise liquid metal circuit preparation; on the other hand, compared with direct liquid metal printing, the efficiency of the irradiation light beam is greatly improved.
Description
Technical Field
The utility model belongs to the technical field of the printing electron makes, especially, relate to a and circuit preparation equipment.
background
with the continuous progress of printed electronics, conductive fluids, as represented by liquid metals, have made direct writing, printing, and other direct circuit printing technologies possible. In the existing liquid metal direct writing and printing, liquid metal ink is soaked and adhered to the surface of an organic polymer substrate to realize single-layer printing of a conducting circuit.
At present, the liquid metal circuit is manufactured mainly by printing modes such as direct writing and the like, so that the manufacturing efficiency of the liquid metal flexible electronic circuit is low, and the manufacturing process is complex. On the other hand, due to the characteristic of large surface tension of the liquid metal, the liquid metal cannot pass through an extremely fine ink channel, so that the ink discharging method of the direct writing pen cannot meet the manufacturing of a liquid metal circuit with higher requirements for fineness.
SUMMERY OF THE UTILITY MODEL
In view of the above, an object of the present invention is to provide a circuit manufacturing method to solve the problems of low manufacturing efficiency, complex manufacturing process and incapability of meeting the requirement of high-precision circuit manufacturing of liquid metal flexible electronic circuits in the prior art.
In some demonstrative embodiments, the circuit fabrication method includes: step S1, providing a transparent substrate; a surface modification layer adhered with liquid metal is attached to the first surface of the transparent substrate; a liquid metal layer is attached to the surface modification layer; step S2, providing a light source, wherein the light source is transmitted from the second surface of the transparent substrate to the surface modification layer on the first surface of the transparent substrate according to a preset pattern, and the connection stability between the corresponding area of the surface modification layer and the liquid metal layer is damaged; and step S3, removing unstable liquid metal connected on the liquid metal layer, wherein the residual liquid metal on the liquid metal layer forms a circuit.
In some optional embodiments, the light source is a picosecond laser beam; the surface modification layer is made of a non-transparent material; and in the step S2, the picosecond laser beam is transmitted to the surface modification layer, and the corresponding area of the surface modification layer is etched, so that the connection stability between the corresponding area of the surface modification layer and the liquid metal layer is damaged.
In some optional embodiments, the light source is a nanosecond laser beam; the surface modification layer is made of a high-temperature-resistant non-transparent material; in step S2, the nanosecond laser beam is transmitted to the surface modification layer, and the corresponding region of the surface modification layer is etched, so that the connection stability between the corresponding region of the surface modification layer and the liquid metal layer is damaged.
In some optional embodiments, the surface modification layer is a colloid uniformly mixed with microcapsules, and the core of each microcapsule is a corrosive solution of liquid metal; and step S2, the second surface of the transparent substrate faces upwards, the liquid metal layer faces downwards, the nanosecond laser beam is transmitted to the surface modification layer to damage the capsule wall of the microcapsule in the corresponding area of the surface modification layer, the corrosive solution in the microcapsule is released, and the microcapsule is contacted with the liquid metal below through the action of gravity to corrode the liquid metal.
In some optional embodiments, the light source comprises an ultraviolet light beam; the transparent base material is made of an anti-aging material; in step S2, the ultraviolet light beam is transmitted to the surface modification layer, so that the corresponding region of the surface modification layer is aged, thereby achieving the purpose of destroying the connection stability between the corresponding region of the surface modification layer and the liquid metal layer.
In some optional embodiments, the unstable liquid metal connected to the liquid metal layer is removed by vibration in step S3.
In some optional embodiments, the surface modification layer is an insulating material; in step S3, the unstable liquid metal is removed from the liquid metal layer by the action of the repulsion of electrons generated by the same charge applied to the transparent substrate and the liquid metal layer.
Another object of the present invention is to provide a circuit manufacturing apparatus to solve the technical problem existing in the prior art.
In some demonstrative embodiments, the circuit fabrication apparatus includes: the fixing mechanism is used for clamping and fixing the transparent base material; the first coating mechanism, the second coating mechanism and the light source are arranged above the transparent substrate; wherein the first coating mechanism is used for coating and forming a surface modification layer; the second coating mechanism is used for coating and forming a liquid metal layer; the light source is used for providing a light beam acting on the surface modification layer; the rotating mechanism is connected with the fixing mechanism and used for overturning the transparent base material; and the control mechanism is used for driving the first coating mechanism, the second coating mechanism or the light source to perform corresponding operation on the transparent substrate.
In some optional embodiments, the securing mechanism comprises: a conductive clamp for applying positive/negative charges, the clamp fastening at least two opposite ends of the transparent substrate; the circuit fabrication apparatus further includes: and the conductive probe is used for contacting the liquid metal layer and applying electric charges with the same property as the conductive clamp.
in some optional embodiments, the circuit fabrication apparatus further includes: and the vibrating mechanism is connected with the fixing mechanism and used for removing unstable liquid metal connected on the liquid metal layer.
compared with the prior art, the utility model has the advantages of as follows:
The utility model discloses a surface modification layer makes liquid metal layer and substrate form stable connection effect, then utilizes the light beam to destroy the surface modification layer on the assigned position to reach and destroy the stable connection between liquid metal on this position and the substrate, getting rid of through applying external force and connecting unstable liquid metal, the liquid metal that stays can form and stably be connected/adnexed liquid metal circuit with the substrate. The utility model forms the target pattern by using the light beam, avoids the characteristic of larger surface tension of the liquid metal, and can meet the requirement of more precise liquid metal circuit preparation; on the other hand, compared with direct liquid metal printing, the efficiency of the irradiation light beam is greatly improved.
Drawings
Fig. 1 is a flow chart of a circuit fabrication method in an embodiment of the present invention;
Fig. 2 is a flow chart of a circuit fabrication method in an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a circuit manufacturing apparatus in an embodiment of the present invention.
Detailed Description
the following description and the drawings sufficiently illustrate specific embodiments of the invention to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in or substituted for those of others. The scope of embodiments of the invention encompasses the full ambit of the claims, as well as all available equivalents of the claims. In this context, these embodiments of the invention may be referred to, individually or collectively, by the term "utility model" merely for convenience and without automatically limiting the scope of this application to any single utility model or utility model concept if more than one is in fact disclosed.
It should be noted that, in the present invention, the technical features may be combined with each other without conflict.
The utility model provides a circuit manufacturing method, specifically, as shown in fig. 1, fig. 1 is a flow chart of the circuit manufacturing method in the embodiment of the present invention; the circuit manufacturing method comprises the following steps:
step S1, providing a transparent substrate 1; a surface modification layer 2 adhered with liquid metal is attached to the first surface of the transparent substrate; a liquid metal layer 3 is attached to the surface modification layer;
Step S2, providing a light source 5, wherein the light source is transmitted from the second surface of the transparent substrate to the surface modification layer on the first surface of the transparent substrate according to a preset pattern, and the connection stability between the corresponding region of the surface modification layer and the liquid metal layer is damaged;
And step S3, removing unstable liquid metal connected on the liquid metal layer, wherein the residual liquid metal on the liquid metal layer forms a circuit.
The transparent substrate in this embodiment may be one of, but not limited to, a polyvinyl chloride substrate, a polyethylene terephthalate substrate, a polybutylene terephthalate substrate, a polypropylene substrate, a polybutylene adipate-terephthalate substrate, a silicone rubber substrate, a natural rubber substrate, an isoprene rubber substrate, a styrene butadiene rubber substrate, a chloroprene rubber substrate, an ethylene propylene rubber substrate, a nitrile butadiene rubber substrate, a silicone rubber substrate, a polysulfide rubber substrate, a glass substrate, a polyurethane substrate, an acryl substrate, a silicon substrate, a quartz substrate, and special engineering plastic pek.
The surface modification layer in this embodiment can be made of, but is not limited to, PDMS (polydimethylsiloxane), Ecoflex (biodegradable plastic), polyurethane, silica gel, acrylic polymer, polylactic acid, PCL (polycaprolactone), and other long-chain polymer organic materials.
The embodiment of the present invention provides a liquid metal, which is also called low melting point metal, and includes a low melting point metal element/low melting point metal alloy with a melting point below 100 ℃, or a conductive slurry formed by mixing the low melting point metal element/low melting point metal alloy and metal nanoparticles, or a conductive nanofluid formed by mixing the low melting point metal element/low melting point metal alloy and a fluid dispersing agent. More specifically, when the conductive nanofluid is selected, the fluid dispersion agent is preferably one of ethanol, propylene glycol, glycerin, polyvinylpyrrolidone, polydimethylsiloxane, polyethylene glycol, and polymethylmethacrylate.
Preferably, the liquid metal is conductive slurry formed by mixing a low-melting-point metal simple substance/low-melting-point metal alloy and metal nanoparticles, so that the surface tension and the fluidity of the liquid metal are reduced, and the self adhesion of the liquid metal is improved, thereby further improving the structural stability of the liquid metal attached to the surface modification layer. The liquid metal can be one or more of a gallium simple substance, an indium simple substance, a tin simple substance, a gallium-indium alloy, a gallium-indium-tin alloy, a gallium-zinc alloy, a gallium-indium-zinc alloy, a gallium-tin-zinc alloy, a gallium-indium-tin-zinc alloy, a gallium-tin-cadmium alloy, a gallium-zinc-cadmium alloy, a bismuth-indium alloy, a bismuth-tin alloy, a bismuth-indium-zinc alloy, a bismuth-tin-zinc alloy, a bismuth-indium-tin-zinc alloy, a tin-lead alloy, a tin-copper alloy, a tin-zinc-copper alloy, a tin-silver-copper alloy. The metal nanoparticles can be one or more of copper, iron, nickel, silver and silver-coated copper. Preferably, the metal nanoparticles can be used as a functional material to improve the characteristics of the liquid metal itself, for example, the metal nanoparticles such as silver-coated copper, silver, copper, etc. can be selected to effectively improve the conductivity of the liquid metal; the metal nanoparticles such as nickel and the like are selected to improve the oxidation resistance and the surface gloss of the liquid metal.
In some more preferred embodiments, the low melting point metal element/low melting point metal alloy is a room temperature liquid metal, such as one or more of gallium element, gallium indium alloy, gallium indium tin alloy, and gallium tin alloy, so that the liquid metal can be in a liquid or slurry state at room temperature. Or bismuth-based alloy and indium-based alloy with the melting point slightly higher than room temperature are selected, and the environment temperature can be increased to be liquid through a simple heating assembly.
The utility model discloses a surface modification layer makes liquid metal layer and substrate form stable connection effect, then utilizes the light beam to destroy the surface modification layer on the assigned position to reach and destroy the stable connection between liquid metal on this position and the substrate, getting rid of through applying external force and connecting unstable liquid metal, the liquid metal that stays can form and stably be connected/adnexed liquid metal circuit with the substrate. The utility model forms the target pattern by using the light beam, avoids the characteristic of larger surface tension of the liquid metal, and can meet the requirement of more precise liquid metal circuit preparation; on the other hand, compared with direct liquid metal printing, the efficiency of the irradiation light beam is greatly improved.
The utility model discloses a surface modification layer in the above-mentioned embodiment is used for carrying out modification treatment to the substrate surface to make liquid metal can be stable adhere to on the substrate, be particularly useful for the substrate surface to the liquid metal performance for the material of state of keeping away, when being convenient for coat liquid metal on the substrate, make the region that the substrate surface does not have surface modification layer not adhere to liquid metal, need not to consider substrate itself to control the coating scope to liquid metal's adhesion during the coating liquid metal, reduce liquid metal material's useless loss.
Referring now to fig. 2, step S1 in the embodiment of the present invention may specifically include:
Step S11, providing a transparent substrate 1;
step S12, forming a surface modification layer 2 adhered with liquid metal on the first surface of the transparent substrate;
step S13, forming a liquid metal layer 3 on the surface modification layer 2.
In the processes of steps S11-S13, the surface modification layer and the liquid metal layer may be formed by spraying, printing, dipping, or the like.
the embodiment of the utility model provides a provide a light source in step S2, the light source from transparent substrate' S second face according to predetermineeing the figure transmission extremely on the first face of transparent substrate surface modification layer destroys surface modification layer corresponding region with connection stability between the liquid metal level can arrange the implementation through different surface modification layers and corresponding light source.
In one embodiment of step S2, the light source is a picosecond laser, and the transparent substrate can be a PET film substrate, a glass substrate, or an acrylic substrate; the surface modification layer can adopt non-transparent adherable liquid metal materials such as polyurethane, polylactic acid and the like (wherein, the surface modification layer of the transparent material can be dyed by adding pigments, pigments and the like); the laser beam emitted by the picosecond laser belongs to a cold laser beam, etching is carried out by utilizing a coulomb force effect mode, and high temperature cannot be generated in the process to influence the transparent base material.
Firstly, horizontally inverting the transparent substrate to enable the first surface of the transparent substrate, which is attached with the surface modification layer and the liquid metal layer, to face downwards and the second surface to face upwards; set up picosecond laser emission head above transparent substrate, the laser beam direction is perpendicular with transparent substrate, and the laser beam jets into transparent substrate perpendicularly to penetrate transparent substrate and directly act on the surface modification layer, through the intensity and the irradiation time of control laser beam, accomplish the surface modification layer on the etching assigned position, make the substrate suspend in the air between this region and the liquid metal layer, cause the liquid metal of this position original stable connection to change into extremely poor. In the process, the horizontal movement and the switch of the picosecond laser emitting head are controlled to drive the laser beam to etch the surface modification layer according to the preset pattern, so that the stability of the region of the non-target liquid metal circuit on the liquid metal layer is reduced. The liquid metal on the transparent base material after being horizontally inverted is very thin and can be stably attached to the surface modification layer, and the inversion can not affect the surface modification layer; for the liquid metal mixed with the metal nano-particles, the liquid metal has certain strength by itself, and the thickness of the liquid metal can be designed to be larger than that of the pure liquid metal. In addition, the transparent substrate is placed horizontally as the best embodiment of the step S2, but in other embodiments, the transparent substrate can be placed at any angle, and only the light beam is applied perpendicularly to the transparent substrate, so as to ensure the accuracy of the etching area.
In this embodiment, the picosecond laser directly vaporizes or atomizes the surface modification layer under the action, so that the gas pressure in the space is increased, the liquid metal at the position can be primarily removed, and the rest of the liquid metal can be removed in step S3.
In another embodiment of step S2, the light source uses a conventional nanosecond laser, which can directly vaporize the material at the instantaneous high temperature of the irradiation spot; the transparent base material can be quartz, glass, special engineering plastics and other base materials with temperature resistance; the surface modification layer can adopt non-transparent liquid metal materials which can be adhered, such as polyurethane, polylactic acid and the like;
the action mode of the nanosecond laser is basically consistent with that of the picosecond laser, only the nanosecond laser utilizes a high-temperature gasification surface modification layer, the light transmittance of the transparent base material enables the light and heat absorbed by the transparent base material to be less, and most of the light and heat is concentrated on the surface modification layer, so that the transparent base material has certain temperature resistance, and the nanosecond laser can etch the surface modification layer without influencing the transparent base material basically.
In another embodiment of step S2, the light source is a light source containing a thermal light beam, and the light source may be a composite light source containing a thermal light beam, such as an infrared light, an incandescent lamp, or a nanosecond laser. The transparent base material can be quartz, glass, special engineering plastics and other base materials with temperature resistance; the surface modification layer may be, for example, a colloid (e.g., polyurethane or polylactic acid) in which microcapsules are uniformly mixed.
The capsule wall of the microcapsule is made of a material with poor heat resistance (such as one or more of paraffin, polyethylene oxide, polypropylene oxide and block polyether), and the capsule core is a corrosive solution of liquid metal (such as one or more of a sodium hydroxide solution, ammonia water, a calcium hydroxide solution, a barium hydroxide solution, a succinic acid solution, a lactic acid solution, a malic acid solution, a salicylic acid solution, an oleic acid solution, an linolic acid solution, an oxalic acid solution, citric acid and a stearic acid solution). The corrosion solution of the liquid metal not only refers to a material capable of chemically reacting with the liquid metal, but also includes a material capable of physically modifying the liquid metal, for example, a sodium hydroxide solution can cause an agglomeration effect to occur on the elemental gallium/gallium-based alloy, and recover the original surface tension thereof to form liquid droplets.
in this embodiment, the surface modification layer is irradiated by a hot light beam to melt the capsule wall of the microcapsule constituting the surface modification layer, thereby releasing the corrosive solution of the liquid metal therein, and the corrosive solution of the liquid metal is brought into contact with the liquid metal therebelow by the action of gravity and removed.
the thermal beam used in this embodiment may additionally be provided with a light blocking structure to allow the beam to irradiate a designated position, and preferably, the irradiation of the predetermined pattern may be realized by using a photomask placed on the second surface of the transparent substrate.
in another embodiment of step S2, the light source is a light source containing an ultraviolet light beam, and the light source may be a composite light source containing an ultraviolet light beam, such as an ultraviolet light, an incandescent lamp, and a xenon lamp. The transparent substrate can be made of quartz, glass, special engineering plastics and other anti-aging substrates; the surface modification layer can adopt materials which are easy to age, such as polylactic acid, PCL and the like.
In this embodiment, the ultraviolet light beam is irradiated to accelerate the aging of the surface modification layer, so that the long-chain polymer material of the surface modification layer is broken, thereby destroying the stable connection between the surface modification layer and the liquid metal layer.
the utility model discloses in each embodiment of step S2, nanosecond laser and picosecond laser relatively speaking, control accuracy is higher, changes the liquid metal preparation that satisfies the high accuracy.
The method for removing unstable liquid metal on the liquid metal layer in step S3 in the embodiment of the present invention can also be implemented in various ways, such as vibration, ultrasound, and electronic force.
In one embodiment of step S3, at least two ends of the transparent substrate are clamped and fixed, and then the unstable liquid metal is removed by vibration/shaking, wherein the shaking force is smaller than the adhesion force between the liquid metal and the surface modification layer and larger than the adhesion force between the liquid metal and the liquid metal.
in still another embodiment of step S3, at least two ends of the transparent substrate are fixed and then the same charge is applied to both the transparent substrate and the liquid metal layer, and the unstable liquid metal is removed from the liquid metal layer due to the repulsive force between the charges. The repulsion between the charges is smaller than the adhesive force between the liquid metal and the surface modification layer and larger than the connecting force between the liquid metal and the liquid metal.
Referring now to fig. 3, fig. 3 shows a schematic structure diagram of a circuit manufacturing apparatus in an embodiment of the present invention, as shown in this schematic structure diagram, the present invention discloses a circuit manufacturing apparatus, including: a fixing mechanism 101, a first coating mechanism (not shown, refer to a print head or a coating structure in the prior art), a second coating mechanism (not shown, refer to a print head or a coating structure in the prior art), a light source 102, a rotation mechanism 103, and a control mechanism (not shown, refer to a robot arm structure in the prior art); wherein, the fixing mechanism 101 is used for clamping and fixing the transparent substrate 1; the first coating mechanism, the second coating mechanism, and the light source 102 are positioned above the substrate; the first coating mechanism is used for coating and forming the surface modification layer 2; the second coating mechanism is used for coating and forming the liquid metal layer 3; a light source to provide a light beam 5 acting on the surface modification layer; the rotating mechanism 103 is connected with the fixing mechanism 101 in a matching manner and is used for overturning the transparent base material 1; the control mechanism is used to drive the first coating mechanism, the second coating mechanism or the light source 102 to perform corresponding operations on the transparent substrate 1.
In some embodiments, the securing mechanism 101 comprises: a conductive jig for applying positive/negative charges, the jig fastening at least opposite ends of the transparent base material 1; the circuit fabrication apparatus further includes: the conductive probe 104, which is used to contact the liquid metal layer, applies a charge of the same nature as the conductive clip.
In some embodiments, the circuit fabrication apparatus further comprises: and a vibration mechanism (not shown, which can adopt an ultrasonic or vibration motor) connected with the fixing mechanism and used for removing unstable liquid metal connected on the liquid metal layer.
In some embodiments, the transparent substrate is fixed on the fixing mechanism without position shift, the first coating mechanism and the second coating mechanism can adopt a spraying or direct-writing printing head, and the control mechanism comprises a mechanical arm for driving the first coating mechanism, the second coating mechanism and the light source. The control flow of the circuit manufacturing apparatus in this embodiment includes:
Step a, clamping a transparent substrate through a fixing mechanism;
B, driving a first coating mechanism to form a surface modification layer on the first surface of the transparent substrate by a control mechanism;
C, driving a second coating mechanism to form a liquid metal layer on the surface modification layer by the control mechanism;
d, the rotating mechanism drives the transparent substrate to horizontally turn over, so that the second surface of the transparent substrate is positioned above the transparent substrate;
e, driving a light source to irradiate light beams on the second surface of the transparent base material according to a preset pattern by a control mechanism;
And f, applying the same charge to the transparent substrate and the liquid metal layer, and removing the liquid metal with unstable connection to form a liquid metal circuit.
In other embodiments, the circuit fabrication apparatus further comprises a track; the first coating mechanism and the second coating mechanism can adopt a printing coating device; the first coating mechanism, the second coating mechanism and the light source are sequentially erected above the track, and the fixing mechanism drives the transparent substrate to move on the track so as to sequentially enter working areas of the first coating mechanism, the second coating mechanism and the third coating mechanism.
those of skill would further appreciate that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.
Claims (3)
1. A circuit fabrication apparatus, comprising:
The fixing mechanism is used for clamping and fixing the transparent base material;
The first coating mechanism, the second coating mechanism and the light source are arranged above the transparent substrate; wherein the first coating mechanism is used for coating and forming a surface modification layer; the second coating mechanism is used for coating and forming a liquid metal layer; the light source is used for providing a light beam acting on the surface modification layer;
The rotating mechanism is connected with the fixing mechanism and used for overturning the transparent base material;
And the control mechanism is used for driving the first coating mechanism, the second coating mechanism or the light source to perform corresponding operation on the transparent substrate.
2. The circuit fabrication apparatus of claim 1, wherein the securing mechanism comprises: a conductive clamp for applying positive/negative charges, the clamp fastening at least two opposite ends of the transparent substrate;
Further comprising: and the conductive probe is used for contacting the liquid metal layer and applying electric charges with the same property as the conductive clamp.
3. The circuit fabrication apparatus of claim 1, further comprising: and the vibrating mechanism is connected with the fixing mechanism and used for removing unstable liquid metal connected on the liquid metal layer.
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| CN201822241762.7U CN209756481U (en) | 2018-12-29 | 2018-12-29 | Circuit manufacturing equipment |
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| CN201822241762.7U CN209756481U (en) | 2018-12-29 | 2018-12-29 | Circuit manufacturing equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210209906A1 (en) * | 2019-11-11 | 2021-07-08 | Carnegie Mellon University | Multi-site damage sensing and localization soft-matter electronics and related systems and methods |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210209906A1 (en) * | 2019-11-11 | 2021-07-08 | Carnegie Mellon University | Multi-site damage sensing and localization soft-matter electronics and related systems and methods |
| US11682276B2 (en) * | 2019-11-11 | 2023-06-20 | Carnegie Mellon University | Multi-site damage sensing and localization soft-matter electronics and related systems and methods |
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