CN209754223U - SMT reflow soldering processing clamp plate mould - Google Patents
SMT reflow soldering processing clamp plate mould Download PDFInfo
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- CN209754223U CN209754223U CN201920230152.9U CN201920230152U CN209754223U CN 209754223 U CN209754223 U CN 209754223U CN 201920230152 U CN201920230152 U CN 201920230152U CN 209754223 U CN209754223 U CN 209754223U
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Abstract
The utility model discloses a SMT reflow soldering processing clamp plate mould belongs to SMT technical field. The plate body structure comprises a base plate, a single template, a concave supporting plate and a pulling plate; the base plate is a plane plate body, a web plate is welded in the middle of the back surface of the base plate, an inner concave plate and a bottom groove are respectively arranged at the left end and the right end of the web plate, the inner concave plate is embedded with the base plate, and a groove of the bottom groove is formed in the back surface of the base plate; the single template is provided with twelve at least, the single template is horizontal vertical parallel arrangement in the base plate surface, single template and base plate fixed connection, utilize the plane base plate and the module of on-board formula, make things convenient for a plurality of PCB board installation butt joint in the module, wherein the bar groove that both ends set up respectively about the base plate, indent board and kerve, can be at the base plate when through the reflow soldering machine platform accumulate heat, thereby in acting on the module die cavity with multidirectional being heated, effectively reduce the influence that the temperature difference produced the inhomogeneous of being heated of sample in the reflow soldering machine platform, the suitability and the heating machining efficiency of mould have been guaranteed.
Description
Technical Field
The utility model relates to a SMT technical field, especially a SMT reflow soldering processing clamp plate mould.
background
When being applied to production, the traditional SMT reflow soldering processing procedure has the following defects:
In the traditional SMT reflow soldering processing procedure, after the surface-mounted component and the PCB are usually pre-assembled, solder paste at the joint of the surface-mounted component and the PCB is heated and cured through high temperature in a reflow soldering machine, however, in actual production, temperature difference exists in each local part of the reflow soldering machine, so that the problems that local heating is uneven when a sample passes through the machine, the curing consistency of the solder paste at the joint of the sample is influenced, and the reliability and the performance of the PCB and the component are influenced to a certain extent;
Based on the problems existing in the above points, a clamping plate mold suitable for the SMT reflow soldering process in the current era needs to be researched, the traditional reflow soldering processing mode is greatly influenced by the temperature curve in a machine table and the local temperature difference of the temperature, so that the solder paste solidification at the welding part is uneven when a sample passes through a reflow soldering machine table, the reliability and the performance of a PCB and a surface-mounted element are directly influenced, the application range is limited, and the processing efficiency of the reflow soldering process is limited to a certain extent.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model aims at the above-mentioned problem, a SMT reflow soldering processing clamp plate mould is provided, utilize the plane base plate and the module of on-board formula, make things convenient for a plurality of PCB board installation butt joint in the module, wherein the bar groove that both ends set up respectively about the base plate, indent board and kerve, can be at the base plate through the heat accumulation when reflow soldering machine platform, thereby act on in the module die cavity with multidirectional being heated, effectively exempt from the influence that the difference in temperature produced the inhomogeneous of being heated of sample in the reflow soldering machine platform, the suitability and the heating machining efficiency of mould have been guaranteed.
In order to achieve the above purpose, the utility model adopts the technical proposal that: an SMT reflow soldering processing clamp plate mould, comprising:
the plate body structure comprises a base plate, a single template, a concave supporting plate and a pulling plate; the substrate is a plane plate body, a web plate is welded in the middle of the back of the substrate, an inner concave plate and a bottom groove are respectively arranged at the left end and the right end of the web plate, the inner concave plate is embedded with the substrate, and the bottom groove is arranged on the back of the substrate; the single templates are at least provided with twelve single templates which are arranged on the surface of the substrate in a transverse and longitudinal parallel manner, the single templates are fixedly connected with the substrate, strip-shaped grooves are formed in the single templates in a slotting manner, the strip-shaped grooves are longitudinally and equidistantly distributed on the surface of the substrate, transverse strips penetrate through the single templates, and the transverse strips are transversely and equidistantly distributed on the surface of the substrate; the pull plate and the concave supporting plate are respectively welded on the left side and the right side of the base plate, the upper end and the lower end of the pull plate and the concave supporting plate are respectively provided with a groove, the pull plate and the concave supporting plate are relatively parallel left and right, and the middle part of the right side of the pull plate is welded with a chuck;
The mold structure includes a mold block; the module is provided with twelve blocks, the module is embedded in the upper surface of the single module board, the module is a square metal plate, the module comprises a shaft lever, a cover plate and a bolt, a die groove is formed in the middle of the front face of the module, the shaft lever is embedded in the right side of the upper end of the module and is rotatably connected with the module, the cover plate is fixed on the left side of the shaft lever and is hinged to the module through the shaft lever, the bolt is inserted in the upper end of the left side of the cover plate, and the bottom end of the bolt penetrates through the upper surface of the module.
The utility model discloses a plate body structure and mould structure, it is both indelible, the plate body structure comprises planar substrate, can be just when carrying out reflow soldering manufacturing procedure, with it treat that the dress component with it PCB board is placed in mould structure module jointly, come when the plate body structure passes through the reflow soldering machine platform, the bar groove that is provided with by the upper and lower surface of base plate, indent board and kerve accumulate heat, the change curve of guaranteeing the local temperature difference in the reflow soldering machine platform is difficult for influencing the base plate upper end and has placed PCB plate, the inseparable laminating of PCB board and treating dress component can be guaranteed to the die cavity structure that sets up in its mould structure simultaneously, the suitability and the result of processing of mould structure have further been guaranteed.
According to the specific scheme, the plug is a U-shaped pipe fitting, the clamping head comprises a magnetic sheet, and the magnetic sheet is embedded in the inner side of the clamping head.
in a specific scheme, the inner wall of the die cavity is filled with a colloid skin.
According to the specific scheme, the die cavity is divided into an upper independent cavity diameter and a lower independent cavity diameter, and the upper end and the lower end of the die cavity are convex.
Due to the adoption of the technical scheme, the utility model discloses following beneficial effect has:
1. The utility model discloses SMT reflow soldering processing splint mould adopts plane board to carry the structure, can be convenient for a plurality of PCB board samples to install and place in the module that the base plate upper end set up to install in the module additional through the sample, improve the efficiency that the sample once passed through the reflow soldering board;
2. The utility model discloses SMT reflow soldering processing clamp plate mould, bar groove, interior notch board groove footpath and the kerve groove footpath that both ends set up about in its plate body structure come when the plate body structure passes through the reflow soldering machine platform, carry out heat-retaining, heat conduction through groove footpath structure to guarantee the module degree of consistency of being heated all around, guaranteed mould heating processing effect.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a schematic view of the back structure of the present invention.
Fig. 3 is a schematic diagram of the internal structure of the module of the present invention.
In the attached drawing, 1-base plate, 2-single template, 3-strip groove, 4-module, 5-concave supporting plate, 6-horizontal bar, 7-web, 8-concave plate, 9-pulling plate, 10-clamping head, 11-bottom groove, 12-shaft rod, 13-cover plate, 14-bolt and 15-die groove.
Detailed Description
the following describes the embodiments of the present invention with reference to the accompanying drawings.
the utility model relates to a SMT reflow soldering processing clamp plate mould is provided with plate body structure and mould structure respectively as shown in the figure.
as shown in fig. 1-3, the plate structure includes a substrate 1, a single mold 2, a concave supporting plate 5 and a pulling plate 9; the substrate 1 is a plane plate, a web 7 is welded in the middle of the back of the substrate 1, an inner concave plate 8 and a bottom groove 11 are respectively arranged at the left end and the right end of the web 7, the inner concave plate 8 is embedded with the substrate 1, and the bottom groove 11 is arranged on the back of the substrate 1 in a groove manner; the single template 2 is at least provided with twelve single templates, the single templates 2 are transversely and longitudinally arranged on the surface of the substrate 1 in parallel, the single templates 2 are fixedly connected with the substrate 1, the single templates 2 are provided with strip-shaped grooves 3 in a groove manner, the strip-shaped grooves 3 are longitudinally and equidistantly distributed on the surface of the substrate 1, the single templates 2 are provided with transverse strips 6 in a penetrating manner, and the transverse strips 6 are transversely and equidistantly distributed on the surface of the substrate 1; the pull plate 9 and the concave supporting plate 5 are respectively welded on the left side and the right side of the base plate 1, the upper end and the lower end of the pull plate 9 and the concave supporting plate 5 are respectively provided with a groove, the pull plate 9 and the concave supporting plate 5 are relatively parallel left and right, and the middle part of the right side of the pull plate 9 is welded with a chuck 10; through the planar structure of base plate 1, make things convenient for the plate structure to place in the reflow soldering machine when using, wherein web 7 is used for reinforcing 1 lower surface structural strength of base plate, by base plate lower extreme indent board 8, kerve 11 and upper end bar groove 3 groove footpaths, come when base plate 1 paves in the reflow soldering machine, the heat can accumulate in indent board 8, kerve 11 and bar groove 3 groove footpaths, thereby guarantee that the inside high temperature of reflow soldering effectively acts on the PCB plate in the mould, the bilateral symmetry structure that comprises concave layer board 5 and arm-tie 9, can make things convenient for a plurality of base plates 1 to transversely pile up, and dock with the concave layer board 5 of other end through the dop in one end arm-tie 9, assemble, the production efficiency of plate structure through the reflow soldering machine once has been guaranteed.
The chuck 10 includes a magnetic sheet embedded inside the chuck 10, and when the chuck 10 is butted with the concave supporting plate 5 in another base plate 1, the connection between the chuck 10 and the concave supporting plate 5 can be reinforced by the magnetic sheet attraction.
As shown in fig. 1-3, the mold structure includes a mold block 4; twelve modules 4 are arranged on the module 4, the module 4 is embedded on the upper surface of the single template 2, the module 4 is a square metal plate, the module 4 comprises a shaft lever 12, a cover plate 13 and a bolt 14, a slot is formed in the middle of the front surface of the module 4 and is provided with a mold cavity 15, the shaft lever 12 is embedded on the right side of the upper end of the module 4, the shaft lever 12 is rotatably connected with the module 4, the cover plate 13 is fixed on the left side of the shaft lever 12, the cover plate 13 is hinged with the module 4 through the shaft lever 12, the bolt 14 is inserted at the upper end of the left side of; the PCB and the element to be pasted are placed in the grinding groove 15 in an opposite position, the cover plate 13 is rotated to enable the cover plate 13 to be tightly attached to the upper surface of the module 4, the bolt 14 is inwards inserted into the upper surface of the module 4, the cover plate 13 and the module 4 are fixed, the PCB is pressed through the cover plate 13, and when the plate body structure passes through the reflow soldering machine, the part of the element to be pasted on the PCB is tightly welded through high temperature in the reflow soldering machine.
Wherein, the inner wall of the die cavity 15 is filled with colloid skin, when the PCB is placed in the die cavity 15 and is clamped with the inner wall of the die cavity, the colloid skin filling can ensure the insulativity of the structure of the die cavity 15 and avoid static electricity from influencing the PCB element while avoiding the side extension of the PCB from being worn and abraded with the inner wall of the die cavity 15.
The die cavity 15 is divided into an upper independent groove diameter and a lower independent groove diameter, the upper end and the lower end of the die cavity 15 are in a convex shape, the upper and lower layered groove diameters can be conveniently placed at the lower end of the PCB, and the upper end of the PCB is tightly attached to the lower end of the groove diameter through the covering of the cover plate 13.
The utility model discloses a plate body structure and mould structure, it is both indelible, the plate body structure comprises planar substrate 1, can be just when carrying out reflow soldering manufacturing procedure, with it treat that the dress component places in module 4 in the mould structure with it jointly, come when the plate body structure passes through reflow soldering machine platform, the bar groove 3 that is provided with by 1 upper and lower surfaces of base plate, interior concave plate 8 and 11 accumulations of heat of kerve, it is difficult for influencing 1 upper end of base plate and has placed the PCB plate to guarantee the change curve of local temperature difference in the reflow soldering machine platform, the inseparable laminating of PCB board and the dress component of treating can be guaranteed to the die cavity structure that sets up in its mould structure simultaneously, the suitability and the result of processing of mould structure have further been guaranteed.
The above description is for the detailed description of the preferred possible embodiments of the present invention, but the embodiments are not intended to limit the scope of the present invention, and all equivalent changes or modifications accomplished under the technical spirit suggested by the present invention should fall within the scope of the present invention.
Claims (4)
1. The utility model provides a SMT reflow soldering processing clamp plate mould which characterized in that: the method comprises the following steps:
The plate body structure comprises a base plate, a single template, a concave supporting plate and a pulling plate; the substrate is a plane plate body, a web plate is welded in the middle of the back of the substrate, an inner concave plate and a bottom groove are respectively arranged at the left end and the right end of the web plate, the inner concave plate is embedded with the substrate, and the bottom groove is arranged on the back of the substrate; the single templates are at least provided with twelve single templates which are arranged on the surface of the substrate in a transverse and longitudinal parallel manner, the single templates are fixedly connected with the substrate, strip-shaped grooves are formed in the single templates in a slotting manner, the strip-shaped grooves are longitudinally and equidistantly distributed on the surface of the substrate, transverse strips penetrate through the single templates, and the transverse strips are transversely and equidistantly distributed on the surface of the substrate; the pull plate and the concave supporting plate are respectively welded on the left side and the right side of the base plate, the upper end and the lower end of the pull plate and the concave supporting plate are respectively provided with a groove, the pull plate and the concave supporting plate are relatively parallel left and right, and the middle part of the right side of the pull plate is welded with a chuck;
The mold structure includes a mold block; the module is provided with twelve blocks, the module is embedded in the upper surface of the single module board, the module is a square metal plate, the module comprises a shaft lever, a cover plate and a bolt, a die groove is formed in the middle of the front face of the module, the shaft lever is embedded in the right side of the upper end of the module and is rotatably connected with the module, the cover plate is fixed on the left side of the shaft lever and is hinged to the module through the shaft lever, the bolt is inserted in the upper end of the left side of the cover plate, and the bottom end of the bolt penetrates through the upper surface of the module.
2. An SMT reflow soldering processing clamp plate mold according to claim 1, wherein: the dop includes the magnetic sheet, the magnetic sheet scarf joint is inboard in the dop.
3. An SMT reflow soldering processing clamp plate mold according to claim 1, wherein: and the inner wall of the die cavity is filled with a colloid skin.
4. An SMT reflow soldering processing clamp plate mold according to claim 1, wherein: the die cavity is divided into an upper independent cavity diameter and a lower independent cavity diameter, and the upper end and the lower end of the die cavity are in a convex shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920230152.9U CN209754223U (en) | 2019-02-21 | 2019-02-21 | SMT reflow soldering processing clamp plate mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920230152.9U CN209754223U (en) | 2019-02-21 | 2019-02-21 | SMT reflow soldering processing clamp plate mould |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209754223U true CN209754223U (en) | 2019-12-10 |
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ID=68752390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920230152.9U Active CN209754223U (en) | 2019-02-21 | 2019-02-21 | SMT reflow soldering processing clamp plate mould |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209754223U (en) |
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2019
- 2019-02-21 CN CN201920230152.9U patent/CN209754223U/en active Active
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