CN209749034U - High frequency multilayer circuit board fast dispels heat - Google Patents
High frequency multilayer circuit board fast dispels heat Download PDFInfo
- Publication number
- CN209749034U CN209749034U CN201920219611.3U CN201920219611U CN209749034U CN 209749034 U CN209749034 U CN 209749034U CN 201920219611 U CN201920219611 U CN 201920219611U CN 209749034 U CN209749034 U CN 209749034U
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- circuit board
- air current
- air
- fixed mounting
- heat
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Abstract
The utility model discloses a high frequency multilayer circuit board fast dispels heat, including the circuit board main part, fixed mounting has inside hollow air current case that is in the middle of the inside of circuit board main part, and the top and the equal fixed mounting in bottom of air current case have splint, and the heat conduction piece has been inlayed to the centre of splint, and the inboard fixed clamp of splint is equipped with the base plate, and one side fixed mounting of air current case has defeated bellows, and the inside fixed mounting of defeated bellows has defeated gas fan, and the opposite side fixed mounting of air current case has the exhaust box, and the inside fixed mounting of exhaust box has the air exhaust fan, and the both ends of air current. The utility model discloses a connect base plate and air current case through the heat conduction piece that forms by the preparation of graphite alkene material, connect gas transmission fan and air exhaust fan respectively at the both ends of air current case again to this accessible gas transmission fan and air exhaust fan form the flowing air current at the air current incasement, with this heat that conducts heat conduction piece to the air current incasement blows to the outside of circuit board, with this realization radiating effect.
Description
Technical Field
The utility model relates to an electron field, in particular to high frequency multilayer circuit board dispels heat fast.
Background
The circuit board is also called as a circuit board, is a flexible printed circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent flexibility, has the characteristics of high wiring density, light weight, thin thickness and good bending property, and has the advantages of miniaturization and intuition of the circuit board and plays an important role in batch production of fixed circuits and optimization of electric appliance layout.
However, the existing circuit board is easy to generate heat in the long-time use process, if the circuit board is not subjected to heat dissipation treatment, an electronic circuit on the circuit board is easy to be damaged due to overhigh temperature, so that the circuit board cannot be used any more, and therefore the practicability is not strong.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to overcome prior art's defect, provide a high frequency multilayer circuit board dispels heat fast, possible heat dissipation problem of solving the circuit board.
In order to solve the technical problem, the utility model provides a following technical scheme:
The utility model relates to a high frequency multilayer circuit board fast dispels heat, including the circuit board main part, fixed mounting has inside hollow air current case that is in the middle of the inside of circuit board main part, the top and the equal fixed mounting in bottom of air current case have splint, the heat conduction piece has been inlayed to the centre of splint, the inboard fixation clamp of splint is equipped with the base plate, one side fixed mounting of air current case has defeated bellows, defeated bellows's inside fixed mounting has gas transmission fan, the opposite side fixed mounting of air current case has the exhaust box, the inside fixed mounting of exhaust box has the air exhaust fan, the both ends of air current case are connected with the gas-supply pipe respectively.
As a preferred technical scheme of the utility model, the air current case is connected through the gas-supply pipe with the defeated bellows.
As a preferred technical scheme of the utility model, the air current case is connected through the gas-supply pipe with the suction box.
As an optimized technical scheme of the utility model, airflow box and base plate are connected through the heat conduction piece.
As an optimized technical solution of the present invention, the heat conducting block is made of graphene material.
As an optimized technical scheme of the utility model, two fixed mounting has the support frame between the splint.
As an optimized technical proposal of the utility model, the splint are fixedly connected with the supporting frame.
Compared with the prior art, the beneficial effects of the utility model are as follows:
The utility model discloses a connect base plate and air current case through the heat conduction piece that forms by the preparation of graphite alkene material, connect gas transmission fan and air exhaust fan respectively at the both ends of air current case again to this accessible gas transmission fan and air exhaust fan form the flowing air current at the air current incasement, with this heat that conducts heat conduction piece to the air current incasement blows to the outside of circuit board, with this realization radiating effect.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic view of the overall structure of the present invention;
Fig. 2 is one of the partial structural schematic diagrams of the present invention;
Fig. 3 is a second partial schematic structural view of the present invention;
In the figure: 1. a circuit board main body; 2. an airflow box; 3. a splint; 4. a heat conducting block; 5. a substrate; 6. an air conveying box; 7. a gas transmission fan; 8. an air extraction box; 9. an air exhaust fan; 10. a gas delivery pipe; 11. a support frame.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.
Wherein like reference numerals refer to like parts throughout.
In addition, if a detailed description of the known art is not necessary to show the features of the present invention, it is omitted. It should be noted that the terms "front," "back," "left," "right," "upper" and "lower" used in the following description refer to directions in the drawings, and the terms "inner" and "outer" refer to directions toward and away from, respectively, the geometric center of a particular component.
Example 1
As shown in fig. 1-3, the utility model provides a high frequency multilayer circuit board fast dispels heat, including circuit board main part 1, fixed mounting has inside hollow air current case 2 in the middle of the inside of circuit board main part 1, the equal fixed mounting in top and the bottom of air current case 2 has splint 3, heat conduction piece 4 has been inlayed to the centre of splint 3, the inboard fixed clamp of splint 3 is equipped with base plate 5, one side fixed mounting of air current case 2 has air transmission case 6, the inside fixed mounting of air transmission case 6 has air transmission fan 7, the opposite side fixed mounting of air current case 2 has air suction box 8, air suction box 8's inside fixed mounting has air exhaust fan 9, the both ends of air current case 2 are connected with gas-supply pipe 10 respectively.
Further, the air flow box 2 is connected with the air conveying box 6 through an air conveying pipe 10, and the air is conveyed into the air flow box 2 through the air conveying fan 7 in the air conveying box 6 and the air conveying pipe 10.
The air flow box 2 is connected with the air suction box 8 through an air pipe 10, and an air suction fan 9 in the air suction box 8 draws out the air flow in the air flow box 2 through the air pipe 10.
The airflow box 2 and the substrate 5 are connected through the heat-conducting block 4, and the heat of the substrate 5 can be conducted into the airflow box 2 through the heat-conducting block 4.
the heat conduction block 4 is made of graphene materials, and the graphene materials have good heat conduction performance, so that the heat conduction block 4 made of the graphene materials can conduct heat of the substrate 2 into the airflow box 2.
A support frame 11 is fixedly arranged between the two clamping plates 3, and the two clamping plates 3 can be connected through the support frame 11.
Splint 3 and support frame 11 fixed connection, support frame 11 plays the effect of fixed stay to splint 3.
specifically, the utility model discloses an in the use, the user is earlier with 1 fixed mounting of circuit board main part, after installing, the utility model discloses can drop into operation, base plate 5 in the circuit board main part 1 produces the heat in long-time working process, heat conduction to the air current case 2 in the heat conduction piece 4 in the base plate 5 this moment, the user opens air transmission fan 7 and air exhaust fan 9 respectively this moment, air transmission fan 7 passes through the gas-supply pipe 10 with the air current input air current case 2 in, air exhaust fan 9 takes the air current out from air current case 2 through gas-supply pipe 10, make the air current in the air current case 2 flow, can take away the heat of heat conduction piece 4 conduction through the air current flow, with this realization heat dissipation.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. the utility model provides a high frequency multilayer circuit board fast dispels heat, includes circuit board main part (1), its characterized in that, fixed mounting has inside hollow air current case (2) of being in the middle of the inside of circuit board main part (1), the top and the equal fixed mounting in bottom of air current case (2) have splint (3), heat conduction piece (4) have been inlayed to the centre of splint (3), base plate (5) are equipped with to the inboard fixation clamp of splint (3), one side fixed mounting of air current case (2) has defeated bellows (6), the inside fixed mounting of defeated bellows (6) has defeated gas fan (7), the opposite side fixed mounting of air current case (2) has air suction box (8), the inside fixed mounting of air suction box (8) has air suction fan (9), the both ends of air current case (2) are connected with gas-supply pipe (10) respectively.
2. the high-frequency multilayer circuit board capable of rapidly dissipating heat according to claim 1, wherein the air flow box (2) and the air delivery box (6) are connected through an air delivery pipe (10).
3. The high-frequency multilayer circuit board capable of rapidly dissipating heat according to claim 1, wherein the air flow box (2) and the air suction box (8) are connected through an air pipe (10).
4. The high-frequency multilayer circuit board with rapid heat dissipation according to claim 1, wherein the airflow box (2) and the substrate (5) are connected through a heat-conducting block (4).
5. The multilayer circuit board with rapid heat dissipation and high frequency of claim 1, wherein the heat-conducting block (4) is made of graphene material.
6. The multilayer circuit board for rapidly dissipating heat at high frequency according to claim 1, wherein a support frame (11) is fixedly installed between the two clamping plates (3).
7. the multilayer circuit board for rapidly dissipating heat and high frequency according to claim 6, wherein the clamping plate (3) is fixedly connected with the supporting frame (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920219611.3U CN209749034U (en) | 2019-02-20 | 2019-02-20 | High frequency multilayer circuit board fast dispels heat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920219611.3U CN209749034U (en) | 2019-02-20 | 2019-02-20 | High frequency multilayer circuit board fast dispels heat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209749034U true CN209749034U (en) | 2019-12-06 |
Family
ID=68707372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920219611.3U Active CN209749034U (en) | 2019-02-20 | 2019-02-20 | High frequency multilayer circuit board fast dispels heat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209749034U (en) |
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2019
- 2019-02-20 CN CN201920219611.3U patent/CN209749034U/en active Active
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