CN209737640U - silicon wafer mechanical gripper - Google Patents
silicon wafer mechanical gripper Download PDFInfo
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- CN209737640U CN209737640U CN201920555414.9U CN201920555414U CN209737640U CN 209737640 U CN209737640 U CN 209737640U CN 201920555414 U CN201920555414 U CN 201920555414U CN 209737640 U CN209737640 U CN 209737640U
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Abstract
the utility model provides a silicon wafer mechanical gripper, it includes mechanical arm mechanism, manipulator and visual identification mechanism, mechanical arm mechanism includes first mechanical arm subassembly and the second mechanical arm subassembly of mutual articulated, the movable tip in second mechanical arm subassembly is all installed to manipulator and visual identification mechanism, it utilizes vacuum chuck to absorb the silicon wafer and shifts the back, when releasing the silicon wafer, utilize the basin that the splendid attire has buffer liquid to connect the silicon wafer greatly, and simultaneously, through setting up the slope subassembly on silicon wafer mechanical gripper, when making the silicon wafer release, become an inclination release with the liquid level, it is internal to make the silicon wafer insert buffer liquid to incline, it is internal that more horizontally falls into buffer liquid, silicon wafer and basin arm collision have been avoided, rigidity touching breakable technical problem when solving the silicon wafer release.
Description
Technical Field
the utility model relates to a silicon wafer automatic processing technical field specifically is a silicon wafer machinery tongs.
background
with the continuous development of science and technology, the application range of thin and brittle wafer materials such as solar silicon wafers and the like is continuously expanded, and because the wafer materials are very brittle and the thickness of the processed wafers is very thin, the wafers are very difficult to load and unload in the production and manufacturing processes such as cutting, edge grinding, etching, polishing, cleaning and the like and are easy to damage. If the method is not proper, the processed nano-scale surface is easy to damage. Therefore, a safe, reliable, efficient pick-up system plays an important role.
at present, a gas vacuum chuck picking mode is mostly adopted for a brittle and thin wafer picking mode, and the problem that after the silicon wafer is picked by the vacuum chuck, the silicon wafer is broken due to hard touch of silicon wafer blanking in the releasing process exists.
chinese utility model application number is CN 201110380003.9's chinese patent discloses a piezoelectricity ultrasonic vibration adsorbs pickup, including an inside vibration cavity that is equipped with vibration chamber and vibration dish, it has the piezoceramics piece to bond on the vibration dish, and the front end of vibration cavity is equipped with the sucking disc of picking up with vibration chamber intercommunication, and the rear end intercommunication of picking up the sucking disc has suction valve and discharge valve, and the front end of picking up the sucking disc is equipped with the one or more small-size elasticity cavitys that are linked together with the suction valve. The vibration cavity, the suction valve, the exhaust valve and the vibration disc form a closed vibration cavity, the vibration disc vibrates under the driving of the power supply, so that the volume of the vibration cavity is changed, air in the closed vibration cavity is exhausted into the atmosphere, negative pressure is formed in the suction disc, and the picking work is completed.
although the above patent only realizes the efficient grasping of the fragile silicon wafer, it also solves the technical problem that the rigid touch is fragile when the silicon wafer is released.
SUMMERY OF THE UTILITY MODEL
to above problem, the utility model provides a silicon wafer machinery tongs, it utilizes vacuum chuck to absorb the silicon wafer and shifts the back, when releasing the silicon wafer, the basin that utilizes the splendid attire to be equipped with buffer liquid connects the silicon wafer greatly, simultaneously, through setting up the slope subassembly on silicon wafer machinery tongs, when making the silicon wafer release, become an inclination release with the liquid level, it is internal to make the silicon wafer insert buffer liquid to one side, it is internal that falls into buffer liquid than the horizontality, the collision of silicon wafer and basin arm has been avoided, rigidity touching breakable technical problem when solving the silicon wafer release.
in order to achieve the above object, the utility model provides a following technical scheme:
a silicon wafer mechanical gripper comprising:
the mechanical arm mechanism comprises a first mechanical arm component and a second mechanical arm component which are mutually hinged, and relative to one end of the first mechanical arm component, which is hinged with the second mechanical arm component, the first mechanical arm component is horizontally and rotatably arranged around the other end of the first mechanical arm component, and the second mechanical arm component is horizontally and rotatably arranged around one end of the second mechanical arm component, which is hinged with the first mechanical arm component;
the manipulator is arranged at one end of the second mechanical arm component, which rotates horizontally, the second mechanical arm component synchronously rotates and swings, and the manipulator comprises a lifting driving piece, an adsorption component and an inclination component, the lifting driving piece is vertically arranged on the second mechanical arm component, the adsorption component and the inclination component are both arranged on a mounting connecting plate below the lifting driving piece, and the adsorption component and the inclination component are respectively arranged at two ends of the mounting connecting plate in the length direction; and
And the visual recognition mechanism is arranged at one end of the second mechanical arm component, which rotates horizontally, and synchronously rotates and swings with the second mechanical arm component.
as a refinement, the first robot arm assembly comprises:
a first rotary drive member;
The first mechanical arm is arranged at the rotating end of the first rotating driving piece, is driven to rotate by the first rotating driving piece, and is hinged with the second mechanical arm component at the rotating end part.
As an improvement, the second robot arm assembly comprises:
one end of the second mechanical arm is hinged with the first mechanical arm component, the other end of the second mechanical arm horizontally rotates and swings, and the mechanical arm is installed at one end of the horizontal rotation and swing; and
and the second rotary driving piece is arranged on the second mechanical arm and drives the second mechanical arm to horizontally rotate and swing.
as an improvement, the adsorption assembly comprises:
the first vacuum chuck is arranged on the mounting connecting plate; and
And the first vacuum negative pressure switch is arranged corresponding to the vacuum sucker and controls the first vacuum sucker to start and stop.
As an improvement, the tilt assembly comprises:
the rotating support is fixedly connected with the mounting connecting plate;
one end of the reset plate is hinged with the rotating support, and the other end of the reset plate is connected with the rotating support in a swinging mode through an elastic adjusting unit;
The second vacuum chuck is arranged on the reset plate;
and the second vacuum negative pressure switch is arranged corresponding to the second vacuum sucker and controls the second vacuum sucker to start and stop.
as an improvement, the elasticity adjusting unit includes:
the top end of the guide rod is installed on the installation connecting plate in a sliding mode along the vertical direction, the bottom end of the guide rod is installed on the reset plate in a sliding mode along the horizontal direction, and a waist groove is formed in the position, in sliding fit with the reset plate, of the guide rod;
The pressing plate is horizontally arranged on the guide rod, is positioned right above the reset plate and is provided with a wave ball screw which is abutted against the reset plate;
The elastic piece is sleeved on the guide rod, and two ends of the elastic piece are respectively abutted against and compressed with the pressing plate and the mounting connecting plate; and
The extruded part, the extruded part is parallel the guide arm install in reset on the board, its lower extreme is located reset the below of board.
As an improvement, the identification mechanism comprises:
The mounting bracket is mounted on the horizontal rotation swinging end of the second mechanical arm component;
The camera is mounted on the mounting bracket and is vertically arranged; and
and the lens is arranged at the lower end part of the camera.
The beneficial effects of the utility model reside in that:
(1) the utility model discloses after utilizing vacuum chuck to absorb silicon wafer and carry out the transfer, when releasing the silicon wafer, utilize the basin that contains buffer liquid to hold and connect the silicon wafer, simultaneously, through setting up the slope subassembly on silicon wafer machinery tongs, when making the silicon wafer release, become an inclination release with the liquid level, make the silicon wafer insert buffer liquid body to one side, the more horizontal falls into buffer liquid body, avoids colliding with the basin arm, has avoided rigid touch to make the silicon wafer broken;
(2) the utility model discloses utilize extruded article and basin open-top's touching, make the elastic component extrusion, and then make second vacuum chuck put on the bench, make absorbent silicon wafer slope appear, it is internal to fall into the buffer solution, and the structure is ingenious, need not additionally set up power unit.
to sum up, the utility model has the advantages of the structure is ingenious, effectively avoid silicon wafer release breakage, be particularly useful for silicon wafer automatic processing technical field.
drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic view of a partial three-dimensional structure of the present invention;
FIG. 3 is a schematic view of the three-dimensional structure of the manipulator of the present invention;
Fig. 4 is a schematic view of the front view structure of the manipulator of the present invention;
FIG. 5 is a schematic side view of the manipulator of the present invention;
FIG. 6 is a schematic sectional view of the manipulator of the present invention;
fig. 7 is a schematic view of the release working state of the manipulator of the present invention;
Fig. 8 is a schematic view of the three-dimensional structure of the vision recognition mechanism of the present invention.
Detailed Description
the technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
example 1:
As shown in fig. 1 to 3, a mechanical gripper for silicon wafers comprises:
the mechanical arm mechanism 1 comprises a first mechanical arm component 11 and a second mechanical arm component 12 which are mutually hinged, relative to one end of the first mechanical arm component 11 hinged with the second mechanical arm component 12, the first mechanical arm component 11 is horizontally and rotatably arranged around the other end of the first mechanical arm component 11, and the second mechanical arm component 12 is horizontally and rotatably arranged around one end of the second mechanical arm component 12 hinged with the first mechanical arm component 11;
The manipulator 2 is installed at one end of the second manipulator assembly 12, which rotates horizontally, the second manipulator assembly 12 rotates and swings synchronously, and the manipulator 2 comprises a lifting driving piece 21, an adsorption component 22 and an inclination component 23, the lifting driving piece 21 is vertically installed on the second manipulator assembly 12, the adsorption component 22 and the inclination component 23 are both installed on an installation connecting plate 20 below the lifting driving piece 21, and the adsorption component 22 and the inclination component 23 are respectively arranged at two ends of the installation connecting plate 20 in the length direction; and
and the visual recognition mechanism 3 is arranged at one end of the second mechanical arm component 12, which rotates horizontally, and synchronously rotates and swings with the second mechanical arm component 12.
It should be noted that the first robot arm assembly 11 drives the second robot arm assembly 12 to swing, so that the robot arm 2 mounted on the second robot arm 12 can move to perform suction gripping on the silicon wafer, wherein the visual recognition mechanism 3 is used for recognizing the position of the silicon wafer and the working table for processing the silicon wafer.
it is further explained that, in order to make the manipulator 2 release after grabbing the silicon wafer again, the silicon wafer can not collide with the lateral wall of the material receiving groove that receives the material rigidly, this application through set up the slope subassembly 23 on the manipulator 2, utilize the slope subassembly 23 to make the silicon wafer insert to receive the buffer liquid body of material groove to one side, avoided the level to put into receiving the material inslot, the buffer liquid in the material receiving groove makes the silicon wafer swing from side to side, with receiving the material groove wall and collide.
as shown in fig. 1, as a preferred embodiment, the first robot arm assembly 11 includes:
a first rotary drive 111;
A first mechanical arm 112, wherein the first mechanical arm 112 is mounted at the rotating end of the first rotary driving member 111, is driven to rotate by the first rotary driving member 111, and has a rotating end hinged to the second mechanical arm assembly 12.
The first rotary driving unit 111 drives the first robot arm 112 to swing around the rotation axis of the first rotary driving unit 111, so as to drive the second robot arm assembly 12 to move.
as shown in fig. 2, as a preferred embodiment, the second robot assembly 12 includes:
one end of the second mechanical arm 121 is hinged to the first mechanical arm assembly 11, the other end of the second mechanical arm 121 horizontally rotates and swings, and the mechanical arm 2 is mounted at one end of the horizontal rotation and swing; and
a second rotary driving member 122, wherein the second rotary driving member 122 is mounted on the second mechanical arm 121, and drives the second mechanical arm 121 to swing horizontally.
the second rotary driving unit 122 drives the second robot 121 to swing around the rotation axis of the second rotary driving unit 122, and drives the robot 2 attached to the second robot 121 to swing and pick up the silicon wafer.
as shown in fig. 3, as a preferred embodiment, the adsorption assembly 22 includes:
the first vacuum chuck 221, the first vacuum chuck 221 is mounted on the mounting connecting plate 20; and
the first vacuum negative pressure switch 222 is arranged corresponding to the vacuum chuck 221, and controls the first vacuum chuck 221 to start and stop.
The first vacuum chuck 221 is controlled by the first vacuum negative pressure switch 222, and the first vacuum chuck 221 cooperates with the second vacuum chuck 234 of the tilting unit 23 to suction and pick up the silicon wafer.
as shown in fig. 3 to 7, as a preferred embodiment, the tilting assembly 23 includes:
the rotating support 231 is fixedly connected with the mounting connecting plate 20;
one end of the reset plate 232 is hinged with the rotating support 231, and the other end of the reset plate 232 is connected with the rotating support 231 in a swinging manner through an elastic adjusting unit 233;
a second vacuum cup 234, wherein the second vacuum cup 234 is mounted on the reset plate 232;
and the second vacuum negative pressure switch 235 is arranged corresponding to the second vacuum chuck 234, and controls the second vacuum chuck 234 to start and stop.
Further, the elastic adjustment unit 233 includes:
A guide rod 2331, the top end of the guide rod 2331 is installed on the installation connection plate 20 in a sliding manner along the vertical direction, the bottom end of the guide rod 2331 is installed on the reset plate 232 in a sliding manner along the horizontal direction, and a waist groove 2332 is arranged at the position where the guide rod is in sliding fit with the reset plate 232;
a pressing plate 2333, wherein the pressing plate 2333 is horizontally mounted on the guide rod 2331, is positioned right above the reset plate 232, and is provided with a wave bead screw 2334 which is abutted against the reset plate 232;
the elastic member 2335 is sleeved on the guide rod 2331, and two ends of the elastic member 2335 are respectively abutted against the pressing plate and the mounting connecting plate 20 for compression; and
and the pressing members 2336 are arranged on the reset plate 232 in parallel with the guide rods 2331, and the lower end of the pressing members 2336 is positioned below the reset plate 232.
As shown in fig. 7, when the second vacuum chuck 234 is controlled by the second vacuum negative pressure switch 235, when the first vacuum chuck 221 and the second vacuum chuck 234 suck and grab the silicon wafer and transfer to the position right above the material receiving slot, the lifting driving member 21 drives the grabbing assembly 22 and the tilting assembly 23 to move down synchronously, so that the silicon wafer sucked by the first vacuum chuck 221 and the second vacuum chuck 234 approaches the material receiving slot, then the pressing member 2336 contacts with the slot wall of the material receiving slot, the elastic member 2335 is compressed by pressing the slot wall of the material receiving slot, the upper end of the guide rod 2331 slides upwards, the lower end slides in the waist slot 2332, the reset plate 232 tilts, the second vacuum chuck 234 tilts, the silicon wafer sucked by the second vacuum chuck 234 is also tilted, and then the second vacuum chuck 234 releases, so that the silicon wafer falls into the buffer body of the material receiving slot.
Further, before the pressing member 2336 presses the groove wall of the receiving groove, the first vacuum negative pressure switch 222 controls the first vacuum chuck 221 to be released to move one end of the silicon wafer.
as shown in fig. 8, as a preferred embodiment, the identification means 3 includes:
A mounting bracket 31, wherein the mounting bracket 31 is mounted on the horizontal rotation swing end of the second mechanical arm assembly 12;
a camera 32, wherein the camera 32 is mounted on the mounting bracket 31 and is vertically arranged; and
And a lens 33, wherein the lens 33 is mounted on the lower end of the camera 32.
the recognition unit 3 reads an external environment image through the camera 32 and the lens 33, compares the external environment image with an environment image stored in advance in the arithmetic unit, and determines the specific positions of the material receiving tank and the table. The working process is as follows:
The first vacuum chuck 221 is controlled by the first vacuum negative pressure switch 222, the first vacuum chuck 221 and the second vacuum chuck 234 in the tilting assembly 23 are matched with each other to suck and grab the silicon wafer, the second vacuum chuck 234 is controlled by the second vacuum negative pressure switch 235, when the first vacuum chuck 221 and the second vacuum chuck 234 suck and grab the silicon wafer and transfer to the right above the material receiving slot, the lifting driving member 21 will drive the grabbing assembly 22 and the tilting assembly 23 to move downwards synchronously, so that the silicon wafer sucked by the first vacuum chuck 221 and the second vacuum chuck 234 is close to the material receiving slot, then the extrusion member 2336 is contacted with the slot wall of the material receiving slot, by extruding the slot wall of the material receiving slot, the elastic member 2335 is compressed, the upper end of the guide rod 2331 slides upwards, and the lower end slides in the waist slot 2332, so that the reset plate 232 tilts the second vacuum chuck 234, and the silicon wafer sucked by the second vacuum chuck 234 is also tilted accordingly, the second vacuum chuck 234 then releases the silicon wafer so that the silicon wafer falls into the buffer volume of the catch basin.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (7)
1. A silicon wafer mechanical gripper, comprising:
The mechanical arm mechanism (1), the mechanical arm mechanism (1) comprises a first mechanical arm component (11) and a second mechanical arm component (12) which are hinged with each other, relative to one end of the first mechanical arm component (11) which is hinged with the second mechanical arm component (12), the first mechanical arm component (11) is horizontally and rotatably arranged around the other end of the first mechanical arm component, and the second mechanical arm component (12) is horizontally and rotatably arranged around one end of the second mechanical arm component which is hinged with the first mechanical arm component (11);
the manipulator (2) is installed at one end of the second mechanical arm assembly (12) which rotates horizontally, the second mechanical arm assembly (12) rotates and swings synchronously and comprises a lifting driving piece (21), an adsorption component (22) and an inclination component (23), the lifting driving piece (21) is vertically installed on the second mechanical arm assembly (12), the adsorption component (22) and the inclination component (23) are installed on a mounting connecting plate (20) below the lifting driving piece (21), and the adsorption component (22) and the inclination component (23) are respectively arranged at two ends of the mounting connecting plate (20) in the length direction; and
and the visual recognition mechanism (3) is arranged at one end of the second mechanical arm assembly (12) which rotates horizontally, and rotates and swings synchronously with the second mechanical arm assembly (12).
2. A silicon wafer mechanical gripper according to claim 1, characterized in that the first robot arm assembly (11) comprises:
A first rotary drive (111);
The first mechanical arm (112), the first mechanical arm (112) is arranged at the rotating end of the first rotary driving part (111), is driven to rotate by the first rotary driving part (111), and the rotating end part of the first mechanical arm is hinged with the second mechanical arm component (12).
3. a silicon wafer mechanical gripper according to claim 1, characterized in that said second robot arm assembly (12) comprises:
One end of the second mechanical arm (121) is hinged with the first mechanical arm component (11), the other end of the second mechanical arm (121) horizontally rotates and swings, and the mechanical arm (2) is mounted at one end of the horizontal rotating and swinging; and
and the second rotary driving part (122), the second rotary driving part (122) is installed on the second mechanical arm (121), and the second rotary driving part drives the second mechanical arm (121) to horizontally rotate and swing.
4. Mechanical gripper for silicon wafers as claimed in claim 1, characterized in that said suction assembly (22) comprises:
a first vacuum chuck (221), the first vacuum chuck (221) being mounted on the mounting connection plate (20); and
the first vacuum negative pressure switch (222), the first vacuum negative pressure switch (222) and the vacuum chuck (221) are correspondingly arranged, and the first vacuum negative pressure switch controls the first vacuum chuck (221) to start and stop.
5. mechanical gripper for silicon wafers as claimed in claim 1, characterized in that said tilting assembly (23) comprises:
The rotating support (231), the rotating support (231) is fixedly connected with the mounting connecting plate (20);
One end of the reset plate (232) is hinged with the rotating support (231), and the other end of the reset plate (232) is connected with the rotating support (231) in a swinging mode through an elastic adjusting unit (233);
A second vacuum cup (234), the second vacuum cup (234) mounted to the reset plate (232);
And the second vacuum negative pressure switch (235) is arranged corresponding to the second vacuum sucker (234) and controls the second vacuum sucker (234) to start and stop.
6. Mechanical gripper for silicon wafers as claimed in claim 5, characterized in that said elastic adjustment unit (233) comprises:
The top end of the guide rod (2331) is installed on the installation connecting plate (20) in a sliding mode along the vertical direction, the bottom end of the guide rod (2331) is installed on the reset plate (232) in a sliding mode along the horizontal direction, and a waist groove (2332) is formed in the position, matched with the reset plate (232), of the guide rod in a sliding mode;
The pressing plate (2333) is horizontally arranged on the guide rod (2331), is positioned right above the reset plate (232), and is provided with a wave bead screw (2334) which is abutted against the reset plate (232);
The elastic piece (2335) is sleeved on the guide rod (2331), and two ends of the elastic piece (2335) are respectively abutted against the pressing plate and the mounting connecting plate (20) for compression; and
the pressing piece (2336) is arranged on the reset plate (232) in parallel to the guide rod (2331), and the lower end of the pressing piece (2336) is positioned below the reset plate (232).
7. mechanical gripper for silicon wafers as claimed in claim 1, characterized in that said recognition means (3) comprise:
a mounting bracket (31), the mounting bracket (31) being mounted on the horizontal rotational swing end of the second robot arm assembly (12);
a camera (32), said camera (32) mounted on said mounting bracket (31), which is vertically disposed; and
a lens (33), wherein the lens (33) is mounted at the lower end of the camera (32).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920555414.9U CN209737640U (en) | 2019-04-23 | 2019-04-23 | silicon wafer mechanical gripper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920555414.9U CN209737640U (en) | 2019-04-23 | 2019-04-23 | silicon wafer mechanical gripper |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209737640U true CN209737640U (en) | 2019-12-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920555414.9U Active CN209737640U (en) | 2019-04-23 | 2019-04-23 | silicon wafer mechanical gripper |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209737640U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118617389A (en) * | 2024-08-09 | 2024-09-10 | 浙江威星智能仪表股份有限公司 | Automatic grabbing device of ultrasonic wave gas table valve |
-
2019
- 2019-04-23 CN CN201920555414.9U patent/CN209737640U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118617389A (en) * | 2024-08-09 | 2024-09-10 | 浙江威星智能仪表股份有限公司 | Automatic grabbing device of ultrasonic wave gas table valve |
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