CN209729740U - A kind of MHFC copper sheet - Google Patents
A kind of MHFC copper sheet Download PDFInfo
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- CN209729740U CN209729740U CN201920088862.2U CN201920088862U CN209729740U CN 209729740 U CN209729740 U CN 209729740U CN 201920088862 U CN201920088862 U CN 201920088862U CN 209729740 U CN209729740 U CN 209729740U
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- copper sheet
- bottom plate
- borehole
- capillary
- mhfc
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Abstract
The utility model discloses a kind of MHFC copper sheets, are applied to capacitor fabrication techniques field, comprising: copper sheet bottom plate；Multiple boreholes are set on the copper sheet bottom plate；Multiple capillaries, each capillary is arranged in a borehole, and the capillary is connected with the copper sheet bottom plate；Multiple injection orifices, each injection orifice is between adjacent preset quantity borehole；Capacity cell is welded on capillary corresponding to the adjacent preset quantity borehole.Using the utility model embodiment, copper sheet bottom plate is connected with the multiple capacity cells installed thereon using capillary, is connect so that lead is as short as possible with element, reduces the stray inductance of capacitor, because copper sheet bottom plate there are enough sectional areas, metal loss is dropped to minimum.
Description
Technical field
The utility model relates to power capacitor technical field more particularly to a kind of MHFC copper sheets.
Background technique
The application of power capacitor is related to D.C. high voltage transmission, middle volage current transformer and middle pressure Rail Transit System, Yi Jisuo
Have using large scale capacitor (> 50kg) etc. in application fields.
The environment used can be the inner connecting way of middle pressure, high-voltage capacitor.With the development of technology, electric energy obtains
Take mode more diversified, the mankind are more and more stronger to the dependence of electric energy.As large-sized capacitor, it is typically installed at important
Capital construction facility in, invest it is usually huge, the reliability of capacitor just seems particularly important at this time, so capacitor is usual
It is required that the service life is decades-long (usual 30-40 or longer).And this requires general technology to be unable to satisfy at all.Because
Capacitor on the market generallys use more copper sheet connections.However, connecting using more copper sheets, high stray inductance will necessarily be caused
It is totally unfavorable to the normal operation of capacitor with high temperature rise.And connecting wire is usually made of thin copper belt, if manufacture work
Skill is bad, and the uneven jagged or serious bending in edge, tip is easy to produce shelf depreciation.Second, capacitor plate edge is electric
Field is concentrated, and the uniform field strength that pole plate is shown in is high, and capacitor edge is also easy to produce shelf depreciation.Adjoint shelf depreciation generation ozone,
The gases such as nitrogen oxides, this gas make medium by chemical attack, dielectric properties decline, so that gradually aging punctures, seriously
Influence the service life of capacitor.Compared with ordinary capacitor, this technology replaces more copper sheets, uses monolith copper sheet and output terminal
Connection, so that capacitor has better performance, makes it have very high proof voltage and ripple current ability, very low stray inductance
(ESL) and equivalent series resistance (ESR), and then the targets of enough long-lives is realized.
Utility model content
The purpose of this utility model is to provide a kind of MHFC copper sheets, it is intended to using capillary by copper sheet bottom plate with install thereon
Multiple capacity cells connect so that being connect by lead that capillary is formed is as short as possible with element, reduce capacitor
Stray inductance metal loss is dropped to minimum because copper sheet bottom plate has enough sectional areas.
To achieve the above object, the utility model provides a kind of MHFC copper sheet, comprising:
Copper sheet bottom plate；
Multiple boreholes are set on the copper sheet bottom plate；
Multiple capillaries, each capillary is arranged in a borehole, and the capillary is connected with the copper sheet bottom plate；
Multiple injection orifices, each injection orifice is between adjacent preset quantity borehole；
Capacity cell is welded on capillary corresponding to the adjacent preset quantity borehole.
In a kind of implementation, the multiple borehole is divided into multirow, and parallelly distribute on is on the copper sheet bottom plate.
In a kind of implementation, each injection orifice is between adjacent 4 boreholes in the multiple injection orifice；And it is the multiple
Injection orifice is spaced apart on the row where borehole.
In a kind of implementation, capillary corresponding to the capacity cell and the adjacent preset quantity borehole is using weldering
Tin connection.
In a kind of implementation, the copper sheet bottom plate includes extension, the plane where the extension and the copper sheet
Plane where floor body is vertical, and the extension is isosceles trapezoidal structure.
In a kind of implementation, the section of the borehole is the rectangle structure with chamfering, and the capillary is from rectangle
A side to another side extend.
In a kind of implementation, the turning of the copper sheet bottom plate is disposed as chamfering structure.
Therefore, using the embodiments of the present invention MHFC copper sheet, what is had is had the beneficial effect that:
Copper sheet copy for the record or for reproduction is connected with the multiple capacity cells installed thereon using capillary, so that being drawn by what capillary was formed
Line is as short as possible to be connect with element, reduces the stray inductance of capacitor, because copper sheet bottom plate has enough sectional areas, so that
Metal loss can drop to minimum；
Copper sheet it is flat and with other copper sheet no overlaps, flat design, can tolerate dash current, can be realized good
Heat transfer；
The position of the solder joint of each capacity cell is clearly defined by copper sheet bottom plate, so that being become with robot welding
May, this just provides technical guarantee for large-scale production capacitor；
It through setting capillary in borehole, realizes that the part of capillary moves freely, compensates for because of the slight of capacity cell
Height it is different and caused by welding difficulty, the mechanical stress between gilding layer and metal film is eliminated, especially in the fortune of capacitor
During row, different materials expand with heat and contract with cold, and the mechanical force for freely eliminating terminal and metallic film surface of capillary prevents capacitor
Run and manufacturing process in generate stress and caused by element displacement and fracture a possibility that；
The chamfering and fillet technique used by copper sheet bottom plate, reduces the shelf depreciation of capacitor.
Detailed description of the invention
Fig. 1 is the first structural schematic diagram of MHFC copper sheet provided by the embodiment of the utility model.
Fig. 2 is second of structural schematic diagram of MHFC copper sheet provided by the embodiment of the utility model.
Fig. 3 is the third structural schematic diagram of MHFC copper sheet provided by the embodiment of the utility model.
Fig. 4 is the first equivalent circuit diagram.
Fig. 5 is second of equivalent circuit diagram.
Specific embodiment
Illustrate the embodiments of the present invention below by way of specific specific example, those skilled in the art can be by this theory
Content disclosed by bright book understands other advantages and effect of the utility model easily.The utility model can also be by addition
Different specific embodiments are embodied or practiced, and the various details in this specification can also be based on different viewpoints and answer
With carrying out various modifications or alterations under the spirit without departing from the utility model.
Please refer to Fig. 1-5, it should be noted that diagram provided in the present embodiment only illustrates that this is practical in a schematic way
Novel basic conception, only shown in schema then with related component in the utility model rather than component when according to actual implementation
Number, shape and size are drawn, when actual implementation kenel, quantity and the ratio of each component can arbitrarily change for one kind, and
Its assembly layout kenel may also be increasingly complex.
As depicted in figs. 1 and 2, the utility model embodiment provides a kind of MHFC copper sheet, comprising:
Copper sheet bottom plate 11；
Multiple boreholes 12 are set on the copper sheet bottom plate 11；
Multiple capillaries 13, each capillary is arranged in a borehole 12, and the capillary and 11 phase of copper sheet bottom plate
Even；
Multiple injection orifices 14, each injection orifice is between adjacent preset quantity borehole；
Capacity cell 15 is welded on capillary corresponding to the adjacent preset quantity borehole.
For copper sheet bottom plate 11, the basic theories based on Calculation of Heat Transfer obtains following formula:
Wherein, Δ t is temperature rise, and Φ is heat flow, and s is plane wall surfaces area, and k is total coefficient of conductivity.
It is understood that 1/sk is known as thermal resistance, then the temperature rise of capacitor is equal to capacitor internal under thermal steady state
The product of the thermal resistance of heating power and certain corresponding a part.Then when one timing of capacitor internal heating power, plane wall surfaces face
Product is bigger, and it is better to radiate, and temperature rise is lower.In the present invention, inner lead uses monolith copper sheet structure, as shown in Figure 1.Copper
Piece current carrying area is no more than 2.5A/mm2, reduce loss.The structure of monolith copper sheet makes plane wall surfaces area reach maximum, drop
Low temperature rise.
In the utility model embodiment, multirow distribution is set by multiple boreholes 12, and parallelly distribute on is on copper sheet bottom plate,
Specifically, the quantity of every a line is without limitation, set according to actual capacitor size demand.The one of the utility model
In kind implementation, specifically, the borehole quantity of every a line is 10,13,16,20 etc., do not constitute practical to this
The specific restriction of new embodiment.
Multiple boreholes 12 are the corresponding boreholes on copper sheet bottom plate 11, which forms an empty region, in the sky
The partial region for retaining copper sheet bottom plate in region forms capillary.In a kind of specific implementation of the utility model, each digging
The section in hole is the rectangle structure with chamfering, and capillary extends from a rectangular side to another side.
As shown in Fig. 2, in a kind of implementation of the utility model, the capacity cell and the adjacent preset quantity
Capillary corresponding to borehole is connected using scolding tin.Specifically, welded for the corresponding capillary of 4 boreholes of phase with capacity cell,
And the inside of capacity cell includes an injection orifice, can be improved the uniformity of injecting glue and is infused for each capacity cell
The validity of glue.Fig. 3 is a kind of specific installation effect diagram.
It should be noted that loss is the root of capacitor fever in capacitor technology, accelerated ageing is destroyed main
Factor.So condenser loss is to measure an important indicator of capacitor quality superiority and inferiority, the bigger fever of loss is more serious, then
Indicate that the efficiency of capacitor transmitting energy is poorer.The parameter for characterizing condenser loss characteristic is loss angle tangent tg δ.Capacitor
Loss tangent is smaller, and loss is smaller, and better, the service life is longer for the performance of capacitor.Metallic film capacitor loss angle is just
Cut the composition of tg δ:
Wherein, tg δd1For main dielectric loss angle tangent, tg δd2For assist medium (including epoxy material and external protective structures
Medium) loss angle tangent, tg δpLoss tangent, tg δ are led for leakageeFor metal part loss tangent, C1 is main medium electricity
Capacity, C2 are the capacitance of replicating medium, and Cp is the total capacitance of major-minor medium；Cp=C1+C2, f are test frequencies, and Rp is leakage
Conduction resistance, reIt is metal part resistance, equivalent circuit diagram is illustrated in fig. 4 shown below.
For metallized film, under normal circumstances, C2 maximum be no more than several hundred PF, visual C1 be much larger than C2, then Cp > >
C2, Cp ≈ C1.
Loss is led in leakage:Due to Rp > 1010Ω is relatively very big, therefore tg δp→ 0, this omits, above formula
It is reduced to
Equivalent circuit is illustrated in fig. 5 shown below.
It can be seen that loss tg δd1Depending on metallized film medium itself, it is mainly by the property institute of medium itself
It determines.
Therefore, it under conditions of dielectric material determines, reduces and stable metal thin film capacitor loss tg δ mainly depends on
In metal part tg δeLoss, the loss tg δ of metal parteAccount for about the 5%~10% of tg δ, but main influence because
Element.
Plane borehole where copper sheet bottom plate reserves the capillary 13 of sufficient length, and copper sheet bottom plate uses tin plating mode, so that
Capillary and capacity cell end face use soldering mode, are reliably connected to copper sheet bottom plate and capacity cell.
Meanwhile such as Fig. 1 and Fig. 3, copper sheet bottom plate includes extension, the plane where extension and the copper sheet floor body
The plane at place is vertical, and the extension is isosceles trapezoidal structure.When installation, as shown in Fig. 3, MHCF copper sheet is direct
Output terminal is connected, such structure makes the lead formed by capillary is as short as possible to connect with element.Simultaneously on an element
Using four copper needle welding manners, accordingly, metal lead-outs loss, the loss of pad contact resistance and plain conductor damage are reduced
Consumption, that is, reduce metal loss.
In capacitor fabrication process, to drive the gas in capacity cell and dry metal film out of, welded in capacity cell
After finishing, high temperature drying processes can be used.Room temperature is reduced to after drying, then row injecting glue carries out injecting glue by hole for injecting glue 14.Then herein
In the process, capacitor will receive the loading process to expand with heat and contract with cold.And capacitor operation use process in, in through-flow situation
Under, electrodynamic effect can be generated.The utility model capacitor internal lead uses copper sheet structure, not only has enough sections
Product, and multi-point welding enhances mechanical strength so that capacitor element ultimately forms an entirety.Avoiding makes in manufacture
With in the process by power under the action of, inner lead occurs fracture and big displacement occurs.
Therefore, in the utility model embodiment, copper sheet bottom plate surrounding uses chamfering mode, and uniform field strength prevents office
Portion's electric discharge is slotted between two rows to meet condenser capacity requirement using the mode of interlocking, welding capacity cell as much as possible,
Injection orifice is opened at setting center, so that element mandrel exposes, facilitates the entrance of resin during injecting glue.
The above embodiments are only illustrative of the principle and efficacy of the utility model, and not for limitation, this is practical new
Type.Any person skilled in the art can all carry out above-described embodiment under the spirit and scope without prejudice to the utility model
Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the revealed essence of the utility model
All equivalent modifications or change completed under mind and technical idea, should be covered by the claim of the utility model.
Claims (7)
1. a kind of MHFC copper sheet characterized by comprising
Copper sheet bottom plate；
Multiple boreholes are set on the copper sheet bottom plate；
Multiple capillaries, each capillary is arranged in a borehole, and the capillary is connected with the copper sheet bottom plate；
Multiple injection orifices, each injection orifice is between adjacent preset quantity borehole；
Capacity cell is welded on capillary corresponding to the adjacent preset quantity borehole.
2. a kind of MHFC copper sheet according to claim 1, which is characterized in that the multiple borehole is divided into multirow, and parallel
It is distributed on the copper sheet bottom plate.
3. a kind of MHFC copper sheet according to claim 2, which is characterized in that each injection hole location in the multiple injection orifice
Between adjacent 4 boreholes；And the multiple injection orifice is spaced apart on the row where borehole.
4. a kind of MHFC copper sheet according to claim 1, which is characterized in that the capacity cell and the adjacent present count
Capillary corresponding to a borehole is measured to connect using scolding tin.
5. a kind of MHFC copper sheet according to claim 1, which is characterized in that the copper sheet bottom plate includes extension, described
Plane where extension is vertical with the plane where the copper sheet floor body, and the extension is isosceles trapezoidal structure.
6. a kind of MHFC copper sheet according to claim 1, which is characterized in that the section of the borehole is the length with chamfering
Square structure, the capillary extend from a rectangular side to another side.
7. a kind of MHFC copper sheet according to claim 1, which is characterized in that the turning of the copper sheet bottom plate is disposed as down
Corner structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920088862.2U CN209729740U (en) | 2019-01-18 | 2019-01-18 | A kind of MHFC copper sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920088862.2U CN209729740U (en) | 2019-01-18 | 2019-01-18 | A kind of MHFC copper sheet |
Publications (1)
| Publication Number | Publication Date |
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| CN209729740U true CN209729740U (en) | 2019-12-03 |
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| CN201920088862.2U Active CN209729740U (en) | 2019-01-18 | 2019-01-18 | A kind of MHFC copper sheet |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109887745A (en) * | 2019-01-18 | 2019-06-14 | 柯贝尔电能质量技术（上海）有限公司 | A kind of MHFC copper sheet |
-
2019
- 2019-01-18 CN CN201920088862.2U patent/CN209729740U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109887745A (en) * | 2019-01-18 | 2019-06-14 | 柯贝尔电能质量技术（上海）有限公司 | A kind of MHFC copper sheet |
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