CN209690638U - A kind of laser heating system - Google Patents
A kind of laser heating system Download PDFInfo
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- CN209690638U CN209690638U CN201920521347.9U CN201920521347U CN209690638U CN 209690638 U CN209690638 U CN 209690638U CN 201920521347 U CN201920521347 U CN 201920521347U CN 209690638 U CN209690638 U CN 209690638U
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- laser
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- shaping
- heating system
- cooling
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Abstract
The utility model relates to laser application apparatus technical fields, provide a kind of laser heating system, it includes semiconductor laser pumping source, the first shaping mirror, two-dimensional scanning mirrors and the focus lamp being successively arranged according to laser transmission direction；The semiconductor laser pumping source includes laser diode, the second shaping mirror and the reflecting mirror being successively arranged according to laser transmission direction, and the laser correspondence reflected from the reflecting mirror is transmitted to first shaping mirror；The utility model heating efficiency is high, it can customize region heating in use, and the energy for exporting laser is uniform, heating effect is good, it is particularly suitable for heating the mobile phone screen or glass material rear cover of mobile phone, to implement to dismantle to mobile phone in the broken screen maintenance of mobile phone.
Description
Technical field
The utility model relates to laser application apparatus technical field more particularly to a kind of laser heating systems.
Background technique
Currently, mobile phone, as consumer goods, frequency of use is very high.During routine use, mobile phone is easy to happen
It collides or falls from high altitude, this causes mobile phone screen or glass material rear cover broken, after broken mobile phone screen or glass material
Lid can be replaced after professional dismantles.Since mobile phone screen and glass material rear cover pass through paste adhesive on mobile phone,
After they need to heat mobile phone by air-heater or special heating tool, dismounting just can be carried out.Either use air-heater
Or special heating tool requires continuous heating, and exists and be difficult to realize ask what the specific region on mobile phone was heated
Topic, this easily causes mobile phone and integrally heats up excessively high and lead to its damage of internal device, or even there are batteries of mobile phone to cross thermal explosion
Danger.
Summary of the invention
(1) technical problems to be solved
The purpose of the utility model is to provide a kind of laser heating systems, to solve currently employed air-heater or specially add
Hot tool on mobile phone screen or glass material rear cover remove when, need continuous heating, and be difficult to realize on mobile phone
Specific region the problem of being heated.
(2) technical solution
In order to solve the above-mentioned technical problem, the utility model provides a kind of laser heating system, including successively according to sharp
Semiconductor laser pumping source, the first shaping mirror, two-dimensional scanning mirrors and the focus lamp of optical transmission direction setting；
The semiconductor laser pumping source includes successively according to the laser diode of laser transmission direction setting, the second shaping
Mirror and reflecting mirror, and the laser correspondence reflected from the reflecting mirror is transmitted to first shaping mirror.
Preferably, laser diode described in the utility model, second shaping mirror and the reflecting mirror are arranged cold
But on bottom plate, cooling component is equipped in the bottom of the cooling bottom plate.
Preferably, cooling bottom plate described in the utility model is in step-like, and in every layer of step surface of the cooling bottom plate
On be respectively provided with the laser diode, second shaping mirror and the reflecting mirror.
Preferably, cooling component described in the utility model includes cooling coil, and the both ends of the cooling coil lead to respectively
Cross piping connection water-cooling system.
Preferably, semiconductor laser pumping source described in the utility model further include for accommodate the laser diode,
The shell of second shaping mirror and the reflecting mirror, offers light hole on the housing；It is reflected from the reflecting mirror
Corresponding corresponded to by the light hole of laser be transmitted to first shaping mirror.
Preferably, the first shaping mirror described in the utility model and second shaping mirror are all made of cylindrical mirror, the column
Incident direction of the cylinder of face mirror towards light.
Preferably, the light-emitting surface of cylindrical mirror described in the utility model is set as circle, rectangle, regular hexagon or octagon
Structure.
Preferably, the wavelength of the laser of the transmitting of semiconductor laser pumping source described in the utility model is 900-980nm, function
Rate is 50-100W；The hot spot is square, and its side length is 3-4mm；The focal length of the focus lamp is 100-245mm.
(3) technical effect
The utility model launches the laser beam evenly dispersed along specific direction, the laser by semiconductor laser pumping source
Beam is shaped to the equally distributed hot spot of energy by the first shaping mirror, real by controlling the angle change of the two-dimensional scanning mirrors
The scanning motion that the hot spot makees different scanning path on the focussing plane of focus lamp is now controlled, to be gathered by the focus lamp
The laser that coke obtains can be implemented to heat to object.The utility model heating efficiency is high, is swept in use by the two dimension
The scan path that galvanometer controls the hot spot is retouched, the heating in self defined area is carried out to object with realization, and export laser
Energy it is uniform, heating effect is good, be particularly suitable for heating the mobile phone screen or glass material rear cover of mobile phone, so as to
The mode that mobile phone is implemented to dismantle, and conventionally employed air-heater or special heating tool is effectively prevent to heat in the broken screen maintenance of mobile phone
It is damaged caused by mobile phone internal component.
Detailed description of the invention
It, below will be to implementation in order to illustrate more clearly of the embodiments of the present invention or technical solution in the prior art
Example or attached drawing needed to be used in the description of the prior art are briefly described, it should be apparent that, the accompanying drawings in the following description is
Some embodiments of the utility model, for those of ordinary skill in the art, without creative efforts,
It is also possible to obtain other drawings based on these drawings.
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the structural schematic diagram in semiconductor laser pumping source in the utility model；
Fig. 3 is the mounting structure schematic diagram of cooling bottom plate and cooling component in the utility model.
In figure: 1- semiconductor laser pumping source, 101- laser diode, the second shaping mirror of 102-, 103- reflecting mirror, 2-
One shaping mirror, 3- two-dimensional scanning mirrors, 4- focus lamp, 5- cooling bottom plate, 6- cooling coil, 7- water-cooling system, 8- shell, 9- go out
Unthreaded hole.
Specific embodiment
It is practical new below in conjunction with this to keep the objectives, technical solutions, and advantages of the embodiments of the present invention clearer
Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched
The embodiment stated is the utility model a part of the embodiment, instead of all the embodiments.Based on the implementation in the utility model
Example, every other embodiment obtained by those of ordinary skill in the art without making creative efforts belong to
The range of the utility model protection.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " is pacified
Dress ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integrally
Connection；It can be mechanical connection, be also possible to be electrically connected；Can be directly connected, can also indirectly connected through an intermediary,
It can be the connection inside two elements.For the ordinary skill in the art, above-mentioned art can be understood with concrete condition
The concrete meaning of language in the present invention.
Embodiment 1
Referring to Fig. 1-2, a kind of laser heating system is present embodiments provided, including is successively arranged according to laser transmission direction
Semiconductor laser pumping source 1, the first shaping mirror 2, two-dimensional scanning mirrors 3 and focus lamp 4；
The semiconductor laser pumping source 1 includes the laser diode 101, second being successively arranged according to laser transmission direction
Shaping mirror 102 and reflecting mirror 103, the divergence form laser that wherein laser diode 101 is launched are whole by the second shaping mirror 102
After shape, it is converted into the laser exported in parallel, which reflects by the reflecting mirror 103, and correspondence is transmitted to
First shaping mirror 2.
The laser beam evenly dispersed along specific direction, the laser are launched by the semiconductor laser pumping source 1 as a result,
Beam is shaped to the equally distributed hot spot of energy by the first shaping mirror 2, and this hot spot (laser beam) is swashed relative to traditional by pulse
It is not in that Gaussian beam intermediate energy is high for the Gaussian beam that light device, transmission fiber and collimating mirror are launched, ambient energy
Weak situation.
Known, two-dimensional scanning mirrors are by the X-axis scanning mirror arranged respectively along X-axis and Y-axis and Y axis scanning microscope group at and X
Axis scanning mirror and Y axis scanning mirror include reflecting optics and the high-speed micro motor for adjusting reflecting optics angle in real time.
In actual use, by controlling angle change of the two-dimensional scanning mirrors 3 in X-axis and Y-axis, control can be realized
The hot spot makees the scanning motion in different scanning path on the focussing plane of focus lamp 4, to be focused by the focus lamp 4
The laser arrived can be implemented to heat to object.
Further, laser diode 101 described in the present embodiment, second shaping mirror 102 and the reflecting mirror 103
It is arranged on cooling bottom plate 5, is equipped with cooling component in the bottom of the cooling bottom plate 5.By be arranged the cooling bottom plate 5 to
Heat transfer is carried out to the heat that the laser diode 101, second shaping mirror 102 and the reflecting mirror 103 generate, in order to
Ensure preferable thermal conduction effect, cooling bottom plate 5 can be made using aluminium material.
Further, cooling bottom plate 5 described in the present embodiment is in step-like, and in every layer of step of the cooling bottom plate 5
The laser diode 101, second shaping mirror 102 and the reflecting mirror 103 are respectively provided on face, wherein phase in order to prevent
Interfered on adjacent two step surfaces from the laser that reflecting mirror 103 reflects, can to each step layer of cooling bottom plate 5 it is high into
The setting of row adaptability.Laser diode 101,102 and of the second shaping mirror being arranged on every layer of step surface of cooling bottom plate 5 as a result,
Reflecting mirror 103 constitutes one luminescence unit, mutually indepedent between these luminescence units, can be used alone,
Can be combined into come together using；When needing to adjust the frequency for the laser that the semiconductor laser pumping source 1 issues, Ji Ketong
The haircut quantity of light unit real work of toning is realized.
Further, referring to Fig. 1, Fig. 3, cooling component described in the present embodiment includes cooling coil 6, the cooling coil
6 both ends pass through piping connection water-cooling system 7 respectively.Cooling coil 6 is set in the bottom of the cooling bottom plate 5, is not only taken up
Spatial volume it is small, and be easy to implement in technique, i.e., cooling coil 6 can design a variety of arrangements, such as back-shaped structure,
Serpentine configuration or polycyclic line structure, so that the surface temperature distribution of the cooling bottom plate 5 is more uniform, and is easier to lead
Heat.
Further, semiconductor laser pumping source described in the present embodiment 1 further includes for accommodating the laser diode
101, the shell 8 of second shaping mirror 102 and the reflecting mirror 103 offers light hole 9 on the shell 8；From described
The laser that reflecting mirror 103 reflects is corresponding to be transmitted to first shaping mirror 2 by the light hole 9 correspondence.Pass through design institute
State shell 8, it is ensured that laser delivery optics it is unimpeded, effectively prevent semiconductor laser pumping source 1 from external environment
The influence of light or sundries.
Further, the first shaping mirror 2 described in the present embodiment and second shaping mirror 102 are all made of cylindrical mirror, institute
The cylinder of cylindrical mirror is stated towards the incident direction of light, central column face mirror is for the laser inputted from its cylinder to be converted into parallel
Light, in actual operation, as needed, can the shape of light output face to cylindrical mirror be designed, to obtain round, square
Shape, regular hexagon, octagon and other shapes of hot spot.
Embodiment 2
The present embodiment is based on laser heating system described in embodiment 1, specifically provides a kind of adding for laser heating system
Hot method, comprising:
S1: being hot spot by the laser shaping that first shaping mirror 2 launches the semiconductor laser pumping source 1；
S2: the angle change by controlling the two-dimensional scanning mirrors 3, to control the hot spot in the focus lamp 4
Make the scanning motion in different scanning path on focussing plane；
S3: obtained laser is focused by the focus lamp 4, object (mobile phone screen or glass material rear cover) is heated.
Preferably, the scan path of hot spot described in the utility model is that several linear types being parallel to each other scan road
Diameter.When two-dimensional scanning mirrors 3 structure arrangement on, be successively set on the first shaping using by its X-axis scanning mirror and Y axis scanning mirror
When between mirror 2 and focus lamp 4, X-axis scanning mirror is by from the laser reflection of the first shaping mirror 2 to Y axis scanning mirror, and by Y-axis
Scanning mirror is by laser reflection to focus lamp 4, to first X-axis scanning mirror be arranged pre- at one every time when controlling beam spot scans
If reflection angle, then control Y axis scanning mirror reflecting optics make continuous rotation, a linear scanning road can be formed
Then diameter readjusts the reflection angle of X-axis scanning mirror, and repetitive operation according to this every time, can be obtained several and be parallel to each other
Linear type scan path.
Preferably, the scanning speed of hot spot described in the utility model is 100-500mm/s, adjacent two scanning roads
Sweep span between diameter is 0.5-1.5mm.
Preferably, the wavelength for the laser that semiconductor laser pumping source described in the utility model 1 emits is 900-980nm,
It is particularly preferred as 915nm, the power for the laser that semiconductor laser pumping source 1 emits is 50-100W；The hot spot is square,
Side length is 3-4mm；The focal length of the focus lamp is 100-245mm.
Embodiment 3
The method that a kind of pair of mobile phone is dismantled is present embodiments provided, it includes using heating side as described in example 2
Method heats the mobile phone screen or glass material rear cover of mobile phone, to dismantle to mobile phone.
It is sticked on mobile phone since mobile phone screen and glass material rear cover pass through viscose glue, when heating, first certainly
Heating region is defined, i.e., by the angle change of control two-dimensional scanning mirrors 3, to plan scan path, to customized heating
It is heated in region.
Viscose glue is burnt or vaporized because temperature is excessively high during heating in order to prevent, during heating, should be controlled
The scanning speed (scanning speed 100-500mm/s) of hot spot processed, and select (the focal length 100- of focus lamp 4 of respective focal
245mm).Since laser depends on laser power, spot diameter and the action time of point of irradiation to the heating temperature of mobile phone, thus
Spot diameter is smaller, laser power is higher, the action time of point of irradiation the long more viscose glue is easy to cause to burn and vaporize, therefore,
During heating, the adjustment to 3 scanning speed of two-dimensional scanning mirrors and selection and practical operation to 4 focal length of focus lamp
Laser heating effect most straightforward approach is controlled in the process.
It by above-mentioned setting, may make during being heated to mobile phone, heated in customized heating region, heated
High-efficient, the instantaneous high-temperature of laser causes glue-line to fail when heating, and without dust pollution during heating, to not only clean
Environmental protection also effectively prevents causing to damage to mobile phone internal component, the maintenance time of mobile phone is greatly saved.
The apparatus embodiments described above are merely exemplary, wherein described, unit can as illustrated by the separation member
It is physically separated with being or may not be, component shown as a unit may or may not be physics list
Member, it can it is in one place, or may be distributed over multiple network units.It can be selected according to the actual needs
In some or all of the modules achieve the purpose of the solution of this embodiment.Those of ordinary skill in the art are not paying creativeness
Labour in the case where, it can understand and implement.
Finally, it should be noted that above embodiments are only to illustrate the technical solution of the utility model, rather than its limitations；
Although the utility model is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that:
It is still possible to modify the technical solutions described in the foregoing embodiments, or part of technical characteristic is carried out etc.
With replacement；And these are modified or replaceed, various embodiments of the utility model technology that it does not separate the essence of the corresponding technical solution
The spirit and scope of scheme.
Claims (8)
1. a kind of laser heating system, which is characterized in that including successively being pumped according to the semiconductor laser of laser transmission direction setting
Pu source, the first shaping mirror, two-dimensional scanning mirrors and focus lamp；
The semiconductor laser pumping source include successively according to laser transmission direction setting laser diode, the second shaping mirror and
Reflecting mirror, and the laser correspondence reflected from the reflecting mirror is transmitted to first shaping mirror.
2. laser heating system according to claim 1, which is characterized in that the laser diode, second shaping
Mirror and the reflecting mirror are arranged on cooling bottom plate, are equipped with cooling component in the bottom of the cooling bottom plate.
3. laser heating system according to claim 2, which is characterized in that the cooling bottom plate is in step-like, and in institute
It states and is respectively provided with the laser diode, second shaping mirror and the reflecting mirror on every layer of step surface of cooling bottom plate.
4. laser heating system according to claim 2 or 3, which is characterized in that the cooling component includes cooling coil,
The both ends of the cooling coil pass through piping connection water-cooling system respectively.
5. laser heating system according to claim 1 or 2 or 3, which is characterized in that the semiconductor laser pumping source is also
Including the shell for accommodating the laser diode, second shaping mirror and the reflecting mirror, open up on the housing
There is light hole；The laser reflected from the reflecting mirror is corresponding to be transmitted to first shaping mirror by light hole correspondence.
6. laser heating system according to claim 1 or 2 or 3, which is characterized in that first shaping mirror and described
Two shaping mirrors are all made of cylindrical mirror, the incident direction of the cylinder of the cylindrical mirror towards light.
7. laser heating system according to claim 6, which is characterized in that the light-emitting surface of the cylindrical mirror be set as it is round,
Rectangle, regular hexagon or octagon structure.
8. laser heating system according to claim 1 or 2 or 3, which is characterized in that the semiconductor laser pumping source hair
The wavelength for the laser penetrated is 900-980nm, power 50-100W；First shaping mirror is by the semiconductor laser pumping source
The laser shaping launched is hot spot, and the hot spot is square, and its side length is 3-4mm；The focal length of the focus lamp is 100-
245mm。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920521347.9U CN209690638U (en) | 2019-04-17 | 2019-04-17 | A kind of laser heating system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920521347.9U CN209690638U (en) | 2019-04-17 | 2019-04-17 | A kind of laser heating system |
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| Publication Number | Publication Date |
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| CN209690638U true CN209690638U (en) | 2019-11-26 |
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| CN201920521347.9U Active CN209690638U (en) | 2019-04-17 | 2019-04-17 | A kind of laser heating system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110045506A (en) * | 2019-04-17 | 2019-07-23 | 武汉锐科光纤激光技术股份有限公司 | A kind of laser heating system and its heating means |
| CN111058032A (en) * | 2019-12-26 | 2020-04-24 | 西安铂力特增材技术股份有限公司 | Laser rapid repair system and method for deep cavity parts |
-
2019
- 2019-04-17 CN CN201920521347.9U patent/CN209690638U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110045506A (en) * | 2019-04-17 | 2019-07-23 | 武汉锐科光纤激光技术股份有限公司 | A kind of laser heating system and its heating means |
| CN111058032A (en) * | 2019-12-26 | 2020-04-24 | 西安铂力特增材技术股份有限公司 | Laser rapid repair system and method for deep cavity parts |
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