CN209676592U - A kind of plate multi-layer flexible circuit board - Google Patents
A kind of plate multi-layer flexible circuit board Download PDFInfo
- Publication number
- CN209676592U CN209676592U CN201920219736.6U CN201920219736U CN209676592U CN 209676592 U CN209676592 U CN 209676592U CN 201920219736 U CN201920219736 U CN 201920219736U CN 209676592 U CN209676592 U CN 209676592U
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- layer
- heat dissipation
- circuit board
- pet film
- flexible circuit
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Abstract
The utility model discloses a kind of plate multi-layer flexible circuit boards, including polyimide substrate, several adhesive-layers and conductive column, the top layer of polyimide substrate is bonded with the first PET film layer by adhesive-layer, the top layer of first PET film layer is provided with the first copper foil circuit layer, the top layer of first copper foil circuit layer is bonded with the first heat dissipation membrane by adhesive-layer, the top layer of first heat dissipation membrane is provided with first screen layer, and conductive column sequentially passes through the first copper foil circuit layer, the first PET film layer, polyimide substrate, the second PET film layer and the second copper foil circuit layer.The utility model flexible circuit board has stronger bend resistance, anti-pull performance; it is able to ascend the service life of flexible circuit board; it prevents from being damaged in transport or use process; there is preferable heat dissipation performance simultaneously; thermal energy caused by circuit is guided faster and is distributed, flexible circuit board is protected not burnt out by high temperature.
Description
Technical field
The utility model relates to flexible circuit board field, in particular to a kind of plate multi-layer flexible circuit board.
Background technique
Flexible circuit board is also known as " soft board ", is the printed circuit made of insulating substrate flexible.Flexible circuit provides excellent
Good electrical property is able to satisfy smaller and more high-density installation design needs, it helps reduces assembling procedure and enhancing can
By property.Flexible circuit board is the only solution for meeting miniaturization of electronic products and movement requirement.It can be with free bend, volume
Around, fold, millions of time dynamic bendings can be born without damaging conducting wire, any arrangement can be required according to space layout, and
It is arbitrarily moved and flexible in three-dimensional space, to reach the integration that components and parts assembling is connected with conducting wire；Flexible circuit board can be big
The big volume and weight for reducing electronic product, is applicable in the needs that electronic product develops to high density, miniaturization, highly reliable direction.
Flexible print circuit board is divided into single side, two-sided and multi-layer board.Used substrate is with polyimide copper clad lamination
It is main.Such material thermal resistance height, good stability of the dimension, pass through with the cover film for having mechanical protection and good electrical insulation performance concurrently
Compacting forms final products.Two-sided, multilayer printed wiring board surface layer and inner conductor pass through metallization realization ectonexine circuit
Electrical connection.
Multilayer circuit board used at present can cause in actual use because of the movement lack of standardization such as bending is pullled
Flexible circuit board is scrapped, while heat dissipation performance is bad, and being easy to cause circuit temperature to rise too high causes flexible circuit board to burn out.
Utility model content
The technical problems to be solved in the utility model is to overcome the deficiencies of existing technologies, and provides a kind of plate layer flexible
Wiring board can accomplish the anti-pull bending performance for promoting flexible circuit board, while have preferable heat dissipation performance, prevent wiring board
Temperature is excessively high and burns out.
In order to solve the above-mentioned technical problem, the utility model provides the following technical solution:
A kind of plate multi-layer flexible circuit board of the utility model, including polyimide substrate, several adhesive-layers and conduction
The top layer of column, the polyimide substrate is bonded with the first PET film layer by adhesive-layer, and the top layer of the first PET film layer is set
It is equipped with the first copper foil circuit layer, the top layer of the first copper foil circuit layer is bonded with the first heat dissipation membrane by adhesive-layer, described
The top layer of first heat dissipation membrane is provided with first screen layer, and the bottom of the polyimide substrate is bonded with second by adhesive-layer
PET film layer, the bottom of the second PET film layer are provided with the second copper foil circuit layer, and the bottom of the second copper foil circuit layer is logical
It crosses adhesive-layer and is bonded with the second heat dissipation membrane, the bottom of second heat dissipation membrane is provided with secondary shielding layer, the conductive column
Sequentially pass through the first copper foil circuit layer, the first PET film layer, polyimide substrate, the second PET film layer and the second copper foil circuit layer.
As a kind of optimal technical scheme of the utility model, the conductive column is the I-shaped copper of hollow structure inside
Pipe, and both ends are separately positioned on inside the first heat dissipation membrane and the second heat dissipation membrane.
As a kind of optimal technical scheme of the utility model, the first PET film layer and the second PET film layer with a thickness of
0.1-0.2mm。
As a kind of optimal technical scheme of the utility model, the adhesive-layer is mainly made of acrylate glue.
As a kind of optimal technical scheme of the utility model, the first screen layer and secondary shielding layer are SF-
PC5000 is electromagnetically shielded black film.
As a kind of optimal technical scheme of the utility model, first heat dissipation membrane and the second heat dissipation membrane are all made of
Liquid coating is made.
As a kind of optimal technical scheme of the utility model, the conductive column quantity is several.
Compared with prior art, the beneficial effects of the utility model are as follows:
The utility model flexible circuit board has stronger bend resistance, anti-pull performance, is able to ascend flexible circuit board
Service life prevents from being damaged in transport or use process, while having preferable heat dissipation performance, faster by circuit
Generated thermal energy, which guides, to be distributed, and flexible circuit board is protected not burnt out by high temperature.
Detailed description of the invention
Attached drawing is used to provide a further understanding of the present invention, and constitutes part of specification, practical with this
Novel embodiment is used to explain the utility model together, does not constitute limitations of the present invention.In the accompanying drawings:
Fig. 1 is the overall structure diagram of the utility model；
In figure: 1, polyimide substrate；2, adhesive-layer；3, the first PET film layer；4, the first copper foil circuit layer；5, first dissipates
Film；6, first screen layer；7, the second PET film layer；8, the second copper foil circuit layer；9, the second heat dissipation membrane；10, secondary shielding
Layer；11, conductive column.
Specific embodiment
It is illustrated below in conjunction with preferred embodiment of the attached drawing to the utility model, it should be understood that described herein excellent
It selects embodiment to be only used for describing and explaining the present invention, is not used to limit the utility model.
Wherein identical label all refers to identical component in attached drawing.
In addition, if the detailed description of known technology for show the utility model be characterized in it is unnecessary, then by it
It omits.It should be noted that word "front", "rear" used in the following description, "left", "right", "up" and "down" refer to it is attached
Direction in figure, word "inner" and "outside" refer respectively to the direction towards or away from geometric center of specific component.
Embodiment 1
As shown in Figure 1, the utility model provides a kind of plate multi-layer flexible circuit board, if including polyimide substrate 1,
The top layer of dry adhesive-layer 2 and conductive column 11, polyimide substrate 1 is bonded with the first PET film layer 3, the first PET by adhesive-layer 2
The top layer of film layer 3 is provided with the first copper foil circuit layer 4, and the top layer of the first copper foil circuit layer 4 is bonded with first by adhesive-layer 2 and dissipates
Film 5, the top layer of the first heat dissipation membrane 5 are provided with first screen layer 6, and the bottom of polyimide substrate 1 is viscous by adhesive-layer 2
Conjunction has the second PET film layer 7, and the bottom of the second PET film layer 7 is provided with the second copper foil circuit layer 8, the bottom of the second copper foil circuit layer 8
Layer is bonded with the second heat dissipation membrane 9 by adhesive-layer 2, and the bottom of the second heat dissipation membrane 9 is provided with secondary shielding layer 10, conductive column
11 sequentially pass through the first copper foil circuit layer 4, the first PET film layer 3, polyimide substrate 1, the second PET film layer 7 and the second copper foil line
Road floor 8.
Further, conductive column 11 is the I-shaped copper pipe of hollow structure inside, and both ends are separately positioned on the first heat dissipation
Inside diaphragm 5 and the second heat dissipation membrane 9, hollow structure is convenient for will be produced by the first copper foil circuit layer 4 and the second copper foil circuit layer 8
Heat conducted, then by thinking happy heat dissipation membrane 5 and the second heat dissipation membrane 9 by thermal energy Quick diffusing, to reduce flexibility
The temperature of wiring board entirety.
First PET film layer 3 and the second PET film layer 7 have preferable hygroscopicity and higher with a thickness of 0.1-0.2mm, PET
Dimensional stability makes flexible circuit board be able to bear more bending numbers, while enhancing anti-pull ability, thus to flexible wires
Road plate carries out reinforcement.
Adhesive-layer 2 is mainly made of acrylate glue, and acrylate glue has excellent heat resistance and higher adhesive strength, and
Storage time is more long, is conducive to plant produced.
First screen layer 6 and secondary shielding layer 10 are SF-PC5000 electromagnetic shielding black film, and SF-PC5000 has bending resistance
The small feature of folding, specific gravity, can control thickness while protecting flexible circuit board.
First heat dissipation membrane 5 and the second heat dissipation membrane 9 are all made of liquid coating and are made, and coating has preferable route closed
Property, available material ranges are wider, and producer can be according to customer demand unrestricted choice, while expense is lower, and coating is again
Coating, which is repaired, to be easy, and is conducive to plant produced work and is carried out.
11 quantity of conductive column be it is several, the first copper foil circuit layer 3 and the second copper foil circuit layer 8 are carried out electrical property by conductive column 11
Conducting, enables flexible circuit board smoothly to carry out electrical conductivity.
Specifically, passing through adhesive-layer 2 respectively by the two sides up and down in polyimide substrate 1 bonds 3 He of the first PET film layer
Second PET film layer 7 carries out reinforcement to polyimide substrate 1 by PET film layer, flexible circuit board is made to have centainly anti-pull
Power, at the same conductive column 11 will be produced by the first copper foil circuit layer 4 and the second copper foil circuit layer 8 while playing electric action
Thermal energy be transferred to the first heat dissipation membrane 5 and the second heat dissipation membrane 9, shift the thermal energy on route, and increase radiating surface
Product, enables flexible circuit board to reduce temperature faster, prevent in use temperature it is excessively high and damage, while first shields
Layer 6 and secondary shielding layer 10 shield electric signal, prevent that flexible circuit board is protected not scraped while electrical short
Wound.
To sum up, the utility model flexible circuit board has stronger bend resistance, anti-pull performance, is able to ascend flexible circuitry
The service life of plate prevents from being damaged in transport or use process, while having preferable heat dissipation performance, faster will
Thermal energy caused by circuit, which guides, to be distributed, and flexible circuit board is protected not burnt out by high temperature.
Finally, it should be noted that the above is only the preferred embodiment of the utility model, it is not limited to practical
It is novel, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art,
It is still possible to modify the technical solutions described in the foregoing embodiments, or part of technical characteristic is carried out etc.
With replacement.Within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on should all include
It is within the protection scope of the utility model.
Claims (7)
1. a kind of plate multi-layer flexible circuit board, including polyimide substrate (1), several adhesive-layers (2) and conductive column (11),
It is characterized in that, the top layer of the polyimide substrate (1) is bonded with the first PET film layer (3) by adhesive-layer (2), described the
The top layer of one PET film layer (3) is provided with the first copper foil circuit layer (4), and the top layer of the first copper foil circuit layer (4) passes through viscose glue
Layer (2) is bonded with the first heat dissipation membrane (5), and the top layer of first heat dissipation membrane (5) is provided with first screen layer (6), described
The bottom of polyimide substrate (1) is bonded with the second PET film layer (7), the bottom of the second PET film layer (7) by adhesive-layer (2)
Layer is provided with the second copper foil circuit layer (8), and the bottom of the second copper foil circuit layer (8) is bonded with second by adhesive-layer (2)
The bottom of heat dissipation membrane (9), second heat dissipation membrane (9) is provided with secondary shielding layer (10), and the conductive column (11) is successively
Through the first copper foil circuit layer (4), the first PET film layer (3), polyimide substrate (1), the second PET film layer (7) and the second copper foil
Line layer (8).
2. a kind of plate multi-layer flexible circuit board according to claim 1, which is characterized in that the conductive column (11) is
The I-shaped copper pipe of hollow structure inside, and both ends are separately positioned in the first heat dissipation membrane (5) and the second heat dissipation membrane (9)
Portion.
3. a kind of plate multi-layer flexible circuit board according to claim 1, which is characterized in that the first PET film layer
(3) and the second PET film layer (7) is with a thickness of 0.1-0.2mm.
4. a kind of plate multi-layer flexible circuit board according to claim 1, which is characterized in that the adhesive-layer (2) is main
It to be made of acrylate glue.
5. a kind of plate multi-layer flexible circuit board according to claim 1, which is characterized in that the first screen layer
(6) and secondary shielding layer (10) is SF-PC5000 electromagnetic shielding black film.
6. a kind of plate multi-layer flexible circuit board according to claim 1, which is characterized in that first heat dissipation membrane
(5) it is all made of liquid coating with the second heat dissipation membrane (9) and is made.
7. a kind of plate multi-layer flexible circuit board according to claim 1, which is characterized in that conductive column (11) number
Amount is several.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920219736.6U CN209676592U (en) | 2019-02-21 | 2019-02-21 | A kind of plate multi-layer flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920219736.6U CN209676592U (en) | 2019-02-21 | 2019-02-21 | A kind of plate multi-layer flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209676592U true CN209676592U (en) | 2019-11-22 |
Family
ID=68569205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920219736.6U Active CN209676592U (en) | 2019-02-21 | 2019-02-21 | A kind of plate multi-layer flexible circuit board |
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| Country | Link |
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| CN (1) | CN209676592U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111683461A (en) * | 2020-05-29 | 2020-09-18 | 珠海新业电子科技有限公司 | Manufacturing method of circuit board |
| CN111694401A (en) * | 2020-04-24 | 2020-09-22 | 上海浩创亘永科技有限公司 | Flexible line way board and have wearing formula smart machine of this flexible line way board |
| CN114531816A (en) * | 2022-01-29 | 2022-05-24 | 苏州恒美电子科技股份有限公司 | Flexible printed circuit board protection structure with heat dissipation function |
-
2019
- 2019-02-21 CN CN201920219736.6U patent/CN209676592U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111694401A (en) * | 2020-04-24 | 2020-09-22 | 上海浩创亘永科技有限公司 | Flexible line way board and have wearing formula smart machine of this flexible line way board |
| CN111694401B (en) * | 2020-04-24 | 2021-02-23 | 上海浩创亘永科技有限公司 | Flexible line way board and have wearing formula smart machine of this flexible line way board |
| CN111683461A (en) * | 2020-05-29 | 2020-09-18 | 珠海新业电子科技有限公司 | Manufacturing method of circuit board |
| CN114531816A (en) * | 2022-01-29 | 2022-05-24 | 苏州恒美电子科技股份有限公司 | Flexible printed circuit board protection structure with heat dissipation function |
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