CN209675253U - A kind of fixed frame claw for semiconductor packages bonding - Google Patents
A kind of fixed frame claw for semiconductor packages bonding Download PDFInfo
- Publication number
- CN209675253U CN209675253U CN201920652757.7U CN201920652757U CN209675253U CN 209675253 U CN209675253 U CN 209675253U CN 201920652757 U CN201920652757 U CN 201920652757U CN 209675253 U CN209675253 U CN 209675253U
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- China
- Prior art keywords
- claw
- working face
- inclined surface
- semiconductor packages
- fixed frame
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model relates to a kind of fixed frame claws for semiconductor packages bonding, belong to technical field of semiconductor encapsulation, which includes claw main body and claw working face two parts, and claw main body and claw working face are an integral molding structure；The claw working face is inclined surface in U-typed or the claw working face, and tilt angle is 0-5 degree, and circular arc chamfering is processed at the both ends of inclined surface.Claw provided by the utility model, it is inclined surface that its working face, which is in U-typed or working face, and circular arc chamfering is processed at the both ends of inclined surface, in this way in semiconductor packages bonding process, can to avoid claw working face be pressed into frame when generate impression, claw rise when claw working face drive impression easily cause copper wire the phenomenon that；The phenomenon of chip short circuit, improves welding stability caused by avoiding in turn because of copper wire.
Description
Technical field
The utility model relates to technical field of semiconductor encapsulation, and in particular to a kind of fixation for semiconductor packages bonding
Frame claw.
Background technique
Currently, semiconductor packages aluminum wire bonding requires the frame in wire bonding process that must fasten, so being bonded
Claw will be used in journey.
Patent No.: CN201210321721.3, patent name are as follows: have improve fixture bonding semiconductor equipment and its
In packaging method, the claw includes the fixed part being fixed on claw on pedestal, several metallic rods and by several metallic rods
Connected several hinges one by one, one of them in several metallic rods are immobilizated on the fixed part, and adjusting the hinge can
Adjust position and the height of claw, the hinge is spherical shape comprising the hemispherical metallic rod mounting portion of upper section, middle section cake
The hemispherical metallic rod mounting portion of shape interconnecting piece and lower section.In the patent, claw is made of hinged metallic rod, face
Product is smaller, it is possible to reduce the puzzlement of bonding wire.Meanwhile using adjustable height, the design in direction, when each claw makes for a long time
When with occurring highly inconsistent, the coplane degree of entire claw can be adjusted by adjusting the height for the claw that go wrong,
The service life of a set of claw can be extended, and when claw is worn, it is only necessary to the metallic rod of abrasion is replaced, energy
Enough effectively reduce cost.But the patent still not can solve: in bonding process, claw presses frame, and claw is easily on frame
Impression has been easy steel wire on frame when claw rises, and then because steel wire leads to the problem of chip short circuit.
Working face, that is, seal face of claw used in now uses wider planar structure, and working face is compared with small round corner
Or wedge angle.In real online monitoring of bonding, claw working face pushes down chi frame, one of impression or load mould can be formed on frame,
When claw lifts, the wedge angle or fillet of claw can form copper wire because of insertion impression, there is the risk for causing chip short circuit.
Utility model content
The purpose of this utility model is to provide a kind of fixed frame claws for semiconductor packages bonding, to solve
Claw impression easily on frame has on frame impression to influence frame beautiful；It has been easy steel wire on frame when claw rises, into
And easily because steel wire leads to the problem of chip short circuit
To achieve the above object, the utility model provides the following technical solutions:
A kind of fixed frame claw for semiconductor packages bonding, which is characterized in that including claw main body and claw
Working face two parts, claw main body and claw working face are an integral molding structure；The claw working face processing is in U-typed；
In the present invention, the claw working face is inclined surface, and tilt angle is 0-5 degree, and the both ends of inclined surface add
Work is at circular arc chamfering.
Compared with prior art, the utility model has the beneficial effects that
Claw provided by the utility model, it is inclined surface that working face, which is in U-typed or working face, and inclined surface
Circular arc chamfering is processed at both ends, in this way in semiconductor packages bonding process, is produced when can be pressed into frame to avoid claw working face
The phenomenon that raw impression, claw working face drives impression easily to cause copper wire when claw rises；Copper wire is conductive, and then avoids because of copper
Silk causes the phenomenon of chip short circuit, improves welding stability.
Detailed description of the invention
Fig. 1 is claw structural schematic diagram；
Fig. 2 is the schematic diagram of existing claw working face；
Fig. 3 is schematic diagram when existing claw works；
Fig. 4 is the first claw working face schematic diagram provided by the utility model；
Fig. 5 is second of claw working face schematic diagram provided by the utility model；
Appended drawing reference: 1 it is claw, 2 is impression, 3 is frame, 4 has been copper wire point.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Please refer to attached drawing 4, embodiment one
A kind of fixed frame claw for semiconductor packages bonding, including claw main body and claw working face two
Point, the claw main body is connected through claw handle；The processing of claw working face is in U-typed.It, will not be because of claw when preventing claw from lifting
Wedge angle be embedded in impression, to form copper wire.
Please refer to attached drawing 5, embodiment two
A kind of fixed frame claw for semiconductor packages bonding, including claw main body and claw working face two
Point, the claw main body is connected through claw handle；Claw working face is inclined surface, and tilt angle a is 0-5 degree, the both ends of inclined surface
It is processed into circular arc chamfering.Circular arc chamfering on inclined surface presses frame in advance, even if generating impression on frame, when claw lifts
Because the working face that claw directly acts on frame is inclined, and has circular arc chamfering, therefore will not be because of claw wedge pressure
Trace and form copper wire.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (2)
1. a kind of fixed frame claw for semiconductor packages bonding, which is characterized in that including claw main body and claw work
Make face two parts, claw main body and claw working face are an integral molding structure；The claw working face is in U-typed.
2. the fixed frame claw according to claim 1 for semiconductor packages bonding, which is characterized in that the pressure
Pawl working face is inclined surface, and tilt angle is 0-5 degree, and circular arc chamfering is processed at the both ends of inclined surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920652757.7U CN209675253U (en) | 2019-05-08 | 2019-05-08 | A kind of fixed frame claw for semiconductor packages bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920652757.7U CN209675253U (en) | 2019-05-08 | 2019-05-08 | A kind of fixed frame claw for semiconductor packages bonding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209675253U true CN209675253U (en) | 2019-11-22 |
Family
ID=68574963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920652757.7U Expired - Fee Related CN209675253U (en) | 2019-05-08 | 2019-05-08 | A kind of fixed frame claw for semiconductor packages bonding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209675253U (en) |
-
2019
- 2019-05-08 CN CN201920652757.7U patent/CN209675253U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191122 |