CN209658162U - A kind of stamp-mounting-paper diode display device - Google Patents
A kind of stamp-mounting-paper diode display device Download PDFInfo
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- CN209658162U CN209658162U CN201920412070.6U CN201920412070U CN209658162U CN 209658162 U CN209658162 U CN 209658162U CN 201920412070 U CN201920412070 U CN 201920412070U CN 209658162 U CN209658162 U CN 209658162U
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- insulation crust
- mounting
- stamp
- backlight unit
- display device
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Abstract
The utility model discloses a kind of stamp-mounting-paper diode display devices, including insulation crust, the insulation crust is internally provided with diode chip for backlight unit, the two sides of the insulation crust are respectively arranged with the first lead piece connecting with diode chip for backlight unit and the second lead wire, the internal symmetry of the insulation crust is provided with movable chamber, and the two sides of the insulation crust are respectively arranged with the directive slide track being connected to movable chamber, the directive slide track is internally provided with operating stick, one end of the operating stick is provided with and the matched tabletting column of movable chamber, the upper end of the tabletting column is provided with the reset spring connecting with insulation crust.The utility model is provided with tabletting column and reset spring, is moved up by pull joystick, and tabletting column is driven to move up, and convenient for sheet connector lug to be inserted into lead wire, under the action of reset spring, lead wire is facilitated to be fixed with sheet connector lug.
Description
Technical field
The utility model belongs to diode technologies field, and in particular to a kind of stamp-mounting-paper diode display device.
Background technique
Stamp-mounting-paper diode is also known as crystal diode, abbreviation diode.In addition, there are also the vacuum electronic diode of early stage, it
It is a kind of electronic device with unidirectional conduction electric current.There are two lead terminals of a PN junction inside semiconductor diode, this
Kind electronic device has the transducing of unidirectional current according to the direction of applied voltage.In general, surface mounting crystal diode is one
It is a that the P-N junction interface formed is sintered by P-type semiconductor and N-type semiconductor.Space charge layer is formed in the two sides at its interface, is constituted
Built-in field.When applied voltage is equal to zero, since the concentration difference of P-N junction both sides carrier causes dissufion current and by self-built electricity
Drift current caused by is equal and is in electric equilibrium state, this is also the diode characteristic under normality.
Lead wire inconvenience in existing stamp-mounting-paper diode display device is fixed with sheet connector lug, when installation more
Cumbersome, working efficiency is low, and is set in closed space due to diode chip for backlight unit, and heat dissipation effect is poor, and high temperature is easy
Damage chip.Thus it is proposed that a kind of stamp-mounting-paper diode display device.
Utility model content
The purpose of this utility model is to provide a kind of stamp-mounting-paper diode display devices, to solve to mention in above-mentioned background technique
The lead wire inconvenience having in stamp-mounting-paper diode display device is fixed with sheet connector lug, and when installation is relatively complicated,
Working efficiency is low, and is set in closed space due to diode chip for backlight unit, and heat dissipation effect is poor, and high temperature is easily damaged core
The problem of piece.
To achieve the above object, the utility model provides the following technical solutions: a kind of stamp-mounting-paper diode display device, including
Insulation crust, the insulation crust is internally provided with diode chip for backlight unit, and the upper surface of the insulation crust is provided with installation
Slot, the inner cavity lower surface of the mounting groove be respectively arranged with the first display lamp being connect with diode chip for backlight unit, the second display lamp and
Third display lamp, the two sides of the insulation crust are respectively arranged with the first lead piece and the second lead connecting with diode chip for backlight unit
Piece, the internal symmetry of the insulation crust is provided with movable chamber, and the two sides of the insulation crust are respectively arranged with and movable chamber
The directive slide track of connection, the directive slide track are internally provided with operating stick, and one end of the operating stick is provided with and movable chamber
The upper end of matched tabletting column, the tabletting column is provided with the reset spring connecting with insulation crust.
Preferably, the first lead piece and the second lead wire are provided with solder between diode chip for backlight unit respectively.
Preferably, the color of first display lamp, the second display lamp and third display lamp is respectively red, yellow, and green.
Preferably, the insulation crust is internally provided with heat-conducting silica gel sheet, and the heat-conducting silica gel sheet is located at diode core
The underface of piece, the lower surface of the insulation crust open up fluted, and the inner cavity upper surface of the groove is uniformly provided with and leads
The heat dissipation channel of hot silica gel piece connection.
Preferably, the U-shaped structure of the heat dissipation channel.
Compared with prior art, the utility model has the beneficial effects that
1. the utility model is provided with tabletting column and reset spring, moved up by pull joystick, drives tabletting column
It moves up, convenient for sheet connector lug to be inserted into lead wire, while under the action of reset spring, facilitates lead wire and sheet
Connector lug is fixed.
2. the utility model is provided with heat-conducting silica gel sheet and heat dissipation channel, diode chip for backlight unit is worked by heat-conducting silica gel sheet
Generated heat conducts the inside into heat dissipation channel, while under the action of air circulation, and realizing reduces temperature, heat dissipation effect
Preferably, chip will not be damaged because of high temperature.
Detailed description of the invention
Fig. 1 is the cross-sectional view of the utility model；
Fig. 2 is the bottom view of the utility model；
In figure: 1, insulation crust；2, movable chamber；3, tabletting column；4, first lead piece；5, heat dissipation channel；6, heat conductive silica gel
Piece；7, diode chip for backlight unit；8, the second lead wire；9, directive slide track；10, operating stick；11, reset spring；12, mounting groove；13,
One display lamp；14, the second display lamp；15, third display lamp；16, groove；17, solder.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
The utility model provides a kind of technical solution referring to FIG. 1-2: a kind of stamp-mounting-paper diode display device, including exhausted
Edge shell 1, the insulation crust 1 is internally provided with diode chip for backlight unit 7, and the upper surface of the insulation crust 1 is provided with peace
Tankage 12, the inner cavity lower surface of the mounting groove 12 are respectively arranged with the first display lamp 13, second connecting with diode chip for backlight unit 7
Display lamp 14 and third display lamp 15, the two sides of the insulation crust 1 are respectively arranged with first connect with diode chip for backlight unit 7 and draw
Line piece 4 and the second lead wire 8, the internal symmetry of the insulation crust 1 are provided with movable chamber 2, and the two sides of the insulation crust 1
It is respectively arranged with the directive slide track 9 being connected to movable chamber 2, the directive slide track 9 is internally provided with operating stick 10, the operation
One end of bar 10 be provided with the matched tabletting column 3 of movable chamber 2, the upper end of the tabletting column 3 is provided with to be connect with insulation crust 1
Reset spring 11.
The first lead piece 4 and the second lead wire 8 are provided with solder 17 between diode chip for backlight unit 7 respectively, and described
The color of one display lamp 13, the second display lamp 14 and third display lamp 15 is respectively red, yellow, and green, the inside of the insulation crust 1
It is provided with heat-conducting silica gel sheet 6, the heat-conducting silica gel sheet 6 is located at the underface of diode chip for backlight unit 7, the following table of the insulation crust 1
Face opens up fluted 16, and the inner cavity upper surface of the groove 16 is uniformly provided with the heat dissipation channel 5 being connected to heat-conducting silica gel sheet 6,
The U-shaped structure of the heat dissipation channel 5.
It should be noted that the utility model is a kind of stamp-mounting-paper diode display device, such as:
Fig. 1 is the cross-sectional view of the utility model, and Fig. 2 is the bottom view of the utility model.When the utility model is used, first
Operating stick 10 is first pulled up, tabletting column 3 connected to it is driven to move up, reset spring 11 is compressed at this time, then will
Sheet connector lug is inserted into first lead piece 4, after the sheet connector lug of output par, c is inserted into the second lead wire 8, unclamps operating stick
10, at this time under the action of reset spring 11, tabletting column 3 is moved down, and the sheet connector lug of 3 pairs of tabletting column insertions is consolidated
Calmly, when work, the heat that diode chip for backlight unit 7 generates is conducted by heat-conducting silica gel sheet 6 into the inside of heat dissipation channel 5, in air stream
Under the action of logical, achieve the effect that cooling.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of stamp-mounting-paper diode display device, including insulation crust (1), it is characterised in that: the inside of the insulation crust (1)
It is provided with diode chip for backlight unit (7), and the upper surface of the insulation crust (1) is provided with mounting groove (12), the mounting groove (12)
Inner cavity lower surface be respectively arranged with the first display lamp (13) connecting with diode chip for backlight unit (7), the second display lamp (14) and
The two sides of three display lamps (15), the insulation crust (1) are respectively arranged with the first lead piece connecting with diode chip for backlight unit (7)
(4) and the second lead wire (8), the internal symmetry of the insulation crust (1) is provided with movable chamber (2), and the insulation crust (1)
Two sides be respectively arranged with the directive slide track (9) being connected to movable chamber (2), the directive slide track (9) is internally provided with operation
Bar (10), one end of the operating stick (10) be provided with movable chamber (2) matched tabletting column (3), the tabletting column (3) it is upper
End is provided with the reset spring (11) connecting with insulation crust (1).
2. a kind of stamp-mounting-paper diode display device according to claim 1, it is characterised in that: the first lead piece (4)
And second lead wire (8) solder (17) are provided between diode chip for backlight unit (7) respectively.
3. a kind of stamp-mounting-paper diode display device according to claim 1, it is characterised in that: first display lamp
(13), the color of the second display lamp (14) and third display lamp (15) is respectively red, yellow, and green.
4. a kind of stamp-mounting-paper diode display device according to claim 1, it is characterised in that: the insulation crust (1)
It is internally provided with heat-conducting silica gel sheet (6), the heat-conducting silica gel sheet (6) is located at the underface of diode chip for backlight unit (7), outside the insulation
The lower surface of shell (1) opens up fluted (16), and the inner cavity upper surface of the groove (16) is uniformly provided with and heat-conducting silica gel sheet (6)
The heat dissipation channel (5) of connection.
5. a kind of stamp-mounting-paper diode display device according to claim 4, it is characterised in that: the heat dissipation channel (5) is in U
Type structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920412070.6U CN209658162U (en) | 2019-03-29 | 2019-03-29 | A kind of stamp-mounting-paper diode display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920412070.6U CN209658162U (en) | 2019-03-29 | 2019-03-29 | A kind of stamp-mounting-paper diode display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209658162U true CN209658162U (en) | 2019-11-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920412070.6U Active CN209658162U (en) | 2019-03-29 | 2019-03-29 | A kind of stamp-mounting-paper diode display device |
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| Country | Link |
|---|---|
| CN (1) | CN209658162U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115132907A (en) * | 2022-07-07 | 2022-09-30 | 河南华辰智控技术有限公司 | Chip packaging device for integrated circuit |
-
2019
- 2019-03-29 CN CN201920412070.6U patent/CN209658162U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115132907A (en) * | 2022-07-07 | 2022-09-30 | 河南华辰智控技术有限公司 | Chip packaging device for integrated circuit |
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