CN209640375U - The heating device of IC test machine - Google Patents

The heating device of IC test machine Download PDF

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Publication number
CN209640375U
CN209640375U CN201822209171.1U CN201822209171U CN209640375U CN 209640375 U CN209640375 U CN 209640375U CN 201822209171 U CN201822209171 U CN 201822209171U CN 209640375 U CN209640375 U CN 209640375U
Authority
CN
China
Prior art keywords
slide rail
heater
heating device
rail group
holding table
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201822209171.1U
Other languages
Chinese (zh)
Inventor
江俊达
詹淙钤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Quanyuneng Technology Co ltd
Original Assignee
Quanyuneng Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Quanyuneng Technology Co ltd filed Critical Quanyuneng Technology Co ltd
Priority to CN201822209171.1U priority Critical patent/CN209640375U/en
Application granted granted Critical
Publication of CN209640375U publication Critical patent/CN209640375U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model provides a kind of heating device of IC test machine, the heating device includes slide rail group and heater, the slide rail group is respectively arranged at articles holding table two sides, heater is connected to slide rail group, and it is located above articles holding table, heater is moved to according to slide rail group to be right against articles holding table or move out above articles holding table, it is not required to manually be moved, reduce the activity duration of IC chip heating, and heating device is avoided to damage when carrying with foreign object collision, or to topple over generation dangerous, to achieve the effect that reduce cost, convenient to use.

Description

The heating device of IC test machine
Technical field
The utility model relates to a kind of heating devices of IC test machine, and espespecially heater can be moved to according to sliding rail and be right against Articles holding table moves out heating device above articles holding table, to reduce cost, convenient to use.
Background technique
General IC Measurer has the articles holding table for placing IC chip, and the heating dress for heating to IC chip It sets, the heating device is in use, be directly to be moved heating device to articles holding table by manual handling mode, by adding Thermal heats the IC chip being placed on articles holding table, and after heating device is to the heating of IC chip, then passes through Manual handling mode moves out heating device above articles holding table, and such mode is not only taken a lot of work, and also elongates adding for entirety IC chip The hot work time, lead to increased costs;Furthermore the heating device is easy to collide and damage with foreign object when manually moving, or inclines Danger is caused, and it is inconvenient to use.
Utility model content
The main purpose of the utility model is in that, connects heater using the slide rail group for being set to two side of articles holding table, allows Heater is moved to according to slide rail group to be right against articles holding table or moves out above articles holding table, is not required to manually be moved, it is brilliant to reduce IC The activity duration of piece heating, and avoid heating device from damaging when carrying with foreign object collision, or topple over generation danger, with Achieve the effect that reduce cost, convenient to use.
In order to achieve the above object, the heating device of the utility model IC test machine, the heating device include slide rail group and Heater, the slide rail group are respectively arranged at articles holding table two sides, and heater is connected to slide rail group, and is located above articles holding table, makes to add Hot device is moved to according to slide rail group to be right against articles holding table or moves out above articles holding table.
The heating device of aforementioned IC test machine, the sliding block that wherein slide rail group has sliding rail and is set on sliding rail, and The side plate that there is heater heater body and heater body two sides to be connected, the side plate are linked to the sliding block of slide rail group, make to add When hot device is mobile according to slide rail group, band movable slider on sliding rail in being displaced.
The heating device of aforementioned IC test machine, wherein the side plate lower side of the heater is connected with fixing seat, the fixing seat With fixed part and it is connected to the fixed plates of fixed part two sides, which is positioned between two fixed plates, and fixed part connects In the sliding block of slide rail group.
The heating device of aforementioned IC test machine, wherein the extreme of the slide rail group is provided with for limiting slider displacement model The block enclosed.
The heating device of aforementioned IC test machine, wherein the heater body side of the heater is provided with handle.
The utility model is not required to manually be moved, and reduces the activity duration of IC chip heating, and avoids heating device It is damaged when carrying with foreign object collision, or topples over generation danger, to achieve the effect that reduce cost, convenient to use.
Detailed description of the invention
Fig. 1 is the stereo appearance figure of the utility model.
Fig. 2 is the side view of the utility model.
Fig. 3 is the stereo appearance figure that the utility model is moved to above articles holding table.
Fig. 4 is the side view that the utility model is moved to above articles holding table.
Fig. 5 is the top view that the utility model is moved to above articles holding table.
Fig. 6 is the side view that the utility model is moved to another visual angle above articles holding table.
Description of symbols: 10- heating device;1- slide rail group;11- sliding rail;12- sliding block;13- block;2- heater; 21- heater body;22- side plate;23- fixing seat;231- fixed part;232- fixed plate;24- handle;3- articles holding table;4- pedestal; 5-IC chip.
Specific embodiment
It please refers to shown in Fig. 1 to Fig. 6, it can be clearly seen from the figure that, which has for heating to IC chip 5 Heating device 10, and the articles holding table 3 for placing IC chip 5, the heating device 10 include slide rail group 1 and heater 2, Wherein:
The sliding block 12 that the slide rail group 1 has sliding rail 11 and is set on sliding rail 11, which is respectively arranged at aforementioned 3 two sides of articles holding table, and 11 end of sliding rail is provided with the block 13 for limiting 12 displacement range of sliding block, to avoid the displacement of sliding block 12 Deviate from sliding rail 11.
The side plate 22 that there is the heater 2 heater body 21 and 21 two sides of heater body to be connected, 22 lower section of side plate Side is connected with fixing seat 23, which has fixed part 231 and be connected to the fixed plate 232 of 231 two sides of fixed part, should Side plate 22 is positioned between two fixed plates 232, and fixed part 231 is connected to the sliding block 12 of slide rail group 1, makes heater 2 and sliding rail Group 1 is stably connected with, and heater body 21 is located at 3 top of articles holding table, which is provided with handle 24.
The articles holding table 3 is set in this present embodiment on 4 surface of pedestal, and slide rail group 1 is individually fixed in 4 two side of pedestal.
When heating device 10 heats IC chip 5, be by handle 24 pull heater body 21, make side plate 22 according to Slide rail group 1 is mobile, with movable slider 12 in being displaced on sliding rail 11 towards the direction close to articles holding table 3, heater body 21 is allowed to be moved to just For articles holding table 3, and with 3 surface interval of articles holding table, one spacing, to add to the IC chip 5 being placed on 3 surface of articles holding table Heat;When heating device 10 completes the heating operation to IC chip 5, it is that heater body 21 is pushed by handle 24, makes side plate 22 It is mobile according to slide rail group 1, with movable slider 12 in being displaced on sliding rail 11 towards the direction far from articles holding table 3, heater body 21 is allowed to move out 3 top of articles holding table.
Therefore the utility model is that can solve the problems, such as that existing and missing, key technology are, using being set to glove The slide rail group 1 of 3 two side of platform connects heater 2, allows heater 2 to be moved to according to slide rail group 1 and is right against articles holding table 3 or moves out glove 3 top of platform, is not required to manually be moved, and reduces the activity duration that IC chip 5 heats, and avoid heating device 10 when carrying Collision is generated with foreign object to damage, or to topple over generation dangerous, achieve the effect that reduce cost, convenient to use.

Claims (5)

1. a kind of heating device of IC test machine, the heating device include slide rail group and heater, it is characterised in that:
The slide rail group is respectively arranged at articles holding table two sides, and heater is connected to slide rail group, and is located above articles holding table, makes heater It is moved to according to slide rail group and is right against articles holding table or moves out above articles holding table.
2. the heating device of IC test machine as described in claim 1, it is characterised in that: the slide rail group has sliding rail and is set to Sliding block on sliding rail, and the side plate that there is heater heater body and heater body two sides to be connected, the side plate are linked to cunning The sliding block of rail group, when keeping heater mobile according to slide rail group, band movable slider is displaced on the slide rail.
3. the heating device of IC test machine as claimed in claim 2, it is characterised in that: the side plate lower side of the heater is connected with Fixing seat, the fixing seat have fixed part and are connected to the fixed plates of fixed part two sides, the side plate be positioned at two fixed plates it Between, and fixed part is connected to the sliding block of slide rail group.
4. the heating device of IC test machine as claimed in claim 2, it is characterised in that: the extreme setting of the slide rail group is useful In the block of limitation slider displacement range.
5. the heating device of IC test machine as claimed in claim 2, it is characterised in that: the heater body side of the heater is arranged There is handle.
CN201822209171.1U 2018-12-26 2018-12-26 The heating device of IC test machine Expired - Fee Related CN209640375U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201822209171.1U CN209640375U (en) 2018-12-26 2018-12-26 The heating device of IC test machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201822209171.1U CN209640375U (en) 2018-12-26 2018-12-26 The heating device of IC test machine

Publications (1)

Publication Number Publication Date
CN209640375U true CN209640375U (en) 2019-11-15

Family

ID=68476053

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201822209171.1U Expired - Fee Related CN209640375U (en) 2018-12-26 2018-12-26 The heating device of IC test machine

Country Status (1)

Country Link
CN (1) CN209640375U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111805841A (en) * 2020-07-14 2020-10-23 孙超月 Rapid die change mechanism for injection molding

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111805841A (en) * 2020-07-14 2020-10-23 孙超月 Rapid die change mechanism for injection molding
CN111805841B (en) * 2020-07-14 2022-04-08 长春百思特汽车零部件有限公司 Rapid die change mechanism for injection molding

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20191115

Termination date: 20201226