CN209627802U - A kind of high efficiency and heat radiation circuit board - Google Patents
A kind of high efficiency and heat radiation circuit board Download PDFInfo
- Publication number
- CN209627802U CN209627802U CN201821960512.2U CN201821960512U CN209627802U CN 209627802 U CN209627802 U CN 209627802U CN 201821960512 U CN201821960512 U CN 201821960512U CN 209627802 U CN209627802 U CN 209627802U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- thermally conductive
- board body
- heat sink
- high efficiency
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a kind of high efficiency and heat radiation circuit board, including circuit board body, heat sink is provided with above circuit board body, four side of heat sink bottom is fixedly connected to thermally conductive screw rod, thermally conductive screw rod is slidably connected through setting in circuit board body and with circuit board body, the nut A and nut B being connected on circuit board body two sides respectively are threaded on thermally conductive screw rod, heat sink bottom is provided with several thermally conductive spiral bars, circuit board body includes base copper, several notches adjacent with base copper are provided in circuit board body, notch shape is matched with thermally conductive spiral bar lower shape, thermally conductive spiral bar bottom end is connected on notch.Its structure is simple, improves heat dissipation for circuit board performance.
Description
Technical field
The utility model relates to circuit board technology fields, specifically disclose a kind of high efficiency and heat radiation circuit board.
Background technique
Circuit board refers to connecting electronic component to constitute an electronic device for having certain function, in recent years, electronics technology
It advances by leaps and bounds, electronic device is more accurate, especially in the case where electronic component microminiaturization, precise treatment, due to electronic component work
It is more and more to make the heat generated, causes circuit board temperature very high, therefore also higher and higher for the cooling requirements of circuit board.City
Heat dissipation for circuit board performance on face is still insufficient, it is necessary to be improved.
Utility model content
Based on this, it is necessary to it is directed to prior art problem, a kind of high efficiency and heat radiation circuit board is provided, unique structure is set,
Promote heat dissipation for circuit board performance.
To solve prior art problem, the utility model discloses a kind of high efficiency and heat radiation circuit board, including circuit board body, electricity
Heat sink is provided with above the plate ontology of road, four side of heat sink bottom is fixedly connected to thermally conductive screw rod, and thermally conductive screw rod is through setting
It is slidably connected in circuit board body and with circuit board body, is threaded on thermally conductive screw rod and is connected to circuit board body respectively
Nut A and nut B on two sides, heat sink bottom are provided with several thermally conductive spiral bars, and circuit board body includes base copper, circuit
Several notches adjacent with base copper are provided on plate ontology, notch shape is matched with thermally conductive spiral bar lower shape, thermally conductive spiral shell
A rotation bottom end is connected on notch.
Preferably, it is provided at the top of heat sink and scrapes paddle, scraping paddle includes scraping leaf, heat sink bottom with what heat dissipation plate top surface abutted
It is fixedly connected with motor, motor output shaft is fixedly connected with paddle side is scraped.
Preferably, scraping leaf is thermal conductive silicon blob of viscose.
Preferably, thermally conductive spiral bar is thermal conductive silicon adhesive tape.
Preferably, heat sink bottom is set side by side with several strip grooves.
The utility model has the following beneficial effects: the utility model discloses a kind of high efficiency and heat radiation circuit board, unique knot is set
Structure can realize by nut A and nut B to the positioning between thermally conductive screw rod and circuit board body, the heat in circuit board body
It will be transmitted on heat sink by thermally conductive screw rod, the heat on base copper absorbing circuit plate ontology is simultaneously transmitted to through thermally conductive spiral bar
On heat sink, heat sink, thermally conductive screw rod, thermally conductive spiral bar can be distributed heat, promote heat dissipation for circuit board efficiency.It is tied
Structure is simple, improves heat dissipation for circuit board performance.
Detailed description of the invention
Fig. 1 is the outline structural diagram of the utility model circuit board.
Fig. 2 is the cross section structure schematic diagram of the utility model circuit board.
Appended drawing reference are as follows: circuit board body 1, base copper 100, notch 101, heat sink 2, strip groove 20, thermally conductive screw rod 3,
Nut A4, it nut B5, thermally conductive spiral bar 6, scrapes paddle 7, scrape leaf 70, motor 8.
Specific embodiment
For the feature, technological means and specific purposes achieved, function that can further appreciate that the utility model, below
The utility model is described in further detail in conjunction with attached drawing and specific embodiment.
Referring to figs. 1 to Fig. 2.
The utility model embodiment discloses a kind of high efficiency and heat radiation circuit board, including circuit board body 1, in circuit board body 1
Side is provided with heat sink 2, and 2 bottom of heat sink, four side is fixedly connected to thermally conductive screw rod 3, and thermally conductive screw rod 3 is through setting in circuit
It is slidably connected on plate ontology 1 and with circuit board body 1, is threaded on thermally conductive screw rod 3 and is connected to 1 liang of circuit board body respectively
Nut A4 and nut B5 on face, 2 bottom of heat sink are provided with several thermally conductive spiral bars 6, and circuit board body 1 includes base copper
100, several notches 101 adjacent with base copper 100,101 shape of notch and thermally conductive spiral bar 6 are provided in circuit board body 1
Lower shape matching, thermally conductive 6 bottom end of spiral bar is connected on notch 101.
Concrete principle is that can be realized by nut A4 and nut B5 and be determined between thermally conductive screw rod 3 and circuit board body 1
, the heat in circuit board body 1 will be transmitted on heat sink 2 by thermally conductive screw rod 3,100 absorbing circuit plate ontology 1 of base copper
On heat and be transmitted on heat sink 2 through thermally conductive spiral bar 6, heat sink 2, thermally conductive screw rod 3, thermally conductive spiral bar 6 can will be hot
Amount is distributed, and heat dissipation for circuit board efficiency is promoted.Its structure is simple, improves heat dissipation for circuit board performance.
Based on the above embodiment, it is provided at the top of heat sink 2 and scrapes paddle 7, scraping paddle 7 includes scraping with what 2 top surface of heat sink abutted
Leaf 70,2 bottom of heat sink are fixedly connected with motor 8, and 8 output shaft of motor is fixedly connected with 7 side of paddle is scraped.When 2 top of heat sink
After gathering dust, paddle 7 is scraped by the driving of motor 8 and is rotated, the dust on heat sink 2 can be scraped by scraping leaf 70, prevent dirt accumulation
2 heat of heat sink is caused to be difficult to distribute.
Based on the above embodiment, scraping leaf 70 is thermal conductive silicon blob of viscose, and elasticity is good for thermal conductive silicon blob of viscose, thermal conductivity is good, reduces heat dissipation
Plate 2 is worn, 2 heat dissipation performance of heat radiation plate.
Based on the above embodiment, thermally conductive spiral bar 6 is thermal conductive silicon adhesive tape, and elasticity is good for thermal conductive silicon adhesive tape, thermal conductivity is good, prevents
Thermally conductive 6 bottom end of spiral bar causes to wear to circuit board body 1, promotes heat dissipation for circuit board efficiency.
Based on the above embodiment, 2 bottom of heat sink is set side by side with several strip grooves 20, and strip groove 20 may be configured as strip
Shape increases by 2 heat dissipation area of heat sink, promotes heat dissipation for circuit board efficiency.
Above embodiments only express a kind of embodiment of the utility model, and the description thereof is more specific and detailed, but not
Therefore it can be interpreted as that a limitation on the scope of the patent of the present invention.It should be pointed out that for the ordinary skill people of this field
For member, without departing from the concept of the premise utility, various modifications and improvements can be made, these belong to this reality
With novel protection scope.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (5)
1. a kind of high efficiency and heat radiation circuit board, including circuit board body (1), which is characterized in that set above the circuit board body (1)
It is equipped with heat sink (2), four side of heat sink (2) bottom is fixedly connected to thermally conductive screw rod (3), and the thermally conductive screw rod (3) is passed through
It wears and sets on the circuit board body (1) and be slidably connected with the circuit board body (1), spiral shell on the thermally conductive screw rod (3)
Line is connected with the nut A (4) and nut B (5) being connected on the circuit board body (1) two sides respectively, heat sink (2) bottom
Portion is provided with several thermally conductive spiral bars (6), and the circuit board body (1) includes base copper (100), the circuit board body (1)
On be provided with several with the base copper (100) adjacent notch (101), notch (101) shape and the thermally conductive spiral
The matching of item (6) lower shape, thermally conductive spiral bar (6) bottom end is connected on the notch (101).
2. a kind of high efficiency and heat radiation circuit board according to claim 1, which is characterized in that setting at the top of the heat sink (2)
It scrapes paddle (7), the paddle (7) of scraping includes scraping leaf (70) with what the heat sink (2) top surface abutted, heat sink (2) bottom
It is fixedly connected with motor (8), motor (8) output shaft is fixedly connected with described paddle (7) side of scraping.
3. a kind of high efficiency and heat radiation circuit board according to claim 2, which is characterized in that described scrape leaf (70) are heat conductive silica gel
Block.
4. a kind of high efficiency and heat radiation circuit board according to claim 1, which is characterized in that the thermally conductive spiral bar (6) is to lead
Hot silica gel strip.
5. a kind of high efficiency and heat radiation circuit board according to claim 1, which is characterized in that heat sink (2) bottom is arranged side by side
It is provided with several strip grooves (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821960512.2U CN209627802U (en) | 2018-11-27 | 2018-11-27 | A kind of high efficiency and heat radiation circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821960512.2U CN209627802U (en) | 2018-11-27 | 2018-11-27 | A kind of high efficiency and heat radiation circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209627802U true CN209627802U (en) | 2019-11-12 |
Family
ID=68444482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821960512.2U Expired - Fee Related CN209627802U (en) | 2018-11-27 | 2018-11-27 | A kind of high efficiency and heat radiation circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209627802U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112423532A (en) * | 2020-11-06 | 2021-02-26 | 常州亮鼎照明科技有限公司 | Strong stable LED luminotron three-parallel circuit board |
-
2018
- 2018-11-27 CN CN201821960512.2U patent/CN209627802U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112423532A (en) * | 2020-11-06 | 2021-02-26 | 常州亮鼎照明科技有限公司 | Strong stable LED luminotron three-parallel circuit board |
| CN112423532B (en) * | 2020-11-06 | 2022-02-18 | 常州亮鼎照明科技有限公司 | Strong stable LED luminotron three-parallel circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191112 Termination date: 20211127 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |