CN209609106U - Optical communication radiator and optical communication equipment - Google Patents
Optical communication radiator and optical communication equipment Download PDFInfo
- Publication number
- CN209609106U CN209609106U CN201920097031.1U CN201920097031U CN209609106U CN 209609106 U CN209609106 U CN 209609106U CN 201920097031 U CN201920097031 U CN 201920097031U CN 209609106 U CN209609106 U CN 209609106U
- Authority
- CN
- China
- Prior art keywords
- optical communication
- heat pipe
- substrate
- communication radiator
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a kind of optical communication radiator and optical communication equipment, belong to radiator field, optical communication radiator includes substrate and heat pipe, one end of heat pipe is fixed on substrate, the fin of multiple rollings is provided on the other end of heat pipe, circulation has working solution in heat pipe, and heat pipe is arranged in one end of substrate for contacting with heat source, conducts heat.Optical communication radiator provided by the utility model, good heat dissipation effect is small in size, and rolled finned tube is applied on heat pipe, by adjusting heat pipe fin parameter, reduces manufacturing procedure, save the cost.
Description
Technical field
The utility model relates to radiator fields, in particular to a kind of optical communication radiator and optical communication equipment.
Background technique
Optic communication enters 21 century and obtains huge development, comes into huge numbers of families' network at present;The end of last century is
Optic communication development period the most brilliant, this period are optic communications to large capacity, the period of super-speed development, 10G, 40G,
The superelevation rate of 80G even 160G is all developed.
The second stage of optic communication research, emphasis have been changed into realization intelligence, automation from large capacity, ultrahigh speed.
The research and development of optical communication equipment are gradually towards miniaturization/multifunction development.With previous piece of board, in simple only simple calculating
Hold, it is only necessary to arrange that 1~2 chip can be completed, require equipment more to refine now, the board of same size integrates more
Circuit, need the layout of more intelligent uses, therefore identical board can integrate more chips and circuit.
Heat dissipation is optical communication board extremely important problem in need of consideration, and optical communication equipment is smaller and smaller, fan volume
It is smaller and smaller, bigger power consumption is solved in smaller space and under the conditions of smaller air quantity, this is just to the performance of radiator
It is higher and higher with structural requirement, and existing radiator has been unable to meet requirement.
Utility model content
The purpose of this utility model is to provide a kind of optical communication radiator and optical communication equipments, and thermal diffusivity is good, and volume
It is small.
The embodiments of the present invention are achieved in that
On the one hand the utility model embodiment provides a kind of optical communication radiator comprising substrate and heat pipe, the one of heat pipe
End is fixed on substrate, and the fin of multiple rollings is provided on the other end of heat pipe, and circulation has working solution, heat pipe in heat pipe
One end of substrate is set for contacting with heat source, conducts heat.
Optionally, be arranged in the one side of substrate it is fluted, heat pipe be arranged in groove.
Optionally, heat pipe is the production of finned tube sinter molding.
Optionally, it is flat end that one end of groove, which is arranged in, in heat pipe.
Optionally, contact chip is provided on flat end.
Optionally, the wing plate of multiple parallel arrangements is provided on the another side of substrate.
Optionally, spring is provided in the one side of substrate setting wing plate.
Optionally, multiple fins are arranged on heat pipe along heat pipe axial screw shape.
Optionally, bending segment is provided on heat pipe, bending segment is located at one end and the heat pipe setting wing that substrate is arranged in heat pipe
Between one end of piece.
On the other hand the utility model embodiment provides a kind of optical communication equipment, including optical mode plate, circuit board and above-mentioned
Optical communication radiator, optical communication radiator are arranged between optical mode plate and circuit board, the substrate of optical mode plate and optical communication radiator
The spring for pasting merga pass optical communication radiator abuts, and optical mode plate is connect with circuit board signal.
The beneficial effect of the utility model embodiment includes:
Optical communication radiator provided by the embodiment of the utility model includes substrate and heat pipe, and one end of heat pipe is fixed at
On substrate, the fin of multiple rollings is provided on the other end of heat pipe, circulation has working solution in heat pipe, and substrate is arranged in heat pipe
Heat is conducted for contacting with heat source in one end.Optical communication radiator provided by the embodiment of the utility model, good heat dissipation effect, body
Product is small, and rolled finned tube is applied on heat pipe, by adjusting heat pipe fin parameter, reduces manufacturing procedure, save the cost.
Optical communication equipment provided by the embodiment of the utility model includes optical mode plate, circuit board and above-mentioned optical communication heat dissipation
Device, optical communication radiator are arranged between optical mode plate and circuit board, and the substrate of optical mode plate and optical communication radiator pastes merga pass
The spring of optical communication radiator abuts, and optical mode plate is connect with circuit board signal.Optical communication provided by the embodiment of the utility model is set
Standby perfect heat-dissipating, effectively reduces the volume of optical communication equipment, reduces product power consumption, the stability enhanced product performance.
Detailed description of the invention
It, below will be to use required in embodiment in order to illustrate more clearly of the technical solution of the utility model embodiment
Attached drawing be briefly described, it should be understood that the following drawings illustrates only some embodiments of the utility model, therefore should not be by
Regard the restriction to range as, for those of ordinary skill in the art, without creative efforts, may be used also
To obtain other relevant attached drawings according to these attached drawings.
Fig. 1 is the structural schematic diagram of optical communication radiator provided by the embodiment of the utility model;
Fig. 2 is the configuration schematic diagram of optical communication radiator provided by the embodiment of the utility model;
Fig. 3 is the structural schematic diagram of the heat pipe of optical communication radiator provided by the embodiment of the utility model;
Fig. 4 is that optical communication radiator provided by the embodiment of the utility model and optical mode plate use schematic construction schematic diagram.
Icon: 10- substrate;11- wing plate;12- spring;20- heat pipe;21- fin;30- contact chip;40- optical mode plate.
Specific embodiment
It is practical new below in conjunction with this to keep the objectives, technical solutions, and advantages of the embodiments of the present invention clearer
Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched
The embodiment stated is the utility model a part of the embodiment, instead of all the embodiments.Usually here in attached drawing description and
The component of the utility model embodiment shown can be arranged and be designed with a variety of different configurations.
Therefore, requirement is not intended to limit to the detailed description of the embodiments of the present invention provided in the accompanying drawings below
The scope of the utility model of protection, but it is merely representative of the selected embodiment of the utility model.Based in the utility model
Embodiment, every other embodiment obtained by those of ordinary skill in the art without making creative efforts, all
Belong to the range of the utility model protection.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.
It is in the description of the present invention, it should be noted that term " center ", "upper", "lower", "left", "right", " perpendicular
Directly ", the orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" be based on the orientation or positional relationship shown in the drawings, or
The utility model product using when the orientation or positional relationship usually put, be merely for convenience of description the utility model and letter
Change description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with specific orientation construct and
Operation, therefore should not be understood as limiting the present invention.In addition, term " first ", " second ", " third " etc. are only used for area
Divide description, is not understood to indicate or imply relative importance.
In addition, the terms such as term "horizontal", "vertical" are not offered as requiring component abswolute level or pendency, but can be slightly
Low dip.It is not to indicate that the structure has been had to if "horizontal" only refers to that its direction is more horizontal with respect to for "vertical"
It is complete horizontal, but can be slightly tilted.
In the description of the present invention, it should also be noted that, unless otherwise clearly defined and limited, term " is set
Set ", " installation ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection,
Or it is integrally connected;It can be mechanical connection, be also possible to be electrically connected;It can be directly connected, intermediary can also be passed through
It is indirectly connected, can be the connection inside two elements.For the ordinary skill in the art, it can be managed with concrete condition
Solve the concrete meaning of above-mentioned term in the present invention.
Embodiment one
Fig. 1 is please referred to, the present embodiment provides a kind of optical communication radiators comprising substrate 10, heat pipe 20 and contact chip 30,
One end of heat pipe 20 is fixed on the substrate 10, and the other end of heat pipe 20 is provided with multiple fins 21, and multiple fins 21 roll.
As shown in Fig. 2, the one side of substrate 10 is equipped with groove, on substrate 10 on the another side opposite with reeded face is set
Equipped with multiple wing plates 11 being parallel to each other, substrate 10, which is equipped on the face of wing plate 11, is further fixed on spring 12, the plating of 12 surface of spring
Nickel.
The material of substrate 10 is aluminium alloy AL6063, which has good resisting wind press capacity, 10 machine-shaping of substrate
Rear surface nickel plating improves the corrosion resistance of substrate 10.
Heat pipe 20 is a kind of heat transfer element with high thermal conductivity, it passes through the working solution in Totally enclosed vacuum shell
With condensation to transmit heat, the heat transfer area with high thermal conductivity, good isothermal, cold and hot two sides can arbitrarily change for evaporation
Become, can the series of advantages such as remotely transferring, temperature controllable.
As shown in figure 3, one end of the heat pipe 20 of the present embodiment is flat, the shape of the groove on flat end and substrate 10
To match, flat end is fixed in the groove of substrate 10, and the other end of heat pipe 20 is circular tube shaped, entire 20 inner hollow of heat pipe,
Working solution is filled in pipe, such as water, acetone or methanol realize heat transfer for phase transformation as the working solution of heat pipe 20;Heat pipe 20 is another
The round tube periphery wall of one end is equipped with multiple fins 21, and multiple fins 21 are arranged in the shape of a spiral along the axial direction of heat pipe 20, works as air
Fin 21 is flowed through, since spiral helicine fin 21 has helix angle, air flow direction is not straight line but a kind of turbulent condition, figure
Arrow direction is the direction of wind in 4, and in this way under conditions of low wind speed, the convective boundary layer of the wall surface between adjacent fins 21 is more
It is easy to upset, to obtain better heat exchange property.Especially present optical communication equipment integrates more functions, and volume becomes
Small, fan volume is also smaller and smaller, and under conditions of low wind speed, the better optical communication radiator of performance can be more favourable.
Illustratively, as shown in figure 3, heat pipe 20 is equipped with bending section, one end of substrate 10 is arranged in heat pipe 20 for bending section
Heat pipe 20 be arranged fin 21 one end between, bending section be also it is flat, be gradually transitions the circular tube shaped at fin end.Heat pipe 20
Bending section is set it is the installation in order to adapt to different optical communication radiators, those skilled in the art can set according to actual needs
It sets.
The heat pipe 20 of the present embodiment is sintered using the copper fin pipe of rolling, then according to the processing technology of conventional heat pipe
It is shaped to 20 structure of heat pipe shown in Fig. 3, finally the optical communication radiator integrally welded with substrate 10.Using rolled fin
Pipe, the parameter of fin 21, such as spacing, piece are thick, height can freely be adjusted by heat pipe process equipment.Identical material can be with
Different parameters is adjusted, without in addition opening up fin die, processing cost is saved, reduces processing technology.Integrally roll
The helical fin 21 of heat pipe 20 under low wind speed condition, can pass through fin 21 in the bigger optical communication equipment of density of texture
Between air turbulence, obtain better heat dissipation performance.
Contact chip 30 is set on the flat end of heat pipe 20, and contact chip 30 is copper sheet, and specifically, material can be fine copper
C1100, the material have good conductive, thermally conductive, anti-corrosion and processing performance, can weld and be brazed.
Illustratively, optical communication radiator provided by the embodiment of the utility model is in use, as shown in figure 4, heat source is optical mode
Plate 40, optical mode plate 40 from Fig. 4 show position be inserted into from left to right with 10 plane contact of optical communication radiator base plate, due to optical mode plate 40
There can be dimensional tolerance with the processing of optical communication radiator, prevent optical mode plate 40 and optical communication radiator plane from being bonded completely, such as
Fruit plane contact is bad, and heat, which concentrates on optical mode plate 40 will cause optical mode plate 40, to be stopped working or even burn out, but by light
The top for communicating radiator increases a spring 12, and spring 12 makes optical communication radiator have the effect of floating mount, makes it more
Good fitting optical mode plate 40 has more reliable installation capability.Optical communication radiator base plate 10 is under the conditions of 12 active force of spring
Plane can float up and down, to promote the plane of optical mode plate 40 well to contact with optical communication radiator base plate 10, and then heat
It can be transmitted on optical communication radiator base plate 10 and spread, then by contact chip 30, conduct heat to the flat end of heat pipe 20, heat
The quick thermal transport property of heat-conduction principle and phase change medium is utilized in pipe 20, through heat pipe 20 that the heat of thermal objects is rapid
It is transmitted to outside heat source, its working principle is that the heat on optical mode plate 40 is conducted to the flat end of heat pipe 20, the working solution in tube core
Body is taken away the heat of optical mode plate 40 by thermal evaporation, which is the evaporation latent heat of working fluid, and steam is flowed to from central passage
The condensation segment (i.e. round tube end) of heat pipe 20, condenses into liquid, while releasing latent heat, under the action of capillary force, liquid reflux arrives
Evaporator section (i.e. flat end) a, in this way, closed circulation is just completed, to conducting a large amount of heat from flat end to tail portion
The heat dissipation of round tube end.
Optical communication radiator provided by the embodiment of the utility model, good heat dissipation effect is small in size, by rolled finned tube application
Onto heat pipe 20,21 parameter of fin of heat pipe 20 is freely adjusted by heat pipe process equipment, reduces fin die sinking, reduces processing work
Sequence, save the cost.
Optical communication radiator provided by the embodiment of the utility model, using tin cream as solder flux, by heat pipe 20, substrate 10,
Spring 12 and contact chip 30 weld together, and make the integrally molded molding of optical communication radiator of the present embodiment.
The production method of optical communication radiator provided by the embodiment of the utility model, comprising the following steps:
Step 1: rolling copper fin pipe.
Step 2: fin inside pipe wall sintered copper powder.
Step 3: will vacuumize in finned tube, and working solution is filled into finned tube, and heat pipe 20 is processed into sealing.
Step 4: 20 bending of heat pipe is flattened.
Step 5: by heat pipe 20, substrate 10, spring 12 and the integrally molded molding of contact chip 30.
Embodiment two
The present embodiment provides a kind of optical communication equipments, including optical mode plate 40, optical communication board and above-mentioned optical communication heat dissipation
Device, optical communication radiator are arranged between optical mode plate 40 and circuit board, and optical mode plate 40 is bonded with the substrate 10 of optical communication radiator
And abutted by the spring 12 of optical communication radiator, optical mode plate 40 is connect with circuit board signal.
Optical mode plate 40 is heat source, is provided with bracket in optical communication equipment, bracket is located at the top of spring 12, for pushing down bullet
Spring 12 applies downward pressure to spring 12 by bracket, and optical communication radiator and optical mode plate 40 is enable to have good contact, will
Heat on optical mode plate 40 is conducted to the heat dissipation of the tail portion of optical communication radiator.
Optical communication equipment provided by the embodiment of the utility model, perfect heat-dissipating effectively reduce the body of optical communication equipment
Product reduces product power consumption, the stability enhanced product performance.
The above descriptions are merely preferred embodiments of the present invention, is not intended to limit the utility model, for this
For the technical staff in field, various modifications and changes may be made to the present invention.It is all in the spirit and principles of the utility model
Within, any modification, equivalent replacement, improvement and so on should be included within the scope of protection of this utility model.
Claims (10)
1. a kind of optical communication radiator, which is characterized in that including substrate and heat pipe, one end of the heat pipe is fixed at described
On substrate, the fin of multiple rollings is provided on the other end of the heat pipe, circulation has working solution, the heat pipe in the heat pipe
One end of the substrate is set for contacting with heat source, conducts heat.
2. optical communication radiator according to claim 1, which is characterized in that be arranged in the one side of the substrate it is fluted,
The heat pipe setting is in the groove.
3. optical communication radiator according to claim 1, which is characterized in that the heat pipe is finned tube sinter molding system
Make.
4. optical communication radiator according to claim 2, which is characterized in that one end of the groove is arranged in the heat pipe
For flat end.
5. optical communication radiator according to claim 4, which is characterized in that be provided with contact chip on the flat end.
6. optical communication radiator according to claim 2, which is characterized in that be provided on the another side of the substrate multiple
The wing plate of parallel arrangement.
7. optical communication radiator according to claim 6, which is characterized in that the substrate is arranged in the one side of the wing plate
It is provided with spring.
8. optical communication radiator according to claim 1, which is characterized in that multiple fins are on the heat pipe along institute
State the arrangement of heat pipe axial screw shape.
9. optical communication radiator according to claim 1, which is characterized in that bending segment is provided on the heat pipe, it is described
Bending segment is located at that one end of the substrate is arranged in the heat pipe and the heat pipe is arranged between one end of the fin.
10. a kind of optical communication equipment, which is characterized in that including described in optical mode plate, circuit board and the claims any one of 1-9
Optical communication radiator, the optical communication radiator is arranged between the optical mode plate and the circuit board, the optical mode plate with
The spring of optical communication radiator described in the substrate patch merga pass of the optical communication radiator abuts, the optical mode plate and the electricity
The connection of road partitioned signal.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201920097031.1U CN209609106U (en) | 2019-01-21 | 2019-01-21 | Optical communication radiator and optical communication equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201920097031.1U CN209609106U (en) | 2019-01-21 | 2019-01-21 | Optical communication radiator and optical communication equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
CN209609106U true CN209609106U (en) | 2019-11-08 |
Family
ID=68401526
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201920097031.1U Active CN209609106U (en) | 2019-01-21 | 2019-01-21 | Optical communication radiator and optical communication equipment |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN209609106U (en) |
-
2019
- 2019-01-21 CN CN201920097031.1U patent/CN209609106U/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101453859B (en) | Loop type heat pipe radiator and manufacturing method thereof | |
CN106535564A (en) | Liquid cooling type heat radiator | |
EP1708261B1 (en) | Heat pipe radiator for a heat-generating component | |
CN108461461A (en) | A kind of porous conductive material filled-type heat-pipe radiator | |
CN209609106U (en) | Optical communication radiator and optical communication equipment | |
CN100584167C (en) | Radiating module and heat tube thereof | |
CN201306960Y (en) | High-power loop type heat pipe radiating device | |
CN212183960U (en) | Heat dissipation pipe, heat dissipation module and liquid cooling system | |
CN209609107U (en) | Teeth radiator and optical communication equipment | |
CN105552049A (en) | Integrated liquid cooling heat sink device of power module and bottom plate used by power module | |
CN206118281U (en) | Board -like loop thermal siphon temperature -uniforming plate | |
CN114641188A (en) | Built-in temperature-uniforming plate with heat radiation structure | |
CN114850811A (en) | Method for processing radiator | |
CN209609105U (en) | Thermal column radiator and optical communication equipment | |
CN207909860U (en) | A kind of electronic component plate-type heat-pipe radiator | |
CN102683307A (en) | CPU (Central Processing Unit) radiator with combined corner-tube type flat self-excited capillary heat pipe | |
CN203980981U (en) | A kind of ultra-thin lightweight loop circuit heat pipe | |
CN114001571A (en) | Closed-loop pulsating heat transfer pipe and heat dissipation heat exchanger | |
CN1869575B (en) | Radiator | |
CN209489056U (en) | A kind of bimetallic cold plate heat exchanger based on fusing point difference | |
CN101075592A (en) | Hot-piping electronic device radiator | |
CN221240673U (en) | Solid-solid interface heat transfer structure | |
CN220935465U (en) | Temperature equalizing plate for heat dissipation of electronic product | |
CN219395069U (en) | High-efficient electric heating pipe and electric heater | |
CN218002297U (en) | Heat exchange area increases large-scale heat transfer sleeve pipe |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |