CN209552180U - Silicon wafer sliver apparatus - Google Patents
Silicon wafer sliver apparatus Download PDFInfo
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- CN209552180U CN209552180U CN201821190618.9U CN201821190618U CN209552180U CN 209552180 U CN209552180 U CN 209552180U CN 201821190618 U CN201821190618 U CN 201821190618U CN 209552180 U CN209552180 U CN 209552180U
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- platform
- silicon wafer
- sliver apparatus
- lug
- split
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 93
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 93
- 239000010703 silicon Substances 0.000 title claims abstract description 93
- 230000007246 mechanism Effects 0.000 claims abstract description 8
- 238000001179 sorption measurement Methods 0.000 claims description 35
- 238000000034 method Methods 0.000 abstract description 4
- 230000008569 process Effects 0.000 abstract description 3
- 230000004992 fission Effects 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 61
- 238000005516 engineering process Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 210000004027 cell Anatomy 0.000 description 2
- 210000003850 cellular structure Anatomy 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The utility model provides a kind of silicon wafer sliver apparatus, the silicon wafer sliver apparatus includes the first platform and the second platform for being respectively provided with loading end, the loading end of first platform and second platform is in same plane to carry silicon wafer to be split jointly, the silicon wafer sliver apparatus is provided with the fixed mechanism for being fixed on the silicon wafer to be split on the loading end, first platform and second platform around the division for the relative rotation to realize the silicon wafer to be split of the line of demarcation of the two.The utility model is divided into the first platform and the second platform using silicon wafer sliver apparatus to fix silicon wafer, realizes the fission process of silicon wafer by rotating doubling between the first platform and the second platform, to mitigate the risk of sliver, reduces loss.
Description
Technical field
The utility model relates to a kind of silicon wafer sliver apparatus more particularly to a kind of silicon wafer of photovoltaic solar cell component to split
Sheet devices.
Background technique
Photovoltaic solar cell component is made up of a large amount of photovoltaic solar cell pieces welding concatenation, then passes through lamination
Prepare to weld welding and busbar, then forms photovoltaic module after stacking and laminating machine laminating.Due to the development of industry, component
New component technology is constantly researched and developed at end, in order to obtain higher power, reduces decaying and the hot spot effect of component, half battery pack
Part is increasingly by the attention of industry.
With the rapid development of silicon chip technology, silicon wafer will not all be less than 156mm substantially in industry, lead to entire solar-electricity
Pond piece will not be less than 156mm.According to current innovation technology, the electricity of two panels 78mm solar battery sheet series connection sending
Greater than the electricity that a piece of 156mm solar battery sheet issues, while hot spot effect is lower.But current silicon wafer and solar battery
Bit end will not make smaller silicon wafer for component, because can largely increase silicon wafer and solar battery sheet in this way
Cost, while reducing the production capacity of silicon wafer and solar battery sheet.
Therefore, in order to adapt to the development trend of half battery component, increase solar battery sheet laser scribing in assembly end
Solar battery sheet is cut into smaller size by function, and not will increase the cost of silicon wafer and solar battery sheet.Component
End will make the component of half solar battery sheet, need to be equipped with the equipment that can scratch solar battery sheet, while guaranteeing to too
The damage of positive energy cell piece is minimum.The scribing principle of laser scribing means is that silicon wafer is placed on to laser scribing platform, is sent out using laser
Silicon wafer is scratched the thickness of about half by raw device, is then again broken silicon wafer into two with one's hands to make half solar battery sheet.
After the completion of laser scribing means scribing used at present, the silicon wafer drawn directly is split using with suctorial manipulator
At the silicon wafer of two half.Four slivers of silicon wafer are only sucked in such sliver mode by sucker, and for silicon wafer without supporting surface, silicon wafer is easy
It occurs bending and deformation, the risk of sliver is larger, when especially scribing is of low quality, will lead to being significantly increased for loss.
In view of this, it is necessory to be improved to the silicon wafer sliver apparatus on scribing machine, to solve the above problems.
Utility model content
The purpose of this utility model is to provide a kind of easily to operate for the silicon wafer sliver apparatus on scribing machine.
To achieve the above objectives, the present invention adopts the following technical solutions:
A kind of silicon wafer sliver apparatus, the silicon wafer sliver apparatus include being respectively provided with the first platform of loading end and second flat
The loading end of platform, first platform and second platform is in same plane to carry silicon wafer to be split jointly, described
Silicon wafer sliver apparatus is provided with the fixed mechanism for being fixed on the silicon wafer to be split on the loading end, first platform
With second platform around the division for the relative rotation to realize the silicon wafer to be split of the line of demarcation of the two.
As the further improved technical solution of the utility model, first platform and second platform pass through boundary
Bolt at line rotates connection.
As the further improved technical solution of the utility model, first platform and second platform two sides difference
It is provided with extension, the extension is provided with lug, and the lug includes first lug on first platform and described
Second lug of the second platform, the first lug and second lug are mutually overlapping.
As the further improved technical solution of the utility model, the first lug and second lug overlap place and set
It is equipped with perforation, the bolt is set in the perforation.
As the further improved technical solution of the utility model, first mesa base is provided with fixed structure, institute
It states fixed structure and is set to first platform quadrangle.
As the further improved technical solution of the utility model, the fixed mechanism is adsorption hole, the adsorption hole packet
Include several first adsorption holes and several second adsorption holes being arranged on first platform and second platform, described first
The aperture of adsorption hole is greater than the aperture of second adsorption hole.
As the further improved technical solution of the utility model, one of first platform and second platform
Fixed, another one is rotated around the line of demarcation.
As the further improved technical solution of the utility model, second platform is connected on moving cylinder, described
Moving cylinder drives second platform to rotate relative to first platform.
As the further improved technical solution of the utility model, during single sliver, first adsorption hole
Enabling time of the enabling time earlier than second adsorption hole.
As the further improved technical solution of the utility model, the gross area of first platform and second platform
Greater than the area of the silicon wafer to be split, the silicon wafer to be split is fully seated on first platform and second platform.
The utility model has the beneficial effects that the utility model is divided into the first platform and second flat using silicon wafer sliver apparatus
Platform fixes solar silicon wafers, realizes the fission process of silicon wafer by rotating doubling between the first platform and the second platform, from
And mitigate the risk of sliver, reduce loss.
Detailed description of the invention
Fig. 1 is the perspective view of the utility model silicon wafer sliver apparatus；
Fig. 2 is the partial enlarged view in the portion A in Fig. 1；
Fig. 3 is the top view of the utility model silicon wafer sliver apparatus.
Specific embodiment
In order to keep the purpose of this utility model, technical solution and advantage clearer, with reference to the accompanying drawing and it is embodied
The utility model is described in detail in example.
As shown in Figure 1, being the perspective view of the utility model silicon wafer sliver apparatus.Silicon wafer sliver apparatus includes having loading end
The first platform 11 and the second platform 12, the loading end of the first platform 11 and the second platform 12 is in same plane to carry jointly
The gross area of silicon wafer to be split, the first platform 11 and the second platform 12 is greater than the area of silicon wafer to be split, and silicon wafer to be split is fully seated at
On first platform 11 and the second platform 12, silicon wafer to be split is carried convenient for stronger；First platform, 11 bottom is provided with fixed knot
Structure 111, fixed structure 111 are set to 11 4 jiaos of the first platform, for the first platform 11 to be fixed on scribing machine；First platform
11 and second platform 12 around the division for the relative rotation to realize silicon wafer to be split of the line of demarcation of the two, the first platform 11 and second is flat
Platform 12 rotates connection by the bolt 30 at line of demarcation.
As shown in Fig. 2, for the partial enlarged view in the portion A in Fig. 1.First platform 11 and the second platform 12 by line of demarcation at
The two sides of the rotation connection of bolt 30, the first platform 11 and the second platform 12 are respectively arranged with extension 13, in two extensions 13
On be provided with lug, lug includes the second lug 132 in first lug 131 and the second platform 12 on the first platform 11,
First lug 131 and the second lug 132 mutually overlap at line of demarcation and are provided with perforation (not shown).Perforation is through the
One lug 131 and the second lug 132, bolt 30 are set in perforation, are connected so that the first platform 11 and the second platform 12 be made to rotate
It connects.
As shown in figure 3, being the top view of the utility model silicon wafer sliver apparatus.Divide on first platform 11 and the second platform 12
It is not provided with fixed mechanism, fixed mechanism is adsorption hole 20, and adsorption hole 20 includes the first adsorption hole 21 and the second adsorption hole 22, the
The adsorption hole 20 of one platform 11 and the second platform 12 is correspondingly arranged, for adsorbing the silicon wafer being placed on two platforms.Adsorption hole 20
First including the first adsorption hole 21 being located on 12 4 jiaos of the first platform 11 and the second platform and at two platform lines of demarcation
Adsorption hole 21 securely adsorbs the silicon wafer being placed on platform；The first adsorption hole 21 being positioned close at two platform lines of demarcation is used
Supporting silicon chip when sliver reduces sliver risk.Several second adsorption holes 22 of first adsorption hole, 21 surrounding are set, and second inhales
The aperture in attached hole 22 is less than the aperture of the first adsorption hole 21, and the first adsorption hole 21 is for fixing silicon wafer, the second adsorption hole 22
Suction is assisted for increasing, thus silicon wafer stronger and that equably absorption is placed on platform.Adsorption hole 20 is sucker knot
The true hole adsorption hole of structure, sucker is made of more soft material, such as rubber, guarantees adsorption hole 20 when adsorbing silicon wafer not
It causes to damage, vacuum plant is placed in platform interior (not shown).
After the completion of scribing machine scribing, silicon wafer to be split is transferred to the platform of sliver apparatus by manipulator, at this time the first platform
11 and second platform 12 be the horizontal positioned state opened, it is flat to be placed in two centered on the scribing line that scribing machine is cut silicon wafer
It is aligned on the loading end of platform and with two platform line of demarcation centers.First adsorption hole 21 of the first platform 11 and the second platform 12 is by silicon
Piece first adsorbs, and then the second adsorption hole 22 starts to adsorb again, during single sliver, the enabling time of the first adsorption hole 21
Earlier than the enabling time of the second adsorption hole 22, avoid as start when suction it is excessive caused by silicon wafer fragmentation risk.Second platform
12 have been directly connected to moving cylinder (not shown), and moving cylinder drives the second platform 12 to rotate around two platform lines of demarcation, the
One platform 11 and the second platform 12 are rotated along line of demarcation to be connected, and such connection type structure is simple, convenient for loading and unloading.
Second platform 12 folds under the drive of moving cylinder to the loading end direction of the first platform 11, rotates about 30 degree,
First platform 11 remains stationary, and silicon wafer is cleaved into two half.Such sliver mode is mainly the vacuum absorption holes for relying on platform
20 is secured by silicon wafer, and platform plays the role of supporting silicon chip, and the sliver platform moment of side folds, directly silicon wafer splits, this
Kind sliver mode can make silicon wafer uniform force, while due to the support of platform during sliver, silicon wafer will not be deformed, be turned round
Song greatly reduces the risk of sliver.
In conclusion the utility model provides a kind of silicon wafer sliver apparatus, silicon wafer sliver apparatus includes being respectively provided with carrying
The loading end of first platform and the second platform in face, the first platform and the second platform is in same plane to carry silicon to be split jointly
Piece, silicon wafer sliver apparatus are provided with for silicon wafer to be split to be fixed on fixed mechanism on loading end, the first platform and second flat
Platform is around the division for the relative rotation to realize silicon wafer to be split of the line of demarcation of the two.The utility model is divided into using silicon wafer sliver apparatus
First platform and the second platform fix silicon wafer, realize point of silicon wafer by rotating doubling between the first platform and the second platform
Process is split, to mitigate the risk of sliver, reduces loss.
It is used herein such as "upper", "lower", "left", "right", "front", "rear", representation space relative position term
It is to describe relationship of the feature relative to another feature as shown in the drawings for the purpose convenient for explanation.It can manage
Solution, according to the difference of product placement position, the term of relative space position can be intended to include other than orientation as shown in the figure
Different direction, should not be interpreted as limitations on claims.In addition, descriptor "horizontal" used herein and non-fully
It is equal to along the inclination for perpendicular to gravity direction, allowing to have certain angle.
In addition, above embodiments are merely to illustrate the utility model and not limit technical side described in the utility model
Case, understanding of this description should be based on persons of ordinary skill in the field, although this specification is referring to above-mentioned
Embodiment has been carried out detailed description to the utility model, still, those skilled in the art should understand that, affiliated skill
The technical staff in art field still can be modified or replaced equivalently the utility model, and all not depart from this practical new
The technical solution and its improvement of the spirit and scope of type, should all cover in the scope of the claims of the utility model.
Claims (10)
1. a kind of silicon wafer sliver apparatus, it is characterised in that: the silicon wafer sliver apparatus includes be respectively provided with loading end first flat
The loading end of platform and the second platform, first platform and second platform is in same plane carried jointly wait split
Silicon wafer, the silicon wafer sliver apparatus are provided with the fixed mechanism for being fixed on the silicon wafer to be split on the loading end, institute
The first platform and second platform are stated around the division for the relative rotation to realize the silicon wafer to be split of the line of demarcation of the two.
2. silicon wafer sliver apparatus according to claim 1, it is characterised in that: first platform and second platform are logical
Cross the bolt rotation connection at line of demarcation.
3. silicon wafer sliver apparatus according to claim 2, it is characterised in that: first platform and second platform two
Side is respectively arranged with extension, and the extension is provided with lug, and the lug includes the first lug on first platform
With the second lug of second platform, the first lug and second lug are mutually overlapping.
4. silicon wafer sliver apparatus according to claim 3, it is characterised in that: the first lug and second lug are handed over
Folded place is provided with perforation, and the bolt is set in the perforation.
5. silicon wafer sliver apparatus according to claim 1, it is characterised in that: first mesa base is provided with fixed knot
Structure, the fixed structure are set to first platform quadrangle.
6. silicon wafer sliver apparatus according to claim 1, it is characterised in that: the fixed mechanism is adsorption hole, the suction
Attached hole includes several first adsorption holes and several second adsorption holes being arranged on first platform and second platform, institute
The aperture for stating the first adsorption hole is greater than the aperture of second adsorption hole.
7. silicon wafer sliver apparatus according to claim 1, it is characterised in that: in first platform and second platform
One of it is fixed, another one is rotated around the line of demarcation.
8. silicon wafer sliver apparatus according to claim 1, it is characterised in that: second platform is connected to moving cylinder
On, the moving cylinder drives second platform to rotate relative to first platform.
9. silicon wafer sliver apparatus according to claim 6, it is characterised in that: during single sliver, described first inhales
Enabling time of the enabling time in attached hole earlier than second adsorption hole.
10. silicon wafer sliver apparatus according to claim 1, it is characterised in that: first platform and second platform
The gross area be greater than the area of the silicon wafer to be split, the silicon wafer to be split is fully seated at first platform and described second flat
On platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821190618.9U CN209552180U (en) | 2018-07-26 | 2018-07-26 | Silicon wafer sliver apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821190618.9U CN209552180U (en) | 2018-07-26 | 2018-07-26 | Silicon wafer sliver apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209552180U true CN209552180U (en) | 2019-10-29 |
Family
ID=68298173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821190618.9U Active CN209552180U (en) | 2018-07-26 | 2018-07-26 | Silicon wafer sliver apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209552180U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111196671A (en) * | 2020-01-08 | 2020-05-26 | 秦绪祥 | Liquid crystal substrate glass splitting device |
| CN111421597A (en) * | 2020-04-13 | 2020-07-17 | 伊书剑 | Quartz crystal oscillator substrate splitting device |
| CN112786740A (en) * | 2021-02-26 | 2021-05-11 | 宁夏小牛自动化设备有限公司 | Method and device for removing solar cell strings to-be-removed cell pieces |
-
2018
- 2018-07-26 CN CN201821190618.9U patent/CN209552180U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111196671A (en) * | 2020-01-08 | 2020-05-26 | 秦绪祥 | Liquid crystal substrate glass splitting device |
| CN111196671B (en) * | 2020-01-08 | 2022-04-01 | 深圳市昊弘飞达科技有限公司 | Liquid crystal substrate glass splitting device |
| CN111421597A (en) * | 2020-04-13 | 2020-07-17 | 伊书剑 | Quartz crystal oscillator substrate splitting device |
| CN112786740A (en) * | 2021-02-26 | 2021-05-11 | 宁夏小牛自动化设备有限公司 | Method and device for removing solar cell strings to-be-removed cell pieces |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 471023 No. 10 Guan Lin Road, Luolong science and Technology Park, Luoyang, Henan Patentee after: LUOYANG CSI PHOTOVOLTAIC TECHNOLOGY Co.,Ltd. Patentee after: Atlas sunshine Power Group Co.,Ltd. Address before: 471023 No. 10 Guan Lin Road, Luolong science and Technology Park, Luoyang, Henan Patentee before: LUOYANG CSI PHOTOVOLTAIC TECHNOLOGY Co.,Ltd. Patentee before: CSI SOLAR POWER GROUP Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder |