CN209544345U - A kind of electrostatic protection array chip encapsulating structure applied to Ethernet interface - Google Patents
A kind of electrostatic protection array chip encapsulating structure applied to Ethernet interface Download PDFInfo
- Publication number
- CN209544345U CN209544345U CN201920255053.6U CN201920255053U CN209544345U CN 209544345 U CN209544345 U CN 209544345U CN 201920255053 U CN201920255053 U CN 201920255053U CN 209544345 U CN209544345 U CN 209544345U
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- CN
- China
- Prior art keywords
- electrostatic protection
- lead wire
- metal lead
- chip
- protection chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
A kind of electrostatic protection array chip encapsulating structure applied to Ethernet interface, the utility model relates to electrostatic protection array chips；No.1 metal lead wire frame and No. two metal lead wire frames are symmetricly set on inside epoxy resin plastics protective shell, and electrostatic protection chip A and electrostatic protection chip B are welded on the pad of No.1 metal lead wire frame and No. two metal lead wire frames；Electrostatic protection chip A on No.1 metal lead wire frame is electrically connected by the electrostatic protection chip B on plain conductor and No. two metal lead wire frames；Electrostatic protection chip B on No.1 metal lead wire frame is electrically connected by the electrostatic protection chip A on plain conductor and No. two metal lead wire frames.The volume and cost of device are effectively reduced, and ensure that the data on guarantee Ethernet interface and back-end chip from the interference and damage of electrostatic, safety is higher, and practicability is stronger.
Description
Technical field
The utility model relates to electrostatic protection array chip technical fields, and in particular to a kind of applied to Ethernet interface
Electrostatic protection array chip encapsulating structure.
Background technique
Ethernet is current most widely used Local network communication mode, and by different equipment, (such as interchanger is routed for it
Device, hub, office equipment, intelligent terminal etc.) linking together is communicated.The end that network data connects in Ethernet
Mouth is exactly Ethernet interface, is transmitted for data.And higher and higher, the locating electricity of message transmission rate of existing Ethernet interface
Magnetic environment also more aobvious complexity, therefore data on Ethernet interface and back-end chip are highly susceptible to the interference and damage of electrostatic,
Urgently improve.
Summary of the invention
The purpose of this utility model is that in view of the drawbacks of the prior art and insufficient, provide that a kind of structure is simple, and design is closed
Reason, the electrostatic protection array chip encapsulating structure easy to use applied to Ethernet interface, effectively reduce the body of device
Long-pending and cost, and ensure that the interference and damage for guaranteeing data and back-end chip on Ethernet interface from electrostatic, safety
Higher, practicability is stronger.
In order to achieve the above purposes, the technical solution adopted by the utility model is:, and it includes epoxy resin plastics protective shell；One
Number metal lead wire frame, No. two metal lead wire frames, electrostatic protection chip A, electrostatic protection chip B, plain conductor；No.1 metal
Lead frame and No. two metal lead wire frames are symmetricly set on inside epoxy resin plastics protective shell, and No.1 metal lead wire frame
With electrostatic protection chip A and electrostatic protection chip B are welded on the pad of No. two metal lead wire frames；No.1 metal draws
Electrostatic protection chip A on wire frame is electrically connected by plain conductor with the electrostatic protection chip B on No. two metal lead wire frames
It connects；Electrostatic protection chip B on No.1 metal lead wire frame is anti-by the electrostatic on plain conductor and No. two metal lead wire frames
Chip A is protected to be electrically connected.
Further, the top of the electrostatic protection chip B is welded with metal ball, plain conductor and electrostatic protection chip
One end of B connection is electrically connected by metal ball and electrostatic protection chip B.
Further, on the electrostatic protection chip A and No. two metal lead wire frames on the No.1 metal lead wire frame
Electrostatic protection chip B or so be arranged side by side；Electrostatic protection chip B and No. two die-attach areas on No.1 metal lead wire frame
Electrostatic protection chip A on frame or so is arranged side by side.
After adopting the above structure, the utility model has the beneficial effect that described in the utility model a kind of applied to Ethernet
The electrostatic protection array chip encapsulating structure of interface, effectively reduces the volume and cost of device, and ensure that guarantee ether
Data and back-end chip on network interface are from the interference and damage of electrostatic, and safety is higher, and practicability is stronger, the utility model
It is simple with structure, setting rationally, the advantages that low manufacture cost.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is the structural schematic diagram of the utility model.
Description of symbols:
Epoxy resin plastics protective shell 1, metal ball 2, No.1 metal lead wire frame 3, No. two metal lead wire frames 4, electrostatic
Protect chip A 5, electrostatic protection chip B 6, plain conductor 7.
Specific embodiment
The utility model will be further described below with reference to the accompanying drawings.
Referring to as shown in Figure 1, present embodiment the technical solution adopted is that: it include epoxy resin plastics protective shell
1；3, No. two metal lead wire frames 4 of No.1 metal lead wire frame, electrostatic protection chip A 5, electrostatic protection chip B 6, metal are led
Line 7；3, No. two metal lead wire frames 4 of No.1 metal lead wire frame, electrostatic protection chip A 5, electrostatic protection chip B 6 and metal
The outside for the entirety that conducting wire 7 is constituted is wrapped with epoxy resin plastics protective shell 1；The pin of No.1 metal lead wire frame 3
The outside of epoxy resin plastics protective shell 1,3 He of No.1 metal lead wire frame are located at the pin dew of No. two metal lead wire frames 4
Electrostatic protection chip A 5 and electrostatic are welded with by ultrosonic high-temp eutectic on the pad of No. two metal lead wire frames 4
Protect chip B 6；Pass through plain conductor 7 and two at the positive windowing of electrostatic protection chip A 5 on No.1 metal lead wire frame 3
The metal ball 2 welded at the positive windowing of electrostatic protection chip B 6 on number metal lead wire frame 4 is electrically connected；No.1 metal draws
The metal ball 2 welded at the positive windowing of electrostatic protection chip B 6 on wire frame 3 passes through plain conductor 7 and No. two metal lead wires
It is electrically connected at the positive windowing of electrostatic protection chip A 5 on frame 4；Above-mentioned metal ball 2 is that alloy wire is fired, above-mentioned
Plain conductor 7 is alloy wire, and epoxy resin plastics protective shell 1 provides certain support construction and insulating layer, protects its inside
Structure does not receive mechanical damage, influences from environment such as temperature, moisture, pollutants.
Further, the electrostatic protection chip A 5 and No. two metal lead wire frames on the No.1 metal lead wire frame 3
Electrostatic protection chip B 6 or so on 4 is arranged side by side；Electrostatic protection chip B 6 and No. two gold on No.1 metal lead wire frame 3
The electrostatic protection chip A 5 or so belonged on lead frame 4 is arranged side by side.
After adopting the above structure, present embodiment has the beneficial effect that a kind of application described in present embodiment
In the electrostatic protection array chip encapsulating structure of Ethernet interface, electrostatic protection chip A and electrostatic protection chip B is closed into envelope and is arrived
In one miniature epoxy resin plastics protective shell 1, the volume and cost of device are effectively reduced, and ensure that guarantee ether
Data and back-end chip on network interface are from the interference and damage of electrostatic, and safety is higher, and practicability is stronger, the utility model
It is simple with structure, setting rationally, the advantages that low manufacture cost.
The above is merely intended for describing the technical solutions of the present application, but not for limiting the present application, those of ordinary skill in the art couple
The other modifications or equivalent replacement that the technical solution of the utility model is made, without departing from technical solutions of the utility model
Spirit and scope should all cover in the scope of the claims of the utility model.
Claims (3)
1. a kind of electrostatic protection array chip encapsulating structure applied to Ethernet interface, it is characterised in that: it includes asphalt mixtures modified by epoxy resin
Rouge plastic protection casing (1)；No.1 metal lead wire frame (3), No. two metal lead wire frames (4), electrostatic protection chip A(5), electrostatic
Protect chip B(6), plain conductor (7)；No.1 metal lead wire frame (3) and No. two metal lead wire frames (4) are symmetricly set on ring
Oxygen resin and plastic protective shell (1) is internal, and on No.1 metal lead wire frame (3) and the pad of No. two metal lead wire frames (4)
It is welded with electrostatic protection chip A(5) and electrostatic protection chip B(6)；Electrostatic protection on No.1 metal lead wire frame (3)
Chip A(5) pass through plain conductor (7) and the electrostatic protection chip B(6 on No. two metal lead wire frames (4)) be electrically connected；No.1
Electrostatic protection chip B(6 on metal lead wire frame (3)) by plain conductor (7) with it is quiet on No. two metal lead wire frames (4)
Electricity protection chip A(5) it is electrically connected.
2. a kind of electrostatic protection array chip encapsulating structure applied to Ethernet interface according to claim 1, special
Sign is: the electrostatic protection chip B(6) top be welded with metal ball (2), plain conductor (7) and electrostatic protection chip B
(6) one end connected passes through metal ball (2) and electrostatic protection chip B(6) it is electrically connected.
3. a kind of electrostatic protection array chip encapsulating structure applied to Ethernet interface according to claim 1, special
Sign is: the electrostatic protection chip A(5 on the No.1 metal lead wire frame (3)) on No. two metal lead wire frames (4)
Electrostatic protection chip B(6) left and right be arranged side by side；Electrostatic protection chip B(6 on No.1 metal lead wire frame (3)) and No. two gold
Belong to lead frame (4) on electrostatic protection chip A(5) left and right be arranged side by side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920255053.6U CN209544345U (en) | 2019-02-28 | 2019-02-28 | A kind of electrostatic protection array chip encapsulating structure applied to Ethernet interface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920255053.6U CN209544345U (en) | 2019-02-28 | 2019-02-28 | A kind of electrostatic protection array chip encapsulating structure applied to Ethernet interface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209544345U true CN209544345U (en) | 2019-10-25 |
Family
ID=68274380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920255053.6U Active CN209544345U (en) | 2019-02-28 | 2019-02-28 | A kind of electrostatic protection array chip encapsulating structure applied to Ethernet interface |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209544345U (en) |
-
2019
- 2019-02-28 CN CN201920255053.6U patent/CN209544345U/en active Active
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