CN209527048U

CN209527048U - A kind of food processor

Info

Publication number: CN209527048U
Application number: CN201821991583.9U
Authority: CN
Inventors: 王旭宁; 赵山雲; 王毓吉; 黄启浪
Original assignee: Joyoung Co Ltd
Current assignee: Shandong Jiuchuang Home Appliance Co ltd
Priority date: 2018-11-30
Filing date: 2018-11-30
Publication date: 2019-10-22
Anticipated expiration: 2028-11-30

Abstract

The utility model embodiment discloses a kind of food processor, and including the DC power supplier, inverter circuit and load being sequentially connected, the inverter circuit may include: multiple switch device, wherein the multiple switching device grouping is arranged on multiple radiators.By the example scheme, heat dissipation is grouped by the switching device to inverter circuit, the consistency of the temperature correlated characteristic of switching device is ensure that, improves heat dissipation performance, solves the problems, such as that switching device temperature increases in food processor.

Description

A kind of food processor

Technical field

The utility model relates to cooking equipment control technology, espespecially a kind of food processor.

Background technique

Food processor (such as soy bean milk making machine) is all made of brushed DC motor currently on the market, by relay or silicon-controlled control System.

The revolving speed of motor can not be continuously adjusted using relay, silicon-controlled controllability is preferable, can be silicon-controlled by controlling Triggering and conducting angle realize different rotating speeds control, but because it is silicon-controlled is that semiconductor devices has device heating, can It controls silicon fever and generally uses radiator auxiliary heat dissipation.Because electric efficiency and environment space limit, motor temperature rise is often very high, limit The operating time of motor has been made, effects on slurry making and user experience are further influenced.

There are carbon brush life problems, carbon brush to have ground for brushed DC motor, and motor just can not work normally, and therefore, there is brush Direct current generator will affect the complete machine service life of food processor.In addition, the carbon dust that carbon brush abrasion generates can be to the environment of surrounding It has an impact, especially has a great impact to the reliability of wiring board.

Based on problem above, brushed DC motor is substituted using brshless DC motor at present, brshless DC motor can solve Certainly problem above, in addition brshless DC motor there are also noises it is small, high-efficient the advantages that.However, being adopted using brushless dc chance With inverter circuit, can bring another question in this way is exactly the problem of temperature rise of switching device.

Utility model content

The utility model embodiment provides a kind of food processor, can guarantee the one of switching device temperature correlated characteristic Cause property improves heat dissipation performance, solves the problems, such as that switching device temperature increases in food processor.

In order to reach the utility model embodiment purpose, the utility model embodiment provides a kind of food processor, packet The DC power supplier, inverter circuit and load being sequentially connected are included, the inverter circuit may include: multiple switch device, In, the multiple switching device grouping is arranged on multiple radiators.

In the exemplary embodiment of the utility model, the inverter circuit may include: upper bridge arm and lower bridge arm；It is described Multiple switch device includes that the upper bridge arm switching device on the upper bridge arm and the lower bridge arm in the lower bridge arm are opened Close device；The multiple radiator includes: the first radiator and the second radiator；

Wherein, the upper bridge arm switching device is set on first radiator, the lower bridge arm switching device setting In on second radiator.

In the exemplary embodiment of the utility model, the radiator may include for the radiator to be fixed on Radiator leg on printing board PCB；

Main radiation tooth is provided with above the radiator leg；The main radiation tooth and the switching device and the PCB Plate face apart from identical, the main radiation tooth is parallel with the plate face of the PCB.

In the exemplary embodiment of the utility model, it is provided between the radiator leg and the main radiation tooth First auxiliary heat dissipation tooth is provided with the second auxiliary heat dissipation tooth above the main radiation tooth；

Wherein, for the first auxiliary heat dissipation tooth towards the plate face of the PCB, being oriented for the second auxiliary heat dissipation tooth be remote The direction of plate face from the PCB.

In the exemplary embodiment of the utility model, the surface of the radiator is provided with thermal dispersant coatings.

In the exemplary embodiment of the utility model, connected between the switching device and the radiator using screw It connects, is coated with heat-conducting silicone grease on the contact surface of the switching device and the radiator.

In the exemplary embodiment of the utility model, fan is provided with above the radiator.

In the exemplary embodiment of the utility model, when the function of the food processor is in startup stage, institute It is in running order to state fan；When the function is in the cancellation stage, the fan is in halted state.

In the exemplary embodiment of the utility model, the food processor further include: for detecting the radiator Temperature temperature sensor.

In the exemplary embodiment of the utility model, the temperature sensor is set on the main radiation tooth.

The beneficial effect of the utility model embodiment may include:

1, the food processor of the utility model embodiment includes the DC power supplier being sequentially connected, inverter circuit and bears It carries, the inverter circuit may include: multiple switch device, wherein the multiple switching device grouping is arranged in multiple heat dissipations On device.By the example scheme, heat dissipation is grouped by the switching device to inverter circuit, ensure that the temperature of switching device The consistency for spending correlation properties, improves heat dissipation performance, solves the problems, such as that switching device temperature increases in food processor.

2, the inverter circuit of the utility model embodiment may include: upper bridge arm and lower bridge arm；The multiple switch Device includes the upper bridge arm switching device on the upper bridge arm and the lower bridge arm switching device in the lower bridge arm；Institute Stating multiple radiators includes: the first radiator and the second radiator；Wherein, the upper bridge arm switching device is set to described first On radiator, the lower bridge arm switching device is set on second radiator.By the example scheme, according to inversion electricity The commutation characteristic on road, i.e., out of phase upper and lower bridge arm carry out commutation conducting, ensure that multiple (such as 3) switch of individually upper bridge arm The temperature consistency of device or multiple (such as 3) switching devices of individual lower bridge arm, so that the difference derailing switch in commutation The temperature characteristic of part will not generate difference, thereby may be ensured that the stationarity of commutation；In addition, the multiple switch device of upper and lower bridge arm Respectively one group, reduce the pin number of component, is conducive to production and processing, is also beneficial to repair demolition.

3, the radiator of the utility model embodiment may include for the radiator to be fixed on printed circuit Radiator leg on plate PCB；Main radiation tooth is provided with above the radiator leg；The main radiation tooth and the derailing switch Apart from identical, the main radiation tooth is parallel with the plate face of the PCB for part and the plate face of the PCB.By the example scheme, have Conducive to heat flowing.

4, the utility model embodiment is provided with the first auxiliary between the radiator leg and the main radiation tooth and dissipates Hot tooth is provided with the second auxiliary heat dissipation tooth above the main radiation tooth；Wherein, the first auxiliary heat dissipation tooth is described in The plate face of PCB, the direction for being oriented the plate face far from the PCB of the second auxiliary heat dissipation tooth.By the example scheme, On the one hand the first auxiliary heat dissipation tooth, which is arranged, can increase heat dissipation area, on the other hand can reduce contact of the radiator with pcb board Area avoids radiator that heat is directly passed to PCB, and it is excessively high to further cause peripheral devices temperature rise；The second auxiliary of setting Radiation tooth interior in a limited space can open more teeth increase heat dissipation areas.

5, the surface of the radiator of the utility model embodiment is provided with thermal dispersant coatings.By the example scheme, Thermal radiation effect is strengthened, cooling is conducive to.

6, it is connected between the switching device and the radiator of the utility model embodiment using screw, the switch Heat-conducting silicone grease is coated on the contact surface of device and the radiator.By the example scheme, switching device and radiator it Between be connected by screw to and can guarantee to be close to, heat-conducting silicone grease can fill the gap between switching device and radiator, and promotion is led The thermal efficiency.

7, the utility model embodiment is provided with fan above the radiator.Pass through the example scheme, Ke Yitong It crosses convection current to blow out heat except food processor cavity, reduces radiator temperature well.

The other feature and advantage of the utility model embodiment will illustrate in the following description, also, partly from It becomes apparent in specification, or is understood and implementing the utility model.The purpose of the utility model embodiment and its He can be achieved and obtained advantage by structure specifically noted in the specification, claims and drawings.

Detailed description of the invention

Attached drawing is used to provide one for further understanding the utility model embodiment technical solution, and constituting specification Part, is used to explain the technical solution of the utility model embodiment together with embodiments herein, does not constitute practical to this The limitation of new embodiment technical solution.

Fig. 1 is a kind of structural schematic diagram of the food processor of the utility model embodiment；

Fig. 2 is a kind of structural schematic diagram of the inverter circuit of the utility model embodiment；

Fig. 3 is the upper bridge arm semiconductor switch device and lower bridge arm semiconductor switching device in the inverter circuit of Fig. 2 embodiment Part is respectively arranged at the structural schematic diagram on two radiators；

Fig. 4 is the heat spreader structures schematic diagram of the utility model embodiment；

Fig. 5 is the fixed form schematic diagram of the switching device of the utility model embodiment on a heat sink；

Fig. 6 is the radiator of the utility model embodiment and the positional diagram of fan.

Specific embodiment

For the objectives, technical solutions, and advantages of the embodiments of the present invention are more clearly understood, below in conjunction with attached The embodiments of the present invention are described in detail in figure.It should be noted that in the absence of conflict, the reality in the application The feature applied in example and embodiment can mutual any combination.

Embodiment one

The utility model embodiment provides a kind of food processor, may include the DC power supplier X being sequentially connected, Inverter circuit Y and load Z, as shown in Figure 1, the inverter circuit Y may include: multiple switch device 1, wherein the multiple The grouping of switching device 1 is arranged on multiple radiators 2.

In the exemplary embodiment of the utility model, switching device 1-1,1-2,1-3,1-4,1-5,1-6 as shown in figure 1 And shown in radiator 2-M, 2-N, wherein 1-1,1-2,1-3 points are one group, are set on 2-M, and 1-4,1-5,1-6 points are one group, It is set on 2-N.

In the exemplary embodiment of the utility model, each of whole switching devices 1 switching device 1 can be distinguished It is arranged on a radiator 2, or the multiple switch device 1 (for example, 2,3 etc.) in whole switching devices 1 is used as one Group, each group is separately positioned on a radiator 2.

In the exemplary embodiment of the utility model, which can be half-bridge inversion circuit, or complete Bridge inverter circuit, herein with no restrictions for the specific structure of inverter circuit.

In the exemplary embodiment of the utility model, for the switching device 1 in inverter circuit specific number not yet It is limited, for example, may include 2,4,6 etc..

In the exemplary embodiment of the utility model, the type of the switching device is also not particularly limited, for example, The switching device can be semiconductor switch device.

In the exemplary embodiment of the utility model, which can be insulated gate bipolar transistor IGBT or Metal-Oxide Semiconductor field effect transistor M OSFET.

In the exemplary embodiment of the utility model, by the example scheme, by the derailing switch for giving inverter circuit Part is grouped heat dissipation, ensure that the consistency of the temperature correlated characteristic of switching device, improves heat dissipation performance, solves food The problem of switching device temperature increases in processing machine.

Embodiment two

The embodiment on the basis of example 1, gives a kind of specific embodiment of inverter circuit.

In the exemplary embodiment of the utility model, led as shown in Fig. 2, above-mentioned inverter circuit can be by 6 half The full bridge inverter of body switching device composition.Wherein, the upper bridge arm of inverter can be by the first semiconductor switch device D1, Two semiconductor switch device D2, third semiconductor switch device D3 composition, the lower bridge arm of inverter can be opened by the 4th semiconductor Close device D4, the 5th semiconductor switch device D5, the 6th semiconductor switch device D6 composition.

In the exemplary embodiment of the utility model, the first semiconductor switch device D1, the second semiconductor switch device D2, third semiconductor switch device D3 collector (or drain electrode) be connected after be connected with the positive VDC of DC power supply；

The base stage of 4th semiconductor switch device D4, the 5th semiconductor switch device D5, the 6th semiconductor switch device D6 (or source electrode) is grounded GND after being connected；

The base stage of first semiconductor switch device D1, the second semiconductor switch device D2, third semiconductor switch device D3 (or source electrode) respectively with the 4th semiconductor switch device D4, the 5th semiconductor switch device D5, the 6th semiconductor switch device D6 Collector (or drain electrode) be connected, and output end of each connecting pin as inverter circuit.

In the exemplary embodiment of the utility model, D1-D6 can be IGBT or MOSFET, and load can be motor Motor can choose IGBT, current parameters can as brshless DC motor output power≤350W that inverter circuit is controlled To select 15A, encapsulation can choose TO-220F.

In the exemplary embodiment of the utility model, MOSFET has its thermal losses of fixed conduction impedance P=I²R, and IGBT has fixed conduction voltage drop, thermal losses P=UI, according to the motor load and work of food processor in this embodiment scheme Make situation, IGBT temperature rise model is better than MOSFET.

In the exemplary embodiment of the utility model, IGBT MOSFET generic encapsulation includes TO-220AB and TO- 220F, TO-220AB are naked envelope (i.e. main part has exposed metal/bare metal, can be connected with radiator), and TO-220F is plastic packaging.Naked envelope benefit In heat dissipation, it is suitable for single tube and uses, pass through radiator between these pipes in use, will lead to when multiple semiconductor switch devices To cause short circuit, general solution is to increase a heat-conducting insulated film between pipe and radiator for conducting, increases institute It will cause thermal conductivity variation after stating heat-conducting insulated film, and to the reliability requirement of heat-conducting insulated film height, increase assembly difficulty Also increase cost, it is important to which reliability reduces.

Embodiment three

It is real to give specific setting of the switching device 1 on radiator 2 on the basis of embodiment one or two for the embodiment Apply a scheme.

In the exemplary embodiment of the utility model, as shown in figure 3, the inverter circuit in such as above-described embodiment two, Semiconductor switch device on upper bridge arm: the first semiconductor switch device D1, the second semiconductor switch device D2, third semiconductor Switching device D3 can be one group, be set on the same radiator, for example, being set on the first radiator 21；In lower bridge arm Semiconductor switch device: the 4th semiconductor switch device D4, the 5th semiconductor switch device D5, the 6th semiconductor switch device D6 can be one group, be set on the same radiator, for example, being set on the second radiator 22.

In the exemplary embodiment of the utility model, described upper bridge arm semiconductor switch device D1, D2, the D3 and first Radiator 21 can be set with described lower bridge arm semiconductor switch device D4, D5, D6 and the second radiator 22 using identical PCB encapsulation Meter.

In the exemplary embodiment of the utility model, 6 semiconductor switch devices can also be fixed on the same heat dissipation On device, it can guarantee that the relevant characteristic of device temperature is consistent in this way, but 6 semiconductor switch devices are assemblied in a radiator On be unfavorable for producing and processing because 3 feet of each device totally 18 feet, are that device beforehand is first mounted on heat dissipation under normal circumstances On device, it is then inserted into PCB, excessive pin leads to have slight pin offset to be difficult to insertion PCB, so from production efficiency Angle considers that the technical solution is improper；In addition it is difficult to dismantle after welding, it is also improper from maintenance angle.

In the exemplary embodiment of the utility model, according to the commutation characteristic of inverter circuit, i.e., out of phase bridge up and down Arm carries out commutation conducting, can guarantee that individually 3 devices of upper bridge arm or three device temperatures of individual lower bridge arm are consistent, that In commutation, the temperature characteristic of different components would not generate difference, therefore can guarantee the stationarity of commutation；In addition, 3 In addition one group of the device pin number for reducing component is also beneficial to repair demolition conducive to production and processing.

Example IV

The embodiment is on the basis of above-mentioned any embodiment, as shown in figure 4, giving by designing reasonable radiator Tooth punching direction forms convection current air duct, reinforces the example scheme of heat loss through convection.

In the exemplary embodiment of the utility model, 2-1 is radiator leg in Fig. 4, and 2-2 is auxiliary radiation tooth, Middle A is the first auxiliary heat dissipation tooth, and B is the second auxiliary heat dissipation tooth, and 2-3 is main radiation tooth, and 2-4 is the spiral shell for fixing switching device Nail hole.

In the exemplary embodiment of the utility model, the radiator with the main heat dissipation on 1 contour plane of switching device The tooth punching direction of tooth 2-3 is parallel with pcb board face, and auxiliary heat dissipation tooth is vertical with pcb board face.

In the exemplary embodiment of the utility model, the radiator 2 may include for the radiator 2 is fixed In the radiator leg 2-1 on printing board PCB；

Main radiation tooth 2-3 is provided with above the radiator leg 2-1；The main radiation tooth 2-3 and the switching device 1 With the plate face of the PCB apart from identical, i.e., the described main radiation tooth 2-3 and the switching device 1 and the plate face of the PCB are contour, The main radiation tooth 2-3 is parallel with the plate face of the PCB.

In the exemplary embodiment of the utility model, the radiator leg 2-1 is inserted into pcb board hole, hangs down with pcb board face Directly, effect is to solve the problems, such as to be easy to cause Pad off since radiator is overweight when complete machine is fallen for fixed heat sink.

In the exemplary embodiment of the utility model, the main radiation tooth 2-3 is parallel with pcb board face, because at this with open Device 1 is closed apart from nearest, space layout is conducive to heat flowing when being parallel to pcb board face.

In the exemplary embodiment of the utility model, between the radiator leg 2-1 and the main radiation tooth 2-3 The first auxiliary heat dissipation tooth A can be set, the second auxiliary heat dissipation tooth B is provided with above the main radiation tooth 2-3；

Wherein, the first auxiliary heat dissipation tooth A can be towards the plate face of the PCB, the court of the second auxiliary heat dissipation tooth B To the direction that can be the plate face far from the PCB.

In the exemplary embodiment of the utility model, on the one hand the first auxiliary heat dissipation tooth A can increase towards pcb board face Add heat dissipation area, on the other hand can reduce the contact area of radiator and pcb board, radiator is avoided to be directly passed to heat PCB is excessively high to further cause peripheral devices temperature rise.

In the exemplary embodiment of the utility model, the second auxiliary heat dissipation tooth B interior in a limited space can be opened more Tooth, to increase heat dissipation area.

In the exemplary embodiment of the utility model, auxiliary heat dissipation tooth 2-2 and main radiation tooth 2-3 can carry out tongue and groove Processing, to increase heat dissipation area.

In the exemplary embodiment of the utility model, the thickness W1 of auxiliary heat dissipation tooth 2-2 and main radiation tooth 2-3 thinnest part Can satisfy: W1 >=1mm, the tongue and groove can satisfy in the size W2 of thickness direction: W2 >=0.1mm, such as 0.2mm, Tooth, which extends reversed size W3, can satisfy: W3 >=0.4mm, such as 0.5mm.The tooth of auxiliary heat dissipation tooth 2-2 and main radiation tooth 2-3 Spacing W4 between tooth can satisfy: W4 >=1.5mm.

In the exemplary embodiment of the utility model, different tooth punching directions is conducive to various dimensions pair in a limited space Flow heat dissipation；Device stress can be led to avoid radiator is overweight by increasing leg to radiator, further result in asking for pad desoldering Topic；Radiator will guarantee the thickness of radiation tooth, can effectively transmit heat, and the spacing between tooth and tooth closely will lead to pair excessively Flow the bad influence heat dissipation of effect；Radiator surface area is bigger, and the area contacted with air is bigger, and heat dissipation effect is better, this programme The tongue and groove of design can increase surface area.

Embodiment five

The embodiment gives on the basis of above-mentioned any embodiment by the way that material figure layer is arranged on 2 surface of radiator, Reinforce radiation effect, in favor of the example scheme of cooling.

In the exemplary embodiment of the utility model, the surface of the radiator 2 is provided with thermal dispersant coatings.

In the exemplary embodiment of the utility model, black oxygen polarization process can be carried out on the surface of radiator 2, received Rice coating treatment or setting graphene figure layer.

In the exemplary embodiment of the utility model, black is conducive to heat radiation, therefore spreader surface can be arranged At black.

In the exemplary embodiment of the utility model, no matter which kind of coating, can be to radiator body (generally aluminium Alloy) surface have protective action, also function to certain insulating effect.

Embodiment six

The embodiment gives the fixed form embodiment of switching device 1 on the basis of above-mentioned any embodiment.

In the exemplary embodiment of the utility model, connected between the switching device 1 and the radiator 2 using screw It connects, is coated with heat-conducting silicone grease on the contact surface of the switching device and the radiator.

In the exemplary embodiment of the utility model, as shown in figure 5, the switching device 1 and radiator 2 pass through screw Heat-conducting silicone grease can be evenly coated on 3 connections, switching device 1 and 2 contact surface of radiator.

It, can by the connection of screw 3 between switching device 1 and radiator 2 in the exemplary embodiment of the utility model To guarantee to be close to, but since contact surface planarization not can guarantee, contact surface still has gap, and air is that the bad of heat is led Body, therefore, heat-conducting silicone grease can fill gap and promote heat transfer efficiency.

Embodiment seven

The embodiment gives the implementation that fan is arranged above the radiator on the basis of above-mentioned any embodiment Example.

In the exemplary embodiment of the utility model, fan 4 is provided with above the radiator 2.

In the exemplary embodiment of the utility model, setting fan Hot-air fan 4 is used for auxiliary heat dissipation above radiator 2, The heat of switching device is taken away by convection type.

In the exemplary embodiment of the utility model, as shown in fig. 6, the fan 4 is located at right above radiator 2, it can Apart from radiator 5-15mm.

In the exemplary embodiment of the utility model, 4 rotary wind of fan is supported or opposed discrete heat device, thus by radiator 2 Heat siphons away.

In the exemplary embodiment of the utility model, in relatively closed space, if without cross-ventilation, even if The size of radiator is very big, and temperature can also continue to rise after motor continues working a period of time, therefore be blown heat by convection current Out except food processor cavity, it can be very good to reduce radiator temperature.

In the exemplary embodiment of the utility model, cross-ventilation can also be formed by blowing against radiator, but be blown away Heat there is no directionality, seldom a part can be blown out except cavity, and the device temperature that will lead to around radiator 2 is very high, The reliability for reducing product solves the problems, such as this by increasing fan, can effectively take away heat, reduce derailing switch Temperature around part.

In the exemplary embodiment of the utility model, startup function rear fan is started to work, slurrying completion or function Fan can stop working when cancellation.

In the exemplary embodiment of the utility model,

In the exemplary embodiment of the utility model, works always after startup function and is conducive to the heat dissipation of radiator, And be conducive to the reduction of food processor internal temperature, slurrying completion or function stop working when cancelling, can avoid to It works when machine, thus the problem for avoiding stand-by power consumption higher.

Embodiment eight

The embodiment gives and temperature detecting point is arranged on radiator 2, be used on the basis of above-mentioned any embodiment The example scheme of switching device overheat protector.

In the exemplary embodiment of the utility model, the food processor can also include: for detecting described dissipate The temperature sensor of the temperature of hot device.

In the exemplary embodiment of the utility model, temperature sensor can be fixed on described dissipate by epoxy resin On the main radiation tooth 2-3 of hot device 2.

In the exemplary embodiment of the utility model, the temperature signal that can be will test inputs brushless electric machine control panel MCU (main control unit) in, to carry out real-time judge to the temperature of switching device by MCU, it is more than default for preventing switching device Highest protect temperature Tmax.

In the exemplary embodiment of the utility model, highest can be arranged according to the junction temperature of switching device and protect temperature Tmax, when the junction temperature of switching device is 150 DEG C, Tmax range can satisfy 115 DEG C -125 DEG C, for example, can choose 120 ℃。

In the exemplary embodiment of the utility model, when the temperature of radiator reaches the highest protection temperature Tmax When, it can control brushless motor and stop working, irrecoverable work before power-off restoration.

In the exemplary embodiment of the utility model, temperature signal can be passed to food processor by brushless control panel Main control MCU, main control MCU according to temperature rise situation carry out program adjustment.

In the exemplary embodiment of the utility model, temperature adjustment may include:

Radiator temperature is detected when powering on, when temperature reaches T1 temperature spot, beating interstice total waiting time can increase T1 (T1 range is 65 DEG C -70 DEG C, and t1 range is -6 minutes 1 minute)；

, can be with real-time detection radiator temperature in the motor course of work, (the T2 temperature spot model when temperature reaches T2 temperature spot Enclose and can satisfy 100 DEG C -110 DEG C), stop motor work, and (T3 temperature spot model when waiting temperature is reduced to T3 temperature spot immediately Enclose and can satisfy 85 DEG C -90 DEG C), food processor restore slurrying process, repeated the above process when reaching T2 temperature again until Food processing is completed.

In the exemplary embodiment of the utility model, increase fan for radiator cooling get up very big effect, Radiator natural heat dissipation is only leaned on not can guarantee conductor temperature in continuous slurrying when fan no longer works for some reason not exceeded；It adopts Closed-loop control may be implemented with thermometric, avoid heat dissipation related accessory damage temperature exceeding standard damage.

In the exemplary embodiment of the utility model, brushless motor is controlled by brushless control panel, operating and stopping It is controlled by food processor main control MCU, is communicated between brushless control panel and food processor master control borad.In order to avoid in electricity Communication failure leads to excess temperature when machine works, and a upscale protection temperature value can be set in brushless control panel, when brushless control panel is examined When testing temperature reaches the temperature spot, motor can be stopped and work and report failure, and power-off restoration is not irrecoverable for the failure.Separately Outside, it in order to guarantee to complete food processing in the case that user will not both burn out device in the case where fan damage, needs in real time Temperature is detected, food processing stream is adjusted according to the situation of change of temperature in real time, reduces temperature by extending waiting time.

The beneficial effect of the utility model embodiment may include:

It will appreciated by the skilled person that whole or certain steps, system, dress in method disclosed hereinabove Functional module/unit in setting may be implemented as software, firmware, hardware and its combination appropriate.In hardware embodiment, Division between the functional module/unit referred in the above description not necessarily corresponds to the division of physical assemblies；For example, one Physical assemblies can have multiple functions or a function or step and can be executed by several physical assemblies cooperations.Certain groups Part or all components may be implemented as by processor, such as the software that digital signal processor or microprocessor execute, or by It is embodied as hardware, or is implemented as integrated circuit, such as specific integrated circuit.Such software can be distributed in computer-readable On medium, computer-readable medium may include computer storage medium (or non-transitory medium) and communication media (or temporarily Property medium).As known to a person of ordinary skill in the art, term computer storage medium is included in for storing information (such as Computer readable instructions, data structure, program module or other data) any method or technique in the volatibility implemented and non- Volatibility, removable and nonremovable medium.Computer storage medium include but is not limited to RAM, ROM, EEPROM, flash memory or its His memory technology, CD-ROM, digital versatile disc (DVD) or other optical disc storages, magnetic holder, tape, disk storage or other Magnetic memory apparatus or any other medium that can be used for storing desired information and can be accessed by a computer.This Outside, known to a person of ordinary skill in the art to be, communication media generally comprises computer readable instructions, data structure, program mould Other data in the modulated data signal of block or such as carrier wave or other transmission mechanisms etc, and may include any information Delivery media.

Claims

1. a kind of food processor, including the DC power supplier, inverter circuit and load being sequentially connected, which is characterized in that institute Stating inverter circuit includes: multiple switch device, wherein the multiple switching device grouping is arranged on multiple radiators.

2. food processor according to claim 1, which is characterized in that the inverter circuit includes: upper bridge arm and lower bridge Arm；The multiple switching device include upper bridge arm switching device on the upper bridge arm and in the lower bridge arm under Bridge arm switching device；The multiple radiator includes: the first radiator and the second radiator；

Wherein, the upper bridge arm switching device is set on first radiator, and the lower bridge arm switching device is set to institute It states on the second radiator.

3. food processor according to claim 1, which is characterized in that the radiator includes for by the radiator The radiator leg being fixed on printing board PCB；

Main radiation tooth is provided with above the radiator leg；The plate of the main radiation tooth and the switching device and the PCB For identity distance from identical, the main radiation tooth is parallel with the plate face of the PCB.

4. food processor according to claim 3, which is characterized in that in the radiator leg and the main radiation tooth Between be provided with the first auxiliary heat dissipation tooth, the second auxiliary heat dissipation tooth is provided with above the main radiation tooth；

Wherein, towards the plate face of the PCB, the second auxiliary heat dissipation tooth is oriented far from institute the first auxiliary heat dissipation tooth State the direction of the plate face of PCB.

5. food processor according to any one of claims 1-4, which is characterized in that the surface of the radiator is arranged There are thermal dispersant coatings.

6. food processor according to any one of claims 1-4, which is characterized in that the switching device is dissipated with described It is connected between hot device using screw, is coated with heat-conducting silicone grease on the contact surface of the switching device and the radiator.

7. food processor according to any one of claims 1-4, which is characterized in that be arranged above the radiator There is fan.

8. food processor according to claim 7, which is characterized in that be in starting in the function of the food processor When the stage, the fan is in running order；When the function is in the cancellation stage, the fan is in halted state.

9. food processor according to claim 3, which is characterized in that the food processor further include: for detecting The temperature sensor of the temperature of the radiator.

10. food processor according to claim 9, which is characterized in that the temperature sensor is set to the master and dissipates On hot tooth.