CN209514285U - Radiator and projector - Google Patents
Radiator and projector Download PDFInfo
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- CN209514285U CN209514285U CN201920401836.0U CN201920401836U CN209514285U CN 209514285 U CN209514285 U CN 209514285U CN 201920401836 U CN201920401836 U CN 201920401836U CN 209514285 U CN209514285 U CN 209514285U
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- heat
- pipeline section
- radiator
- accommodating cavity
- cryogenic fluid
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Abstract
The utility model provides a kind of radiator and projector, radiator includes heat exchange mechanism and airflow circulating mechanism, heat exchange mechanism includes cooling line, cooler and the cryogenic fluid being placed in cooling line, cooling line includes end to end heat absorption pipeline section and heat dissipation pipeline section, absorbing pipe section is located at accommodating cavity, heat-dissipating pipe section is located at electronic device exterior, cryogenic fluid can be in cooling line internal circulation flow, and circuit sequentially and flow through heat absorption pipeline section and heat dissipation pipeline section, cooler cools down cryogenic fluid at heat dissipation pipeline section；Airflow circulating mechanism, for making accommodating cavity form circulating current, circulating current flows through heat absorption pipeline section.The radiator of the utility model realizes internal heat exchanging process by external heat exchanging process, not needing the blowing to the inside of accommodating cavity can be realized the cooling of electronic component, it avoids dust or aqueous vapor from entering electronic equipment, just greatly extends the service life of electronic equipment in this way.
Description
Technical field
The utility model belongs to projector's technical field more particularly to a kind of radiator and projector.
Background technique
The mainstream of projector is all using solid state light emitter at present, and the color of solid state light emitter tool service life length, environmental protection and light is more
The advantages such as bright-coloured, but solid state light emitter is very high to cooling requirements, and radiator is needed to take away the heat of generation.
A large amount of cold air is sucked from outside when existing projector works, cooling air inside projector by becoming
Outside hot-air discharge machine, and the heat that projector generates is taken away.
But projector can bring moisture content or dust into when sucking cold air, moisture content causes projector's internal electron first
Part damage, although projector is generally provided with Air Filter, Air Filter cannot all stop dust, and dust can drop significantly
The service life of low projector can also pollute camera lens, cause optical frame bad, and dust is adhered to electronical elements surface, also can
Electronic element radiating is influenced, and then electronic component is caused to cross cause thermal damage.
Utility model content
The purpose of this utility model is to provide a kind of radiator and projectors, it is intended to solve existing projector and dissipate
Easily to the technical issues of sucking dust or moisture content inside projector in thermal process.
The utility model is realized in this way a kind of radiator, radiates for electronic device, the electronic equipment packet
Include the shell with accommodating cavity and the electronic component positioned at the accommodating cavity, comprising:
Heat exchange mechanism, it is described including cooling line, cooler and the cryogenic fluid being placed in the cooling line
Cooling line includes end to end heat absorption pipeline section and heat dissipation pipeline section, and the absorbing pipe section is located at the accommodating cavity, the heat dissipation
Pipeline section is located at the electronic device exterior, and the cryogenic fluid can be in the cooling line internal circulation flow, and circuits sequentially
The heat absorption pipeline section and the heat dissipation pipeline section are flowed through, the cooler carries out the cryogenic fluid at the heat dissipation pipeline section cold
But；
Airflow circulating mechanism, for making the accommodating cavity form circulating current, the circulating current flows through the absorbing pipe
Section.
Further, the cooler is included at least for compressing cryogenic fluid so that the cryogenic fluid cooling
Compressor and for be the compressor cooling fan.
Further, the heat exchange mechanism further includes being connected to the heat absorption pipeline section and for increasing the absorbing pipe
The heat absorption component of endotherm area.
Further, the heat absorption component includes the heat absorbing sheet of multiple interval settings and array arrangement.
Further, the cooling line is arranged in the heat absorbing sheet.
Further, the cooling line is arranged in the electronic component.
Further, the airflow circulating mechanism includes at least blowing part, and the blowing part is used for the heat absorption pipeline section
Cooling air is blown to the electronic component.
Further, the airflow circulating mechanism further includes being connected to the blowing part and for conveying the blowing part
Wind guide to the wind channel tube of the electronic component, the wind channel tube has towards the air inlet of the blowing part and towards institute
State the air outlet of electronic component.
The utility model also provides a kind of radiator, radiates for electronic device, and the electronic equipment has accommodating
Chamber, comprising:
Heat exchange mechanism, including being located at the accommodating cavity and can be in heat-absorbing structure that the accommodating cavity absorbs heat, position
In the electronic device exterior and the radiator structure that can radiate in the electronic device exterior；
Airflow circulating mechanism, for making the accommodating cavity form circulating current, the circulating current flows through the heat absorption knot
Structure.
The utility model also provides a kind of projector, including the shell with accommodating cavity, the electricity in the accommodating cavity
Subcomponent and radiator as described above.
The radiator for having the technical effect that the utility model of the utility model compared with the existing technology by cooler with
Cryogenic fluid carries out heat exchange, and with the cryogenic fluid in the circulating cooling cooling line, cryogenic fluid is flowing through cooling line
Absorb heat pipeline section when the heat that absorbs in accommodating cavity become high-temperature refrigeration fluid, high-temperature refrigeration fluid when flowing through heat dissipation pipeline section again
Heat exchange is carried out with cooler and is cooled off, and forms external heat exchange circulation process, the utility model is also followed by air-flow
Ring mechanism forms circulating current in accommodating cavity, so that hot-air flows through heat absorption pipeline section constantly to carry out heat with cryogenic fluid
Exchange become cold air, cold air flows to electronic component under the action of circulating current so that electronic component be able to radiate it is cold
But, this just forms internal heat exchange process, and the utility model realizes internal heat exchange by external heat exchanging process
Journey, not needing the blowing to the inside of accommodating cavity can be realized the cooling of electronic component, and dust or aqueous vapor is avoided to enter electronic equipment, this
Sample just greatly extends the service life of electronic equipment.Cooler is located at electronic device exterior, and electronic equipment can be at closed
State, therefore reduce its noise at work.
Detailed description of the invention
In order to illustrate more clearly of the technical solution of the utility model embodiment, below will to the utility model embodiment or
Attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, drawings described below is only
Some embodiments of the utility model, for those of ordinary skill in the art, without creative efforts,
It is also possible to obtain other drawings based on these drawings.
Fig. 1 is the schematic perspective view of projector provided by the embodiment of the utility model；
Fig. 2 is the schematic perspective view of radiator provided by the embodiment of the utility model；
Fig. 3 is the partial exploded view of projector provided by the embodiment of the utility model；
Fig. 4 is the explosive view of air cooling mechanism provided by the embodiment of the utility model.
Description of symbols:
10, electronic equipment；101, accommodating cavity；11, shell；12, electronic component；20, heat exchange mechanism；21, cooler；
211, compressor；212, fan；22, cooling line；221, absorb heat pipeline section；222, radiate pipeline section；23, absorb heat component；231, it inhales
Backing；31, heat absorbing sheet；30, airflow circulating mechanism；31, blowing part；32, wind channel tube；321, upper cover plate；322, lower cover plate
Specific embodiment
The embodiments of the present invention are described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, it is intended to for explaining the utility model, and should not be understood as to the utility model
Limitation.
In the description of the present invention, it should be understood that the orientation or positional relationship of the instructions such as term "inner", "outside"
To be based on the orientation or positional relationship shown in the drawings, it is merely for convenience of describing the present invention and simplifying the description, without referring to
Show or imply that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore cannot manage
Solution is limitations of the present invention.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " Gu
It is fixed " etc. terms shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；It can be
Mechanical connection, is also possible to be electrically connected；It can be directly connected, two can also be can be indirectly connected through an intermediary
The interaction relationship of connection or two elements inside element.It for the ordinary skill in the art, can basis
Concrete condition understands the concrete meaning of above-mentioned term in the present invention.
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.
Embodiment one
Fig. 1 to Fig. 4 is please referred to, the utility model embodiment provides a kind of radiator, it radiates for electronic device 10,
Electronic equipment 10 includes the shell 11 with accommodating cavity 101 and the electronic component 12 positioned at accommodating cavity 101.Electronic equipment 10 can be with
For the equipment generated heat after projector or other energizations.
Fig. 1 to Fig. 2 is please referred to, radiator includes heat exchange mechanism 20 and airflow circulating mechanism 30, wherein heat exchanger
Structure 20 includes cooling line 22, cooler 21 and the cryogenic fluid being placed in cooling line 22, and cooling line 22 includes head
The connected heat absorption pipeline section 221 of tail and heat dissipation pipeline section 222, heat absorption pipeline section 221 are located at accommodating cavity 101, and heat dissipation pipeline section 222 is located at electronics
Outside equipment 10, cryogenic fluid can be in 22 internal circulation flow of cooling line, and circuits sequentially and flow through heat absorption pipeline section 221 and heat dissipation
Pipeline section 222, cooler 21 cool down cryogenic fluid at heat dissipation pipeline section 222.Cooling line 22 can also include being located to inhale
Connecting pipe between hot pipe section 221 and heat dissipation pipeline section 222, cryogenic fluid do not absorb heat in connection pipeline section and do not radiate yet, Yi Mianzao
At energy loss or scald user of service.Wherein, cryogenic fluid can by phase-state change realize heat absorption and radiation processes and
Fluid mobilization dynamic.
For making accommodating cavity 101 form circulating current, circulating current flows through heat absorption pipeline section 221 for airflow circulating mechanism 30.
General high-end projector involves great expense, to operating environment requirements height, if the dust in use environment is excessive
Or air temperature is too high can all influence the service life of projector, the utility model such as projector of electronic equipment 10 can be arranged
For sealing structure, completely cut off completely with external environment, the radiator of the utility model is carried out by cooler 21 and cryogenic fluid
Heat exchange, with the cryogenic fluid in the circulating cooling cooling line 22, cryogenic fluid is in the heat absorption pipeline section for flowing through cooling line 22
The heat absorbed in accommodating cavity 101 when 221 becomes high-temperature refrigeration fluid, high-temperature refrigeration fluid when flowing through heat dissipation pipeline section 222 again
It is secondary to carry out heat exchange with cooler 21 and cool off, external heat exchange circulation process is formd, the utility model also passes through gas
Stream circulation mechanism 30 circulating current is formed in accommodating cavity so that hot-air constantly flow through heat absorption pipeline section 221 with refrigeration stream
Body, which carries out heat exchange, becomes cold air, and cold air flows to electronic component under the action of circulating current, so that electronic component
It is able to cooling, this just forms internal heat exchange process, and the utility model realizes inside by external heat exchanging process
Heat exchanging process, not needing to the inside of accommodating cavity 101 blowing can be realized the cooling of electronic component, avoid dust or aqueous vapor into
Enter electronic equipment, just greatly extends the service life of electronic equipment 10 in this way.Cooler 21 is located at outside electronic equipment 10,
Electronic equipment 10 can be at closed state, therefore reduce its noise at work.
Fig. 1 to Fig. 2 is please referred to, further, cooler 21 includes for compressing cryogenic fluid so that cryogenic fluid dissipates
The compressor 211 and be used to be 211 cooling fan 212 of compressor that heat cools down.Cryogenic fluid is absorbed in heat absorption pipeline section 221
Gas can be become from liquid after heat in accommodating cavity 101, in heat dissipation pipeline section 222 from becoming liquid from gaseous state after compressor compresses
State simultaneously radiates, and the heat that wherein cryogenic fluid is generated by phase-state change drains into atmosphere by fan 212 again, realizes heat exchange mechanism
20 with the heat exchange of 10 internal heat of electronic equipment.
Referring to figure 2., further, heat exchange mechanism 20 further includes being connected to heat absorption pipeline section 221 and for increasing refrigeration
Heat absorption component 23 of the fluid in the endotherm area of heat absorption pipeline section 221.Heat absorption component 23 increases cryogenic fluid in heat absorption pipeline section 221
Endotherm area, improve the cooling efficiency to air in accommodating cavity 101.
Referring to figure 4., specifically, heat absorption component 23 includes the heat absorbing sheet 31 of multiple interval settings and array arrangement, heat absorption
Piece 231 increases the cooling pipeline section of cooling line 22 and the contact area of air, also just increases endotherm area, helps to freeze
Fluid absorbs the heat in air.Wherein, cooling line 22 is arranged in heat absorbing sheet 231, so that the heat of heat absorbing sheet 231 is inhaled
Backing 231 absorbs, and heat absorbing sheet cools off.Preferably, cooling line 22 is back and forth arranged in heat absorbing sheet 231, to increase refrigeration stream
Body is to the cooling number of monolithic heat absorbing sheet 231, so that each region heat dissipation of each heat absorbing sheet 231 is uniform.
Referring to figure 2. to Fig. 4, it is preferable that cooling line 22 is arranged in electronic component 12, directly to absorb electronic component 12
Heat, improve electronic component 12 radiating efficiency.In projector, the temperature change of solid state light emitter on its performance influence compared with
Greatly, therefore concentration heat dissipation need to be carried out for solid state light emitter, the heat absorption pipeline section 221 of cooling line 22 is directly arranged in and is wherein made
Cryogenic fluid can carry out fast cooling to it, guarantee the normal work of projector.
Referring to figure 3. to Fig. 4, further, airflow circulating mechanism 30 includes at least blowing part 31, and blowing part 31 is used for will
The cooling air of heat absorption pipeline section 221 is blown to electronic component 12.Blowing part 31 makes the air in accommodating cavity 101 flow to be formed
Internal circulating current constantly flows to electronic component 12, accommodating cavity by the cooling cold air of the cryogenic fluid of heat absorption pipeline section 221
Hot-air in 101 flows to heat absorption pipeline section 221 also with circulating current, forms the heat exchanging process inside accommodating cavity 101.It is excellent
Selection of land, blowing part 31 be equipped with it is multiple so that carrying out airflow circulating in accommodating cavity 101 comprehensively, cold air is able to uniform and comprehensive
Output.In the utility model embodiment, blowing part 31 is blower and there are two setting.
Referring to figure 3. to Fig. 4, further, airflow circulating mechanism 30 further includes being connected to blowing part 31 and for that will blow
The wind that wind part 31 conveys is guided to the wind channel tube 32 of electronic component 12, wind channel tube 32 have towards blowing part 31 air inlet and
Towards the air outlet of electronic component 12.Wind channel tube 32 plays guiding role, enables cold air accurately to electronic component
12 are cooled down.Wherein, wind channel tube 32 includes upper cover plate 321 and the lower cover plate 322 with the lid conjunction of upper cover plate 321.
Embodiment two
The utility model embodiment also provides a kind of radiator, radiates for electronic device 10, and electronic equipment 10 has
There is accommodating cavity 101, radiator includes heat exchange mechanism 20 and airflow circulating mechanism 30.
Wherein, heat exchange mechanism 20 includes the heat-absorbing structure that is located at accommodating cavity 101 and can absorb heat in accommodating cavity 101
And positioned at radiator structure electronic equipment 10 outside and can radiated outside electronic equipment 10；
For making accommodating cavity form circulating current, circulating current flows through heat-absorbing structure for airflow circulating mechanism 30.
Radiator provided by the embodiment of the utility model absorbs the heat inside accommodating cavity 101 by heat-absorbing structure, and
Radiator structure is transferred heat to, radiator structure radiates outside electronic equipment 10, completes heat exchange mechanism 30 and electricity
The heat exchanging process of sub- equipment 10, airflow circulating mechanism 30 form circulating current in accommodating cavity 101, so that hot-air and suction
Heat structure, which carries out heat exchange, becomes cold air, and cold air flows to electronic component under the action of circulating current, so that electronics
Element is able to cooling, this just forms the heat exchanging process of circulating current in heat-absorbing structure and accommodating cavity 101, this is practical new
Type realizes circulating current in heat-absorbing structure and accommodating cavity 101 by the heat exchanging process of heat exchange mechanism 20 and electronic equipment 10
Heat exchanging process, not needing to the inside of accommodating cavity 101 blowing can be realized the cooling of electronic component, avoid dust or aqueous vapor into
Enter electronic equipment 10, just greatly extends the service life of electronic equipment 10 in this way.
The utility model embodiment also provides a kind of projector, including with accommodating cavity 101 shell 11, be located at accommodating cavity
The radiator that electronic component 12 and each embodiment as above in 101 provide.In the radiator and the various embodiments described above
Radiator structure feature having the same, and role is identical, does not repeat herein.
The above is only the preferred embodiments of the present utility model only, is not intended to limit the utility model, all practical at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the guarantor of the utility model within novel spirit and principle
Within the scope of shield.
Claims (10)
1. a kind of radiator radiates for electronic device, the electronic equipment includes having the shell of accommodating cavity and being located at
The electronic component of the accommodating cavity characterized by comprising
Heat exchange mechanism, including cooling line, cooler and the cryogenic fluid being placed in the cooling line, the cooling
Pipeline includes end to end heat absorption pipeline section and heat dissipation pipeline section, and the absorbing pipe section is located at the accommodating cavity, the heat dissipation pipeline section
Positioned at the electronic device exterior, the cryogenic fluid can be in the cooling line internal circulation flow, and circuits sequentially and flow through
The heat absorption pipeline section and the heat dissipation pipeline section, the cooler cool down the cryogenic fluid at the heat dissipation pipeline section；
Airflow circulating mechanism, for making the accommodating cavity form circulating current, the circulating current flows through the heat absorption pipeline section.
2. radiator as described in claim 1, which is characterized in that the cooler is included at least for compressing cryogenic fluid
So that the compressor of the cryogenic fluid cooling and for be the compressor cooling fan.
3. radiator as described in claim 1, which is characterized in that the heat exchange mechanism further includes being connected to the heat absorption
Pipeline section is simultaneously used to increase cryogenic fluid in the heat absorption component of the endotherm area of the heat absorption pipeline section.
4. radiator as claimed in claim 3, which is characterized in that the heat absorption component includes multiple interval settings and array
The heat absorbing sheet of arrangement.
5. radiator as claimed in claim 4, which is characterized in that the cooling line is arranged in the heat absorbing sheet.
6. such as radiator described in any one of claim 1 to 5, which is characterized in that the cooling line is arranged in the electricity
Subcomponent.
7. radiator as described in claim 1, which is characterized in that the airflow circulating mechanism includes at least blowing part, institute
Blowing part is stated to be used to the cooling air of the heat absorption pipeline section being blown to the electronic component.
8. radiator as claimed in claim 7, which is characterized in that the airflow circulating mechanism further includes being connected to described blow
Wind part simultaneously is used to guide the wind of the blowing part conveying to the wind channel tube of the electronic component, and the wind channel tube has towards institute
State the air inlet of blowing part and the air outlet towards the electronic component.
9. a kind of radiator radiates for electronic device, the electronic equipment has accommodating cavity characterized by comprising
Heat exchange mechanism, including be located at the accommodating cavity and can in the heat-absorbing structure that the accommodating cavity absorbs heat, positioned at institute
The radiator structure stating electronic device exterior and capable of radiating in the electronic device exterior；
Airflow circulating mechanism, for making the accommodating cavity form circulating current, the circulating current flows through the heat-absorbing structure.
10. a kind of projector, which is characterized in that including the shell with accommodating cavity, the electronic component in the accommodating cavity
And radiator as described in any one of claim 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920401836.0U CN209514285U (en) | 2019-03-25 | 2019-03-25 | Radiator and projector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920401836.0U CN209514285U (en) | 2019-03-25 | 2019-03-25 | Radiator and projector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209514285U true CN209514285U (en) | 2019-10-18 |
Family
ID=68187831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920401836.0U Active CN209514285U (en) | 2019-03-25 | 2019-03-25 | Radiator and projector |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209514285U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112782915A (en) * | 2019-11-05 | 2021-05-11 | 青岛海信激光显示股份有限公司 | Light processing projector |
-
2019
- 2019-03-25 CN CN201920401836.0U patent/CN209514285U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112782915A (en) * | 2019-11-05 | 2021-05-11 | 青岛海信激光显示股份有限公司 | Light processing projector |
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