CN209490159U - Pressurization cold compress refrigerating system - Google Patents
Pressurization cold compress refrigerating system Download PDFInfo
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- CN209490159U CN209490159U CN201821275106.2U CN201821275106U CN209490159U CN 209490159 U CN209490159 U CN 209490159U CN 201821275106 U CN201821275106 U CN 201821275106U CN 209490159 U CN209490159 U CN 209490159U
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- water
- cold
- semiconductor chilling
- bucket
- chilling plate
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 145
- 239000004065 semiconductor Substances 0.000 claims abstract description 82
- 238000001816 cooling Methods 0.000 claims abstract description 55
- 238000005057 refrigeration Methods 0.000 claims abstract description 55
- 238000010438 heat treatment Methods 0.000 claims abstract description 37
- 238000009413 insulation Methods 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 7
- 238000003756 stirring Methods 0.000 claims description 6
- 229910001094 6061 aluminium alloy Inorganic materials 0.000 claims description 5
- 229910000831 Steel Inorganic materials 0.000 claims description 5
- 239000010959 steel Substances 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 239000002937 thermal insulation foam Substances 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 238000007710 freezing Methods 0.000 claims 1
- 230000008014 freezing Effects 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 14
- 230000008569 process Effects 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 description 14
- 239000000463 material Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 206010047139 Vasoconstriction Diseases 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 230000000202 analgesic effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 230000036760 body temperature Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 230000003902 lesion Effects 0.000 description 1
- 201000009240 nasopharyngitis Diseases 0.000 description 1
- 235000012149 noodles Nutrition 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000002560 therapeutic procedure Methods 0.000 description 1
- 230000025033 vasoconstriction Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Landscapes
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model discloses a pressurization cold compress refrigerating system, including cold water bucket, semiconductor refrigeration piece, water-cooling head, water tank and water pump, the semiconductor refrigeration piece sets up the cold water bucket just the refrigeration face of semiconductor refrigeration piece with the surface contact of cold water bucket is used for right after circular telegram water in the cold water bucket refrigerates, the water-cooling head with the face of heating of semiconductor refrigeration piece is fixed, is used for receiving the heat that the face of heating of semiconductor refrigeration piece produced, water pump and water tank the water-cooling head is connected, be used for with water in the water tank is pumped and is sent the water-cooling head takes away the water-cooling head is followed the absorptive heat of the face of heating of semiconductor refrigeration piece. The pressurization cold compress refrigerating system refrigerates by adopting the semiconductor refrigerating sheet, does not need to use parts such as a compressor and the like, has no noise in the refrigerating process, has small volume, simple structure, low manufacturing cost and high refrigerating speed, and can meet the requirement of conventional refrigeration.
Description
Technical field
The utility model relates to cryotherapeutic apparatus tool technical fields, more particularly to a kind of pressurization cold compress refrigeration system.
Background technique
Cold compress, generally by being spread on after neck, neck or on diseased region skin with ice bag or cold wet towel.Spread on lesion
Position, main purpose is to promote local vasoconstriction, controls the bleeding of thin vessels and mitigates the pain of the larger lump of tension, reaches and disappear
The effect of swollen analgesic, hyperpyretic patient can reduce body temperature, improvement sense of discomfort after spreading on neck, neck.
Common refrigerating method is to be freezed using compressor, and refrigeration work consumption is larger, and speed is fast, but volume is larger,
It is with high costs.Compressor is usually to apply on the large scale equipments such as air-conditioning, refrigerator, is had for the refrigeration that cold therapy needs
It breaks a fly upon a wheel, cost is too high, and patient's use is very inconvenient.
Therefore, it is needed in face of common cold compress, designing a simple refrigeration equipment of structure small in size, at low cost just becomes non-
Often it is necessary to.
Utility model content
The purpose of the utility model is to provide a kind of pressurization cold compress refrigeration systems, and structure is simple, process of refrigerastion noiseless,
Good refrigeration effect.
In order to solve the above technical problems, the utility model embodiment provides a kind of pressurization cold compress refrigeration system, including cold
Bucket, semiconductor chilling plate, water-cooling head, water tank and water pump, the semiconductor chilling plate setting is in the cold water bucket and described half
The chill surface of conductor cooling piece is contacted with the surface of the cold water bucket, for after powered up to the water system in the cold water bucket
Cold, the heating face of the water-cooling head and the semiconductor chilling plate is fixed, for receiving the heating face of the semiconductor chilling plate
The heat of generation, the water pump are connect with water tank, the water-cooling head, for the water in the water tank to be pumped to the water cooling
Head takes away the heat that the water-cooling head is absorbed from the heating face of the semiconductor chilling plate.
Wherein, the cold water bucket is the Double-layer bucket for including internal layer and outer layer, and the semiconductor chilling plate is arranged described
On the outside of the internal layer of cold water bucket.
Wherein, the internal layer of the cold water bucket is 6061 aluminum alloy inner layers.
Wherein, the outer layer of the cold water bucket is steel outer layer.
Wherein, further include fixed plate and thermal insulation layer, be provided between the fixed plate and the semiconductor chilling plate heat-insulated
Layer, the fixed plate is by the semiconductor chilling plate fixed plate to the cold water bucket.
Wherein, the thermal insulation layer is heat insulation foam.
It wherein, further include the stirring pump that the cold water bucket is set.
It wherein, further include the liquid level sensor that the cold water bucket is set.
It wherein, further include the temperature detect switch (TDS) that the heating face of the semiconductor chilling plate is set, in the cooling piece
Heating face temperature be greater than threshold value after cut off the power supply of the semiconductor chilling plate.
It wherein, further include the radiator being connect with the water-cooling head, the water tank, it is described for taking away the water-cooling head
The water of the heat in the heating face of semiconductor chilling plate is recycled into the water tank after radiating treatment cools down.
Pressurization cold compress refrigeration system provided by the utility model embodiment has the advantage that compared with prior art
The pressurization cold compress refrigeration system, freezes by using semiconductor chilling plate, while using water cooling piece and half
Water in the water tank is pumped to the water-cooling head using the water pump by the heating face contact of conductor cooling piece, is taken away described
The heat that water-cooling head is absorbed from the heating face of the semiconductor chilling plate realizes the temperature base in the heating face of semiconductor chilling plate
This effect not risen, under the premise of the both ends copper point voltage of semiconductor chilling plate remains unchanged, temperature difference is also remained unchanged,
So that the temperature of the cooling piece of semiconductor chilling plate will not rise, refrigerating speed and effect, while entire process of refrigerastion are improved
Without using components such as compressors, process of refrigerastion does not have noise, and the small volume of entire refrigeration system, structure are simple, system
Make at low cost, refrigerating speed is very fast, can satisfy conventional refrigeration.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is this
Some embodiments of utility model, for those of ordinary skill in the art, without creative efforts, also
Other drawings may be obtained according to these drawings without any creative labor.
Fig. 1 is that a kind of structure of specific embodiment of pressurization cold compress refrigeration system provided by the embodiment of the utility model is shown
It is intended to；
Fig. 2 is the heat dissipation in a kind of specific embodiment of pressurization cold compress refrigeration system provided by the embodiment of the utility model
Loop structure schematic diagram.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
FIG. 1 to FIG. 2 is please referred to, Fig. 1 is that one kind of pressurization cold compress refrigeration system provided by the embodiment of the utility model is specific
The structural schematic diagram of embodiment；Fig. 2 is a kind of specific reality of pressurization cold compress refrigeration system provided by the embodiment of the utility model
Apply the heat dissipation loop structure schematic diagram in mode.
In a specific embodiment, the pressurization cold compress refrigeration system, including cold water bucket 10, semiconductor chilling plate
20, water-cooling head 30, water tank 70 and water pump, the semiconductor chilling plate 20 are arranged in the cold water bucket 10 and the semiconductor refrigerating
The chill surface of piece 20 is contacted with the surface of the cold water bucket 10, for after powered up to the water system in the cold water bucket 10
Cold, the heating face of the water-cooling head 30 and the semiconductor chilling plate 20 is fixed, for receiving the semiconductor chilling plate 20
The heat that heating face generates, the water pump 80 are connect with water tank 70, the water-cooling head 30, for taking out the water in the water tank 70
It is sent to the water-cooling head 30, takes away the heat that the water-cooling head 30 is absorbed from the heating face of the semiconductor chilling plate 20.
The pressurization cold compress refrigeration system freezes to the water in cold water bucket 10 by using semiconductor chilling plate 20,
Due to being freezed using paltie effect, when the galvanic couple that direct current is connected by two kinds of different semiconductor materials, in electricity
Even both ends can absorb heat respectively and release heat, and the purpose of refrigeration may be implemented.Without tradition in process of refrigerastion
Compressor so that the noiseless generation of process of refrigerastion, and semiconductor chilling plate 20 need to be powered and can freeze, and volume is much smaller than
Traditional compressor, but also being greatly reduced using the volume of the cold compress device of the refrigeration system, manufacturing cost is greatly reduced, just
In transport and movement.
In addition, the temperature difference range freezed using semiconductor chilling plate 20, it generally can be 90 DEG C to 130 DEG C of negative temperature from positive temperature
Can realize, any refrigerant not needed in the course of work, can continuous work, no pollution sources do not have rotary part, will not
Gyroscopic action is generated, without slide unit, when work do not shake, noise, service life are long, and installation is easy.
In order to further increase refrigerating efficiency, in one embodiment of this utility model, the cold water bucket 10 is packet
The Double-layer bucket of internal layer and outer layer is included, the semiconductor chilling plate 20 is arranged on the outside of the internal layer of the cold water bucket 10.
By using double-layer structure, the structure of similar thermos flask is formed, reduces the extraneous influence to semiconductor chilling plate 20,
A possibility that cooling water after reducing the refrigeration of the chill surface of semiconductor chilling plate 20 absorbs heat from the external world, is carried out by outer layer
Certain shielding.
In order to further increase heat conduction efficiency, the heat in cold water bucket 10 is inhaled by the chill surface of semiconductor chilling plate 20
It takes, in one embodiment of the utility model, the internal layer of the cold water bucket 10 is 6061 aluminum alloy inner layers.
The internal layer of cold water bucket 10 uses preferable 6061 aluminum alloy inner layer of thermal conductivity, same compared with high structural strength having
When, heat transfer efficiency coefficient is larger, can be more quickly by the temperature conduction of the water in cold water bucket 10 to semiconductor chilling plate 20.
6061 aluminum alloy inner layers use Cutter Body Processing with Machining Center, ensure that the size at each position, the optimal effect of flatness and surface roughness
Fruit, outer layer are processed using high-quality steel, protect each part of internal layer bucket and the inside.
And material, the shape and size of outer layer and internal layer for the cold water bucket 10 are not specifically limited, it is general described
The outer layer of cold water bucket 10 is steel outer layer.
It should be pointed out that the utility model for the semiconductor chilling plate 20 material, size, shape and quantity not
Be specifically limited, need in conjunction in manufacturing cost, cold water bucket 10 volume and refrigeration work consumption determine.
Shape and size of the utility model for water-cooling head 30 and the fixed form in the cold water bucket 10, which are not done, to be had
Body limits, and since semiconductor chilling plate 20 is while chill surface freezes, heat can be also generated in heating face, if in semiconductor
In 20 course of work of cooling piece, there is the case where heating towards meeting huyashi-chuuka (cold chinese-style noodles) transmission heat, if the heat that heating face generates is whole
It is transferred to chill surface, then the efficiency of the semiconductor chilling plate 20 is with regard to very low, therefore generally requires and avoids this case.
In order to solve this problem, in one embodiment of the utility model, the pressurization cold compress refrigeration system is also wrapped
Fixed plate and thermal insulation layer 40 are included, thermal insulation layer 40, the fixation are provided between the fixed plate and the semiconductor chilling plate 20
Plate is by 20 fixed plate of semiconductor chilling plate to the cold water bucket 10.
During semiconductor chilling plate 20 is fixed on cold water bucket 10 by fixed plate, in fixed plate and semiconductor refrigerating
Thermal insulation layer 40 is set between piece 20, prevents heat from transmitting fixed plate from semiconductor chilling plate 20, is finally transmitted back to semiconductor refrigerating
Piece 20 or cold water bucket 10, to improve refrigerating efficiency.
The utility model for the thickness of thermal insulation layer 40, material and size without limitation, the general thermal insulation layer 40 be every
Hot cotton.
Can arbitrarily be adjusted using heat insulation foam as thermal insulation layer 40, thickness and shape, can satisfy various needs, using at
The case where this is very low, and good toughness, will not be easy to appear damage as other thermal insulation layers 40.
In the present invention, the purpose of semiconductor chilling plate 20 is to reduce the temperature of the water of cold water bucket 10, reaches cold
The temperature needed is applied, but in process of refrigerastion, since there is no moving component, the water in cold water bucket 10 is in close semiconductor system
Good refrigeration effect near cold 20 position, distance is remoter, will there is a situation where that the temperature difference is bigger, and the temperature difference is got in cold water bucket 10
The needs of cold compress are neither able to satisfy greatly, while making semiconductor chilling plate 20 in the case where power-on voltage remains unchanged, are freezed
The temperature difference in face and heating face is to maintain constant, at this moment will appear the feelings to the refrigeration effect rapid deterioration of the water in cold water bucket 10
Condition.
In order to solve this technical problem, in one embodiment of the utility model, the pressurization cold compress refrigeration system
It further include the stirring pump 50 that the cold water bucket 10 is set.
By the way that stirring pump 50 is arranged in cold water bucket 10, accelerates the flowing of the water of each position in cold water bucket 10, reduce
The temperature difference at each position reaches cold compress needs, on the other hand, additionally it is possible to by the flowing of the water in cold water bucket 10, half-and-half lead
The position of the chill surface of body cooling piece 20 carries out certain heating, reduces the water temperature drop speed near it, improves refrigerating efficiency.
The utility model for stirring pump 50 shape and size without limitation, can be with semiconductor chilling plate 20
It works and automatic operating, is also possible to be operated in other manners, in addition to this, can also be used in the utility model
Agitating paddle is replaced, or is replaced using other components, as long as the water in the cold water bucket 10 that can be is in flowing shape
State is conducive to improve cooling rate.
In the present invention, due to need in advance to cold water bucket 10 carry out plus water operation, in order to guarantee plus water during
Water spilling is not had, and in one embodiment of the utility model, the pressurization cold compress refrigeration system further includes being arranged described
The liquid level sensor of cold water bucket 10.
Using liquid level sensor 60, during Jia Shui, water level rises so that the float of liquid level sensor 60 rises, and arrives
Liquid level sensor 60 has open circuit to become access after up to certain altitude, issues signal, so that stopping adding water.
In the present invention, in the lasting course of work, the lower use of the temperature of the chill surface of semiconductor chilling plate 20
In in cold water bucket 10 water carry out refrigerating operation, but semiconductor chilling plate 20 heating face temperature may constantly on
It rising, temperature is excessively high may to burn or reduce the service life, therefore in order to guarantee its service life and operational reliability,
In one embodiment of the utility model, the pressurization cold compress refrigeration system further includes that the semiconductor chilling plate 20 is arranged in
The temperature detect switch (TDS) in heating face cuts off the semiconductor chilling plate after being greater than threshold value for the temperature in the heating face of the cooling piece
20 power supply.
The utility model for temperature detect switch (TDS) operating temperature range without limitation, can be using natural type, that is, utilize
Its characteristic having, such as it is 60 DEG C that working range is online, reaches temperature and disconnects automatically is also possible to using manually being set
It is fixed, set operating temperature range.
In order to further increase the utilization efficiency to water, the waste of water resource is reduced, in an implementation of the utility model
In example, the pressurization cold compress refrigeration system further includes the radiator 90 connecting with the water-cooling head 30, the water tank 70, and being used for will
The water that the water-cooling head 30 takes away the heat in the heating face of the semiconductor chilling plate 20 recycled after radiating treatment cools down into
Enter the water tank 70.
By the high-temperature water that will be generated in 30 cooling procedure of water-cooling head, radiator 90 is output to by water pipe, passes through heat dissipation
Device 90 carries out radiating treatment, reduces the temperature of these cooling waters, then realizes the circulation benefit of water resource by being input to water tank 70 again
With so that simplifying the workflow to the refrigeration system without carrying out drain operation and adding water operation in whole process.
In one embodiment of the utility model, the pressurization cold compress refrigeration system is as shown in Figure 1, in square water tank 70
Interior setting square cold water bucket 10, semiconductor chilling plate 20 are arranged the preceding of cold water bucket 10 and are convenient for the left side, and corresponding is all to pass through fixation
Piece is fixed, and is thermally isolated between fixed plate and semiconductor chilling plate 20 by heat insulation foam, and setting water-cooling head 30 is simultaneously
The heating face of water-cooling head 30 and semiconductor chilling plate 20 is subjected to heat cooling, square cold water bucket 10 includes inside and outside bilayer, and internal layer is adopted
Cutter Body Processing with Machining Center is used with 6061 good aluminium alloys of heat-conducting glue, ensure that the size, flatness and roughness at each position reach
To optimal effect, outer layer is processed using high-quality steel, is protected the part of internal layer bucket and the inside, is arranged in internal layer bucket
Stirring pump 50 improves cooling rate so that the water in bucket is in flow regime, promotes the refrigeration effect of semiconductor chilling plate 20
Temperature detect switch (TDS) is arranged in the heating face of each semiconductor chilling plate 20 in rate, is more than cutting semiconductor after 60 DEG C in surface temperature
Cooling piece 20 does system power supply, guarantees working life.Radiator 90 is set between the outer wall and cold water bucket 10 of water tank 70, it will
After thering is water tank 70 to cool down by the water that water circulating pump pumps to water-cooling head 30 to water-cooling head 30, radiates to it, take away system
The surface heat in cold heating face and the heat of water-cooling head 30, are then input to water tank 70, realize the circulation benefit of water resource
With.In addition, being unlikely to completely to cause very much when being placed through water inlet 11 plus water liquid level sensor 60 is arranged in the inside of cold water bucket 10
Water overflows.Certainly, extra water can be discharged by the water outlet 12 of setting when excessive in order to facilitate inner bucket water, is existed by setting
The discharge outlet 13 of bottom will be in the extra waste water not used all discharge bucket.
The effect that can reach fast-refrigerating using above-mentioned cooling piece mounting means can guarantee the water in cold water bucket 10
2 DEG C are reduced in minute.Certainly, it if user needs lower cryogenic temperature and faster refrigeration effect, needs to install additional more
The semiconductor chilling plate crossed improves the DC voltage of application, accelerates the radiating efficiency in heating face.
In conclusion pressurization cold compress refrigeration system provided by the embodiment of the utility model, by using semiconductor chilling plate
Freeze, while using the heating face contact of water cooling piece and semiconductor chilling plate, it will be in the water tank using the water pump
Water pumps to the water-cooling head, takes away the heat that the water-cooling head is absorbed from the heating face of the semiconductor chilling plate, realizes
The effect that the temperature in the heating face of semiconductor chilling plate does not rise substantially is kept not in the both ends copper point voltage of semiconductor chilling plate
Under the premise of change, temperature difference is also remained unchanged, so that the temperature of the cooling piece of semiconductor chilling plate will not rise, improves refrigeration
Speed and effect, while entire process of refrigerastion, without using components such as compressors, process of refrigerastion does not have noise, and entirely freezes
The small volume of system, structure are simple, manufacturing cost is low, and refrigerating speed is very fast, can satisfy conventional refrigeration.
Pressurization cold compress refrigeration system provided by the utility model is described in detail above.Tool used herein
Body example is expounded the principles of the present invention and embodiment, and the above embodiments are only used to help understand
The method and its core concept of the utility model.It should be pointed out that for those skilled in the art, not taking off
Under the premise of from the utility model principle, several improvements and modifications can be made to this utility model, these improvement and modification
It also falls into the protection scope of the utility model claims.
Claims (10)
1. a kind of pressurization cold compress refrigeration system, which is characterized in that including cold water bucket, semiconductor chilling plate, water-cooling head, water tank and water
The table of the cold water bucket and the chill surface of the semiconductor chilling plate and the cold water bucket is arranged in pump, the semiconductor chilling plate
Face contact, for freezing after powered up to the water in the cold water bucket, the water-cooling head and the semiconductor chilling plate
Heating face is fixed, the heat that the heating face for receiving the semiconductor chilling plate generates, the water pump and water tank, the water cooling
Head connection, for the water in the water tank to be pumped to the water-cooling head, takes away the water-cooling head from the semiconductor chilling plate
Heating face absorb heat.
2. as described in claim 1 pressurization cold compress refrigeration system, which is characterized in that the cold water bucket be include internal layer and outer layer
Double-layer bucket, the semiconductor chilling plate are arranged on the outside of the internal layer of the cold water bucket.
3. pressurization cold compress refrigeration system as claimed in claim 2, which is characterized in that the internal layer of the cold water bucket is 6061 aluminium alloys
Internal layer.
4. pressurization cold compress refrigeration system as claimed in claim 3, which is characterized in that the outer layer of the cold water bucket is steel outer layer.
5. pressurization cold compress refrigeration system as claimed in claim 4, which is characterized in that it further include fixed plate and thermal insulation layer, it is described solid
It is provided with thermal insulation layer between fixed board and the semiconductor chilling plate, the fixed plate is by the semiconductor chilling plate fixed plate to institute
State cold water bucket.
6. pressurization cold compress refrigeration system as claimed in claim 5, which is characterized in that the thermal insulation layer is heat insulation foam.
7. pressurization cold compress refrigeration system as claimed in claim 6, which is characterized in that further include the stirring that the cold water bucket is arranged in
Water pump.
8. cold compress refrigeration system of pressurizeing as described in claim 1-7 any one, which is characterized in that further include being arranged described cold
The liquid level sensor of bucket.
9. pressurization cold compress refrigeration system as claimed in claim 8, which is characterized in that further include being arranged in the semiconductor chilling plate
Heating face temperature detect switch (TDS), for the temperature in the heating face of the cooling piece greater than cutting off the semiconductor refrigerating after threshold value
The power supply of piece.
10. pressurization cold compress refrigeration system as claimed in claim 9, which is characterized in that further include and the water-cooling head, the water tank
The radiator of connection, the water of the heat in the heating face for the water-cooling head to be taken away to the semiconductor chilling plate is by heat dissipation
The water tank is recycled into after reason cooling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821275106.2U CN209490159U (en) | 2018-08-08 | 2018-08-08 | Pressurization cold compress refrigerating system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821275106.2U CN209490159U (en) | 2018-08-08 | 2018-08-08 | Pressurization cold compress refrigerating system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209490159U true CN209490159U (en) | 2019-10-15 |
Family
ID=68150688
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821275106.2U Active CN209490159U (en) | 2018-08-08 | 2018-08-08 | Pressurization cold compress refrigerating system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209490159U (en) |
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2018
- 2018-08-08 CN CN201821275106.2U patent/CN209490159U/en active Active
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