CN209218511U - A kind of TEC conduction cooling locking mechanism - Google Patents
A kind of TEC conduction cooling locking mechanism Download PDFInfo
- Publication number
- CN209218511U CN209218511U CN201821414815.4U CN201821414815U CN209218511U CN 209218511 U CN209218511 U CN 209218511U CN 201821414815 U CN201821414815 U CN 201821414815U CN 209218511 U CN209218511 U CN 209218511U
- Authority
- CN
- China
- Prior art keywords
- tec
- cold plate
- plate pedestal
- piece
- locking mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of TEC conduction cooling locking mechanisms, including cabinet, pcb board and cold plate pedestal, coolant flow channel is equipped in the top plate and bottom plate of the cabinet, and top and bottom are equipped with corresponding locking slot, pass through the fixed cold plate pedestal of locking bar in locking slot, cold plate pedestal is connect by heat-conducting layer with the euthermic chip on pcb board, and the locking slot and cold plate base contact face are equipped with TEC cooling piece, and the TEC piece is connected with the controller of its refrigeration of driving.The utility model is equipped with TEC cooling piece by the contact surface of cold plate pedestal and cabinet, and the control of refrigerating capacity is carried out by control TEC cooling piece, can the flexible modulation temperature difference, make the heat dissipation effect of chip more preferable.
Description
Technical field
The utility model belongs to the thermally conductive technical field of electrical chip, and in particular to a kind of TEC conduction cooling locking mechanism.
Background technique
As the requirement of chip functions integrated level is higher and higher, the continuous promotion of power density, while external use environment
It is required that it is higher, while with the light-weighted requirement of product, it is higher and higher to the capacity of heat transmission of cold plate.Cold plate base commonly now
Seat has copper material, aluminium alloy, magnesium alloy, carbon fiber etc., and the thermal coefficient of cold plate pedestal is not high, will lead to chip boss and arrives
The thermal resistance of cold plate slipway location is larger, causes excessive temperature differentials, and the temperature of chip is excessively high.New technical solution is utilized in cold plate base
It is embedded in phase change structure on seat, can significantly promote the thermal coefficient of cold plate, the temperature difference of reduction chip boss to slipway location.But it adopts
It is not only at high cost with this structure, but also have strict requirements to the thickness of shell, it is high, light meeting environment temperature height, power consumption
Under conditions of quantization, at this stage this structure will cause on the one hand it is at high cost, on the other hand can not realize in structure.
Summary of the invention
The purpose of this utility model is to provide a kind of simple TEC conduction cooling locking mechanisms of at low cost and structure.
The purpose of this utility model is achieved through the following technical solutions:
A kind of TEC conduction cooling locking mechanism, including cabinet, pcb board and cold plate pedestal are set in the top plate and bottom plate of the cabinet
There is coolant flow channel, and top and bottom are equipped with corresponding locking slot, locking slot is interior to fix cold plate pedestal by locking bar,
Cold plate pedestal is connect by heat-conducting layer with the euthermic chip on pcb board, and the locking slot and cold plate base contact face are equipped with TEC
Cooling piece, the TEC piece are connected with the controller of its refrigeration of driving.
Further, the cold plate pedestal is made using metal, ceramics or aluminium carbide.
Further, the metal is one of copper, aluminium, magnesium.
Further, the heat-conducting layer is equipped with TEC cooling piece.
Further, the cold plate pedestal is equipped with several TEC cooling pieces.
The utility model has the following beneficial effects:
(1) TEC cooling piece is equipped with by the contact surface of cold plate pedestal and cabinet, is freezed by controlling TEC cooling piece
The control of amount, can the flexible modulation temperature difference, make the heat dissipation effect of chip more preferable；
(2) cold plate pedestal is made using metal (copper, aluminium, magnesium), ceramics or aluminium carbide, is not only able to satisfy the common of chip and dissipates
Heat request, moreover it is possible to reduce the cost of product, while be whole more lightweight；
(3) it is mounted on TEC cooling piece on cold plate substrate, between chip and cold plate pedestal, makes the part of entire product
Temperature can realize it is adjustable, make its radiate heat-conducting effect it is more preferable.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model.
Marked in the figure: 1, cabinet；11, locking slot；12, locking bar；13, coolant flow channel；2, cold plate pedestal；3,
Pcb board；31, euthermic chip；4, TEC cooling piece.
Specific embodiment
As shown in Figure 1, TEC conduction cooling locking mechanism provided in this embodiment includes cabinet 1, cold plate pedestal 2, pcb board 3, TEC
Cooling piece 4 and controller, the top plate and bottom plate of the cabinet 1 are interior to be equipped with coolant flow channel 13, and top and bottom are equipped with
Corresponding locking slot 11, locking slot 11 is interior by the fixed cold plate pedestal 2 of locking bar 12, and cold plate pedestal 2 passes through heat-conducting layer and pcb board
Euthermic chip 31 on 3 connects, and is equipped with 1 or 2 TEC cooling pieces 4 on the locking slot 11 and 2 contact surface of cold plate pedestal,
Also mountable TEC cooling piece 4, the TEC cooling piece 4 are connected with the control of its refrigeration of driving between locking bar 12 and cold plate pedestal 2
Device processed, the controller include power module, single-chip microcontroller, power driver module and temperature collecting module, the temperature acquisition mould
Block, power driver module and power module are connect with single-chip microcontroller, and the power supply powered to pcb board 3 can be used in the power module,
Power supply adaptor can also be separately provided or battery power supply, the single-chip microcontroller use STM32 single-chip microcontroller, control can be written in single-chip microcontroller
Processing procedure sequence, the temperature collecting module specifically use temperature sensor, and temperature sensor acquires the temperature in cabinet, passes through temperature
Variation control driving power module, driving power module connect with TEC cooling piece 4, control of the realization to refrigerating capacity.The control
Device processed is mountable on pcb board 3, can also be in independently installed cabinet.
The cold plate pedestal 2 is made using metal, ceramics or aluminium carbide, and metal mainly uses copper, aluminium, in magnesium
It is a kind of.Not only it is able to satisfy the common cooling requirements of chip, moreover it is possible to reduce the cost of product, while be whole more lightweight.
Heat-conducting layer described in the present embodiment is also equipped with TEC cooling piece.The cold plate pedestal 2 freezes equipped with several TEC
Piece 4, the TEC cooling piece 4 are also connected with the controller for driving its work.TEC cooling piece 4 on the cold plate pedestal 2 can be with
It is that single side setting is also possible to two-sided setting.
The present embodiment in conjunction with existing cooling system, realizes the control to refrigerating capacity, and then make core by TEC cooling piece
The heat dissipation effect of piece is more preferable.
The above is only the utility model preferred embodiment, but the protection scope of the utility model is not limited to
This, any transformation carried out based on technical solution provided by the utility model and utility model design and replacement should all be covered
In the protection scope of the utility model.
Claims (5)
1. a kind of TEC conduction cooling locking mechanism, including cabinet, pcb board and cold plate pedestal, it is equipped in the top plate and bottom plate of the cabinet
Coolant flow channel, and top and bottom are equipped with corresponding locking slot, locking slot is interior by the fixed cold plate pedestal of locking bar, cold
Plate pedestal is connect by heat-conducting layer with the euthermic chip on pcb board, it is characterised in that: the locking slot and cold plate base contact face
It is equipped with TEC cooling piece, the TEC piece is connected with the controller of its refrigeration of driving.
2. TEC conduction cooling locking mechanism according to claim 1, it is characterised in that: the cold plate pedestal uses metal, ceramics
Or aluminium carbide is made.
3. TEC conduction cooling locking mechanism according to claim 2, it is characterised in that: the metal is copper, aluminium, one in magnesium
Kind.
4. TEC conduction cooling locking mechanism according to claim 1, it is characterised in that: the heat-conducting layer is equipped with TEC refrigeration
Piece.
5. TEC conduction cooling locking mechanism according to claim 1 or 2, it is characterised in that: the cold plate pedestal is equipped with several
TEC cooling piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821414815.4U CN209218511U (en) | 2018-08-30 | 2018-08-30 | A kind of TEC conduction cooling locking mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821414815.4U CN209218511U (en) | 2018-08-30 | 2018-08-30 | A kind of TEC conduction cooling locking mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209218511U true CN209218511U (en) | 2019-08-06 |
Family
ID=67453476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821414815.4U Active CN209218511U (en) | 2018-08-30 | 2018-08-30 | A kind of TEC conduction cooling locking mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209218511U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110799017A (en) * | 2019-10-12 | 2020-02-14 | 重庆长安工业(集团)有限责任公司 | Fully-sealed case heat dissipation structure with cold plate provided with air duct |
| CN112902492A (en) * | 2021-02-02 | 2021-06-04 | 中国科学院空间应用工程与技术中心 | Mechanical-electrical integrated gas-liquid cooling device based on TEC |
| CN114025582A (en) * | 2021-11-23 | 2022-02-08 | 佛山市液冷时代科技有限公司 | 5G intelligent rod of collection AAU liquid cooling system |
-
2018
- 2018-08-30 CN CN201821414815.4U patent/CN209218511U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110799017A (en) * | 2019-10-12 | 2020-02-14 | 重庆长安工业(集团)有限责任公司 | Fully-sealed case heat dissipation structure with cold plate provided with air duct |
| CN112902492A (en) * | 2021-02-02 | 2021-06-04 | 中国科学院空间应用工程与技术中心 | Mechanical-electrical integrated gas-liquid cooling device based on TEC |
| CN114025582A (en) * | 2021-11-23 | 2022-02-08 | 佛山市液冷时代科技有限公司 | 5G intelligent rod of collection AAU liquid cooling system |
| CN114025582B (en) * | 2021-11-23 | 2022-06-10 | 佛山市液冷时代科技有限公司 | 5G intelligent rod of collection AAU liquid cooling system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN209218511U (en) | A kind of TEC conduction cooling locking mechanism | |
| CN210956919U (en) | Power battery package heat management mechanism | |
| CN108650862B (en) | A kind of rapid cooling method and device based on semiconductor refrigerating technology | |
| CN205649576U (en) | Constant temperature cold compress heat sink | |
| CN201452579U (en) | Semiconductor refrigerating cup with temperature control | |
| CN105232210A (en) | Medical bracelet with thermoelectric cooling and heating functions | |
| CN205193716U (en) | Extremely fast notebook computer radiator of cold temperature formula | |
| CN201599601U (en) | High-power LED energy-saving lighting lamp | |
| CN107172854B (en) | Vehicle-mounted integrated controller cooling system based on plate-fin heat pipe radiator | |
| CN201742674U (en) | Heat superconducting pipe radiator taking porous metal material as heat dissipation body | |
| CN208079654U (en) | Water-cooled motor controller | |
| CN200968745Y (en) | Cool-warm dual-purpose electronic refrigerator | |
| CN208808806U (en) | Intelligence is brought down a fever instrument | |
| CN215774014U (en) | Constructional device capable of cooling and warming | |
| CN214199271U (en) | High-performance refrigeration module with simple structure | |
| CN201216544Y (en) | Cold-hot towel cabinet | |
| CN109960375A (en) | One kind being used for host computer base support means | |
| CN210220096U (en) | Portable bladeless air feeder based on semiconductor refrigeration | |
| CN2906491Y (en) | Electronic wine cabinet | |
| CN209074875U (en) | Semiconductor laser depilatory apparatus handle | |
| CN208781187U (en) | A kind of cooling and warming mouse | |
| CN2773573Y (en) | Semi conductor refrigerator | |
| CN2333975Y (en) | Semiconductor wafer refrigerator | |
| CN220755317U (en) | Dual-semiconductor core heat dissipation control module for mobile phone air-cooled radiator | |
| CN219553742U (en) | Battery pack with heating function |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |