CN209487474U - Wafer cleaning bench - Google Patents
Wafer cleaning bench Download PDFInfo
- Publication number
- CN209487474U CN209487474U CN201920451585.7U CN201920451585U CN209487474U CN 209487474 U CN209487474 U CN 209487474U CN 201920451585 U CN201920451585 U CN 201920451585U CN 209487474 U CN209487474 U CN 209487474U
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- China
- Prior art keywords
- cleaning
- wafer
- wafer cleaning
- slot
- pumping equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 232
- 239000007788 liquid Substances 0.000 claims abstract description 79
- 238000005086 pumping Methods 0.000 claims abstract description 53
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 239000008367 deionised water Substances 0.000 claims description 9
- 229910021641 deionized water Inorganic materials 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 8
- 230000000694 effects Effects 0.000 abstract description 12
- 235000012431 wafers Nutrition 0.000 description 126
- 238000000034 method Methods 0.000 description 11
- 239000013078 crystal Substances 0.000 description 8
- 239000012530 fluid Substances 0.000 description 7
- 239000002253 acid Substances 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000003020 moisturizing effect Effects 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model provides a kind of wafer cleaning bench, and the wafer cleaning bench includes: wafer cleaning slot, pumping equipment and cleaning device；The first cleaning liquid covering in wafer cleaning slot is located at the wafer in wafer cleaning slot；Pumping equipment includes the first pumping equipment and the second pumping equipment being connected respectively with wafer cleaning slot；Cleaning device includes the cleaning sprayer above wafer cleaning slot, and cleaning sprayer provides the second cleaning liquid, and the liquid level that the second cleaning liquid is formed covers wafer.The utility model realizes the first cleaning liquid quickly excluded in wafer cleaning slot, improves drain efficiency by the pumping equipment being connected with wafer cleaning slot；The second cleaning liquid provided by cleaning device, can in time clean wafer, to improve the cleaning effect of wafer, improve the quality of wafer.
Description
Technical field
The utility model belongs to field of semiconductor devices, is related to a kind of wafer cleaning bench.
Background technique
The manufacturing process of wafer generally includes all multi-process such as photoetching, ion implanting, etching, heat treatment, vapor deposition.?
Carry out concerned process steps after, such as to wafer carry out photoetching after, need to clean wafer, to remove on crystal column surface
Impurity.According to statistics, wafer cleaning technique accounts for about the 20%~30% of whole wafer manufacturing process.If insufficient to wafer cleaning,
So that crystal column surface residual impurity, then in subsequent processing, it is possible to damage wafer, lead to wafer loss.
Existing groove-type cleaning machine platform, such as DNS FC3100, in process of production, it is possible that machinery etc.
Problem leads to the shutdown of cleaning machine, so that wafer is rested on (such as hydrofluoric acid) in corrosive liquid.Due to hydrofluoric acid
It is higher to the etching efficiency of the oxidation film of wafer, therefore currently, first passed through existing when machine halt trouble occurs in cleaning machine
Circulation line carry out the acid discharge process of hydrofluoric acid, however the acid discharge process time is long, low efficiency, the hydrogen fluorine in the process bracket groove
Acid will continue to perform etching the oxidation film layer of crystal column surface；And since the liquid supply device of existing cleaning machine is located at cleaning machine
The bottom of platform, therefore can only be after the completion of acid discharge, then water-refilling operation is carried out, to remove the remaining hydrofluoric acid of crystal column surface, moisturizing
It is carried out after the completion of acid discharge, timely the remaining hydrofluoric acid of crystal column surface cannot be cleaned, will cause remaining hydrofluoric acid
Continue to perform etching the oxidation film layer of crystal column surface.Therefore this method is used, the mesh on timely cleaning wafer surface cannot be reached
, and since the oxidation film layer of crystal column surface is destroyed, it is also possible to lead to scrapping for wafer.Therefore, existing wafer cleaning
Board passes through the process of moisturizing progress wafer cleaning after first acid discharge, has been unable to satisfy the processing requirement after cleaning machine is shut down.
Therefore it provides a kind of novel wafer cleaning bench, improves wafer cleaning bench drain efficiency, improves the clear of wafer
Effect is washed, and improves the quality of wafer, it has also become this field urgent problem to be solved.
Utility model content
In view of the foregoing deficiencies of prior art, the purpose of this utility model is to provide a kind of wafer cleaning bench,
For solving in the prior art, when there is shutdown status in wafer cleaning bench, wafer cleaning bench drain low efficiency, wafer
Cleaning effect is poor, reduces the problem of quality of wafer.
In order to achieve the above objects and other related objects, the utility model provides a kind of wafer cleaning bench, the wafer
Cleaning machine includes:
Wafer cleaning slot, the first cleaning liquid covering in the wafer cleaning slot are located at the crystalline substance in the wafer cleaning slot
Circle；
Pumping equipment, the pumping equipment include the first pumping equipment being connected respectively with the wafer cleaning slot and
Two pumping equipments；
Cleaning device, the cleaning device include the cleaning sprayer above the wafer cleaning slot, the cleaning spray
Head provides the second cleaning liquid, and the liquid level that second cleaning liquid is formed covers the wafer.
It optionally, further include outer groove on the outside of the wafer cleaning slot.
Optionally, the liquid level that second cleaning liquid is formed covers the wafer cleaning slot.
Optionally, first pumping equipment includes the first drain pipe, and second pumping equipment includes the second drain pipe,
And the ratio range of the internal diameter of the internal diameter of first drain pipe and second drain pipe includes 1:1~4:1.
Optionally, first pumping equipment includes impeller pump；Second pumping equipment includes bellowspump.
Optionally, the cleaning device includes resorption type cleaning device.
Optionally, the cleaning device further includes one of flowmeter and liquid regulator or combination.
Optionally, the wafer cleaning slot includes hydrofluoric acid wafer cleaning slot；The cleaning sprayer includes that deionized water is clear
Wash spray head.
Optionally, the wafer cleaning bench further includes controller.
Optionally, second pumping equipment further includes one of heating element and filter element or combination.
As described above, the wafer cleaning bench of the utility model can by the pumping equipment being connected with wafer cleaning slot
The first cleaning liquid quickly excluded in wafer cleaning slot is realized, to improve drain efficiency；Second provided by cleaning device
Cleaning liquid can in time clean wafer, to improve the cleaning effect of wafer, improve the quality of wafer.
Detailed description of the invention
Fig. 1 is shown as the structural schematic diagram of the wafer cleaning bench in the utility model.
Component label instructions
100 wafers
101 wafer cleaning slots
102 outer grooves
103 wafer cleaning slot passways
104 outer groove leakage fluid drams
201 impeller pumps
202 valves
203 Drainage tanks
204 first drain pipes
211 bellowspumps
212 heating elements
213 filter elements
214 valves
215 Drainage tanks
216 second drain pipes
301 cleaning sprayers
302 liquid regulators
303 flowmeters
304 valves
305 valves
Specific embodiment
The embodiments of the present invention is illustrated by particular specific embodiment below, those skilled in the art can be by this
Content disclosed by specification understands other advantages and effect of the utility model easily.
Please refer to Fig. 1.It should be clear that this specification structure depicted in this specification institute accompanying drawings, ratio, size etc., only to cooperate
The revealed content of specification, so that those skilled in the art understands and reads, being not intended to limit the utility model can be real
The qualifications applied, therefore do not have technical essential meaning, the tune of the modification of any structure, the change of proportionate relationship or size
It is whole, in the case where not influencing the effect of the utility model can be generated and the purpose that can reach, it should all still fall in the utility model institute
The technology contents of announcement obtain in the range of capable of covering.Meanwhile in this specification it is cited as "upper", "lower", "left", "right",
The term of " centre " and " one " etc. is merely convenient to being illustrated for narration, rather than to limit the enforceable range of the utility model,
Its relativeness is altered or modified, under the content of no substantial changes in technology, when being also considered as the enforceable scope of the utility model.
The present embodiment provides a kind of wafer cleaning bench, the wafer cleaning bench includes: wafer cleaning slot, pumping equipment
And cleaning device.The first cleaning liquid covering in the wafer cleaning slot is located at the wafer in the wafer cleaning slot, passes through
First cleaning liquid cleans the wafer；The pumping equipment includes first to be connected respectively with the wafer cleaning slot
By the pumping equipment wafer cleaning slot is discharged in first cleaning liquid by pumping equipment and the second pumping equipment；
The cleaning device includes the cleaning sprayer above the wafer cleaning slot, and the cleaning sprayer provides the second cleaning solution
Body, and the liquid level that second cleaning liquid is formed covers the wafer, with what is appeared by second cleaning liquid removal
Positioned at first cleaning liquid of the crystal column surface.
The wafer cleaning bench of the present embodiment is realized and is quickly excluded by the pumping equipment being connected with wafer cleaning slot
The first cleaning liquid in wafer cleaning slot improves drain efficiency；The second cleaning liquid provided by cleaning device, can be timely
Wafer is cleaned；To improve the cleaning effect of wafer, the quality of wafer is improved.
Specifically, such as Fig. 1, provide a kind of wafer cleaning bench, the wafer cleaning bench include wafer cleaning slot 101,
First pumping equipment, the second pumping equipment and cleaning device.The wafer cleaning bench further includes and the wafer cleaning slot 101
Wafer cleaning slot passway in the liquid feed device (not shown) being connected, the liquid feed device and the wafer cleaning slot 101
103 are connected, with by 103 fluid infusion of wafer cleaning slot passway, wherein wafer cleaning slot passway 103 can be located at
The bottom of the wafer cleaning slot 101, however, it is not limited to this.The wafer cleaning bench can be to institute by the liquid feed device
It states and injects first cleaning liquid in wafer cleaning slot 101, it can be clear to the wafer is located at by first cleaning liquid
Wafer 100 in washing trough 101 is cleaned.Wherein, first cleaning liquid may include acidic cleaning solution, as hydrofluoric acid is molten
Liquid, i.e., the described wafer cleaning bench may include hydrofluoric acid wafer cleaning bench, by the hydrofluoric acid solution to remove etching after
Pollutant positioned at 100 surface of wafer, the type of first cleaning liquid are not limited thereto, wherein the feed flow
Device may include hydrofluoric acid liquid feed device and deionized water liquid feed device.Wafer cleaning slot passway 103 and described first
Pumping equipment is connected, and wafer cleaning slot passway 103 is connected with second pumping equipment, therefore can pass through institute
It states the first pumping equipment and the second pumping equipment excludes first cleaning liquid being located in the wafer cleaning slot 101, from
And drain efficiency can be improved, damage of first cleaning liquid to the wafer 100 is reduced, product quality is improved.The crystalline substance
Circle cleaning machine can provide by being located at the cleaning sprayer 301 of 101 top of the wafer cleaning slot and top-down cover institute
Second cleaning liquid of wafer 100 is stated, so as to act on before the pumping equipment has excluded first cleaning liquid
It is remained on surface to remove the wafer 100 further to be cleaned to the wafer 100 in the wafer cleaning slot 101
The first drain wash liq further improves the quality of the wafer 100 to improve cleaning effect.The cleaning spray
First 301 may include deionized water cleaning sprayer, i.e., described second cleaning liquid may include deionized water solution, but described second is clear
The type of wash liq is not limited thereto, and can be selected according to the type of first cleaning liquid.It is described in the present embodiment
First cleaning liquid uses hydrofluoric acid solution, and second cleaning liquid uses deionized water solution.
As the further embodiment of the embodiment, the number of the open ended wafer 100 of wafer cleaning slot 101
It may include 1~50, the particular number of the wafer 100 and distribution can be selected as needed.
As the further embodiment of the embodiment, the outside of the wafer cleaning slot 101 may also include outer groove 102.
Specifically, the outer groove 102 can surround the wafer cleaning slot 101, the crystalline substance can be prevented by the outer groove 102
The spilling of first cleaning liquid in circle rinse bath 101, and when the height of the outer groove 102 exceeds second cleaning solution
When body is formed by liquid level, the outer groove 102 can also prevent the splashing of second cleaning liquid.The outer groove 102 can be with institute
It states wafer cleaning slot 101 to be connected, the outer groove 102 can not also be connected to the wafer cleaning slot 101 and is independently arranged, and pass through
Outer groove leakage fluid dram 104 is set and carries out drain operation.In the present embodiment, to improve efficiency, the preferably described outer groove 102 includes described outer
Slot leakage fluid dram 104, and the outer groove leakage fluid dram 104 is connected with wafer cleaning slot passway 103, and the outer groove drain
Mouth 104 is connected with second pumping equipment, in order to which second pumping equipment is by the outer groove leakage fluid dram 104, i.e.,
The drain to the outer groove 102 can be achieved and can also be achieved the drain to the wafer cleaning slot 101.
As the further embodiment of the embodiment, it is clear that the liquid level that second cleaning liquid is formed can cover the wafer
Washing trough 101.
Specifically, may make institute when the liquid level that second cleaning liquid is formed can cover the wafer cleaning slot 101
Cleaning device is stated while cleaning to the wafer 100, realizes the cleaning to the wafer cleaning slot 101, so as to
Extend the service life of the wafer cleaning slot 101.Wherein, the top end surface of the preferably described outer groove 102 is higher than the liquid level, from
And during the cleaning device is cleaned, 102 one side of outer groove can be used as overflow launder use, on the other hand also
It can prevent the splashing of second cleaning liquid.
As the further embodiment of the embodiment, first pumping equipment includes impeller pump 201；Second drain
Device includes bellowspump 211.
Specifically, first pumping equipment may include valve 202, impeller pump 201, Drainage tank 203 and the first drain pipe
204.First cleaning liquid in the wafer cleaning slot 101 passes through described the from wafer cleaning slot passway 103
One drain pipe 204, valve 202, impeller pump 201 enter the Drainage tank 203, and it is clear to control described first by the valve 202
The circulation of wash liq, and first cleaning liquid is transferred in the Drainage tank 203 by the impeller pump 201, thus
It can be realized by first pumping equipment with simple layout to first cleaning solution in the wafer cleaning slot 101
The direct emission of body, to improve drain efficiency.Second pumping equipment may include bellowspump 211, heating element 212, mistake
Filter component 213, valve 214, Drainage tank 215 and the second drain pipe 216, second pumping equipment can be used as the wafer
The pumping equipment of rinse bath 101 is alternatively arranged as liquid circulating apparatus use, by will second drain pipe 216 and the crystalline substance
Circle rinse bath passway 103 and outer groove leakage fluid dram 104 are connected, and can carry out drain and liquid recycle operation as needed.Institute
Stating Drainage tank 215 can also share with the Drainage tank 203, herein with no restriction.When second pumping equipment is followed as liquid
In use, the heating element 212 can heat liquid, the filter element 213 can be filtered liquid loop device,
To meet processing procedure needs, but the position of the heating element 212 and the filter element 213 is not limited thereto, the heating
The specific type and number of component 212 and the filter element 213, herein with no restriction.Wherein, first pumping equipment
The pump housing is preferably higher, compact-sized, small volume the impeller pump 201 of revolving speed, and gear pump, screw pump, rotation such as can be used
Turn piston pump etc.；The pump housing of second pumping equipment is preferably the bellowspump 211；First drain pipe 204 it is interior
The ratio range of the internal diameter of diameter and second drain pipe 216 may include 1:1~4:1, preferably 2:1；To pass through the rotor
Pump 201 and the first drain pipe 204 realize the effect of the first pumping equipment quick fluid-discharge, by the bellowspump 211 and
Second drain pipe 216 meets the drain of second pumping equipment and the needs of liquid circulation.
As the further embodiment of the embodiment, the deionized water cleaning sprayer may include 1~50 nozzles.
Specifically, the cleaning device may include the cleaning sprayer 301, liquid regulator 302, flowmeter 303, valve
304 and valve 305, but the structure of the cleaning device is not limited thereto.Wherein, the cleaning sprayer 301 can be used from
Sub- water cleaning sprayer can timely and effectively remove the 100 surface institute of the wafer appeared by the deionized water cleaning sprayer
Remaining first cleaning liquid improves the wafer 100 further to improve the cleaning effect of the wafer 100
Quality.Further, the deionized water cleaning sprayer may include 1~50 nozzles, such as 20,40, and preferred institute
Nozzle equidistantly distributed is stated, to provide uniform cleaning liquid level.
As the further embodiment of the embodiment, the cleaning device may include resorption type cleaning device.
Specifically, the type and number of the valve 304 and 305 can be selected as needed.Described in the present embodiment
Cleaning device can be realized by the valve 305 and is precisely controlled to second cleaning liquid, and second cleaning solution is avoided
The drippage of body, to avoid influencing the concentration of first cleaning liquid injected in the subsequent wafer cleaning slot 101.
As the further embodiment of the embodiment, the wafer cleaning bench may also include controller (not shown).
Specifically, such as computer smart machine can be used in the controller, specific type does not limit excessively herein.Pass through
The control of the controller may make the pumping equipment and the cleaning device that can act on the wafer cleaning slot simultaneously
101, controller is electrically connected with the pumping equipment and the cleaning device as will be described, controllable described by the controller
The operation of pumping equipment and the cleaning device, to can ensure that the wafer 100 has excluded it in first cleaning liquid
Before effective cleaning of second cleaning liquid can be obtained, to be cleaned in time to the wafer 100, thus described in improving
The cleaning effect of wafer 100 improves the quality of the wafer 100.
In conclusion the wafer cleaning bench of the utility model can by the pumping equipment being connected with wafer cleaning slot
The first cleaning liquid quickly excluded in wafer cleaning slot is realized, to improve drain efficiency；Second provided by cleaning device
Cleaning liquid can in time clean wafer, to improve the cleaning effect of wafer, improve the quality of wafer.So this reality
It is effectively overcome various shortcoming in the prior art with novel and is had high industrial utilization value.
The above embodiments are only illustrative of the principle and efficacy of the utility model, and not for limitation, this is practical new
Type.Any person skilled in the art can all carry out above-described embodiment under the spirit and scope without prejudice to the utility model
Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the revealed essence of the utility model
All equivalent modifications or change completed under mind and technical idea, should be covered by the claim of the utility model.
Claims (10)
1. a kind of wafer cleaning bench, which is characterized in that the wafer cleaning bench includes:
Wafer cleaning slot, the first cleaning liquid covering in the wafer cleaning slot are located at the wafer in the wafer cleaning slot；
Pumping equipment, the pumping equipment include the first pumping equipment and second row being connected respectively with the wafer cleaning slot
Liquid device；
Cleaning device, the cleaning device include the cleaning sprayer above the wafer cleaning slot, and the cleaning sprayer mentions
For the second cleaning liquid, and the liquid level that second cleaning liquid is formed covers the wafer.
2. wafer cleaning bench according to claim 1, it is characterised in that: further include outer on the outside of the wafer cleaning slot
Slot.
3. wafer cleaning bench according to claim 1, it is characterised in that: the liquid level that second cleaning liquid is formed covers
Cover the wafer cleaning slot.
4. wafer cleaning bench according to claim 1, it is characterised in that: first pumping equipment includes the first drain
Pipe, second pumping equipment includes the second drain pipe, and the internal diameter of first drain pipe and second drain pipe is interior
The ratio range of diameter includes 1:1~4:1.
5. wafer cleaning bench according to claim 1, it is characterised in that: first pumping equipment includes impeller pump；
Second pumping equipment includes bellowspump.
6. wafer cleaning bench according to claim 1, it is characterised in that: the cleaning device includes resorption type cleaning dress
It sets.
7. wafer cleaning bench according to claim 1, it is characterised in that: the cleaning device further includes flowmeter and liquid
One of body adjuster or combination.
8. wafer cleaning bench according to claim 1, it is characterised in that: the wafer cleaning slot includes hydrofluoric acid wafer
Rinse bath；The cleaning sprayer includes deionized water cleaning sprayer.
9. wafer cleaning bench according to claim 1, it is characterised in that: the wafer cleaning bench further includes control
Device.
10. wafer cleaning bench according to claim 1, it is characterised in that: second pumping equipment further includes heating
One of component and filter element or combination.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920451585.7U CN209487474U (en) | 2019-04-03 | 2019-04-03 | Wafer cleaning bench |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920451585.7U CN209487474U (en) | 2019-04-03 | 2019-04-03 | Wafer cleaning bench |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209487474U true CN209487474U (en) | 2019-10-11 |
Family
ID=68135142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920451585.7U Expired - Fee Related CN209487474U (en) | 2019-04-03 | 2019-04-03 | Wafer cleaning bench |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209487474U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111570380A (en) * | 2020-06-19 | 2020-08-25 | 北京北方华创微电子装备有限公司 | Bubble passing protection device and bubble passing protection method of groove type cleaning equipment |
| WO2022052550A1 (en) * | 2020-09-10 | 2022-03-17 | 长鑫存储技术有限公司 | Wet etching control system, wet etching machine and wet etching control method |
| US12094734B2 (en) | 2020-09-10 | 2024-09-17 | Changxin Memory Technologies, Inc. | Wet etching control system, wet etching machine and wet etching control method |
-
2019
- 2019-04-03 CN CN201920451585.7U patent/CN209487474U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111570380A (en) * | 2020-06-19 | 2020-08-25 | 北京北方华创微电子装备有限公司 | Bubble passing protection device and bubble passing protection method of groove type cleaning equipment |
| WO2022052550A1 (en) * | 2020-09-10 | 2022-03-17 | 长鑫存储技术有限公司 | Wet etching control system, wet etching machine and wet etching control method |
| US12094734B2 (en) | 2020-09-10 | 2024-09-17 | Changxin Memory Technologies, Inc. | Wet etching control system, wet etching machine and wet etching control method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191011 |
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| CF01 | Termination of patent right due to non-payment of annual fee |