CN209460364U - A kind of arrangement for testing integrated circuit - Google Patents
A kind of arrangement for testing integrated circuit Download PDFInfo
- Publication number
- CN209460364U CN209460364U CN201822004158.2U CN201822004158U CN209460364U CN 209460364 U CN209460364 U CN 209460364U CN 201822004158 U CN201822004158 U CN 201822004158U CN 209460364 U CN209460364 U CN 209460364U
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- Prior art keywords
- integrated circuit
- arrangement
- testing integrated
- fixed
- heat
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- 238000012360 testing method Methods 0.000 title claims abstract description 76
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 18
- 230000017525 heat dissipation Effects 0.000 claims abstract description 17
- 230000000694 effects Effects 0.000 claims abstract description 6
- 238000001816 cooling Methods 0.000 claims description 18
- 239000012530 fluid Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 3
- 206010037660 Pyrexia Diseases 0.000 abstract description 4
- 239000000428 dust Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 2
- FGRBYDKOBBBPOI-UHFFFAOYSA-N 10,10-dioxo-2-[4-(N-phenylanilino)phenyl]thioxanthen-9-one Chemical compound O=C1c2ccccc2S(=O)(=O)c2ccc(cc12)-c1ccc(cc1)N(c1ccccc1)c1ccccc1 FGRBYDKOBBBPOI-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 210000004209 hair Anatomy 0.000 description 1
- 238000013101 initial test Methods 0.000 description 1
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model discloses a kind of arrangement for testing integrated circuit, including arrangement for testing integrated circuit ontology and auxiliary radiating device, the first radiator window is offered above the arrangement for testing integrated circuit ontology, the two sides of the arrangement for testing integrated circuit ontology symmetrically offer the second radiator window, the arrangement for testing integrated circuit body interior is equipped with auxiliary radiating device, the auxiliary radiating device includes catheter, the catheter is fixed on the upper end inner wall of the arrangement for testing integrated circuit ontology by fixed device, several heat absorbing sheets are fixed under the catheter, described catheter one end is connected with water pump, the water pump is fixed on the upper end inner wall of the arrangement for testing integrated circuit ontology, the output end of the water pump is equipped with heat-dissipating pipe.The utility model has the advantages that can greatly increase the heat dissipation effect inside arrangement for testing integrated circuit, so that heat dissipation is more uniform, the device more for certain fevers also can effectively help its heat dissipation, avoid the damage of this kind of device.
Description
Technical field
The utility model relates to integrated circuit testing fields, it particularly relates to a kind of arrangement for testing integrated circuit.
Background technique
Integrated circuit tester is the dedicated unit tested integrated circuit.Integrated circuit testing is to guarantee integrated electricity
One of road performance, key means of quality.Ic test technique be develop IC industry three big support technologies it
One, therefore, integrated circuit tester tests great attention of the class by many countries as one.Over 40 years, with integrated
Circuit develops to forth generation, and integrated circuit tester also develops to scale in test, big from initial test small scale integration
Scale and super large-scale integration, have arrived the eighties, and super large-scale integration tester enters the period of full bloom.
In the prior art, the thermal component of arrangement for testing integrated circuit is that individual water-cooling component is either air-cooled scattered
Thermal part, and individually water cooling or wind-cooling heat dissipating are not able to satisfy the radiating requirements of high-power integrated circuit plate, cause certain hairs
The more device temperature one of heat lands vertically to go down, and be easy to cause the damage of this kind of device.
For the problems in the relevant technologies, currently no effective solution has been proposed.
Utility model content
The purpose of this utility model is to provide a kind of arrangement for testing integrated circuit, to solve to propose in above-mentioned background technique
The problem of.
To achieve the above object, the utility model provides the following technical solutions: a kind of arrangement for testing integrated circuit includes collection
At circuit test device ontology and auxiliary radiating device, the first heat dissipation is offered above the arrangement for testing integrated circuit ontology
Window, the two sides of the arrangement for testing integrated circuit ontology symmetrically offer the second radiator window, the arrangement for testing integrated circuit
Body interior is equipped with auxiliary radiating device, and the auxiliary radiating device includes catheter, and it is solid that the catheter passes through fixed device
It is scheduled on the upper end inner wall of the arrangement for testing integrated circuit ontology, several heat absorbing sheets are fixed under the catheter, it is described to lead
Liquid pipe one end is connected with water pump, and the water pump is fixed on the upper end inner wall of the arrangement for testing integrated circuit ontology, the water pump
Output end be equipped with heat-dissipating pipe, the other end of the catheter matches connection far from one end of the water pump with the heat-dissipating pipe,
The heat-dissipating pipe is fixed on a heat sink, and four angles of the cooling fin are fixed with the first connecting column, first connection
Column is fixedly connected with the upper end of the arrangement for testing integrated circuit ontology far from described cooling fin one end, the cooling fin and institute
It states the first radiator window to match, the two sides of the heat-dissipating pipe are equipped with heat emission fan, and the heat emission fan passes through the second connecting column and institute
The upper end inner wall for stating arrangement for testing integrated circuit ontology is fixedly connected, and the heat emission fan matches with second radiator window.
Further, the fixed device includes connecting plate, the connecting plate and the arrangement for testing integrated circuit ontology
Upper end inner wall be fixedly connected, the first arc snap-gauge is fixed on the connecting plate, the first arc snap-gauge one passes through
Shaft is movably equipped with the second arc snap-gauge, and the first arc snap-gauge is fixed with the first fixed plate far from described shaft one end,
The second arc snap-gauge is fixed with the second fixed plate far from described shaft one end, and first fixed plate is solid with described second
The middle part of fixed board has offered circular hole, is equipped with bolt in the circular hole, the upper end of the bolt is equipped with nut.
Further, first radiator window and second radiator window are fixed with Air Filter.
Further, the first arc snap-gauge and the second arc snap-gauge are made of heat-resisting soft rubber material.
Further, the arrangement for testing integrated circuit ontology is provided with reset button on one side.
Compared with prior art, the utility model has the following beneficial effects:
(1), the utility model can greatly be increased inside arrangement for testing integrated circuit by setting auxiliary radiating device
Heat dissipation effect so that heat dissipation is more uniform, the devices more for certain fevers also can effectively help its heat dissipation, avoid
The damage of this kind of device.
(2), catheter can be fixed on arrangement for testing integrated circuit ontology by the way that fixed device is arranged by the utility model
Upper end inner wall, and be convenient for catheter dismounting.
(3), the utility model is by being arranged to heat-resisting soft rubber material, energy for the first arc snap-gauge and the second arc snap-gauge
It is enough that catheter is effectively avoided to be galled by the first arc snap-gauge and the second arc snap-gauge.
(4), the utility model is pressed this key when arrangement for testing integrated circuit crashes by setting reset button,
Its restarting can be made in case of constant power.
(5), the utility model can prevent dust from entering from the first radiator window and the second radiator window by setting Air Filter
To the inside of arrangement for testing integrated circuit, the surface for avoiding dust from being adsorbed on electronic component hinders its heat dissipation.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Needed in attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is only the utility model
Some embodiments for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other attached drawings.
Fig. 1 is the external structure schematic diagram according to a kind of arrangement for testing integrated circuit of the utility model embodiment；
Fig. 2 is the schematic diagram of internal structure according to a kind of arrangement for testing integrated circuit of the utility model embodiment；
Fig. 3 is heat emission fan in a kind of arrangement for testing integrated circuit according to the utility model embodiment, heat-dissipating pipe and integrates
The structural schematic diagram of circuit test device upper end inner wall；
Fig. 4 is the structural representation that device is fixed in a kind of arrangement for testing integrated circuit according to the utility model embodiment
Figure.
Appended drawing reference:
1, arrangement for testing integrated circuit ontology；2, the first radiator window；3, the second radiator window；4, catheter；5, fixed device；
6, heat absorbing sheet；7, water pump；8, heat-dissipating pipe；9, cooling fin；10, the first connecting column；11, heat emission fan；12, the second connecting column；13, even
Fishplate bar；14, the first arc snap-gauge；15, shaft；16, the second arc snap-gauge；17, the first fixed plate；18, the second fixed plate；19,
Bolt；20, nut；21, reset button.
Specific embodiment
In the following, making further description to utility model in conjunction with attached drawing and specific embodiment:
Embodiment one:
Fig. 1-4 is please referred to, is surveyed according to a kind of arrangement for testing integrated circuit of the utility model embodiment, including integrated circuit
Device noumenon 1 and auxiliary radiating device are tried, the arrangement for testing integrated circuit ontology 1 offers the first radiator window 2 above, described
The two sides of arrangement for testing integrated circuit ontology 1 symmetrically offer the second radiator window 3, the arrangement for testing integrated circuit ontology 1
Inside is equipped with auxiliary radiating device, and the auxiliary radiating device includes catheter 4, and it is fixed that the catheter 4 passes through fixed device 5
Several heat absorbing sheets 6 are fixed under the upper end inner wall of the arrangement for testing integrated circuit ontology 1, the catheter 4, it is described to lead
4 one end of liquid pipe is connected with water pump 7, and the water pump 7 is fixed on the upper end inner wall of the arrangement for testing integrated circuit ontology 1, described
The output end of water pump 7 is equipped with heat-dissipating pipe 8, the other end of the catheter 4 and the one end of the heat-dissipating pipe 8 far from the water pump 7
Matching connects, and is equipped with conductive fluid in the catheter 4 and the heat-dissipating pipe 8, the heat-dissipating pipe 8 is fixed on cooling fin 9, institute
Four angles for stating cooling fin 9 are fixed with the first connecting column 10, and first connecting column 10 is equal far from described 9 one end of cooling fin
It being fixedly connected with the upper end of the arrangement for testing integrated circuit ontology 1, the cooling fin 9 matches with first radiator window 2,
The two sides of the heat-dissipating pipe 8 are equipped with heat emission fan 11, and the heat emission fan 11 is surveyed by the second connecting column 12 with the integrated circuit
The upper end inner wall of examination device noumenon 1 is fixedly connected, and the heat emission fan 11 matches with second radiator window 3.
By the above scheme of the utility model, it can greatly increase the heat dissipation effect inside arrangement for testing integrated circuit
Fruit, so that heat dissipation is more uniform, the device more for certain fevers also can effectively help its heat dissipation, avoid this kind of device
The damage of part.
Embodiment two:
Referring to Fig. 4, the fixed device 5 includes connecting plate 13 for fixed device 5, the connecting plate 13 with
The upper end inner wall of the arrangement for testing integrated circuit ontology 1 is fixedly connected, and the first arc card is fixed on the connecting plate 13
Plate 14, the first arc snap-gauge 14 1 are movably equipped with the second arc snap-gauge 16, the first arc snap-gauge by shaft 15
14 are fixed with the first fixed plate 17 far from described 15 one end of shaft, and the second arc snap-gauge 16 is far from described 15 one end of shaft
It is fixed with the second fixed plate 18, the middle part of first fixed plate 17 and second fixed plate 18 has offered circular hole,
Bolt 19 is equipped in the circular hole, the upper end of the bolt 19 is equipped with nut 20, for the first arc snap-gauge 14 and the second arc
For shape snap-gauge 16, the first arc snap-gauge 14 and the second arc snap-gauge 16 are made of heat-resisting soft rubber material.
By the above scheme of the utility model, catheter 4 can be fixed on the upper of arrangement for testing integrated circuit ontology 1
Inner wall is held, and is convenient for the dismounting of catheter 4, can effectively avoid catheter 4 by the first arc snap-gauge 14 and the second arc card
Plate 16 galls.
Embodiment three:
Fig. 1-3 is please referred to, for arrangement for testing integrated circuit ontology 1, the arrangement for testing integrated circuit ontology 1 one
Face is provided with reset button 21；For the first radiator window 2 and the second radiator window 3, first radiator window 2 and described second
Radiator window 3 is fixed with Air Filter.
By the above scheme of the utility model, reset button 21 is pressed when arrangement for testing integrated circuit crashes,
Its restarting can be made in case of constant power, can prevent dust from entering from the first radiator window 2 and the second radiator window 3
To the inside of arrangement for testing integrated circuit, the surface for avoiding dust from being adsorbed on electronic component hinders its heat dissipation.
In conclusion, by the way that auxiliary radiating device is arranged, can will be inhaled by means of the above-mentioned technical proposal of the utility model
The more component outer surface that generates heat is arranged in backing 6, and when arrangement for testing integrated circuit work, heat absorbing sheet 6 can absorb collection
At the heat inside circuit test device, and the conductive fluid in catheter 4 is transferred heat to, water pump 7 is by conductive fluid in drain
It is circulated between pipe 4 and heat-dissipating pipe 8, when conductive fluid flows in heat-dissipating pipe 8, cooling fin 9 can absorb the heat of conductive fluid,
Temperature is passed to the air of surrounding by cooling fin 9, and heat emission fan 11 dissipates the hot-air inside arrangement for testing integrated circuit from second
Hot window 3 is blown out, and external air is entered inside arrangement for testing integrated circuit from the first radiator window 2 under the action of pressure, held
Continuous radiates to heat-dissipating pipe 8 and cooling fin 9, greatly increases the heat dissipation effect inside arrangement for testing integrated circuit, so that heat dissipation
More uniform, the device more for certain fevers also can effectively help its heat dissipation, avoid the damage of this kind of device, energy
Enough upper end inner walls that catheter 4 is fixed on to arrangement for testing integrated circuit ontology 1, and it is convenient for the dismounting of catheter 4, Neng Gouyou
Effect avoids catheter 4 from being galled by the first arc snap-gauge 14 and the second arc snap-gauge 16, when arrangement for testing integrated circuit crashes
Time presses reset button 21, can make its restarting in case of constant power, dust can be prevented from the first radiator window 2
The inside that arrangement for testing integrated circuit is entered with the second radiator window 3, the surface for avoiding dust from being adsorbed on electronic component hinder
It radiates.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of arrangement for testing integrated circuit, which is characterized in that filled including arrangement for testing integrated circuit ontology (1) and auxiliary heat dissipation
It sets, the arrangement for testing integrated circuit ontology (1) offers the first radiator window (2) above, the arrangement for testing integrated circuit sheet
The two sides of body (1) symmetrically offer the second radiator window (3), and auxiliary is equipped with inside the arrangement for testing integrated circuit ontology (1)
Radiator, the auxiliary radiating device include catheter (4), and the catheter (4) is fixed on described by fixed device (5)
The upper end inner wall of arrangement for testing integrated circuit ontology (1) is fixed with several heat absorbing sheets (6) under the catheter (4), described to lead
Liquid pipe (4) one end is connected with water pump (7), and the water pump (7) is fixed in the upper end of the arrangement for testing integrated circuit ontology (1)
The output end of wall, the water pump (7) is equipped with heat-dissipating pipe (8), and the other end and the heat-dissipating pipe (8) of the catheter (4) are separate
One end of the water pump (7) matches connection, is equipped with conductive fluid, the heat dissipation in the catheter (4) and the heat-dissipating pipe (8)
Pipe (8) is fixed on cooling fin (9), and four angles of the cooling fin (9) are fixed with the first connecting column (10), and described first
Connecting column (10) is fixedly connected with the upper end of the arrangement for testing integrated circuit ontology (1) far from the cooling fin (9) one end,
The cooling fin (9) matches with first radiator window (2), and the two sides of the heat-dissipating pipe (8) are equipped with heat emission fan (11), institute
Heat emission fan (11) are stated to connect by the way that the upper end inner wall of the second connecting column (12) and the arrangement for testing integrated circuit ontology (1) is fixed
It connects, the heat emission fan (11) matches with second radiator window (3).
2. a kind of arrangement for testing integrated circuit according to claim 1, which is characterized in that the fixed device (5) includes
Connecting plate (13), the connecting plate (13) is fixedly connected with the upper end inner wall of the arrangement for testing integrated circuit ontology (1), described
The first arc snap-gauge (14) is fixed on connecting plate (13), the first arc snap-gauge (14) one passes through shaft (15) activity
Equipped with the second arc snap-gauge (16), the first arc snap-gauge (14) is fixed with first far from the shaft (15) one end and fixes
Plate (17), the second arc snap-gauge (16) are fixed with the second fixed plate (18) far from the shaft (15) one end, and described the
The middle part of one fixed plate (17) and second fixed plate (18) has offered circular hole, is equipped with bolt (19) in the circular hole,
The upper end of the bolt (19) is equipped with nut (20).
3. a kind of arrangement for testing integrated circuit according to claim 2, which is characterized in that the first arc snap-gauge (14)
It is made with the second arc snap-gauge (16) of heat-resisting soft rubber material.
4. a kind of arrangement for testing integrated circuit according to claim 1, which is characterized in that the arrangement for testing integrated circuit
Ontology (1) is provided with reset button (21) on one side.
5. a kind of arrangement for testing integrated circuit according to claim 1, which is characterized in that first radiator window (2) and
Second radiator window (3) is fixed with Air Filter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822004158.2U CN209460364U (en) | 2018-12-01 | 2018-12-01 | A kind of arrangement for testing integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822004158.2U CN209460364U (en) | 2018-12-01 | 2018-12-01 | A kind of arrangement for testing integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209460364U true CN209460364U (en) | 2019-10-01 |
Family
ID=68039652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822004158.2U Expired - Fee Related CN209460364U (en) | 2018-12-01 | 2018-12-01 | A kind of arrangement for testing integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209460364U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112255474A (en) * | 2020-09-10 | 2021-01-22 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Chip near-field scanning system and method |
-
2018
- 2018-12-01 CN CN201822004158.2U patent/CN209460364U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112255474A (en) * | 2020-09-10 | 2021-01-22 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Chip near-field scanning system and method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191001 |
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| CF01 | Termination of patent right due to non-payment of annual fee |