CN209453694U - A kind of semiconductor material deep hole drilling apparatus - Google Patents
A kind of semiconductor material deep hole drilling apparatus Download PDFInfo
- Publication number
- CN209453694U CN209453694U CN201920053227.0U CN201920053227U CN209453694U CN 209453694 U CN209453694 U CN 209453694U CN 201920053227 U CN201920053227 U CN 201920053227U CN 209453694 U CN209453694 U CN 209453694U
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- China
- Prior art keywords
- plate
- pedestal
- deep hole
- semiconductor material
- drilling apparatus
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Abstract
The utility model discloses a kind of semiconductor material deep hole drilling apparatus, including bottom plate, the top of the bottom plate is equipped with support plate, the bottom end of the thermally conductive loading plate is connected with heater strip, and the bottom end of heater strip is equipped with heating plate, the outer wall of the pedestal is provided with ventilating groove, and the inside of ventilating groove is equipped with filter plate, the top of the pedestal is equipped with fixed plate, and the inside of fixed plate is through there is adjusting rod, the top of the adjusting rod is connected with conflict plate, and the top for contradicting plate is provided with protective plate, the support column of arcuate structure is installed on the left of the fixed plate, and the top of support column is welded with hydraulic press, the lower end of the hydraulic press is connected with pressing plate, and the center bottom of pressing plate is connected with pressure head, and the inside of pressure head is equipped with reticle.The semiconductor material deep hole drilling apparatus, can preheat finished product, convenient for being collected to the material cut, be conducive to carry out for a long time using the problem of.
Description
Technical field
The utility model relates to semiconductor material Deep-Hole Drilling Technology field, specially a kind of semiconductor material deep hole machining
Device.
Background technique
The substance of nature, material can be divided into conductor, semiconductor and insulator three categories by conductive capability size.Semiconductor
Resistivity 1m Ω cm~1G Ω cm range (upper limit press Xie Jiakui " electronic circuit " value, also take its 1/10 or 10
Times；Because footmark is unavailable, temporary is currently described).Under normal circumstances, [1] conductivity semiconductor rises with the raising of temperature
Height, this is just the opposite with metallic conductor.
With the development of modern industry, the semiconductor materials such as various rubber, plastics utilization also gradually increase, material into
It before row comes into operation, needs to carry out deep hole machining to semiconductor material product mostly, in order to carry out using but existing
Deep hole drilling apparatus cannot preheat finished product, be unfavorable for being punched out, and be not easy to be collected the material cut,
And it is unfavorable for being carried out for a long time using therefore, it is proposed that a kind of semiconductor material deep hole drilling apparatus, above-mentioned in order to solve
The problem of middle proposition.
Utility model content
(1) the technical issues of solving
In view of the deficiencies of the prior art, the utility model provides a kind of semiconductor material deep hole drilling apparatus, solves
Existing deep hole drilling apparatus cannot preheat finished product, be unfavorable for being punched out, and be not easy to carry out the material cut
Collect, and be unfavorable for carrying out for a long time using the problem of.
(2) technical solution
To achieve the above object, the utility model provides the following technical solutions: a kind of semiconductor material deep hole drilling apparatus,
Including bottom plate, the top of the bottom plate is equipped with support plate, and pedestal is connected on the inside of support plate, the top peace of the pedestal
Equipped with thermal insulation protection plate, and thermally conductive loading plate is provided on the inside of thermal insulation protection plate, the bottom end of the thermally conductive loading plate is connected with
Heater strip, and the bottom end of heater strip is equipped with heating plate, the outer wall of the pedestal is provided with ventilating groove, and the inside peace of ventilating groove
Equipped with filter plate, the top of the pedestal is equipped with fixed plate, and the inside of fixed plate is through there is adjusting rod, the adjusting rod
Top is connected with conflict plate, and the top for contradicting plate is provided with protective plate, is equipped with arcuate structure on the left of the fixed plate
Support column, and the top of support column is welded with hydraulic press, the lower end of the hydraulic press is connected with pressing plate, and the bottom end of pressing plate
Middle part is connected with pressure head, and the inside of pressure head is equipped with reticle.
Preferably, it is integrated between the bottom plate, support plate and pedestal, and the shape and structure of support plate is rectangular
Triangular structure, and support plate is symmetrical arranged about the central axes of pedestal.
Preferably, the thermally conductive loading plate is separated by thermal insulation protection plate and pedestal, and pedestal, thermal insulation protection plate and thermally conductive is held
To be fixedly connected between support plate, and the bottom end of thermally conductive loading plate is uniformly equipped with heater strip.
Preferably, the ventilating groove is evenly arranged in the left and right sides of pedestal, and the inclined structure setting of ventilating groove, and
The inside correspondence of ventilating groove is fixedly installed with filter plate.
Preferably, it is opposite slide construction between the fixed plate and conflict plate, and contradicts the company between plate and protective plate
Connecing mode is to inlay connection, and contradict plate and be symmetrically arranged with two groups about the central axes of pedestal.
It preferably, is detaching structure between the pressing plate and pressure head, and the top structure in the form of slot of pressing plate, and pressure head is
Hollow structure, and the inner bottom of pressure head has reticle, while the monomer shape and structure of reticle in " ten " word cross-fixing
Assume diamond in shape structure.
(3) beneficial effect
The utility model provides a kind of semiconductor material deep hole drilling apparatus, have it is following the utility model has the advantages that
(1), it is provided with thermally conductive loading plate, thermally conductive loading plate is heated by heating plate by heater strip, convenient for high score
Sub- product is preheated, in order to rapidly and efficiently complete deep hole work.
(2), it is provided with support plate and ventilating groove, is conducive to increase the apparatus structure stability, and by being uniformly arranged
Ventilating groove is tilted, ventilative pressure release is convenient for, is conducive to increase the service using life.
(3), it is provided with adjusting rod and contradicts plate, convenient for passing through threaded function of the adjusting rod inside fixed plate, to conflict
Plate is slided, and is clamped in order to contradict plate by protective plate to finished product.
(4), pressure head and reticle are provided with, reticle is in cross-shaped structure cross-distribution, and the monomer structure of reticle
For diamond structure, convenient for directly carrying out the punching press of deep hole, and is conducive to take out the material inside cut hole and collect.
Detailed description of the invention
Fig. 1 is the utility model positive structure diagram；
Fig. 2 is the utility model side structure schematic view；
Fig. 3 is the utility model pedestal schematic cross-sectional view；
Fig. 4 is the utility model pressing plate and pressure head attachment structure schematic diagram.
In figure: 1, bottom plate；2, support plate；3, pedestal；4, thermal insulation protection plate；5, thermally conductive loading plate；6, heater strip；7, it heats
Plate；8, ventilating groove；9, filter plate；10, fixed plate；11, adjusting rod；12, plate is contradicted；13, protective plate；14, support column；15, liquid
Press；16, pressing plate；17, pressure head；18, reticle.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment, based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
As shown in Figs 1-4, the utility model provides a kind of technical solution: a kind of semiconductor material deep hole drilling apparatus, packet
Bottom plate 1 is included, the top of bottom plate 1 is equipped with support plate 2, and the inside of support plate 2 is connected with pedestal 3, and the top of pedestal 3 is equipped with
Thermal insulation protection plate 4, and the inside of thermal insulation protection plate 4 is provided with thermally conductive loading plate 5, the bottom end of thermally conductive loading plate 5 is connected with heating
Silk 6, and the bottom end of heater strip 6 is equipped with heating plate 7, the outer wall of pedestal 3 is provided with ventilating groove 8, and the inside installation of ventilating groove 8
There is a filter plate 9, the top of pedestal 3 is equipped with fixed plate 10, and the inside of fixed plate 10 is through there is adjusting rod 11, adjusting rod 11
Top, which is connected with, contradicts plate 12, and the top for contradicting plate 12 is provided with protective plate 13, and the left side of fixed plate 10 is equipped with arc knot
The support column 14 of structure, and the top of support column 14 is welded with hydraulic press 15, the lower end of hydraulic press 15 is connected with pressing plate 16, and
The center bottom of pressing plate 16 is connected with pressure head 17, and the inside of pressure head 17 is equipped with reticle 18.
As being integrated between Fig. 1-3 insole board 1, support plate 2 and pedestal 3, and the shape and structure of support plate 2 is in straight
Angle triangular structure, and support plate 2 is symmetrical arranged about the central axes of pedestal 3, is conducive to increase the apparatus structure stability,
Thermally conductive loading plate 5 is separated by thermal insulation protection plate 4 and pedestal 3, and is solid between pedestal 3, thermal insulation protection plate 4 and thermally conductive loading plate 5
Fixed connection, and the bottom end of thermally conductive loading plate 5 is uniformly equipped with heater strip 6, convenient for preheating to finished product, is conducive to deep hole
The rapidly and efficiently completion of processing, ventilating groove 8 are evenly arranged in the left and right sides of pedestal 3, and the inclined structure setting of ventilating groove 8,
And the inside correspondence of ventilating groove 8 is fixedly installed with filter plate 9, is convenient for ventilative pressure release, be conducive to carry out for a long time using.
Such as being opposite slide construction between fixed plate 10 in Fig. 2 and conflict plate 12, and contradict between plate 12 and protective plate 13
Connection type be to inlay connection, and contradict plate 12 and be symmetrically arranged with two groups about the central axes of pedestal 3, be convenient for finished product into
Row clamps, and avoids finished product cheap, advantageously ensures that being normally carried out for deep hole machining work.
As being detaching structure, and the top structure in the form of slot of pressing plate 16, and pressure head between pressing plate 16 and pressure head 17 in Fig. 4
17 be hollow structure, and the inner bottom of pressure head 17 has reticle 18, while the list of reticle 18 in " ten " word cross-fixing
Shape structure assumes diamond in shape structure, finished product directly can be carried out punching press pore-forming, convenient for being collected to the material after cut hole.
In use, the made finished product of semiconductor material is placed on the lower section of pressure head 17 first, and make punch position and pressure
First 17 central axis is corresponding；
Then by rotation adjusting rod 11, so that contradicting screw thread sliding of the plate 12 by adjusting rod 11 inside fixed plate 10
Effect is moved, and is clamped so as to make to contradict plate 12 by protective plate 13 to finished product, while strengthening to finished product
Protection, avoids finished product punch position from deviating；
Then by connecting external power supply, start heating plate 7, by the equally distributed heater strip 6 in 7 upper end of heating plate to leading
Hot loading plate 5 is heated, and in order to preheat finished product, is conducive to quickly be punched, and the periphery of thermally conductive loading plate 5
Thermal insulation protection plate 4 is installed, high temperature is avoided and the device other component is damaged, and two groups of the left and right of pedestal 3 is impartial
Spacing arrangement has ventilating groove 8, is convenient for radiating, and avoids 3 internal cavities atmospheric pressure of pedestal much, influences the device and uses the longevity
Life, and reinforced by the ventilating groove of inclined structure 8 and its internal corresponding filter plate 9 inlayed to extraneous dust and moisture
Isolation effect, avoid damaging internal element, be conducive to the long-time service of the device；
Then pressing plate 16 is gone up and down by hydraulic press 15, by being located at the pressure head 17 of 16 center bottom of pressing plate to finished product
It is punched, and pressure head 17 is in hollow structure, and the inner wall of pressure head 17 can be tangent with the bottom interior wall of pressing plate 16, ensure that
When punching, the material cut can be entered in pressing plate 16, and be in the reticle of " ten " font setting by 17 inner bottom of pressure head
Material in 18 device to hole is cut, and after switching to certain depth, is more convenient for carrying out the material cut by its diamond structure
It pulls out, convenient for guaranteeing being normally carried out for deep hole machining.
It can to sum up obtain, 1, the semiconductor material deep hole drilling apparatus, be provided with thermally conductive loading plate 5, thermally conductive loading plate 5 is by adding
Hot plate 7 is heated by heater strip 6, convenient for preheating to high molecular products, in order to rapidly and efficiently complete deep hole work.
2, the semiconductor material deep hole drilling apparatus, is provided with support plate 2 and ventilating groove 8, is conducive to increase the device knot
Structure stability, and by the inclination ventilating groove 8 that is uniformly arranged, is convenient for ventilative pressure release, is conducive to increase the device and uses the longevity
Life.
3, the semiconductor material deep hole drilling apparatus is provided with adjusting rod 11 and contradicts plate 12, convenient for passing through adjusting rod 11
Threaded function inside fixed plate 10 is slided to plate 12 is contradicted, right by protective plate 13 in order to contradict plate 12
Finished product is clamped.
4, the semiconductor material deep hole drilling apparatus, is provided with pressure head 17 and reticle 18, and reticle 18 is in cross knot
Structure cross-distribution, and the monomer structure of reticle 18 is diamond structure, convenient for directly carrying out the punching press of deep hole, and is conducive to cut
Material inside hole, which takes out, to be collected.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of semiconductor material deep hole drilling apparatus, including bottom plate (1), it is characterised in that: install on the top of the bottom plate (1)
Have support plate (2), and be connected with pedestal (3) on the inside of support plate (2), thermal insulation protection plate is installed at the top of the pedestal (3)
(4), it and on the inside of thermal insulation protection plate (4) is provided with thermally conductive loading plate (5), the bottom end of the thermally conductive loading plate (5), which is connected with, to be added
Heated filament (6), and the bottom end of heater strip (6) is equipped with heating plate (7), the outer wall of the pedestal (3) is provided with ventilating groove (8), and
The inside of ventilating groove (8) is equipped with filter plate (9), and the top of the pedestal (3) is equipped with fixed plate (10), and fixed plate (10)
Inside through having adjusting rod (11), the top of the adjusting rod (11) is connected with the top for contradicting plate (12), and contradicting plate (12)
End is provided with protective plate (13), and the support column (14) of arcuate structure, and support column are equipped on the left of the fixed plate (10)
(14) top is welded with hydraulic press (15), and the lower end of the hydraulic press (15) is connected with pressing plate (16), and pressing plate (16)
Center bottom be connected with pressure head (17), and the inside of pressure head (17) is equipped with reticle (18).
2. a kind of semiconductor material deep hole drilling apparatus according to claim 1, it is characterised in that: the bottom plate (1), branch
It is integrated, and the rectangular triangular structure of shape and structure of support plate (2), and props up between fagging (2) and pedestal (3)
Fagging (2) is symmetrical arranged about the central axes of pedestal (3).
3. a kind of semiconductor material deep hole drilling apparatus according to claim 1, it is characterised in that: the thermally conductive loading plate
(5) separated by thermal insulation protection plate (4) and pedestal (3), and be between pedestal (3), thermal insulation protection plate (4) and thermally conductive loading plate (5)
It is fixedly connected, and the bottom end of thermally conductive loading plate (5) is uniformly equipped with heater strip (6).
4. a kind of semiconductor material deep hole drilling apparatus according to claim 1, it is characterised in that: the ventilating groove (8)
It is evenly arranged in the left and right sides of pedestal (3), and ventilating groove (8) inclined structure setting, and the inside of ventilating groove (8) is corresponding
It is fixedly installed with filter plate (9).
5. a kind of semiconductor material deep hole drilling apparatus according to claim 1, it is characterised in that: the fixed plate (10)
It is opposite slide construction with contradicting between plate (12), and contradicting the connection type between plate (12) and protective plate (13) is to inlay company
It connects, and contradicts plate (12) and be symmetrically arranged with two groups about the central axes of pedestal (3).
6. a kind of semiconductor material deep hole drilling apparatus according to claim 1, it is characterised in that: the pressing plate (16) with
It is detaching structure between pressure head (17), and the top structure in the form of slot of pressing plate (16), and pressure head (17) is hollow structure, and
The inner bottom of pressure head (17) has reticle (18) in " ten " word cross-fixing, while the monomer shape and structure of reticle (18) is in
Diamond structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920053227.0U CN209453694U (en) | 2019-01-14 | 2019-01-14 | A kind of semiconductor material deep hole drilling apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920053227.0U CN209453694U (en) | 2019-01-14 | 2019-01-14 | A kind of semiconductor material deep hole drilling apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209453694U true CN209453694U (en) | 2019-10-01 |
Family
ID=68044372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920053227.0U Expired - Fee Related CN209453694U (en) | 2019-01-14 | 2019-01-14 | A kind of semiconductor material deep hole drilling apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209453694U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110901087A (en) * | 2019-12-17 | 2020-03-24 | 袁翠莲 | Novel plastic welding machine with hot punching structure |
-
2019
- 2019-01-14 CN CN201920053227.0U patent/CN209453694U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110901087A (en) * | 2019-12-17 | 2020-03-24 | 袁翠莲 | Novel plastic welding machine with hot punching structure |
| CN110901087B (en) * | 2019-12-17 | 2021-08-03 | 安徽冠泓塑业有限公司 | Plastic welding machine with hot punching structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191001 Termination date: 20200114 |